CN207099434U - A kind of FPC plates and electronic device - Google Patents
A kind of FPC plates and electronic device Download PDFInfo
- Publication number
- CN207099434U CN207099434U CN201720948979.4U CN201720948979U CN207099434U CN 207099434 U CN207099434 U CN 207099434U CN 201720948979 U CN201720948979 U CN 201720948979U CN 207099434 U CN207099434 U CN 207099434U
- Authority
- CN
- China
- Prior art keywords
- weld pad
- fpc plates
- welding
- fpc
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of FPC plates and electronic device.Include some the first weld pads that tin welding is melted for hot pressing on the FPC plates, the back side corresponding position of each first weld pad respectively sets second weld pad without electric connection, the height of the back side force area for increasing first weld pad.When tin welding is melted in progress hot pressing, the pressure concentration used is acted on the second weld pad, reduces the pressure that remaining region is subject on FPC plates, so as to change stressing conditions during FPC plate welds, reduces the deformation in the region that do not stressed when welding.After the completion of welding, welding region is reduced by the effect of deformation force, and the reliability of the molten tin welding pressing of hot pressing is improved with this.
Description
Technical field
It the utility model is related to electronic circuit field, more particularly to a kind of FPC plates and electronic device.
Background technology
Traditional FPC plates (Flexible Printed Circuit, flexible PCB) are melting tin welding using hot pressing
(hot-bar) technique is bonded, and realizes when electrically conducting of two or more electronic device, and FPC plate non-solder face is under pressure
Effect.Because FPC non-solder region is in welding process, by downward pressure, temperature distortion easily occurs.Completed in welding
Afterwards, welding region is influenceed by power caused by non-solder region deformation, and welding position is produced rebound phenomenon or compression
Incomplete situation, influence the reliability for connecting and electrically conducting.
Utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of FPC plates and electronic device, purport
Resilience is produced solving the problems, such as that existing FPC plates are melted when tin-welding process welds using hot pressing, improves the reliability of welding press,
So as to reduce the fraction defective of production product.
According to one side of the present utility model, there is provided a kind of FPC plates, include on the FPC plates some being used for hot pressing and melting tin
First weld pad of welding, the back side corresponding position of each first weld pad respectively set second weld pad without electric connection, used
Height in the back side force area for increasing the first weld pad.
Preferably, the second weld pad of no electric connection is one layer of copper sheet.
Preferably, non-patch region overlay has diaphragm on the FPC plates.
Preferably, unprotect film covers between second weld pad of two neighboring no electric connection.
Preferably, unprotect film covers between two neighboring first weld pad.
Preferably, the second weld pad size is more than or equal to the first weld pad size.
According to other side of the present utility model, there is provided a kind of electronic device, including FPC plates and pcb board, wherein,
The FPC plates melt soldering connection technology by hot pressing and are welded on the pcb board.
The beneficial effects of the utility model：FPC plates provided by the utility model, include on a surface of the FPC plates
Some the first weld pads that tin welding is melted for hot pressing, are respectively set by the opening position that each first weld pad is corresponded at the back side on the surface
Second weld pad without electric connection is put, to increase the height of the back side force area of the first weld pad.Because there is provided the second weldering
Pad, when melting tin welding using hot pressing, the pressure concentration used is acted on the second weld pad, and reduction is not provided with the second weld pad
The stress in region, so as to change stressing conditions when tin welding is melted in the progress hot pressing of FPC plates, do not stress region change when reducing welding
Shape.After the completion of welding, welding region is reduced by the effect of deformation force, and improving hot pressing with this melts the reliable of tin welding pressing
Property.Electronic device provided by the utility model, the FPC plates in it are connected reliably in welding position with pcb board, are not likely to produce back
Phenomenon or the incomplete situation of compression are played, improves the acceptance rate of product.
Brief description of the drawings
Fig. 1 is the schematic top plan view that conventional two faces of FPC plates are split；
Fig. 2 is stress diagram of the conventional FPC plates when carrying out hot pressing and melting tin welding；
Fig. 3 is the schematic top plan view that two faces of the utility model FPC plates are split；
Fig. 4 is the structural section schematic diagram of the utility model FPC plates；
Fig. 5 is stress diagram of the utility model FPC plates when carrying out hot pressing and melting tin welding.
