CN207052578U - Semiconductor silicon annular eclipse engraving device - Google Patents
Semiconductor silicon annular eclipse engraving device Download PDFInfo
- Publication number
- CN207052578U CN207052578U CN201721001451.2U CN201721001451U CN207052578U CN 207052578 U CN207052578 U CN 207052578U CN 201721001451 U CN201721001451 U CN 201721001451U CN 207052578 U CN207052578 U CN 207052578U
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- semiconductor silicon
- support shaft
- rinse bath
- support
- engraving device
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Abstract
The utility model discloses a kind of semiconductor silicon annular eclipse engraving device, including the rinse bath that upper end is open, support driving mechanism is provided with the rinse bath, the support driving mechanism is used to keep semiconductor silicon ring in etching process in rinse bath internal rotation.Using above structure, during etch cleaning, the stable rotation in rinse bath of semiconductor silicon ring is driven by support driving mechanism, ensure that the effect of cleaning fluid suffered by semiconductor silicon ring each several part is basically identical, i.e. soak time, soaking depth etc. are identical, so as to improve the uniformity of semiconductor silicon ring surface cleaning etching, the yields of product, and cleaning etching efficiency are improved.
Description
Technical field
The utility model belongs to semiconductor etching technique field, and in particular to a kind of semiconductor silicon annular eclipse engraving device.
Background technology
The etching of semiconductor is that semiconductor is immersed in etching solution to the unwanted material for removing its surface attachment, is ensured
Its clean purity, in existing Etaching device, for the semiconductor silicon ring in disk or ring-type, typically silicon ring is hung over typically
Frock on, then be put into etching groove static soak in etching solution, such silicon ring each several part is because the etching solution being subject to is pressed
Power effect is different, then cleaning action is also different, and it is uneven so to will result in the etching of ring product surface, so as to reduce the good of product
Product rate.
Utility model content
To solve above technical problem, the utility model provides a kind of semiconductor silicon annular eclipse engraving device, can half-and-half led
Body silicon ring realizes uniform etching, improves the yields of product.
To achieve the above object, technical solutions of the utility model are as follows：
A kind of semiconductor silicon annular eclipse engraving device, its key are：Including the rinse bath that upper end is open, set in the rinse bath
There is support driving mechanism, the support driving mechanism is used to keep semiconductor silicon ring in etching process in rinse bath internal rotation.
Using above scheme, semiconductor silicon ring is driven in rinse bath internal rotation, energy basic guarantee by support driving mechanism
Soaking and washing pressure suffered by semiconductor silicon ring each several part or the time contacted with etch cleaning liquid are essentially identical, so as to reach
Each several part uniformly cleans the purpose of etching, and after the completion of cleaning etching, uniform and smooth property is presented in its surface, improves the good of product
Product rate.
As preferred：The support driving mechanism includes at least three support shafts be arrangeding in parallel, and driving at least its
In the motor that rotates of support shaft, each support shaft is triangular in shape in rinse bath or circular arc distribution.Tied more than
Structure, simplify support driving structure, semiconductor silicon ring is realized by support shaft and supported, while driven by the rotation of support shaft
Semiconductor silicon ring rotates, simple in construction, it is easy to accomplish.
As preferred：Position limiting structure is distributed in the support shaft along its length, the position limiting structure is used to etch
During limitation semiconductor silicon ring be moved along the axial direction of support shaft.Using above structure, ensure half by position limiting structure
Conductor silicon ring position in rotary course keeps constant, and avoiding position from changing causes semiconductor silicon ring to collide.
As preferred：The position limiting structure is the annular groove being distributed along its length in support shaft, and in each support shaft
Annular groove face is set.Using above structure, annular groove directly can be process in support shaft, and without introducing more parts
Come as position limiting structure, reduce manufacturing cost, and difficulty of processing.
As preferred：The support driving mechanism also includes two installing plates for being symmetricly set in support shaft both ends, described
Support shaft is three, is horizontally set in rinse bath, and the motor is arranged on the side of rinse bath, and three support shafts are in three
Angular distribution a, wherein support shaft close to bottom of rinse bath is connected with motor.Using above structure, pass through three branch
The supporting construction that axle forms triangle is supportted, semiconductor silicon ring is put into the shape with the inscribed circle of similar triangle after three support shafts afterwards
Shape abuts with three support shafts, and its weight is mainly by the spring bearing close to cleaning groove bottom wall by then design driven motor drives
Move this root support shaft to rotate, can preferably ensure the servo-actuated stability of semiconductor silicon ring, reduce the probability for skidding and stopping operating,
Further improve the reliability of device.
As preferred：The position of corresponding two support the end of the shaft not being connected with motor of the installing plate is equipped with cunning
Groove, two support shaft both ends extend through chute, and can run through the end of chute along the slide, the support shaft
It is equipped with locking nut.Using above structure, the size for the support triangle shape that three support shafts are formed can be so adjusted, from
And different size of semiconductor silicon ring is adapted to, the applicability of device is further increased, and after regulation in place, locking can be passed through
Nut is locked, and ensure that the stability after its regulation.
As preferred：Installing plate lower end both sides have the protuberance extended straight down, the cleaning groove bottom wall pair
The position of protuberance is answered to be provided with neck, the protuberance is embedded in neck.Using above structure, so only needing will be with motor
After the support shaft of connection disconnects, you can very quickly whole support driving mechanism is taken out out of rinse bath, it is convenient to cleaning
Groove inner wall washing, and the maintenance inspection to support driving mechanism.
As preferred：The motor is by governor gear group and wherein supports axis connection., can be with using above structure
Preferably control motor power transmission shaft passes to the rotating speed of support shaft, so as to realize the control to semiconductor silicon ring rotating speed, has
Cleaning etching quality is controlled beneficial to rotating speed is preferably relied on.
Compared with prior art, the beneficial effects of the utility model are：
Using semiconductor silicon annular eclipse engraving device provided by the utility model, during etch cleaning, driven by supporting
Mechanism drives the stable rotation in rinse bath of semiconductor silicon ring, it is ensured that the effect base of cleaning fluid suffered by semiconductor silicon ring each several part
This is consistent, i.e., soak time, soaking depth etc. are identical, so as to improve the uniformity of semiconductor silicon ring surface cleaning etching, improves
The yields of product, and cleaning etching efficiency.
Brief description of the drawings
Fig. 1 is schematic perspective view of the present utility model；
Fig. 2 is the rearview of embodiment illustrated in fig. 1；
Fig. 3 is the structural representation of support driving mechanism；
Fig. 4 is rinse bath internal structure schematic diagram；
Fig. 5 is the mounting structure schematic diagram of support driving mechanism；
Fig. 6 use state diagrams of the present utility model.
Embodiment
The utility model is described in further detail with accompanying drawing with reference to embodiments.
It is main to include in the cleaning of hollow rectangular parallelepiped structure referring to figs. 1 to the semiconductor silicon annular eclipse engraving device shown in Fig. 6
Groove 1 and liquid reserve tank 3, and the internal capacity of liquid reserve tank 3 is more than the internal capacity of rinse bath 1, rinse bath 1 is located at the upper of liquid reserve tank 3
Side, its open topped, liquid reserve tank 3 is closed casing.
With reference to figure 1 and Fig. 2, for the compactedness of holding meanss, rinse bath 1 is identical with the width of liquid reserve tank 3, and liquid reserve tank 3
It is longer than rinse bath 1, be communicated with valve 5 in the side of rinse bath 1, the upper end of communicating valve 5 connect with the inside of rinse bath 1, lower end and
The inside of liquid reserve tank 3 connects, can so when the etch cleaning liquid in rinse bath 1 is excessive or can not be continuing with because of cleaning pollution
It is directly entered by communicating valve 5 in the liquid reserve tank 3 of bottom；
Recursive filter 4 is additionally provided between rinse bath 1 and liquid reserve tank 3, as illustrated, the front end of the length direction of rinse bath 1
Alignd with liquid reserve tank 3, recursive filter 4 is then located at the rear end of rinse bath 1, and direct seat is on the roof of liquid reserve tank 3, circulating filtration
The bottom of device 4 is provided with pump intake 41, and pump intake 41 is stretched into inside liquid reserve tank 3 and communicated therewith, and close to the bottom of liquid reserve tank 3, follows
Ring filter 4 is set straight up, and the inside of its port of export 40 and rinse bath 1 connect, inside recursive filter 4 in pump intake 41 and
Filter assemblies (not shown) is provided between the port of export 40, filter assemblies can be sponge kind material, can be to impurity caused by etching
Produce suction-operated, and do not influence etch cleaning liquid normal through；
By communicating valve 5 and recursive filter 4, then when the cleaning fluid in rinse bath 1 is contaminated being unable to normal use,
Then entered by communicating valve 5 in liquid reserve tank 3, then the effect by recursive filter 4, i.e., it is then relatively clean by being pumped into, filtering
Net cleaning fluid is again introduced into rinse bath 1, realizes the quick cyclic utilization of cleaning fluid, is saved the replacing construction of cleaning fluid, is carried
High etch cleaning efficiency, while the utilization rate of etch cleaning liquid is added, reduce production cost.
Certainly, etch cleaning liquid can not possibly use always, and in order to during etch cleaning liquid is changed, not interfere with
To normal cleaning etching work procedure, liquid injection port 30 is provided with the roof of liquid reserve tank 3, can be quickly to liquid storage by liquid injection port 30
The pure cleaning etching liquid of supplement, is provided with dump valve 31 close to the position of bottom in the side wall of liquid reserve tank 3, passes through discharge in case 3
Valve 31 can discharge the liquid in liquid reserve tank 3, and liquid injection port 30 is used cooperatively with dump valve 31, together with recursive filter 4,
It can be very good to realize the quality control to cleaning etching solution, it is ensured that carve cleaning quality premise not influenceing semiconductor silicon annular eclipse
Under, avoid because being replaced and cleaned liquid reduces cleaning efficiency, and provides the service efficiency of etch cleaning liquid.
With reference to figure 1 and Fig. 3, etching is uniformly cleaned to semiconductor silicon ring in order to realize in the utility model, in rinse bath 1
Be additionally provided with support driving mechanism 2, installed for the ease of manufacture, in the present embodiment support driving mechanism 2 mainly by support shaft 20,
Motor 21 and installing plate 22 are formed.
It is horizontal between two pieces of installing plates 22 being vertically arranged to be provided with three support shafts 20, three support shafts 20 with reference to figure 3
It is arranged in parallel, and wherein at least has one to be in two other on horizontal plane of different height, be i.e. an at least support shaft
20 have difference in height with the axis of other two support shafts 20, and such three forms the supporting construction of a triangle；
Motor 21 is located at the side of rinse bath 1, and its power transmission shaft is connected with speed regulating axle 210, and passes through timing gear
Wheel shaft 210 is connected with a wherein support shaft 20, drives its rotation, in the present embodiment, in order to ensure semiconductor silicon ring E rotation
Stability, motor 21 is connected with close to a support shaft 20 of the bottom wall of rinse bath 1, because semiconductor silicon ring E is placed on into three
When in root support shaft 20, the power born close to a support shaft 20 of rinse bath 1 bottom wall is maximum, then this root support shaft 20 with
Frictional force liquid caused by semiconductor silicon ring E is maximum and most stable of, then stability servo-actuated semiconductor silicon ring E is also better.
In order to ensure semiconductor silicon ring E will not glance off collision when rotating, also set along the length direction of support shaft 20
Limited bit architecture, ensure that support shaft 20 can only be circumferentially rotated with this, without axial displacement occurs, that improves device can
By property, with reference to figure 3, Fig. 5 and Fig. 6, the position limiting structure in the present embodiment is the annular groove 200 of the length direction of support shaft 20 distribution, ring
Groove 200 is that the sub- surface of support shaft 20 radially caves inward to form deep gouge structure, and the annular groove 200 1 in each support shaft 20
One correspondence, such three support shafts 20 form the structure of triangle, and semiconductor silicon ring E is placed between three support shafts 20, and embedding
In three annular grooves 200 corresponding to entering, so as to can both realize the support to semiconductor silicon ring E, and can realizes axially clamping limit to it
Position, it is ensured that stability when it is rotated.
Can be according to material and Cost Design difference position limiting structure in certain actual production process, for example can also directly exist
Support shaft 20 is spaced apart the annular protrusion to stretch out, and semiconductor silicon ring E is placed on into two neighboring ring when so cleaning
Between shape projection.
Similarly, the embodiment of above-mentioned support driving 2 is also only a kind of preferable scheme, can basis when setting
Need, or even support shaft 20 is vertically arranged, then design is in step-like structure, and semiconductor silicon ring E is directly placed at correspondingly
Same one-level step on, can equally drive semiconductor silicon ring E is stable to rotate, or only rely on a support shaft 20 and rinse bath
Other supporting constructions of 1 inwall together, can also realize above-mentioned function；
Even if in the present embodiment, the quantity of support shaft 20 can also set multiple support shafts 20 nor fixed, more
Individual support shaft 20 is distributed in circular arc, i.e., line of the axis of support shaft 20 on vertical section is in arc-shaped, as semiconductor silicon ring E
Can be with each support shaft 20 while abutting after being put into, certain motor 21 can also be driven several simultaneously by transmission combination
Support shaft 20 rotates simultaneously, so ensures the stability of semiconductor silicon ring E velocities of rotation.
In the present embodiment, in order that device adapts to the semiconductor silicon ring E of different size model, corresponded on installing plate 22
The position of two ends of support shaft 20 not being connected with motor 21 is equipped with chute 220, with reference to figure 3 and Fig. 5, chute
220 be the strip through-hole being obliquely installed on installing plate 22, and the both ends for not connecting the support shaft 20 of motor 21 extend through
Corresponding chute 220, and locking nut 201 is provided with its end, tightened by locking nut 201, can be by the end of support shaft 20
Portion is fixed on the optional position in chute 220, changes the position of any one support shaft 20, you can changes three institutes of support shaft 20
The size of the triangular support structure of formation, meet the semiconductor silicon ring E support fixed demands of more polytypic.
With reference to figure 3 to Fig. 5, the both sides lower end of installing plate 22 has the protuberance 221 extended straight down, the bottom of rinse bath 1
The position of corresponding protuberance 221 is provided with neck 11 on the inside of wall, and after installing plate 22 is put into rinse bath 1, protuberance 221 is just embedding
Enter in neck 11, then will be close to a support shaft 20 of the bottom wall of rinse bath 1 and be connected with motor 21, so that it is with respect to position
Fixation is put, further improves the stability of device.
With reference to figure 1, to prevent in the case of not paying attention in the present embodiment, the cleaning etching solution in rinse bath 1 is excessive, and from
The spilling of the upper end open-mouth dispersiveness of rinse bath 1, is impacted, rinse bath 1 leans on to workplace or to the parts of lower section
The position of nearly upper end is provided with an overfolw hole 10, and overfolw hole 10 passes through overfolw hole 10 away from the side for being provided with motor 21
It can further realize and control and guiding are realized to the liquid measure in rinse bath 1.
Referring to figs. 1 to Fig. 6, semiconductor silicon ring E is put into three support shafts 20, and ensure semiconductor silicon ring E lateral margin
It is embedded into one group of annular groove 200 of face, it is ensured that its stability, will not find that deflection moves, then start motor 21, band
A dynamic support shaft 20 close to the bottom wall of rinse bath 1 rotates, then by the frictional force between semiconductor silicon ring E and support shaft 20,
Rotated together so as to drive semiconductor silicon ring E also to follow, so that semiconductor silicon ring E times the affected in etching solution is cleaned
It is consistent with position etc., its uniformity is kept, improves its yields.
Finally it should be noted that foregoing description is only preferred embodiment of the present utility model, the common skill of this area
Art personnel on the premise of without prejudice to the utility model aims and claim, can make under enlightenment of the present utility model
Expression, such conversion are each fallen within the scope of protection of the utility model as multiple types.
Claims (8)
- A kind of 1. semiconductor silicon annular eclipse engraving device, it is characterised in that：Including the rinse bath (1) that upper end is open, the rinse bath (1) Interior to be provided with support driving mechanism (2), the support driving mechanism (2) is used to keep semiconductor silicon ring cleaning in etching process Groove (1) internal rotation.
- 2. semiconductor silicon annular eclipse engraving device according to claim 1, it is characterised in that：Support driving mechanism (2) bag Include at least three support shafts be arrangeding in parallel (20), and the motor that at least one of support shaft (20) of driving rotates (21), each support shaft (20) is triangular in shape in rinse bath (1) or circular arc is distributed.
- 3. semiconductor silicon annular eclipse engraving device according to claim 2, it is characterised in that：Grown on the support shaft (20) along it Directional spreding position limiting structure is spent, the position limiting structure is used to limit axle of the semiconductor silicon ring along support shaft (20) in etching process To being moved.
- 4. semiconductor silicon annular eclipse engraving device according to claim 3, it is characterised in that：The position limiting structure is support shaft (20) annular groove (200) being distributed along its length on, and annular groove (200) face in each support shaft (20) is set.
- 5. semiconductor silicon annular eclipse engraving device as claimed in any of claims 2 to 4, it is characterised in that：The support Drive mechanism (2) also includes two installing plates (22) for being symmetricly set in support shaft (20) both ends, and the support shaft (20) is three Root, it is horizontally set in rinse bath (1), the motor (21) is arranged on the side of rinse bath (1), three support shafts (20) Distribution triangular in shape a, wherein support shaft (20) close to rinse bath (1) bottom is connected with motor (21).
- 6. semiconductor silicon annular eclipse engraving device according to claim 5, it is characterised in that：The installing plate (22) is corresponding two The position of support shaft (20) end not being connected with motor (21) is equipped with chute (220), two support shafts (20) Both ends extend through chute (220), and can be slided along the chute (220), and the support shaft (20) runs through the end of chute (220) Portion is equipped with locking nut (201).
- 7. semiconductor silicon annular eclipse engraving device according to claim 6, it is characterised in that：Installing plate (22) the lower end both sides With the protuberance (221) extended straight down, the position that rinse bath (1) bottom wall corresponds to protuberance (221) is provided with neck (12), in the embedded neck (12) of the protuberance (221).
- 8. according to the semiconductor silicon annular eclipse engraving device described in any one in claim 2 to 4, it is characterised in that：The drive Dynamic motor (21) is connected by governor gear group (210) with wherein support shaft (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721001451.2U CN207052578U (en) | 2017-08-09 | 2017-08-09 | Semiconductor silicon annular eclipse engraving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721001451.2U CN207052578U (en) | 2017-08-09 | 2017-08-09 | Semiconductor silicon annular eclipse engraving device |
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| Publication Number | Publication Date |
|---|---|
| CN207052578U true CN207052578U (en) | 2018-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721001451.2U Active CN207052578U (en) | 2017-08-09 | 2017-08-09 | Semiconductor silicon annular eclipse engraving device |
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| CN (1) | CN207052578U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073325A (en) * | 2021-03-24 | 2021-07-06 | 重庆臻宝实业有限公司 | Etching cleaning device |
| CN114334727A (en) * | 2021-12-24 | 2022-04-12 | 广州仕上科技有限公司 | Semiconductor surface cleaning processing device |
-
2017
- 2017-08-09 CN CN201721001451.2U patent/CN207052578U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073325A (en) * | 2021-03-24 | 2021-07-06 | 重庆臻宝实业有限公司 | Etching cleaning device |
| CN113073325B (en) * | 2021-03-24 | 2023-03-14 | 重庆臻宝实业有限公司 | Etching cleaning device |
| CN114334727A (en) * | 2021-12-24 | 2022-04-12 | 广州仕上科技有限公司 | Semiconductor surface cleaning processing device |
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