CN207117762U - Array lens module and its easy cleaning photosensory assembly - Google Patents

Abstract

A kind of array lens module and its easy cleaning photosensory assembly are the utility model is related to, easy cleaning photosensory assembly includes substrate, at least two photo-sensitive cells and packaging body.Photo-sensitive cell is arranged at intervals to the first surface of substrate, photo-sensitive cell is set to be electrically connected with substrate, the packaging body for being set around photo-sensitive cell is formed by way of encapsulated moulding in first surface, packaging body is provided with least two holding tanks, photo-sensitive cell is respectively in a holding tank, packaging body after shaping is very firm, it can not almost be dismantled from substrate, packaging body includes the inwall close to photo-sensitive cell and the outer wall away from photo-sensitive cell, packaging body is provided with opening, opening insertion inwall and outer wall, the photosensory assembly for having packaging body to encapsulated moulding by the way of centrifugation is washed again integrally cleans, effectively cleansing medium can be discharged outside packaging body.

Description

Array lens module and its easy cleaning photosensory assembly

Technical field

Camera technology field is the utility model is related to, more particularly to a kind of array lens module and its photosensitive group of easy cleaning Part.

Background technology

In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting Further improved on the basis of few size and strengthen imaging capability.

With requirement more and more higher of the people to mobile phone photograph quality, single camera is limited by the limit of self-condition at present System, can not meet the requirement of people.Therefore, the array lens module with least two cameras arises at the historic moment.

The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, i.e. shooting mould Wiring board, photo-sensitive cell, the support etc. of group are made into respectively, then successively by passive electronic component, photo-sensitive cell and support Encapsulation is in the circuit board.But the camera module size that this packaged type is formed is larger, can not meet what size increasingly reduced Trend.

In order to solve this problem, moulding technology is introduced into camera module field, and moulding technology allows camera module in quilt Make support integrally formed in the circuit board during making.

But during encapsulation, dust and chip are inevitably fallen on sensitive chip, if not in time Remove, the image quality of camera module can be influenceed after packaged, causes shadow problem.The mode of traditional generally use washing, After molding process planning step, sensitive chip is cleaned, yet with the reasons in structure of molded camera module, Water after cleaning can not be completely exhausted out.Therefore the region of sensitive chip is set not only to still have dust and chip, but also New residual rinse water is introduced, easily causes shadow and short circuit problem.

Utility model content

Based on this, it is necessary to for above-mentioned technical problem, there is provided one kind effectively can discharge cleansing medium outside packaging body Array lens module and its easy cleaning photosensory assembly.

A kind of easy cleaning photosensory assembly, including：

Substrate, including the first surface and second surface being oppositely arranged；

At least two photo-sensitive cells, it is arranged at intervals at the first surface；

Packaging body, photo-sensitive cell encapsulated moulding described in winding is in being arranged at the first surface, and the packaging body is provided with extremely Few two holding tanks, respectively in the holding tank, the packaging body is included close to the photo-sensitive cell photo-sensitive cell Inwall and outer wall away from the photo-sensitive cell, the packaging body be provided with opening, the opening insertion inwall with it is described Outer wall.

In one of the embodiments, the quantity of the photo-sensitive cell is two, and the quantity of the holding tank is two, point Not Wei the first holding tank and the second holding tank, the packaging body includes the first encapsulation part and the second encapsulation part, first encapsulation Portion is in frame shape and including multiple end to end encapsulation sides, and second encapsulation part is in frame shape and including multiple end to end envelopes Rim, first encapsulation part is adjacent with second encapsulation part and shared adjacent package side, wherein first encapsulation part Non-common encapsulation side open up opening, wherein second encapsulation part non-common encapsulate side offer opening, the opening Size can allow for the photo-sensitive cell to pass through.

In one of the embodiments, the quantity of the photo-sensitive cell is two, and the quantity of the holding tank is two, point Not Wei the first holding tank and the second holding tank, the packaging body include three be spaced be oppositely arranged first encapsulation side and connection three It is individual it is described first encapsulation while one end second encapsulation while, per it is two neighboring it is described first encapsulation side is not connected with it is described second encapsulation The one end on side is collectively forming an opening.

In one of the embodiments, the packaging body includes the first encapsulation side and the connection two that two intervals are oppositely arranged It is individual it is described first encapsulation while second encapsulation while, it is described second encapsulation while both ends respectively positioned at two it is described first encapsulation while Middle part, first holding tank and second holding tank, two the first encapsulation sides are separated out by the described first encapsulation side End between form two openings respectively.

In one of the embodiments, the inwall on two relative the first encapsulation sides has flow-guiding structure.

In one of the embodiments, two relative described first encapsulate the distance between the inwall on side from close to described The gradual increase in side that the one of substrate is laterally away from the substrate forms the flow-guiding structure；Or

Two relative first encapsulation while the distance between inwall from close to the described second encapsulation while one end to Gradually increase forms the flow-guiding structure for one end away from the described second encapsulation side.

In one of the embodiments, in addition to occulter, the occulter block the opening.

In one of the embodiments, two first encapsulation for forming the opening are outlying from the described second encapsulation side One end be provided with the first guiding face, the occulter is provided with second guiding face corresponding with first guiding face.

In one of the embodiments, first guiding face laterally leans on from the described first encapsulation is outlying from the substrate one The nearly substrate side tilts extension and is gradually distance from the second encapsulation side.

In one of the embodiments, first guiding face is laterally remote close to the substrate one from the described first encapsulation side Extension is tilted from the substrate side and is gradually distance from the second encapsulation side.

In one of the embodiments, the packaging body includes the first encapsulation part and the second encapsulation part, first encapsulation Portion and second encapsulation part are four frame shapes, including four end to end encapsulation sides, first encapsulation part and described Second encapsulation part is adjacent and shared adjacent package side, and the unshared encapsulation side of first encapsulation part and second encapsulation part are not Shared encapsulation side offers the opening.

In one of the embodiments, described be open is through to the top surface of the packaging body from the bottom surface of the packaging body.

In one of the embodiments, the opening is the top surface depression from the bottom surface of the packaging body to the packaging body The groove of formation.

In one of the embodiments, the occulter is Nian Jie with the packaging body by glue-line.

In one of the embodiments, the top surface of the packaging body is loading end, and the loading end is used to install optical section, The optical section and the shading body by integral forming.

A kind of array lens module, including：

Easy cleaning photosensory assembly, including substrate, at least two photo-sensitive cells and packaging body, the substrate include being oppositely arranged First surface and second surface, the photo-sensitive cell is arranged at intervals at the first surface, sense described in the packaging body winding Element package takes shape in the first surface, and the packaging body is provided with least two holding tanks, and the photo-sensitive cell distinguishes position In in the holding tank, the packaging body includes the inwall close to the photo-sensitive cell and the outer wall away from the photo-sensitive cell, The packaging body is provided with opening, and the opening penetrates the inwall and the outer wall；And

At least two optical sections, it is arranged at respectively including lens barrel and camera lens, the lens barrel on the packaging body, a mirror Cylinder corresponds to a holding tank, and the camera lens is arranged in the lens barrel.

In one of the embodiments, the easy cleaning photosensory assembly also includes occulter, and the occulter blocks described Opening.

In one of the embodiments, the optical section also includes support, and the occulter is integrally formed with the support, The support is arranged on the packaging body, and the lens barrel is arranged on the support.

In one of the embodiments, the optical section includes voice coil motor, the occulter and the voice coil motor one Body formed, the voice coil motor is arranged on the packaging body, and the lens barrel is arranged on the voice coil motor.

In one of the embodiments, the quantity of the photo-sensitive cell is two, and the quantity of the holding tank is two, point Not Wei the first holding tank and the second holding tank, the packaging body includes the first encapsulation part and the second encapsulation part, first encapsulation Portion is in frame shape and including multiple end to end encapsulation sides, and second encapsulation part is in frame shape and including multiple end to end envelopes Rim, first encapsulation part is adjacent with second encapsulation part and shared adjacent package side, wherein first encapsulation part Non-common encapsulation side open up opening, wherein second encapsulation part non-common encapsulate side offer opening, the opening Size can allow for the photo-sensitive cell to pass through.

In one of the embodiments, the quantity of the photo-sensitive cell is two, and the quantity of the holding tank is two, point Not Wei the first holding tank and the second holding tank, the packaging body include three be spaced be oppositely arranged first encapsulation side and connection three It is individual it is described first encapsulation while one end second encapsulation while, per it is two neighboring it is described first encapsulation side is not connected with it is described second encapsulation The one end on side is collectively forming an opening.

In one of the embodiments, the packaging body includes the first encapsulation side and the connection two that two intervals are oppositely arranged It is individual it is described first encapsulation while second encapsulation while, it is described second encapsulation while both ends respectively positioned at two it is described first encapsulation while Middle part, first holding tank and second holding tank, two the first encapsulation sides are separated out by the described first encapsulation side End between form two openings respectively.

In one of the embodiments, the inwall on two relative the first encapsulation sides has flow-guiding structure.

In one of the embodiments, two relative described first encapsulate the distance between the inwall on side from close to described The gradual increase in side that the one of substrate is laterally away from the substrate forms the flow-guiding structure；Or

Two relative first encapsulation while the distance between inwall from close to the described second encapsulation while one end to Gradually increase forms the flow-guiding structure for one end away from the described second encapsulation side.

In one of the embodiments, two first encapsulation for forming the opening are outlying from the described second encapsulation side One end be provided with the first guiding face, the occulter is provided with second guiding face corresponding with first guiding face.

In one of the embodiments, first guiding face laterally leans on from the described first encapsulation is outlying from the substrate one The nearly substrate side tilts extension and is gradually distance from the second encapsulation side.

In one of the embodiments, first guiding face is laterally remote close to the substrate one from the described first encapsulation side Extension is tilted from the substrate side and is gradually distance from the second encapsulation side.

In one of the embodiments, the packaging body includes the first encapsulation part and the second encapsulation part, first encapsulation Portion and second encapsulation part are four frame shapes, including four end to end encapsulation sides, first encapsulation part and described Second encapsulation part shares adjacent package side, first encapsulation part and the unshared encapsulation side of second encapsulation part offer to Few two spaced openings.

In one of the embodiments, described be open is through to the top surface of the packaging body from the bottom surface of the packaging body.

In one of the embodiments, the opening is the top surface depression from the bottom surface of the packaging body to the packaging body The groove of formation.

In one of the embodiments, the occulter is Nian Jie with the packaging body by glue-line.

Above-mentioned array lens module and its easy cleaning photosensory assembly at least have advantages below：

During encapsulation, photo-sensitive cell is first arranged at intervals to the first surface of substrate, makes photo-sensitive cell and substrate Electrical connection, then formed by way of encapsulated moulding in the first surface of substrate and be set around the packaging body of photo-sensitive cell, encapsulation Body is provided with least two holding tanks, and for photo-sensitive cell respectively in a holding tank, the packaging body after shaping is very firm, it is virtually impossible to To be dismantled from substrate, packaging body includes the inwall close to photo-sensitive cell and the outer wall away from photo-sensitive cell, and packaging body is provided with opening, Opening insertion inwall and outer wall, then the photosensory assembly for having packaging body to encapsulated moulding by the way of centrifugation is washed integrally are carried out clearly Wash, cleansing medium after cleaning carries dust on photo-sensitive cell and impurity under the influence of centrifugal force, is together arranged by opening Go out outside packaging body, effectively can discharge cleansing medium outside packaging body.

Brief description of the drawings

Fig. 1 is the decomposing schematic representation of double camera modules in first embodiment；

Fig. 2 is the partial schematic diagram of double camera modules shown in Fig. 1；

Fig. 3 is the sectional view after double camera module assemblings shown in Fig. 1；

Fig. 4 is the decomposing schematic representation of double camera modules in second embodiment；

Fig. 5 is the partial schematic diagram of double camera modules shown in Fig. 2；

Fig. 6 is the sectional view of double camera modules shown in Fig. 2；

Fig. 7 is the decomposing schematic representation of double camera modules in the 3rd embodiment, optical section not shown in figure；

Fig. 8 is the side view of double camera modules shown in Fig. 7；

Fig. 9 is the sectional view of double camera modules shown in Fig. 7；

Figure 10 is the decomposing schematic representation of double camera modules in the 4th embodiment, optical section not shown in figure；

Figure 11 is the side view of double camera modules shown in Figure 10；

Figure 12 is the sectional view of double camera modules shown in Figure 10；

Figure 13 is the decomposing schematic representation of double camera modules in the 5th embodiment, optical section not shown in figure；

Figure 14 is the side view of double camera modules shown in Figure 13.

Embodiment

To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description Understand the utility model.But the utility model can be to be much different from other manner described here to implement, this area Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs The limitation for the specific implementation opened.

It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.

Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein The purpose of description specific embodiment, it is not intended that in limitation the utility model.Each technical characteristic of embodiment described above Can arbitrarily it be combined, to make description succinct, not to all possible combination of each technical characteristic in above-described embodiment All it is described, as long as however, contradiction is not present in the combination of these technical characteristics, is all considered to be the model of this specification record Enclose.

Array lens module in one embodiment, including easy cleaning photosensory assembly and at least two optical sections.Specifically, Easy cleaning photosensory assembly includes substrate, at least two photo-sensitive cells and packaging body.Each optical section includes lens barrel and camera lens.

Substrate includes the first surface and second surface being oppositely arranged, and photo-sensitive cell is arranged at intervals at first surface.Encapsulation For body winding photo-sensitive cell encapsulated moulding in the first surface of substrate, packaging body is provided with least two holding tanks, photo-sensitive cell difference In holding tank.That is, a photo-sensitive cell is located in a holding tank.Packaging body is included close to the inwall of photo-sensitive cell and away from sense The outer wall of optical element.Packaging body is provided with opening, opening insertion inwall and outer wall.That is, opening is connected with holding tank.

During encapsulation, photo-sensitive cell is first arranged at intervals to the first surface of substrate, makes photo-sensitive cell and substrate Electrical connection, then formed by way of encapsulated moulding in the first surface of substrate and be set around the packaging body of photo-sensitive cell, encapsulation Body is provided with least two holding tanks, and for photo-sensitive cell respectively in a holding tank, the packaging body after shaping is very firm, it is virtually impossible to To be dismantled from substrate, packaging body includes the inwall close to photo-sensitive cell and the outer wall away from photo-sensitive cell, and packaging body is provided with opening, Opening insertion inwall and outer wall, then the photosensory assembly for having packaging body to encapsulated moulding by the way of centrifugation is washed integrally are carried out clearly Wash, cleansing medium after cleaning carries dust on photo-sensitive cell and impurity under the influence of centrifugal force, is together arranged by opening Go out outside packaging body, effectively can discharge cleansing medium outside packaging body.

Specifically, three camera modules or bag that array lens module can be double camera modules, include three optical sections Four camera modules containing four optical sections and the array lens module for including five, six etc. optical sections.Accordingly, photosensitive member The quantity of part is also two, three, four, five, six etc..The quantity of holding tank can also be two, three, four, Five, six etc..

Mainly illustrated below with double camera modules comprising two optical sections to illustrate, but this can not be used as to this Utility model limits.

Fig. 1 to Fig. 3 is referred to, is double camera modules 100 in first embodiment.This pair of camera module 100 includes easy Clean photosensory assembly 110 and two optical sections 120.Easy cleaning photosensory assembly 110 include 111, two photo-sensitive cells 112 of substrate, Electronic component 113, packaging body 114 and occulter 115.Each optical section 120 includes lens barrel 121 and camera lens 122, specific to first In embodiment, each optical section 120 also includes voice coil motor 123, and lens barrel 121 is arranged in voice coil motor 123, camera lens 122 It is arranged in lens barrel 121, camera lens 122 includes multiple eyeglasses.Double camera modules 100 also include two optical filters 130, two optical filterings Piece 130 is respectively positioned at two tops of photo-sensitive cell 112.I.e., in the first embodiment, double camera modules 100 are taken the photograph to be varifocal As module.

Substrate 111 includes the first surface 1111 and second surface 1112 being oppositely arranged.Substrate 111 is wiring board, such as Can be hard circuit board, ceramic substrate (without soft board), or Rigid Flex, or be soft board, when substrate 111 is During soft board, stiffening plate can be set in the second surface 1112 of substrate 111, to strengthen the intensity of substrate 111.

Two photo-sensitive cells 112 are arranged at intervals at first surface 1111, and photo-sensitive cell 112 can be CCD (Charge- Coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide Semiconductor, Metal oxide semiconductor device).Photo-sensitive cell 112 is generally rectangle, square or circle.For example, specific to first In embodiment, photo-sensitive cell 112 is rectangle.

Photo-sensitive cell 112 includes the photosurface 112a and non-photo-sensing face 112b set back on photosurface 112a, non-photo-sensing Face 112b is arranged on the first surface 1111 of substrate 111 by glue-line.Photosurface 112a includes photosensitive area 1121 and non-photo-sensing Area 1122, photosensitive area 1121 are located at middle part, and non-photo-sensing area 1122 is set around photosensitive area 1121.Certainly, in other embodiment party In formula, non-photo-sensing area 1122 can also be only located at the side of photosensitive area 1121.Light is incident from camera lens 122 and reaches photosurface 112a, photosurface 112a convert optical signals into electric signal, and are transferred to by substrate 111 on connector.

Specific in first embodiment, each photo-sensitive cell 112 passes through conductive connecting 116 and the electricity of substrate 111 respectively Connection.Conductive connecting 116 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 116 respectively with Photo-sensitive cell 112 and substrate 111 are electrically connected, and conductive connecting 116 can be formed by way of just beating：Using wiring tool from Direction routing of the substrate 111 to photo-sensitive cell 112.Conductive connecting 116 can also be formed by way of counter beat：Use routing Direction routing of the instrument from photo-sensitive cell 112 to substrate 111.The camber of the conductive connecting 116 formed by the way of counter beat The conductive connecting 116 formed less than the just mode of beating.

Certainly, in other embodiments, the non-photo-sensing face 112b and substrate in photo-sensitive cell 112 can also be passed through Conductive bumps are set between 111, such as conductive bumps can be soldered ball, photo-sensitive cell 112 is electrically connected by soldered ball and substrate 111 Connect.

Electronic component 113 is arranged at the first surface 1111 of substrate 111, and electronic component 113 electrically connects with substrate 111. Specifically, electronic component 113 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.

Packaging body 114 winding, two encapsulated mouldings of photo-sensitive cell 112 are in the first surface 1111 of substrate 111, packaging body 114 Provided with the first holding tank 114 ' and the second holding tank 114 ", two photo-sensitive cells 112 are respectively positioned at the first holding tank 114 ' and the In two holding tanks 114 ".Packaging body 114 includes the inwall 114a close to photo-sensitive cell 112 and the outer wall away from photo-sensitive cell 112 114b, packaging body 114 are provided with opening 114c, the inwall 114a and outer wall 114b of opening 114c insertion packaging bodies 114.One lens barrel 121 correspond to the first holding tank 114 ', and field lens barrel 121 corresponds to the second holding tank 114 ".

Packaging body 114 can be formed at the first surface 1111 of substrate 111 by molded mode.For example, using Injection machine, after carrying out SMT (Surface Mount Technology, surface mounting technology) technique by insert molding technique Wiring board carry out molding and form packaging body 114, or form packaging body 114 with the mould pressing process commonly used in semiconductor packages. The mode that packaging body 114 is formed can select Shooting Technique or mould pressing process etc..Packaging body 114 and substrate after shaping 111 are firmly connected, and compared with conventional stent is bonded by glue-line, the bonding force between packaging body 114 and substrate 111 big will obtain It is more.

It can be nylon to use Shooting Technique to form the material of packaging body 114, LCP (Liquid Crystal Polymer, Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 114 is formed using mould pressing process Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.

Specific in first embodiment, packaging body 114 include three be spaced the first encapsulation side 1141 for being oppositely arranged and Three first encapsulation of connection are in second encapsulation of 1141 one end 1142, not connected the per the two neighboring first encapsulation side 1141 The one end on two encapsulation sides 1142 is collectively forming an opening 114c.Therefore, in the first embodiment, be open 114c quantity be two It is individual, and the position for the 114c that is open is adjacent, and towards the same side.To photo-sensitive cell 112 clean after, cleansing medium (such as water or Other cleaning fluids) dust and impurity are carried outside opening 114c discharge packaging bodies 114.

Certainly, in other embodiments, packaging body 114 can also include the first encapsulation that three intervals are oppositely arranged When 1141 and two second encapsulate 1142, one second encapsulates when 1142 connect two neighboring first encapsulation 1141 one end, Two neighboring first encapsulation 1142 one end in 1141 not connected second encapsulation forms opening 114c.Another second encapsulation side The other end on the other two neighboring first encapsulation side 1141 of 1142 connections, not connected second encapsulation in this two first encapsulation sides 1141 The one end on side 1142 forms opening 114c.That is, the 114c quantity of being open is two, and the 114c that is open is positioned against phase negative side To.

Occulter 115 blocks opening 114c.Specific in first embodiment, because opening 114c quantity is two, The corresponding quantity of occulter 115 is also two.Occulter 115 is raised line, and raised line insertion is open in 114c to block opening 114c. When occulter 115 is raised line, raised line can encapsulate side as the 3rd of packaging body 114, can be that carrying optical section 120 provides supporting Active force, strengthen the intensity of packaging body 114.Certainly, in other embodiments, occulter 115 can also be a baffle plate, gear Plate can be embedded in opening 114c, or positioned at opening 114c side, as long as opening 114c can be blocked.

Certainly, in other embodiments, it may be omitted with occulter.And by the way that opening is arranged into edge from top to bottom The inclined structure in direction away from optical axis, the side wall for the close photo-sensitive cell that is now open can block to enter from side as occulter Enter the light in photo-sensitive cell environment.

Certainly, in other embodiments, packaging body 114 can also include the first encapsulation part and the second encapsulation part, the One encapsulation part is in frame shape and including multiple end to end encapsulation sides, and the second encapsulation part is in frame shape and including multiple end to end Encapsulate side, the first encapsulation part is adjacent with the second encapsulation part and shared adjacent package side.The non-common envelope of wherein one first encapsulation part Rim opens up opening 114c, wherein the non-common encapsulation side of one second encapsulation part offers opening 114c, the size for the 114c that is open Photo-sensitive cell 112 be can allow for by being advantageous to cleansing medium and being smoothly discharged out outside packaging body 114.

For example, the first encapsulation part includes four end to end encapsulation sides, the second encapsulation part is end to end including four Encapsulate side, the first encapsulation part is adjacent with the second encapsulation part and shared adjacent package side.The wherein non-common of one first encapsulation part Encapsulation side opens up opening 114c, wherein the non-common encapsulation side of one second encapsulation part opens up opening 114c.Photo-sensitive cell 112 is length It is square, and encapsulation side of four sides of photo-sensitive cell 112 respectively with packaging body 114 be arranged in parallel, the size for the 114c that is open is big In the length of photo-sensitive cell 112, to allow photo-sensitive cell 112 by the way that therefore the cleansing medium after cleaning can be smoothly discharged out Outside packaging body 114.

Certainly, in other embodiments, the first encapsulation part and the second encapsulation part can also include three, five, six The encapsulation side of the quantity such as individual, each side of photo-sensitive cell 112 can not also be parallel with encapsulation side, as long as ensureing opening 114c chi It is very little to can allow for photo-sensitive cell 112 by the way that it is outer that cleansing medium be smoothly discharged out packaging body 114.Opening 114c number Amount can also only have one, therefore the quantity for the 114c that is open is not particularly limited.

Certainly, in other embodiments, the first encapsulation part and the second encapsulation part can also in a ring, annular first There is opening 114c, opening 114c to allow cleansing medium to discharge outside packaging body 114 respectively in encapsulation part and the second encapsulation part.

Or in other embodiments, packaging body 114 can also be the encapsulation part only formed by a side arm, not The region for forming encapsulation part is collectively forming opening 114c.Corresponding, occulter 115 is three end to end raised lines, occulter 115 block opening 114c.That is, occulter 115 is collectively forming a closing frame shape with packaging body 114.

Or first encapsulation part and the second encapsulation part be that two formed by two adjacent side arms into angle encapsulate Side, do not form encapsulation side is collectively forming opening 114c, and corresponding, occulter 115 is two adjacent raised lines into angle, is hidden Body of light 115 blocks opening 114c.That is, occulter 115 is surrounded and held with the first holding tank 114 ' and second jointly with packaging body 114 Receive the closing framework of groove 114 ".

Specific in first embodiment, the inwall 114a on two the first relative encapsulation sides 1141 has flow-guiding structure, Flow-guiding structure is advantageous to guide the cleansing medium in packaging body 114 to be discharged by opening 114c outside packaging body 114.For example, two The distance between relative inwall 114a on the first encapsulation side 1141 is laterally away from the one of substrate 111 from close to the one of substrate 111 Gradually increase forms flow-guiding structure for side.That is, the 114c that is open is up big and down small structure, not only contributes to smoothly discharge cleaning and is situated between Matter, also help the demoulding after packaging body 114 is molded.The water conservancy diversion direction of flow-guiding structure relatively coincide with centrifugal force direction ratio, from In heart cleaning process, cleaning liquid flows out from flow-guiding structure to flow out than non-flow-guiding structure, and cleaning liquid outflow is more smooth, more thorough Bottom, cleaning performance are more preferable.

Certainly, in other embodiments, the distance between the side wall on two relative first encapsulation sides 1141 is leaned on certainly Nearly second encapsulation 1142 one end when 1142 one end is to away from the second encapsulation, which gradually increases, forms flow-guiding structure.That is, it is open 114c is the big structure in the small outside in inner side, is advantageous to smoothly discharge cleansing medium.Certainly, flow-guiding structure can also be other shapes Formula, as long as flow-guiding structure can be played.

Encapsulated specific in first embodiment, form opening 114c two first when 1141 encapsulate away from second 1142 one end is provided with the first guiding face 1143, and occulter 115 is provided with second guiding face corresponding with the first guiding face 1143 1151.By the mutual cooperation of the first guiding face 1143 and the second guiding face 1151, be advantageous to occulter 115 and block opening 114c When positioning.

Specific in first embodiment, the first guiding face 1143 is lateral away from substrate 111 1 from the first encapsulation side 1141 Extension is tilted close to the side of substrate 111 and is gradually distance from the second encapsulation side 1142.That is, the one end on the first encapsulation side 1141 is in wedge Shape.Accordingly, the second guiding face 1151 on occulter 115 is engaged with the first guiding face 1143, is embodied on occulter 115 To tilt extension and away from close to the second encapsulation side away from the laterally closer side of substrate 111 of substrate 111 1 from occulter 115 1142.That is, occulter 115 is in reverse wedge shape.

Certainly, in other implementations, the first guiding face 1143 encapsulates side 1141 close to the side of substrate 111 from first Extend and be gradually distance from the second encapsulation side 1142 to being tilted away from the side of substrate 111.That is, the one end on the first encapsulation side 1141 is in Wedge shape.Accordingly, the second guiding face 1151 on occulter 115 is engaged with the first guiding face 1143, is embodied in occulter 115 Upper is to tilt extension away from the laterally closer side of substrate 111 of substrate 111 1 from occulter 115 and move closer to the second encapsulation side 1142.That is, occulter 115 is wedge shaped.

Certainly, in other implementations, first guiding face 1143 on the first encapsulation side 1141 can also be vertical plane, Now the second guiding face 1151 of occulter 115 is also vertical plane to be engaged with the first guiding face 1143.

Specific in first embodiment, electronic component 113 is arranged at the first surface 1111 of substrate 111, and is embedded at In packaging body 114.Therefore, electronic component 113 is covered by packaging body 114, will not be directly exposed in space, more specifically Say, be not exposed in the environment that is communicated with photo-sensitive cell 112, so as to when being assembled into double camera modules 100, electronic component The pollutants such as dust will not be infected with 113, also do not interfere with photo-sensitive cell 112, avoid polluting sensitive chip and causing double shootings There are the bad phenomenons such as dirty stain in module 100.

Certainly, in other embodiments, electronic component 113 is arranged at the first surface 1111 of substrate 111, and is located at Outside packaging body 114.That is, electronic component 113 is not wrapped by packaging body 114, thus the heat dispersion of electronic component 113 compared with It is good.Electronic component 113 be located at packaging body 114 it is outer when in two kinds of situation：Electronic component 113 is located at the inwall 114a of packaging body 114 Side, the good heat dispersion performance of electronic component 113；Electronic component 113 is located at the outer wall 114b sides of packaging body 114, can subtract Safe distance between the inwall 114a of small conductive connecting 116 and packaging body 114, further reduce the chi of whole photosensory assembly It is very little.

Specific in first embodiment, the non-photo-sensing area 1122 of photo-sensitive cell 112 is embedded in packaging body 114, conductive Connecting line 116 is embedded in packaging body 114 completely.Therefore, conductive connecting 116 will not be directly exposed to exterior space, so as to In the double camera module 100 of assembling so that conductive connecting 116 will not be touched damage by any, while reduce environment because Influence of the element to conductive connecting 116, such as temperature so that the electric connection between photo-sensitive cell 112 and substrate 111 is stable.

Certainly, in other embodiments, conductive connecting 116 can also be partly embedded in packaging body 114, part Packaging body 114 is exposed to, simplifies processing step.

Certainly, in other embodiments, the non-photo-sensing area 1122 of photo-sensitive cell 112 and the inwall of packaging body 114 There is safe spacing, the end that conductive connecting 116 is connected with the substrate 111 also inwall 114a with packaging body 114 between 114a Between there is safe spacing.That is, photo-sensitive cell 112 is directly exposed to outside packaging body 114 with conductive connecting 116, technical maturity, Cost is relatively low.

The top surface 114d of packaging body 114 is loading end, and loading end is used to install optical section 120, optical section 120 and occulter 115 are integrally formed.Specific in first embodiment, each optical section 120 each includes a voice coil motor 123, occulter 115 It is integrally formed with voice coil motor 123.That is, occulter 115 is to protrude the raised line to be formed from the bottom of voice coil motor 123, during assembling, sound The raised line of the bottom of coil motor 123 is embedded in opening 114c, and packaging body 114 and two voice coil motors 123 surround two light jointly Learn airtight cavity.

The top surface 114d of packaging body 114 is loading end, and loading end is used to install optical section 120.Specifically, can be by holding Glue-line is formed on section, optical section 120 forms optics airtight cavity by the glue-line of loading end with packaging body 114.Specifically, may be used Glue-line is formed on loading end in a manner of by dispensing or frame glue, then voice coil motor 123 is attached on loading end.

Occulter 115 is be bonded with packaging body 114 by glue-line.Such as the first guiding face on the first encapsulation side 1141 1143rd, glue-line is formed on the second guiding face 1151 and substrate 111 of occulter 115, voice coil motor 123 assembles with packaging body 114 When, occulter 115 is bonded to the one end on the first encapsulation side 1141 and the first surface 1111 of substrate 111 by glue-line respectively, with Block opening 114c.

Certainly, in other embodiments, optical section 120 can also include support, and voice coil motor is substituted using support 123, lens barrel 121 is arranged on support, and camera lens 122 is arranged in lens barrel 121, and support is integrally formed with occulter 115.That is, hide Body of light 115 is to protrude the raised line to be formed from the bottom of support.During assembling, the raised line of the bottom of support is embedded in opening 114c, Packaging body 114 surrounds optics airtight cavity jointly with support.In this embodiment, double camera modules 100 are to focus double shootings Module 100.Support is fitted by glue-line and packaging body 114.For example, loading end, the first guiding face that can be in packaging body 114 All glue coating on 1143, then encapsulates cradle fits to packaging body 114.

The specific assembling process of double camera modules 100 in first embodiment is as follows：

During encapsulation, there is provided substrate 111, two photo-sensitive cells 112 are first arranged to the first surface of substrate 111 1111, by way of routing, form conductive connecting 116, the both ends of conductive connecting 116 respectively with photo-sensitive cell 112 and Substrate 111 electrically connects.Then substrate 111 first surface 1111 formed by way of encapsulated moulding be set around two it is photosensitive The packaging body 114 of element 112, the packaging body 114 after shaping can not be dismantled from substrate 111.Packaging body 114 is included close to photosensitive The inwall 114a of the element 112 and outer wall 114b away from photo-sensitive cell 112, packaging body 114 include three and are spaced what is be oppositely arranged The second encapsulation side 1142 of the first encapsulation 1141 one end at 1141 and three first encapsulation of connection, per the two neighboring first encapsulation Form opening 114c between 1142 one end when 1141 are not connected with second encapsulation, opening 114c insertion inwall 114a with it is outer Wall 114b.

The photosensory assembly for having packaging body 114 to encapsulated moulding by the way of centrifugation is washed again integrally cleans, and cleans Rear cleansing medium carries dust on photo-sensitive cell 112 and impurity under the influence of centrifugal force, passes through opening 114c discharge envelopes Fill outside body 114, then block opening 114c with occulter 115.

Fig. 4 to Fig. 6 is referred to, is double camera modules 200 in second embodiment, this pair of camera module 200 includes easy Clean photosensory assembly 210 and two optical sections 220.Easy cleaning photosensory assembly 210 include 211, two photo-sensitive cells 212 of substrate, Electronic component 213, packaging body 214 and occulter 215.Each optical section 220 includes lens barrel 221 and camera lens 222, specific to second In embodiment, optical section 220 also includes voice coil motor 223, and lens barrel 221 is arranged in voice coil motor 223, and camera lens 222 is set In in lens barrel 221.I.e., in this second embodiment, double camera modules 200 are varifocal double camera modules.Double camera modules 200 Also include two optical filters 230, two optical filters 230 are respectively positioned at the top of two photo-sensitive cells 212.

Substrate 211 includes the first surface 2111 and second surface 2112 being oppositely arranged.Substrate 211 is wiring board, such as Can be hard circuit board, ceramic substrate 211 (without soft board), or Rigid Flex, or be soft board, work as substrate 211 when being soft board, stiffening plate can be set in the second surface 2112 of substrate 211, to strengthen the intensity of substrate 211.

Two photo-sensitive cells 212 are arranged at intervals at first surface 2111, and photo-sensitive cell 212 can be CCD (Charge- Coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide Semiconductor, Metal oxide semiconductor device).Photo-sensitive cell 212 is generally rectangle, square or circle.For example, specific to second In embodiment, photo-sensitive cell 212 is rectangle.

Photo-sensitive cell 212 includes the photosurface 212a and non-photo-sensing face 212b set back on photosurface 212a, non-photo-sensing Face 212b is arranged on the first surface 2111 of substrate 211 by glue-line.Photosurface 212a includes photosensitive area 2121 and non-photo-sensing Area 2122, photosensitive area 2121 are located at middle part, and non-photo-sensing area 2122 is set around photosensitive area 2121.Certainly, in other embodiment party In formula, non-photo-sensing area 2122 can also be only located at the side of photosensitive area 2121.Light is incident from camera lens 222 and reaches photosurface 212a, photosurface 212a convert optical signals into electric signal, and are transferred to by substrate 211 on connector.

Specific in second embodiment, each photo-sensitive cell 212 passes through conductive connecting 216 and the electricity of substrate 211 respectively Connection.Conductive connecting 216 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 216 respectively with Photo-sensitive cell 212 and substrate 211 are electrically connected, and conductive connecting 216 can be formed by way of just beating：Using wiring tool from Direction routing of the substrate 211 to photo-sensitive cell 212.Conductive connecting 216 can also be formed by way of counter beat：Use routing Direction routing of the instrument from photo-sensitive cell 212 to substrate 211.The camber of the conductive connecting 216 formed by the way of counter beat The conductive connecting 216 formed less than the just mode of beating.

Certainly, in other embodiments, the non-photo-sensing face 212b and substrate in photo-sensitive cell 212 can also be passed through Conductive bumps are set between 211, such as conductive bumps can be soldered ball, photo-sensitive cell 212 is electrically connected by soldered ball and substrate 211 Connect.

Electronic component 213 is arranged at the first surface 2111 of substrate 211, and electronic component 213 electrically connects with substrate 211. Specifically, electronic component 213 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.

Packaging body 214 winding, two encapsulated mouldings of photo-sensitive cell 212 are in the first surface 2111 of substrate 211, packaging body 214 Provided with the first holding tank 214 ' and the second holding tank 214 ", two photo-sensitive cells 212 are respectively positioned at the first holding tank 214 ' and the In two holding tanks 214 ".Packaging body 214 includes the inwall 214a close to photo-sensitive cell 212 and the outer wall away from photo-sensitive cell 212 214b, packaging body 214 are provided with opening 214c, the inwall 214a and outer wall 214b of opening 214c insertion packaging bodies 214.

Packaging body 214 can be formed at the first surface 2111 of substrate 211 by molded mode.For example, using Injection machine, after carrying out SMT (Surface Mount Technology, surface mounting technology) technique by insert molding technique Wiring board carry out molding and form packaging body 214, or form packaging body 214 with the mould pressing process commonly used in semiconductor packages. The mode that packaging body 214 is formed can select Shooting Technique or mould pressing process etc..Packaging body 214 and substrate after shaping 211 are firmly connected, and compared with conventional stent is bonded by glue-line, the bonding force between packaging body 214 and substrate 211 big will obtain It is more.

It can be nylon to use Shooting Technique to form the material of packaging body 214, LCP (Liquid Crystal Polymer, Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 214 is formed using mould pressing process Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.

Specific in second embodiment, packaging body 214 include two be spaced the first encapsulation side 2141 for being oppositely arranged and For two first encapsulation of connection in 2141 the second encapsulation 2142, the both ends on the second encapsulation side 2142 are located at two the first envelopes respectively The middle part of rim 2141, the first holding tank 214 ' and the second holding tank 214 " are separated out by the first encapsulation side 2141, two first Two opening 214c are formed between the end on encapsulation side 2141 respectively.I.e., in this second embodiment, the second encapsulation side 2142 is Encapsulation side is shared, the cross section of packaging body 214 is substantially in " H " type, and the quantity for the 214c that is open is two, and two are open 214c's Position is set in the opposite direction.After being cleaned to photo-sensitive cell 212, cleansing medium carries dust and impurity and discharges envelope from opening 214c Fill outside body 214.

Occulter 215 blocks opening 214c.Specific in second embodiment, because opening 214c quantity is two, The corresponding quantity of occulter 215 is also two.Occulter 215 is raised line, and raised line insertion is open in 214c to block opening 214c. When occulter 215 is raised line, raised line can encapsulate side as the 3rd of packaging body 214, can be that carrying optical section 220 provides supporting Active force, strengthen the intensity of packaging body 214.Certainly, in other embodiments, occulter 215 can also be a baffle plate, gear Plate can be embedded in opening 214c, or positioned at opening 214c side, as long as opening 214c can be blocked.

Specific in second embodiment, the inwall 214a on two the first relative encapsulation sides 2141 has flow-guiding structure, Flow-guiding structure is advantageous to guide the cleansing medium in packaging body 214 to be discharged by opening 214c outside packaging body 214.For example, can be with Inwall 214a at the both ends on the first encapsulation side 2141 has flow-guiding structure.

Specific in second embodiment, two relative first encapsulate the distance between the inwall 214a on side 2141 and lean on certainly The gradual increase in side that the one of nearly substrate 211 is laterally away from substrate 211 forms flow-guiding structure.That is, the 214c that is open is up big and down small Structure, not only contribute to smoothly discharge cleansing medium, also help packaging body 214 be molded after the demoulding.Flow-guiding structure is led Flow direction relatively to coincide with centrifugal force direction ratio, during eccentric cleaning, cleaning liquid is flowed out than non-water conservancy diversion from flow-guiding structure Structure flows out, and cleaning liquid outflow is more smooth, and more thoroughly, cleaning performance is more preferable.

Certainly, in other embodiments, the distance between the side wall on two relative first encapsulation sides 2141 is leaned on certainly Nearly second encapsulation 2142 one end when 2142 one end is to away from the second encapsulation, which gradually increases, forms flow-guiding structure.That is, it is open 214c is the big structure in the small outside in inner side, is advantageous to smoothly discharge cleansing medium.Certainly, flow-guiding structure can also be other shapes Formula, as long as flow-guiding structure can be played.

Encapsulated specific in second embodiment, form opening 214c two first when 2141 encapsulate away from second 2142 one end is provided with the first guiding face 2143, and occulter 215 is provided with second guiding face corresponding with the first guiding face 2143 2151.By the mutual cooperation of the first guiding face 2143 and the second guiding face 2151, be advantageous to occulter 215 and block opening 214c When positioning.

Specific in second embodiment, the first guiding face 2143 is lateral away from substrate 211 1 from the first encapsulation side 2141 Extension is tilted close to the side of substrate 211 and is gradually distance from the second encapsulation side 2142.That is, the one end on the first encapsulation side 2141 is in wedge Shape.Accordingly, the second guiding face 2151 on occulter 215 is engaged with the first guiding face 2143, is embodied on occulter 215 To tilt extension and away from close to the second encapsulation side away from the laterally closer side of substrate 211 of substrate 211 1 from occulter 215 2142.That is, occulter 215 is in reverse wedge shape.

Certainly, in other implementations, the first guiding face 2143 encapsulates side 2141 close to the side of substrate 211 from first Extend and be gradually distance from the second encapsulation side 2142 to being tilted away from the side of substrate 211.That is, the one end on the first encapsulation side 2141 is in Wedge shape.Accordingly, the second guiding face 2151 on occulter 215 is engaged with the first guiding face 2143, is embodied in occulter 215 Upper is to tilt extension away from the laterally closer side of substrate 211 of substrate 211 1 from occulter 215 and move closer to the second encapsulation side 2142.That is, occulter 215 is wedge shaped.

Certainly, in other implementations, first guiding face 2143 on the first encapsulation side 2141 can also be vertical plane, Now the second guiding face 2151 of occulter 215 is also vertical plane to be engaged with the first guiding face 2143.

Specific in second embodiment, electronic component 213 is arranged at the first surface 2111 of substrate 211, and is embedded at In packaging body 214.Therefore, electronic component 213 is covered by packaging body 214, will not be directly exposed in space, more specifically Say, be not exposed in the environment that is communicated with photo-sensitive cell 212, so as to when being assembled into double camera modules 200, electronic component The pollutants such as dust will not be infected with 213, also do not interfere with photo-sensitive cell 212, avoid polluting sensitive chip and causing double shootings There are the bad phenomenons such as dirty stain in module 200.

Specific in second embodiment, the non-photo-sensing area 2122 of photo-sensitive cell 212 and the inwall 214a of packaging body 214 it Between there is safe spacing, the end that conductive connecting 216 is connected with substrate 211 also has between the inwall 214a of packaging body 214 There is safe spacing.That is, photo-sensitive cell 212 and conductive connecting 216 is directly exposed to outside packaging body 214, technical maturity, cost compared with It is low.

Certainly, in other embodiments, the non-photo-sensing area 2122 of photo-sensitive cell 212 is embedded in packaging body 214, is led Electric connection line 216 is embedded in packaging body 214 completely.Therefore, conductive connecting 216 will not be directly exposed to exterior space, from And in the double camera modules 200 of assembling so that conductive connecting 216 will not be by any damage of touching, while reduces environment Influence of the factor to conductive connecting 216, such as temperature so that the electric connection between photo-sensitive cell 212 and substrate 211 is stable.

Certainly, in other embodiments, conductive connecting 216 can also be partly embedded in packaging body 214, part Packaging body 214 is exposed to, simplifies processing step.

The top surface 214d of packaging body 214 is loading end, and loading end is used to install optical section 220, optical section 220 and occulter 215 are integrally formed.Specific in second embodiment, each optical section 220 each includes a voice coil motor 223, occulter 215 It is integrally formed with voice coil motor 223.That is, occulter 215 is to protrude the raised line to be formed from the bottom of voice coil motor 223, during assembling, sound The raised line of the bottom of coil motor 223 is embedded in opening 214c, and packaging body 214 and two voice coil motors 223 surround two light jointly Learn airtight cavity.

The top surface 214d of packaging body 214 is loading end, and loading end is used to install optical section 220.Specifically, can be by holding Glue-line is formed on section, optical section 220 forms optics airtight cavity by the glue-line of loading end with packaging body 214.Specifically, may be used Glue-line is formed on loading end in a manner of by dispensing or frame glue, then voice coil motor 223 is attached on loading end.

Occulter 215 is be bonded with packaging body 214 by glue-line.Such as the first guiding face on the first encapsulation side 2141 2143rd, glue-line is formed on the second guiding face 2151 and substrate 211 of occulter 215, voice coil motor 223 assembles with packaging body 214 When, occulter 215 is bonded to the one end on the first encapsulation side 2141 and the first surface 2111 of substrate 211 by glue-line respectively, with Block opening 214c.

Certainly, in other embodiments, optical section 220 can also include support, and voice coil motor is mentioned using support 223, lens barrel 221 is arranged on support, and camera lens 222 is arranged in lens barrel 221, and support is integrally formed with occulter 215.That is, hide Body of light 215 is to protrude the raised line to be formed from the bottom of support.During assembling, the raised line of the bottom of support is embedded in opening 214c, Packaging body 214 surrounds optics airtight cavity jointly with support.In this embodiment, double camera modules 200 are to focus double shootings Module 200.Support is fitted by glue-line and packaging body 214.For example, loading end, the first guiding face that can be in packaging body 214 All glue coating on 2143, then encapsulates cradle fits to packaging body 214.

The specific assembling process of double camera modules 200 in second embodiment is as follows：

During encapsulation, there is provided substrate 211, two photo-sensitive cells 212 are first arranged to the first surface of substrate 211 2111, by way of routing, form conductive connecting 216, the both ends of conductive connecting 216 respectively with photo-sensitive cell 212 and Substrate 211 electrically connects.Then substrate 211 first surface 2111 formed by way of encapsulated moulding be set around two it is photosensitive The packaging body 214 of element 212, the packaging body 214 after shaping can not be dismantled from substrate 211.Packaging body 214 is included close to photosensitive The inwall 214a of the element 212 and outer wall 214b away from photo-sensitive cell 212, packaging body 214 include two and are spaced what is be oppositely arranged First encapsulates at 2141 and two first encapsulation of connection 2141 the second encapsulation side 2142, and the both ends on the second encapsulation side 2142 are divided Not Wei Yu two first encapsulation side 2141 middle parts, by first encapsulation side 2141 be separated out the first holding tank 214 ' with second receiving Groove 214 ", two opening 214c, opening 214c insertions inwall 214a are formed respectively between the ends on two first encapsulation sides 2141 With outer wall 214b.

The photosensory assembly for having packaging body 214 to encapsulated moulding by the way of centrifugation is washed again integrally cleans, and cleans Rear cleansing medium carries dust on photo-sensitive cell 212 and impurity under the influence of centrifugal force, passes through opening 214c discharge envelopes Fill outside body 214, then block opening 214c with occulter 215.

Fig. 7 to Fig. 9 is referred to, is double camera modules 300 in the 3rd embodiment, this pair of camera module 300 includes easy Clean photosensory assembly 310 and two optical sections 320.Easy cleaning photosensory assembly 310 include 311, two photo-sensitive cells 312 of substrate, Electronic component 313, packaging body 314 and occulter 315.Each optical section 320 includes lens barrel 321 and camera lens 322, specific to the 3rd In embodiment, optical section 320 also includes voice coil motor 323, and lens barrel 321 is arranged in voice coil motor 323, and camera lens 322 is set In in lens barrel 321.I.e., in the third embodiment, double camera modules 300 are varifocal double camera modules.Double camera modules 300 Also include two optical filters 330, two optical filters 330 are respectively positioned at the top of two photo-sensitive cells 312.

Substrate 311 includes the first surface 3111 and second surface 3112 being oppositely arranged.Substrate 311 is wiring board, such as Can be hard circuit board, ceramic substrate 311 (without soft board), or Rigid Flex, or be soft board, work as substrate 311 when being soft board, stiffening plate can be set in the second surface 3112 of substrate 311, to strengthen the intensity of substrate 311.

Two photo-sensitive cells 312 are arranged at intervals at first surface 3111, and photo-sensitive cell 312 can be CCD (Charge- Coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide Semiconductor, Metal oxide semiconductor device).Photo-sensitive cell 312 is generally rectangle, square or circle.For example, specific to the 3rd In embodiment, photo-sensitive cell 312 is rectangle.

Photo-sensitive cell 312 includes photosurface and the non-photo-sensing face set back on photosurface, and non-photo-sensing face is set by glue-line It is placed on the first surface 3111 of substrate 311.Photosurface includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, non-photo-sensing Area is set around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only located at the side of photosensitive area.Light Line is incident from camera lens 322 and reaches photosurface, and photosurface converts optical signals into electric signal, and passes through the company of being transferred to of substrate 311 Connect on device.

Specific in the 3rd embodiment, each photo-sensitive cell 312 passes through conductive connecting 316316 and substrate 311 respectively Electrical connection.Conductive connecting 316 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends difference of conductive connecting 316 Electrically connected with photo-sensitive cell 312 and substrate 311, conductive connecting 316 can be formed by way of just beating：Use wiring tool From substrate 311 to the direction routing of photo-sensitive cell 312.Conductive connecting 316 can also be formed by way of counter beat：Using beating Direction routing of the Line tool from photo-sensitive cell 312 to substrate 311.The arc of the conductive connecting 316 formed by the way of counter beat Height is less than the conductive connecting 316 that just mode of beating is formed.

Certainly, in other embodiments, can also by the non-photo-sensing face of photo-sensitive cell 312 and substrate 311 it Between conductive bumps are set, such as conductive bumps can be soldered ball, and photo-sensitive cell 312 is electrically connected by soldered ball with substrate 311.

Electronic component 313 is arranged at the first surface 3111 of substrate 311, and electronic component 313 electrically connects with substrate 311. Specifically, electronic component 313 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.

Packaging body 314 winding, two encapsulated mouldings of photo-sensitive cell 312 are in the first surface 3111 of substrate 311, packaging body 314 Provided with the first holding tank 314 ' and the second holding tank 314 ", two photo-sensitive cells 312 are respectively positioned at the first holding tank 314 ' and the In two holding tanks 314 ".Packaging body 314 includes the inwall 314a close to photo-sensitive cell 312 and the outer wall away from photo-sensitive cell 312 314b, packaging body 314 are provided with opening 314c, the inwall 314a and outer wall 314b of opening 314c insertion packaging bodies 314.

Packaging body 314 can be formed at the first surface 3111 of substrate 311 by molded mode.For example, using Injection machine, after carrying out SMT (Surface Mount Technology, surface mounting technology) technique by insert molding technique Wiring board carry out molding and form packaging body 314, or form packaging body 314 with the mould pressing process commonly used in semiconductor packages. The mode that packaging body 314 is formed can select Shooting Technique or mould pressing process etc..Packaging body 314 and substrate after shaping 311 are firmly connected, and compared with conventional stent is bonded by glue-line, the bonding force between packaging body 314 and substrate 311 big will obtain It is more.

It can be nylon to use Shooting Technique to form the material of packaging body 314, LCP (Liquid Crystal Polymer, Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 314 is formed using mould pressing process Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.

Packaging body 314 includes the first encapsulation part and the second encapsulation part, and the first encapsulation part and the second encapsulation part are four frames Shape, including four end to end encapsulation sides, the first encapsulation part and the second encapsulation part is adjacent and shared adjacent package side, the first envelope The unshared encapsulation in dress portion while and offer at least two spaced openings respectively during the unshared encapsulation of the second encapsulation part 314c。

For example, the first encapsulation part is four frame shapes, therefore with three in unshared encapsulation, wherein a unshared envelope Rim offers an opening 314c, or offers at least two opening 314c.Or wherein the unshared encapsulation side in both sides is divided An opening 314c is not offered be out of stock offer at least two opening 314c.Or three all offer in unshared encapsulation One opening 314c, or offer at least two.

Similarly, the second encapsulation part is also four frame shapes, therefore with three in unshared encapsulation, wherein one is unshared Encapsulation side offer an opening 314c, or offer at least two opening 314c.Or the wherein unshared encapsulation in both sides Side offers an opening 314c respectively is out of stock and offers at least two opening 314c.Or three all open in unshared encapsulation Provided with an opening 314c, or offer at least two.

Specific in the 3rd embodiment, the first encapsulation part is four frame shapes, wherein non-common encapsulation side offers one Be open 314c, and the 314c that is open is through to the top surface of packaging body 314 from the bottom surface of packaging body 314.Opening 314c is opened in together With encapsulation in that relative encapsulation on.Second encapsulation part is four frame shapes, wherein non-common encapsulation side offers one and opened Mouth 314c, and the 314c that is open is through to the top surface of packaging body 314 from the bottom surface of packaging body 314.Opening 314c is opened in and shared Encapsulate in that relative encapsulation.Therefore, two the in opposite direction of 314c that are open.After being cleaned to photo-sensitive cell 312, cleaning Medium (such as water or other cleaning fluids) carries dust and impurity outside opening 314c discharge packaging bodies 314.

Occulter 315 blocks opening 314c.Specific in the 3rd embodiment, because opening 314c quantity is two, The quantity of occulter 315 also corresponds to two.Occulter 315 is projection, and projection insertion is open in 314c to block opening 314c. When occulter 315 is projection, optical section 320 is together carried with encapsulation side after projection insertion opening 314c, to carry optical section 320 Carrying active force is provided, strengthens the intensity of packaging body 314.Certainly, in other embodiments, occulter 315 can also be The small front apron suitable with opening 314c areas, small front apron can be embedded in opening 314c, or small front apron can be located at opening 314c side, as long as opening 314c can be sheltered from.

There is flow-guiding structure, water conservancy diversion knot specific to the two lateral walls for the opening 314c in the 3rd embodiment, encapsulating side Structure is advantageous to guide the cleansing medium in packaging body 314 to be discharged by opening 314c outside packaging body 314.For example, encapsulation side is opened The distance between mouth 314c two lateral walls gradually increase shape from the side for being laterally away from substrate 311 close to substrate 311 Into flow-guiding structure.That is, the 314c that is open is up big and down small structure, not only contributes to smoothly discharge cleansing medium, also helps into The demoulding after type.

Certainly, in other embodiments, the distance between the opening 314c two lateral walls on side are encapsulated from close To outer wall 314b directions, gradually increase forms flow-guiding structure to inwall 314a.That is, the 314c that is open is the big structure in the small outside in inner side, is had Beneficial to smooth discharge cleansing medium.

Specific in the 3rd embodiment, electronic component 313 is arranged at the first surface 3111 of substrate 311, and is embedded at In packaging body 314.Therefore, electronic component 313 is covered by packaging body 314, will not be directly exposed in space, more specifically Say, be not exposed in the environment that is communicated with photo-sensitive cell 312, so as to when being assembled into double camera modules 300, electronic component The pollutants such as dust will not be infected with 313, also do not interfere with photo-sensitive cell 312, avoid polluting sensitive chip and causing double shootings There are the bad phenomenons such as dirty stain in module 300.

Certainly, in other embodiments, electronic component 313 is arranged at the first surface 3111 of substrate 311, and is located at Outside packaging body 314.That is, electronic component 313 is not wrapped by packaging body 314, thus the heat dispersion of electronic component 313 compared with It is good.Electronic component 313 be located at packaging body 314 it is outer when in two kinds of situation：Electronic component 313 is located at the inwall 314a of packaging body 314 Side, the good heat dispersion performance of electronic component 313；Electronic component 313 is located at the outer wall 314b sides of packaging body 314, can subtract Safe distance between the inwall 314a of small conductive connecting 316 and packaging body 314, further reduce the chi of whole photosensory assembly It is very little.

Specific in the 3rd embodiment, have between the non-photo-sensing area of photo-sensitive cell 312 and the inwall 314a of packaging body 314 There is safe spacing, the end that conductive connecting 316 is connected with substrate 311 also has peace between the inwall 314a of packaging body 314 Full spacing.That is, photo-sensitive cell 312 is directly exposed to outside packaging body 314 with conductive connecting 316, technical maturity, and cost is relatively low.

Certainly, in other embodiments, the non-photo-sensing area of photo-sensitive cell 312 is embedded in packaging body 314, and conduction is even Wiring 316 is embedded in packaging body 314 completely.Therefore, conductive connecting 316 will not be directly exposed to exterior space, so that During assembling pair camera module 300 so that conductive connecting 316 will not be touched damage by any, while reduce environmental factor Influence to conductive connecting 316, such as temperature so that the electric connection between photo-sensitive cell 312 and substrate 311 is stable.Or Conductive connecting 316 can also be partly embedded in packaging body 314, partly expose to packaging body 314, simplify processing step.

The top surface 314d of packaging body 314 is loading end, and loading end is used to install optical section 320, optical section 320 and occulter 315 are integrally formed.Specific in the 3rd embodiment, optical section 320 includes voice coil motor 323, occulter 315 and voice coil motor 323 are integrally formed.That is, occulter 315 is to protrude the projection to be formed from the bottom of voice coil motor 323, during assembling, voice coil motor 323 The projection of bottom is embedded in opening 314c, and packaging body 314 surrounds optics airtight cavity jointly with voice coil motor 323.

The top surface 314d of packaging body 314 is loading end, and loading end is used to install optical section 320.Specifically, can be by holding Glue-line is formed on section, optical section 320 forms optics airtight cavity by the glue-line of loading end with packaging body 314.Specifically, may be used Glue-line is formed on loading end in a manner of by dispensing or frame glue, then voice coil motor 323 is attached on loading end.

Occulter 315 is be bonded with packaging body 314 by glue-line.Such as encapsulation side opening 314c at side wall, bottom And the side wall of occulter 315 and bottom are respectively coated glue-line, then voice coil motor 323 is assembled on packaging body 314, so that envelope Fill body 314 and voice coil motor 323 forms optics airtight cavity.

Certainly, in other embodiments, optical section 320 can also include support, and voice coil motor is mentioned using support 323, lens barrel 321 is arranged on support, and camera lens 322 is arranged in lens barrel 321, and support is integrally formed with occulter 315.That is, hide Body of light 315 is to protrude the projection to be formed from the bottom of support.During assembling, the projection of the bottom of support is embedded in opening 314c, Packaging body 314 surrounds optics airtight cavity jointly with support.In this embodiment, double camera modules 300 are to focus double shootings Module 300.Support is fitted by glue-line and packaging body 314.For example, can be in the loading end glue coating of packaging body 314, so Cradle fits are packaged on packaging body 314 afterwards.

The specific assembling process of double camera modules 300 in 3rd embodiment is as follows：

During encapsulation, there is provided substrate 311, two photo-sensitive cells 312 are first arranged to the first surface of substrate 311 3111, by way of routing, form conductive connecting 316, the both ends of conductive connecting 316 respectively with photo-sensitive cell 312 and Substrate 311 electrically connects.Then substrate 311 first surface 3111 formed by way of encapsulated moulding be set around two it is photosensitive The packaging body 314 of element 312, the packaging body 314 after shaping can not be dismantled from substrate 311.Packaging body 314 is included close to photosensitive The inwall 314a of element 312 and the outer wall 314b away from photo-sensitive cell 312, packaging body 314 include the first encapsulation part and the second envelope Dress portion, the first encapsulation part and the second encapsulation part are four frame shapes, including four end to end encapsulation sides, the first encapsulation part and The high non-conterminous and shared adjacent package side of second phoenix group, the unshared encapsulation side of the first encapsulation part and the second encapsulation part are unshared Encapsulation side offer at least two spaced opening 314c respectively

The photosensory assembly for having packaging body 314 to encapsulated moulding by the way of centrifugation is washed again integrally cleans, and cleans Rear cleansing medium carries dust on photo-sensitive cell 312 and impurity under the influence of centrifugal force, passes through opening 314c discharge envelopes Fill outside body 314, then block opening 314c with occulter 315.

Figure 10 to Figure 12 is referred to, is double camera modules 400 in the 4th embodiment.This pair of camera module 400 includes Easy cleaning photosensory assembly 410 and two optical sections 420.Easy cleaning photosensory assembly 410 includes 411, two photo-sensitive cells of substrate 412nd, electronic component 413, packaging body 414 and occulter 415.Each optical section 420 includes lens barrel 421 and camera lens 422, specific to In 4th embodiment, optical section 420 also includes voice coil motor 423, and lens barrel 421 is arranged in voice coil motor 423, camera lens 422 It is arranged in lens barrel 421.That is, in the 4th embodiment, double camera modules 400 are varifocal double camera modules.Double shooting moulds Group 400 also includes two optical filters 430, and two optical filters 430 are respectively positioned at the top of two photo-sensitive cells 412.

Substrate 411 includes the first surface 4111 and second surface 4112 being oppositely arranged.Substrate 411 is wiring board, such as Can be hard circuit board, ceramic substrate 411 (without soft board), or Rigid Flex, or be soft board, work as substrate 411 when being soft board, stiffening plate can be set in the second surface 4112 of substrate 411, to strengthen the intensity of substrate 411.

Two photo-sensitive cells 412 are arranged at intervals at first surface 4111, and photo-sensitive cell 412 can be CCD (Charge- Coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide Semiconductor, Metal oxide semiconductor device).Photo-sensitive cell 412 is generally rectangle, square or circle.For example, specific to the 4th In embodiment, photo-sensitive cell 412 is rectangle.

Photo-sensitive cell 412 includes photosurface and the non-photo-sensing face set back on photosurface, and non-photo-sensing face is set by glue-line It is placed on the first surface 4111 of substrate 411.Photosurface includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, non-photo-sensing Area is set around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only located at the side of photosensitive area.Light Line is incident from camera lens 422 and reaches photosurface, and photosurface converts optical signals into electric signal, and passes through the company of being transferred to of substrate 411 Connect on device.

Specific in the 4th embodiment, each photo-sensitive cell 412 passes through conductive connecting 416 and the electricity of substrate 411 respectively Connection.Conductive connecting 416 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 416 respectively with Photo-sensitive cell 412 and substrate 411 are electrically connected, and conductive connecting 416 can be formed by way of just beating：Using wiring tool from Direction routing of the substrate 411 to photo-sensitive cell 412.Conductive connecting 416 can also be formed by way of counter beat：Use routing Direction routing of the instrument from photo-sensitive cell 412 to substrate 411.The camber of the conductive connecting 416 formed by the way of counter beat The conductive connecting 416 formed less than the just mode of beating.

Electronic component 413 is arranged at the first surface 4111 of substrate 411, and electronic component 413 electrically connects with substrate 411. Specifically, electronic component 413 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.

Packaging body 414 winding, two encapsulated mouldings of photo-sensitive cell 412 are in the first surface 4111 of substrate 411, packaging body 414 Provided with the first holding tank and the second holding tank, two photo-sensitive cells 412 are respectively in the first holding tank and the second holding tank.Envelope Filling body 414 includes the inwall 414a close to the photo-sensitive cell 412 and outer wall 414b away from photo-sensitive cell 412, and packaging body 414 is provided with Be open 414c, the inwall 414a and outer wall 414b of opening 414c insertion packaging bodies 414.

Packaging body 414 can be formed at the first surface 4111 of substrate 411 by molded mode.For example, using Injection machine, after carrying out SMT (Surface Mount Technology, surface mounting technology) technique by insert molding technique Wiring board carry out molding and form packaging body 414, or form packaging body 414 with the mould pressing process commonly used in semiconductor packages. The mode that packaging body 414 is formed can select Shooting Technique or mould pressing process etc..Packaging body 414 and substrate after shaping 411 are firmly connected, and compared with conventional stent is bonded by glue-line, the bonding force between packaging body 414 and substrate 411 big will obtain It is more.

It can be nylon to use Shooting Technique to form the material of packaging body 414, LCP (Liquid Crystal Polymer, Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 414 is formed using mould pressing process Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.

Packaging body 414 includes the first encapsulation part and the second encapsulation part, and the first encapsulation part is four frame shapes, including four head and the tail Connected encapsulation side, the second encapsulation part are four frame shapes, including four end to end encapsulation sides, the first encapsulation part and the second envelope Dress portion is adjacent and shared adjacent package side.First encapsulation part has three in unshared encapsulation, and two of which is with sharing encapsulation While adjacent non-common encapsulation while on offer opening 414c respectively.Second encapsulation part has three in unshared encapsulation, Two of which with share encapsulation while adjacent non-common encapsulate while on offer opening 414c respectively.414c be open from packaging body 414 bottom surface is through to the top surface of packaging body 414.That is, in the 4th embodiment, the quantity for the 414c that is open is four, and point It Wei Yu not encapsulated with shared on when adjacent non-common encapsulates.

Occulter 415 blocks opening 414c.Specific in the 4th embodiment, because opening 414c quantity is four, The quantity of occulter 415 also corresponds to four.Occulter 415 is projection, and projection insertion is open in 414c to block opening 414c. When occulter 415 is projection, optical section 420 is together carried with encapsulation side after projection insertion opening 414c, to carry optical section 420 Carrying active force is provided, strengthens the intensity of packaging body 414.Certainly, in other embodiments, occulter 415 can also be The small front apron suitable with opening 414c areas, small front apron can be embedded in opening 414c, or small front apron can be located at opening 414c side, as long as opening 414c can be sheltered from.

The top surface of packaging body 414 is loading end, and loading end is used to install optical section 420, optical section 420 and occulter 415 It is integrally formed.Specific in the 4th embodiment, each optical section 420 each includes a voice coil motor 423, occulter 415 and Voice coil motor 423 is integrally formed.That is, occulter 415 is to protrude the projection to be formed from the bottom of voice coil motor 423, during assembling, voice coil loudspeaker voice coil The projection of the bottom of motor 423 is embedded in opening 414c, and packaging body 414 and two voice coil motors 423 surround two optics jointly Airtight cavity.

The top surface of packaging body 414 is loading end, and loading end is used to install optical section 420.Specifically, can be by loading end Upper formation glue-line, optical section 420 form optics airtight cavity by the glue-line of loading end with packaging body 414.Specifically, Ke Yitong The mode for crossing dispensing or frame glue forms glue-line on loading end, and then voice coil motor 423 is attached on loading end.

Figure 13 and Figure 14 is referred to, is double camera modules 500 in the 5th embodiment.This pair of camera module 500 includes Easy cleaning photosensory assembly 510 and two optical section (not shown).Easy cleaning photosensory assembly 510 includes 511, two photosensitive members of substrate Part 512, electronic component 513, packaging body 514 and occulter 515.Each optical section includes lens barrel and camera lens, real specific to the 5th Apply in mode, optical section also includes voice coil motor, and lens barrel is arranged in voice coil motor, and camera lens is arranged in lens barrel.That is, the 5th In embodiment, double camera modules 500 are varifocal double camera modules 500.Double camera modules 500 also include two optical filters 530, two optical filters 530 are respectively positioned at the top of two photo-sensitive cells 512.

Substrate 511 includes the first surface and second surface being oppositely arranged.Substrate 511 is wiring board, such as can be hard Matter circuit board, ceramic substrate (without soft board), or Rigid Flex, or be soft board, when substrate 511 is soft board, Stiffening plate can be set in the second surface of substrate 511, to strengthen the intensity of substrate 511.

Two photo-sensitive cells 512 are arranged at intervals at first surface, and photo-sensitive cell 512 can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide Semiconductor, metal oxidation Thing semiconductor element).Photo-sensitive cell 512 is generally rectangle, square or circle.For example, specific to the 5th embodiment In, photo-sensitive cell 512 is rectangle.

Photo-sensitive cell 512 includes photosurface and the non-photo-sensing face set back on photosurface, and non-photo-sensing face is set by glue-line It is placed on the first surface of substrate 511.Photosurface includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, and non-photo-sensing area encloses Set around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only located at the side of photosensitive area.Light from Camera lens is incident and reaches photosurface, and photosurface converts optical signals into electric signal, and is transferred to by substrate 511 on connector.

Specific in the 5th embodiment, each photo-sensitive cell 512 passes through conductive connecting 516 and the electricity of substrate 511 respectively Connection.Conductive connecting 516 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 516 respectively with Photo-sensitive cell 512 and substrate 511 are electrically connected, and conductive connecting 516 can be formed by way of just beating：Using wiring tool from Direction routing of the substrate 511 to photo-sensitive cell 512.Conductive connecting 516 can also be formed by way of counter beat：Use routing Direction routing of the instrument from photo-sensitive cell 512 to substrate 511.The camber of the conductive connecting 516 formed by the way of counter beat The conductive connecting 516 formed less than the just mode of beating.

Electronic component 513 is arranged at the first surface of substrate 511, and electronic component 513 electrically connects with substrate 511.Specifically Ground, electronic component 513 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver.

Packaging body 514 winding, two encapsulated mouldings of photo-sensitive cell 512 are provided with the first surface of substrate 511, packaging body 514 First holding tank and the second holding tank, two photo-sensitive cells 512 are respectively in the first holding tank and the second holding tank.Packaging body 514 include the inwall 514a close to the photo-sensitive cell 512 and outer wall 514b away from photo-sensitive cell 512, and packaging body 514 is provided with opening 514c, the inwall 514a and outer wall 514b of opening 514c insertion packaging bodies 514.

Packaging body 514 can be formed at the first surface of substrate 511 by molded mode.For example, using injection Machine, the line after SMT (Surface Mount Technology, surface mounting technology) technique will be carried out by insert molding technique Road plate carries out molding and forms packaging body 514, or forms packaging body 514 with the mould pressing process commonly used in semiconductor packages.Encapsulation The mode that body 514 is formed can select Shooting Technique or mould pressing process etc..Packaging body 514 and the jail of substrate 511 after shaping Solid phase connects, and compared with conventional stent is bonded by glue-line, the bonding force between packaging body 514 and substrate 511 is much greater.

It can be nylon to use Shooting Technique to form the material of packaging body 514, LCP (Liquid Crystal Polymer, Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 514 is formed using mould pressing process Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.

Packaging body 514 includes the first encapsulation part and the second encapsulation part, and the first encapsulation part is four frame shapes, including four head and the tail Connected encapsulation side, the second encapsulation part are four frame shapes, including four end to end encapsulation sides, the first encapsulation part and the second envelope Dress portion is adjacent and shared adjacent package side.First encapsulation part has three in unshared encapsulation, and three in unshared encapsulation All offer opening 514c.Second encapsulation part has three in unshared encapsulation, and three all offer in unshared encapsulation Be open 514c.Opening 514c is the groove formed that is recessed from the bottom surface of packaging body 514 to the top surface of packaging body 514.That is, it is open 514c is the groove for the top surface for not running through packaging body 514.

Occulter 515 blocks opening 514c.Specific in the 5th embodiment, occulter 515 is projection, and projection insertion is opened To block opening 514c in mouthful 514c.When occulter 515 is projection, together held with packaging body 514 after projection insertion opening 514c Optical section is carried, carrying active force is provided for carrying optical section, strengthens the intensity of packaging body 514.Certainly, in other embodiments In, occulter 515 can also be the small front apron suitable with opening 514c areas, and small front apron can be embedded in opening 514c, or Small front apron can be located at opening 514c side, as long as opening 514c can be blocked.

The top surface of packaging body 514 is loading end, and loading end is used to install optical section.Specific in the 5th embodiment, light The department of the Chinese Academy of Sciences includes voice coil motor.The projection of occulter 515, during assembling, projection is embedded in opening 514c.Occulter 515 and voice coil loudspeaker voice coil horse Up to for two relatively independent parts.

The top surface of packaging body 514 is loading end, and loading end is used to install optical section.Specifically, can be by loading end Glue-line is formed, optical section forms optics airtight cavity by the glue-line of loading end with packaging body 514.Specifically, can pass through a little The mode of glue or frame glue forms glue-line on loading end, and then voice coil motor is attached on loading end.

Occulter 515 is be bonded with packaging body 514 by glue-line.Such as encapsulation side opening 514c at side wall, bottom And the side wall of occulter 515 and bottom are respectively coated glue-line, then occulter 515 is embedded on packaging body 514, so that shading Body 515 blocks opening 514c.

Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (31)

1. A kind of 1. easy cleaning photosensory assembly, it is characterised in that including：

   Substrate, including the first surface and second surface being oppositely arranged；

   At least two photo-sensitive cells, it is arranged at intervals at the first surface；

   Packaging body, photo-sensitive cell encapsulated moulding described in winding is in being arranged at the first surface, and the packaging body is provided with least two Individual holding tank, respectively in the holding tank, the packaging body is included close to the interior of the photo-sensitive cell photo-sensitive cell Wall and the outer wall away from the photo-sensitive cell, the packaging body are provided with opening, and the opening penetrates the inwall and the outer wall.
2. 2. easy cleaning photosensory assembly according to claim 1, it is characterised in that the quantity of the photo-sensitive cell is two, The quantity of the holding tank is two, and respectively the first holding tank and the second holding tank, the packaging body include the first encapsulation part And second encapsulation part, first encapsulation part are in frame shape and including multiple end to end encapsulation sides, second encapsulation part Frame shape and including multiple end to end encapsulation sides, first encapsulation part is adjacent with second encapsulation part and shared adjacent envelope Rim, wherein the non-common encapsulation side of first encapsulation part opens up opening, wherein the non-common of second encapsulation part Encapsulation side offers opening, and the size of the opening can allow for the photo-sensitive cell to pass through.
3. 3. easy cleaning photosensory assembly according to claim 1, it is characterised in that the quantity of the photo-sensitive cell is two, The quantity of the holding tank is two, respectively the first holding tank and the second holding tank, and the packaging body includes three interval phases To the first of setting the encapsulation while and one end during first encapsulation of connection three the second encapsulation side, per two neighboring described the The one end of one encapsulation when being not connected with second encapsulation is collectively forming an opening.
4. 4. easy cleaning photosensory assembly according to claim 1, it is characterised in that it is relative that the packaging body includes two intervals The second encapsulation side when first set encapsulates while and connect two first encapsulation, the both ends on the second encapsulation side are distinguished Positioned at the middle part on two the first encapsulation sides, the first holding tank and the second holding tank are separated out by the described first encapsulation side, two Two openings are formed respectively between the end on the individual first encapsulation side.
5. 5. the easy cleaning photosensory assembly according to claim 3 or 4, it is characterised in that two relative first encapsulation The inwall on side has flow-guiding structure.
6. 6. easy cleaning photosensory assembly according to claim 5, it is characterised in that two relative described first encapsulate side The distance between inwall gradually increases from the side that the substrate is laterally away from close to the one of the substrate and forms the water conservancy diversion knot Structure；Or

   Two relative first encapsulation while the distance between inwall from close to the described second encapsulation while one end to remote Gradually increase forms the flow-guiding structure for the one end on the second encapsulation side.
7. 7. easy cleaning photosensory assembly according to claim 4, it is characterised in that also hidden including occulter, the occulter Keep off the opening.
8. 8. easy cleaning photosensory assembly according to claim 7, it is characterised in that form two described first of the opening Encapsulate outlying one end from the described second encapsulation side and be provided with the first guiding face, the occulter is provided with and the first guiding face phase Corresponding second guiding face.
9. 9. easy cleaning photosensory assembly according to claim 8, it is characterised in that first guiding face is from first envelope Rim tilts extension away from the laterally closer substrate side of the substrate one and is gradually distance from the second encapsulation side.
10. 10. easy cleaning photosensory assembly according to claim 8, it is characterised in that first guiding face is from described first Encapsulation is when being laterally away from the substrate side inclination extension close to the substrate one and being gradually distance from second encapsulation.
11. 11. the easy cleaning photosensory assembly according to claim 7 to 10 any one, it is characterised in that the occulter leads to It is Nian Jie with the packaging body to cross glue-line.
12. 12. the easy cleaning photosensory assembly according to claim 7 to 10 any one, it is characterised in that the packaging body Top surface is loading end, and the loading end is used to install optical section, the optical section and the shading body by integral forming.
13. 13. easy cleaning photosensory assembly according to claim 1, it is characterised in that the packaging body includes the first encapsulation part And second encapsulation part, first encapsulation part and second encapsulation part are four frame shapes, including four end to end envelopes Rim, first encapsulation part and second encapsulation part is adjacent and shared adjacent package side, first encapsulation part are unshared Encapsulation while and offer the opening during the unshared encapsulation of second encapsulation part.
14. 14. easy cleaning photosensory assembly according to claim 13, it is characterised in that described to be open from the bottom of the packaging body Face is through to the top surface of the packaging body.
15. 15. easy cleaning photosensory assembly according to claim 13, it is characterised in that the opening is by the packaging body Bottom surface is recessed the groove to be formed to the top surface of the packaging body.
16. A kind of 16. array lens module, it is characterised in that including：

    Easy cleaning photosensory assembly, including substrate, at least two photo-sensitive cells and packaging body, the substrate include the be oppositely arranged One surface and second surface, the photo-sensitive cell are arranged at intervals at the first surface, photosensitive member described in the packaging body winding For part encapsulated moulding in the first surface, the packaging body is provided with least two holding tanks, and the photo-sensitive cell is located at institute respectively State in holding tank, the packaging body includes the inwall close to the photo-sensitive cell and the outer wall away from the photo-sensitive cell, described Packaging body is provided with opening, and the opening penetrates the inwall and the outer wall；And

    At least two optical sections, it is arranged at respectively including lens barrel and camera lens, the lens barrel on the packaging body, a lens barrel pair Holding tank described in Ying Yuyi, the camera lens are arranged in the lens barrel.
17. 17. array lens module according to claim 16, it is characterised in that the easy cleaning photosensory assembly also includes hiding Body of light, the occulter block the opening.
18. 18. array lens module according to claim 17, it is characterised in that the optical section also includes support, described Occulter is integrally formed with the support, and the support is arranged on the packaging body, and the lens barrel is arranged on the support.
19. 19. array lens module according to claim 17, it is characterised in that the optical section includes voice coil motor, institute State occulter to be integrally formed with the voice coil motor, the voice coil motor is arranged on the packaging body, and the lens barrel is arranged at On the voice coil motor.
20. 20. array lens module according to claim 16, it is characterised in that the quantity of the photo-sensitive cell is two, The quantity of the holding tank is two, and respectively the first holding tank and the second holding tank, the packaging body include the first encapsulation part And second encapsulation part, first encapsulation part are in frame shape and including multiple end to end encapsulation sides, second encapsulation part Frame shape and including multiple end to end encapsulation sides, first encapsulation part is adjacent with second encapsulation part and shared adjacent envelope Rim, wherein the non-common encapsulation side of first encapsulation part opens up opening, wherein the non-common of second encapsulation part Encapsulation side offers opening, and the size of the opening can allow for the photo-sensitive cell to pass through.
21. 21. array lens module according to claim 16, it is characterised in that the quantity of the photo-sensitive cell is two, The quantity of the holding tank is two, respectively the first holding tank and the second holding tank, and the packaging body includes three interval phases To the first of setting the encapsulation while and one end during first encapsulation of connection three the second encapsulation side, per two neighboring described the The one end of one encapsulation when being not connected with second encapsulation is collectively forming an opening.
22. 22. array lens module according to claim 16, it is characterised in that it is relative that the packaging body includes two intervals The second encapsulation side when first set encapsulates while and connect two first encapsulation, the both ends on the second encapsulation side are distinguished Positioned at the middle part on two the first encapsulation sides, the first holding tank and the second holding tank are separated out by the described first encapsulation side, two Two openings are formed respectively between the end on the individual first encapsulation side.
23. 23. the array lens module according to claim 21 or 22, it is characterised in that two relative first encapsulation The inwall on side has flow-guiding structure.
24. 24. array lens module according to claim 23, it is characterised in that two relative described first encapsulate side The distance between inwall gradually increases from the side that the substrate is laterally away from close to the one of the substrate and forms the water conservancy diversion knot Structure；Or

    Two relative first encapsulation while the distance between inwall from close to the described second encapsulation while one end to remote Gradually increase forms the flow-guiding structure for the one end on the second encapsulation side.
25. 25. the array lens module according to claim 21 or 22, it is characterised in that also including occulter, the shading Body blocks the opening, forms two of the opening outlying one end from the described second encapsulation side of first encapsulation and is provided with the One guiding face, the occulter are provided with second guiding face corresponding with first guiding face.
26. 26. array lens module according to claim 25, it is characterised in that first guiding face is from first envelope Rim tilts extension away from the laterally closer substrate side of the substrate one and is gradually distance from the second encapsulation side.
27. 27. array lens module according to claim 25, it is characterised in that first guiding face is from first envelope Rim is laterally away from the substrate side and tilted close to the substrate one extends and is gradually distance from the second encapsulation side.
28. 28. array lens module according to claim 16, it is characterised in that the packaging body include the first encapsulation part and Second encapsulation part, first encapsulation part and second encapsulation part are four frame shapes, including four end to end encapsulation Side, first encapsulation part and second encapsulation part share adjacent package side, first encapsulation part and the described second encapsulation The unshared encapsulation side in portion offers at least two spaced openings.
29. 29. array lens module according to claim 28, it is characterised in that described to be open from the bottom surface of the packaging body It is through to the top surface of the packaging body.
30. 30. array lens module according to claim 28, it is characterised in that the opening is the bottom by the packaging body Top surface towards the packaging body is recessed the groove to be formed.
31. 31. array lens module according to claim 17, it is characterised in that the occulter passes through glue-line and the envelope Fill body bonding.