Embodiment
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
Type embodiment is described in further detail.
Fig. 1 is the schematic top plan view that conventional two faces of FPC plates are split.As shown in figure 1, a face of conventional FPC plates 100 is set
Some the first weld pads 111 that tin welding is melted for hot pressing are equipped with, remaining region overlay has diaphragm 110.Another face is not provided with
Weld pad, diaphragm 120 is covered in the whole surface of plate.
The welding pressure that conventional FPC plates 100 are subject in welding is as shown in Figure 2.It is conventional when tin welding is melted in progress hot pressing
FPC plates 100 are acted on by downward welding pressure, at welding region 140, weld together with pcb board 300.The pcb board
It is upper to include substrate 320, and it is provided for the weld pad 310 of welding.Pressure during welding acts on the whole non-solder of upper surface
On face, the non-solder region 130 of lower surface causes the region that temperature distortion occurs also by downward pressure.After completing welding,
The non-patch region 130 of deformation produces the effect of power to welding region 140, causes the loosening or fracture of welding region 140, influences
The reliability of welding.
A kind of FPC plates provided by the utility model, it is to set nothing electrically to connect in the back side corresponding position of the first weld pad
The second weld pad connect, the geomery of second weld pad is suitable with the first weld pad, increases the height of welding region force area with this,
Change stressing conditions during FPC plate welds, improve the reliability that tin welding pressing is melted in hot pressing.
Specifically, the schematic top plan view and such as Fig. 4 that FPC plates provided by the utility model two faces as shown in Figure 3 are split
The cross section structure figure of shown FPC plates.Some the first welderings for being used to weld are set on one face of the utility model FPC plates 200
Pad 211, on another face of the FPC, i.e., corresponding position corresponding to the back side of the first weld pad, set the second of no electric connection
Weld pad 221.
Second weld pad 221 can increase the back side force area height of the first weld pad 211, concentrate welding pressure and act on weldering
Connect on region 240, greatly reduce the influence to remaining region on FPC plates.Preferably, corresponding first weld pad 211 of the second weld pad 221
The positive back side set, and size is suitable with the size of the first weld pad 210.To ensure the electric connection of FPC plates 200,
Second weld pad 221 is configured to without being electrically connected with and being normal heat transfer when ensureing welding, and the second weld pad 221 uses metal material
Matter, because the heat conductivility of copper is preferable, the preferred copper sheet of the second weld pad.
Remaining region of weld pad is not provided with the utility model FPC plates 200 due to wire is distributed with, so should be covered with one
Layer diaphragm 210 and 220, the diaphragm separates wire and air, prevents wire from corroding, while has insulating effect.
On two surfaces of the FPC plates 200, the region 230 between adjacent two the first weld pads and adjacent two
The setting for removing diaphragm is taken in region 231 between second weld pad, due in small distance between weld pad and there is no arrangement of conductors,
Therefore remove diaphragm influences less on FPC plates 200.And diaphragm is most yielding in welding, removes the region between adjacent welding-pad
230 and 231 diaphragm, can effectively reduce deformation, reduce the stressing influence of welding region 240, and that improves welding press can
By property.
The pressure that is subject to of the FPC plates 200 provided by the utility model in welding is as shown in figure 5, the FPC plates pass through hot pressing
Molten soldering connection technology is welded on pcb board 300.Weld pad 310 on pcb board passes through the first weldering in welding technique and the FPC plates
Pad 211 connects, and realizes and is electrically connected with.Welding when, it is different from the stress of conventional FPC plates, FPC plates provided by the utility model by
To welding pressure concentrate act on the second weld pad 221, the region 230 and 231 between remaining region and two adjacent welding-pads
Very little is influenceed by welding pressure, reduces the heated stress deformation in non-solder region, the power effect to welding region is reduced, improves
Welding press reliability.
The utility model additionally provides a kind of electronic device, and the electronic device includes FPC plates and pcb board, is wrapped on the FPC plates
Some the first weld pads that tin welding is melted for hot pressing are included, the back side corresponding position of each first weld pad respectively sets one without electrically
Second weld pad of connection, the first weld pad of the FPC plates melt soldering connection technology by hot pressing and welded together with pcb board.
In summary, the technical solution of the utility model, by FPC plates the first weld pad back side set corresponding the
Two weld pads, increase the height of the first weld pad back side force area, concentrate the pressure of welding and act on welding region, reduce non-solder
The stress in region, do not stress region deformation problem when reducing welding, and after the completion of welding, welding region is subtracted by the effect of deformation force
It is small, the reliability of welding region is improved, so as to improve the acceptance rate of electronic device product.
Specific embodiment of the present utility model is the foregoing is only, under above-mentioned teaching of the present utility model, this area
Technical staff can carry out other improvement or deformation on the basis of above-described embodiment.It will be understood by those skilled in the art that
Above-mentioned specific descriptions simply preferably explain the purpose of this utility model, and the scope of protection of the utility model should be with claim
Protection domain be defined.
Claims (7)
1. a kind of FPC plates, it is characterised in that include some the first weld pads that tin welding is melted for hot pressing on the FPC plates, each
The back side corresponding position of first weld pad respectively sets second weld pad without electric connection, for increasing first weld pad
The height of back side force area.
2. FPC plates according to claim 1, it is characterised in that the second weld pad of the no electric connection is one layer of copper sheet.
3. FPC plates according to claim 1, it is characterised in that non-patch region overlay has diaphragm on the FPC plates.
4. FPC plates according to claim 1, it is characterised in that second weld pad of two neighboring no electric connection it
Between unprotect film cover.
5. FPC plates according to claim 1, it is characterised in that unprotect film covers between two neighboring first weld pad
Lid.
6. FPC plates according to claim 1, it is characterised in that the second weld pad size is more than or equal to the first weld pad chi
It is very little.
7. a kind of electronic device, it is characterised in that including the FPC plates and pcb board described in claim any one of 1-6, the FPC
Plate melts soldering connection technology by hot pressing and is welded on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720948979.4U CN207099434U (en) | 2017-07-31 | 2017-07-31 | A kind of FPC plates and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720948979.4U CN207099434U (en) | 2017-07-31 | 2017-07-31 | A kind of FPC plates and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207099434U true CN207099434U (en) | 2018-03-13 |
Family
ID=61543377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720948979.4U Active CN207099434U (en) | 2017-07-31 | 2017-07-31 | A kind of FPC plates and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207099434U (en) |
-
2017
- 2017-07-31 CN CN201720948979.4U patent/CN207099434U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206674303U (en) | It is a kind of to reveal copper circuit board without carbon oil | |
| CN110459667B (en) | LED flip-chip substrate | |
| CN207099434U (en) | A kind of FPC plates and electronic device | |
| CN201608971U (en) | Circuit board | |
| WO2017120808A1 (en) | Auxiliary welding structure for alc pcb board and process of fabrication thereof | |
| CN109688700A (en) | A kind of welding resistance windowing design of PCB pad | |
| CN108145268A (en) | Pcb board and the welding procedure of metal shell butt welding based on air return | |
| CN104254202B (en) | Circuit board with interior embedded electronic component and preparation method thereof | |
| CN202076551U (en) | Electric connector | |
| CN208195884U (en) | Thermocompression bonding pressure head | |
| CN217607770U (en) | Connecting structure of photovoltaic junction box and bus bar | |
| CN104600047B (en) | Power module and packaging method thereof | |
| CN101489358B (en) | Element surface mounting method for flexible circuit board | |
| CN206341474U (en) | A kind of anti-corrugation PCB layer pressure fusion structure | |
| CN213704921U (en) | Verification structure for printing high-low temperature solder paste on PCB | |
| CN110931627B (en) | Miniature light-emitting diode display back plate and manufacturing method thereof | |
| CN103188884A (en) | Soldering method of metal printed circuit board and flexible circuit and soldering apparatus thereof | |
| CN102843856A (en) | Flexible circuit board welded with a plurality of conductive contact blocks and manufacture method thereof | |
| CN210272424U (en) | LED flip substrate | |
| CN200976416Y (en) | Connecting structure of flexible circuit board and connector | |
| CN102497745A (en) | Double-side wave soldering method for electronic element | |
| CN202043385U (en) | Modified LED welding structure | |
| CN201369426Y (en) | Connection terminal | |
| CN101252808B (en) | Soldering circuit plate and soldering method thereof | |
| CN206879276U (en) | A kind of screening cover and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201026 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |