CN114334727A

CN114334727A - Semiconductor surface cleaning processing device

Info

Publication number: CN114334727A
Application number: CN202111603391.2A
Authority: CN
Inventors: 朱峰; 熊志红; 胡超
Original assignee: Guangzhou Shishang Technology Co ltd
Current assignee: Guangzhou Shishang Technology Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-04-12
Anticipated expiration: 2041-12-24
Also published as: CN114334727B

Abstract

The application discloses a semiconductor surface cleaning device, which belongs to the field of semiconductor cleaning and comprises a base and a cleaning barrel arranged on the base, wherein a liquid inlet box used for containing cleaning liquid is arranged at the upper end of the outer side wall of the cleaning barrel, the liquid inlet box is communicated with the cleaning barrel, a circulating box is arranged on the base, a water outlet pipe is communicated between the end part of the circulating box far away from the liquid inlet box and the cleaning barrel, a filter plate is arranged in the circulating box, a water pump is arranged on the side surface of the filter plate close to the liquid inlet box, a water delivery pipe is communicated on the water pump, the water delivery pipe penetrates out of the circulating box and is communicated with the liquid inlet box, a discharge pipe is communicated with the inner bottom surface of the circulating box close to the water outlet pipe, and a solenoid valve is arranged on the discharge pipe; and a fixing component for fixing the semiconductor device is arranged in the cleaning barrel. The semiconductor device cleaning method and device have the effect of improving the cleaning effect of the semiconductor device.

Description

Semiconductor surface cleaning processing device

Technical Field

The application relates to the technical field of semiconductor cleaning, in particular to a semiconductor surface cleaning and processing device.

Background

In the semiconductor industry, the cleaning process may be said to run through the entire process, and the cleaning process accounts for about 30% or more of all the steps of the chip manufacturing process. As the integration of semiconductor devices continues to increase, the size of wafers continues to expand, the size of chip process nodes continues to shrink, and semiconductor structures become more complex, the need for cleaning steps by the industry chain is rapidly increasing.

However, the cleaning technology of some manufacturers is still very traditional, in the related technology, an operator uses a large-volume container to contain cleaning liquid, then the operator puts a semiconductor device into the container, so that the surface of the semiconductor device is in contact with the cleaning liquid, the cleaning liquid is favorable for removing particles on the surface of the semiconductor device, after the semiconductor device is cleaned, the operator takes out the semiconductor device and air-dries the semiconductor device, and finally the semiconductor device enters the next procedure.

In view of the above-mentioned related art, the inventor believes that when the semiconductor device is cleaned, particles of the semiconductor device remain in the cleaning liquid after the particles fall off, and the cleaning of the semiconductor device is continued by using the cleaning liquid containing impurities, which results in poor cleaning effect of the semiconductor device.

Disclosure of Invention

In order to improve the cleaning efficiency of semiconductor devices, the application provides a semiconductor surface cleaning treatment device.

The semiconductor surface cleaning treatment device provided by the application adopts the following technical scheme:

the semiconductor surface cleaning treatment device comprises a base and a cleaning barrel arranged on the base, wherein a liquid inlet box used for containing cleaning liquid is arranged at the upper end of the outer side wall of the cleaning barrel, the liquid inlet box is communicated with the cleaning barrel, a circulating box is arranged on the base, a water outlet pipe is communicated between the end part of the circulating box far away from the liquid inlet box and the cleaning barrel, a filter plate is arranged in the circulating box, a water pump is arranged on the side surface of the filter plate close to the liquid inlet box, a water pipe is communicated with the water pump, the water pipe penetrates out of the circulating box and is communicated with the liquid inlet box, a discharge pipe is communicated with the inner bottom surface of the circulating box close to the water outlet pipe, and an electromagnetic valve is arranged on the discharge pipe; and a fixing component for fixing the semiconductor device is arranged in the cleaning barrel.

Through adopting above-mentioned technical scheme, operating personnel utilizes fixed subassembly earlier to fix semiconductor device, operating personnel pours the cleaning solution into the liquid inlet box after, the cleaning solution of liquid inlet box gets into in the cleaning solution barrel, the cleaning solution of cleaning barrel washs semiconductor device, after operating personnel starts the water pump, the cleaning solution that mixes impurity in the cleaning barrel gets into the circulation incasement, being provided with of filter does benefit to the impurity in the filtration cleaning solution, clean cleaning solution gets into the liquid inlet box through the raceway once more, thereby realize the circulation flow of cleaning solution, be favorable to taking away the particle on the semiconductor device, improve semiconductor device's cleaning performance.

Preferably, the fixed subassembly include the base, the symmetry install in two first support columns on the base and slidable mounting in second support column on the base, semiconductor device set up in first support column with between the second support column, first support column with all seted up on the second support column a plurality of be used for with the ring channel of semiconductor device butt, be provided with on the base and be used for removing the adjusting part of second support column, be provided with in the clearance section of thick bamboo and be used for the drive the lift subassembly that the base moved in vertical direction.

Through adopting above-mentioned technical scheme, lifting unit's setting makes things convenient for operating personnel control base, the position of first support column and second support column, and then make things convenient for operating personnel to control semiconductor device's position, when operating personnel utilized lifting unit to remove semiconductor device to the clearance section of thick bamboo in, operating personnel utilizes the position that adjusting part removed the second support column, first support column, the cooperation of second support column makes things convenient for the fixed semiconductor device of operating personnel, and then improve the stability of semiconductor device in the cleaning solution, when operating personnel utilized lifting unit to remove semiconductor device to breaking away from the clearance section of thick bamboo, operating personnel utilizes adjusting part to make the second support column keep away from semiconductor device, and then make things convenient for operating personnel to take off the semiconductor device that has washd the completion and change new semiconductor device of treating.

Preferably, be provided with the support on the base, lifting unit include the lead screw of vertical setting, threaded connection in mounting panel on the lead screw and install in elevator motor on the support, the lead screw bottom with the interior bottom surface of a clearance section of thick bamboo is rotated and is connected, fixed cover is equipped with first bevel gear on elevator motor's the output shaft, fixed cover is equipped with the second bevel gear on the lead screw, first bevel gear with second bevel gear intermeshing, the mounting panel with base fixed connection, the vertical guide bar that is provided with in the clearance section of thick bamboo, the guide bar passes the mounting panel, the guide bar with mounting panel sliding connection.

Through adopting above-mentioned technical scheme, the setting of guide bar provides the guide effect for the removal of mounting panel, prevent that the mounting panel from rotating, operating personnel starts elevator motor, elevator motor's output shaft rotates and drives first bevel gear and rotate, first bevel gear rotates and drives second bevel gear and rotate, second bevel gear rotates and drives the lead screw and rotate, the lead screw rotates and drives the length direction removal of mounting panel along the lead screw, the mounting panel removes and drives the base and remove, the base removes and finally makes semiconductor device remove.

Preferably, the sliding arrangement has the dovetail block on the base, seted up on the base be used for with dovetail block sliding fit's dovetail, adjusting part including set up in iron plate on the dovetail block and set up in electromagnet on the dovetail inside wall, the dovetail block with be provided with the connecting plate between the second support column.

Through adopting above-mentioned technical scheme, when operating personnel was the electro-magnet power supply, the electro-magnet adsorbs the iron plate, and the iron plate removes and drives the forked tail piece removal, and the forked tail piece removes and drives the connecting plate removal, and the connecting plate removes and drives the second support column removal to make things convenient for the position of operating personnel control second support column.

Preferably, be provided with the auxiliary assembly on the guide bar, the auxiliary assembly including articulate in the fixed sleeve on guide bar top, wear to locate in the fixed sleeve and with fixed sleeve sliding fit's removal post and fixed connection in remove the spring on the post, the spring is kept away from remove the tip of post with fixed sleeve's inside wall fixed connection, remove the post keep away from fixed sleeve's tip with the connecting plate is articulated.

Through adopting above-mentioned technical scheme, when operating personnel utilized lifting unit to remove semiconductor device to breaking away from a clearance section of thick bamboo, the spring was in tensile state this moment, and operating personnel stopped to supply power for the electro-magnet after that, and the electro-magnet no longer attracts the iron plate, removes the post and removes under the spring action of spring, removes the post and removes and drive the forked tail piece and remove, and the forked tail piece removes and drives the second support column through the connecting plate and remove, and then makes things convenient for operating personnel to take out semiconductor device and more renew semiconductor device.

Preferably, the first support column with the base rotates to be connected, the second support column with the connecting plate rotates to be connected, first support column is kept away from with the second support column all be provided with the screw on the tip of base, the axis of screw with the axis of first support column is parallel to each other.

Through adopting above-mentioned technical scheme, the cleaning solution that the circulation flows drives the screw and rotates, and the screw rotates and makes first support column, second support column remove, and first support column removes with the second support column and drives semiconductor device and rotate to the cleaning performance on semiconductor device surface that further improves.

Preferably, the mounting panel including be used for with lead screw thread fit's vertical board and with vertical board fixed connection's horizontal board, the base is close to fixedly connected with card strip on the side of vertical board, seted up on the vertical board be used for with card strip sliding fit's draw-in groove, fixedly connected with limiting plate on the horizontal board, wear to be equipped with on the limiting plate be used for with base thread fit's spacing bolt.

Through adopting above-mentioned technical scheme, card strip and draw-in groove be provided with and do benefit to the enhancement base and be connected between the vertical board, limiting plate and spacing bolt be provided with do benefit to and prevent that the base from breaking away from the mounting panel, the mounting panel can be dismantled with the base and be connected and make things convenient for operating personnel to change and wash the base.

Preferably, the upper surface of support fixedly connected with exhaust pipe, install the dry gas production mechanism who is used for making dry gas on the support, dry gas production mechanism with the intercommunication has the blast pipe between the exhaust pipe.

Through adopting above-mentioned technical scheme, when the abluent semiconductor device of cleaning solution rises to when breaking away from the clearance section of thick bamboo, operating personnel starts dry gas production mechanism, and dry gas blows to the semiconductor device through blast pipe and exhaust pipe in proper order on to dry semiconductor device.

In summary, the present application includes at least one of the following beneficial technical effects:

firstly, fixing the semiconductor device by using a fixing component, then pouring the cleaning liquid into a liquid inlet box by an operator, enabling the cleaning liquid in the liquid inlet box to enter a cleaning barrel, cleaning the semiconductor device by the cleaning liquid in the cleaning barrel, after the water pump is started by the operator, enabling the cleaning liquid mixed with impurities in the cleaning barrel to enter a circulating box, enabling the filter plate to be arranged to be beneficial to filtering the impurities in the cleaning liquid, enabling the clean cleaning liquid to enter the liquid inlet box again through a water delivery pipe, thereby realizing the circulating flow of the cleaning liquid, being beneficial to taking away particles on the semiconductor device and improving the cleaning effect of the semiconductor device;

when the operator moves the semiconductor device to be separated from the cleaning barrel by using the lifting assembly, the operator makes the second support column far away from the semiconductor device by using the adjusting assembly, so that the operator can take off the cleaned semiconductor device and replace the cleaned semiconductor device with a new semiconductor device to be treated conveniently;

when operating personnel was the electro-magnet power supply, the iron plate was adsorbed to the electro-magnet, and the iron plate removes and drives the forked tail piece removal, and the forked tail piece removal drives the connecting plate removal, and the connecting plate removal drives the second support column removal to make things convenient for operating personnel to control the position of second support column.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor surface cleaning apparatus according to an embodiment of the present disclosure.

Fig. 2 is a schematic view of the internal structure of the semiconductor surface cleaning apparatus according to the embodiment of the present application.

Fig. 3 is a schematic structural diagram of a fixing assembly according to an embodiment of the present application.

FIG. 4 is a schematic structural diagram illustrating a connection relationship between a mounting plate and a base according to an embodiment of the present application.

Description of reference numerals:

1. a base; 11. a vibrating device; 12. a circulation box; 121. a filter plate; 122. a water pump; 123. a water delivery pipe; 124. a water outlet pipe; 125. a discharge pipe; 126. an electromagnetic valve; 13. a support; 131. a mounting cavity; 2. cleaning the cylinder; 21. a guide bar; 3. a liquid inlet tank; 31. a liquid inlet pipe; 4. a lifting assembly; 41. a screw rod; 411. a second bevel gear; 42. mounting a plate; 421. a vertical plate; 422. a transverse plate; 423. a limiting plate; 424. a card slot; 425. a limit bolt; 43. a lifting motor; 431. a first bevel gear; 5. a fixing assembly; 51. a base; 511. clamping the strip; 512. a dovetail block; 513. a dovetail groove; 514. a connecting plate; 52. a first support column; 521. an annular groove; 522. a propeller; 53. a second support column; 6. an adjustment assembly; 61. an iron block; 62. an electromagnet; 7. an auxiliary component; 71. fixing the sleeve; 72. moving the column; 73. a spring; 8. a dry gas production mechanism; 81. an exhaust pipe; 82. an exhaust duct; 9. a semiconductor device is provided.

Detailed Description

The present application is described in further detail below with reference to figures 1-4.

The embodiment of the application discloses a semiconductor surface cleaning treatment device. Referring to fig. 1 and 2, the semiconductor surface cleaning apparatus includes a base 1 horizontally disposed, a cleaning cylinder 2 disposed on the base 1, and a semiconductor device 9. Be provided with between base 1 and the clearance section of thick bamboo 2 and be used for driving the vibrating device 11 of cleaning solution in the clearance section of thick bamboo 2, vibrating device 11's upper surface and clearance section of thick bamboo 2 fixed connection, vibrating device 11's bottom surface and base 1's upper surface fixed connection.

Referring to fig. 1 and 2, the cleaning cylinder 2 is vertically arranged, and an upper surface of the cleaning cylinder 2 is opened. The side of the cleaning barrel 2 is fixedly connected with a liquid inlet box 3, the liquid inlet box 3 is communicated with the cleaning barrel 2, and the upper surface of the liquid inlet box 3 is provided with a liquid inlet pipe 31. Fixedly connected with circulation case 12 on the lateral wall of base 1, circulation case 12 is the cavity box, and the vertical filter 121 that is provided with in the circulation case 12, the lateral wall of filter 121 respectively with the inside wall fixed connection of circulation case 12, and install water pump 122 on the interior bottom surface of circulation case 12, water pump 122 sets up in the side that filter 121 is close to into liquid case 3. A water pipe 123 is arranged between the water pump 122 and the liquid inlet tank 3, the water pipe 123 penetrates through the circulation tank 12, one end of the water pipe 123 is communicated with a water outlet of the water pump 122, the other end of the water pipe 123 is communicated with the upper end of the liquid inlet tank 3, and the communication position of the liquid inlet tank 3 and the cleaning barrel 2 is lower than the communication position of the liquid inlet tank 3 and the water pipe 123.

Referring to fig. 1 and 2, a water outlet pipe 124 is communicated with the side surface of the circulation box 12 far away from the liquid inlet box 3, and the end part of the water outlet pipe 124 far away from the circulation box 12 is communicated with the bottom part of the cleaning cylinder 2 far away from the side surface of the liquid inlet box 3. And the bottom surface of the circulation box 12 close to the water outlet pipe 124 is communicated with a discharge pipe 125, and an electromagnetic valve 126 is arranged on the discharge pipe 125. Operating personnel pours the cleaning solution into liquid case 3 from feed liquor pipe 31 in, the cleaning solution in the feed liquor case 3 gets into cleaning barrel 2, operating personnel starts water pump 122 after that, cleaning barrel 2's cleaning solution is through outlet pipe 124 entering circulation case 12 in, the cleaning solution in the circulation case 12 passes through raceway 123 and gets into liquid case 3 again, thereby realize the circulation of cleaning solution, being provided with of filter 121 does benefit to the impurity in the filtration cycle cleaning solution. When the operator needs to replace the cleaning liquid, the operator opens the solenoid valve 126 and the cleaning liquid in the circulation tank 12 can be discharged through the discharge pipe 125.

Referring to fig. 2 and 3, a lifting assembly 4 is arranged in the cleaning barrel 2, the lifting assembly 4 comprises a screw rod 41, an installation plate 42 and a lifting motor 43, the screw rod 41 is vertically arranged in the cleaning barrel 2, and the bottom of the screw rod 41 is rotatably connected with the inner bottom surface of the cleaning barrel 2. The upper surface of the base 1 is fixedly connected with a support 13, the support 13 is provided with a mounting cavity 131, the lifting motor 43 is mounted on the inner end surface of the mounting cavity 131, an output shaft of the lifting motor 43 is sleeved with a first bevel gear 431, and the first bevel gear 431 is fixedly connected with the output shaft of the lifting motor 43. The end part of the screw rod 41 close to the first bevel gear 431 is provided with a second bevel gear 411, the second bevel gear 411 is fixedly connected with the screw rod 41, and the second bevel gear 411 is meshed with the first bevel gear 431. The mounting plate 42 is sleeved on the screw rod 41, and the mounting plate 42 is in threaded fit with the screw rod 41. An operator starts the lifting motor 43, an output shaft of the lifting motor 43 rotates to drive the first bevel gear 431 to rotate, the first bevel gear 431 rotates to drive the second bevel gear 411 to rotate, the second bevel gear 411 rotates to enable the screw rod 41 to rotate, and the screw rod 41 rotates to drive the mounting plate 42 to move.

Referring to fig. 3 and 4, the mounting plate 42 includes a vertical plate 421 and a horizontal plate 422, the length direction of the vertical plate 421 is the same as the length direction of the screw rod 41, the vertical plate 421 is sleeved on the screw rod 41, the vertical plate 421 is in threaded fit with the screw rod 41, the upper surface of the horizontal plate 422 is fixedly connected with the bottom of the vertical plate 421, a limiting plate 423 is fixedly connected to the end of the vertical plate 421 away from the horizontal plate 422, and the bottom surface of the limiting plate 423 is fixedly connected with the upper surface of the horizontal plate 422.

Referring to fig. 2, fig. 3, be provided with fixed subassembly 5 in the clearance section of thick bamboo 2, fixed subassembly 5 includes base 51, first support column 52 and second support column 53, the vertical setting of base 51, the length direction of base 51 is unanimous with the length direction of vertical board 421, fixedly connected with card strip 511 is close to on the side of vertical board 421 to base 51, the length direction of card strip 511 is unanimous with the length direction of base 51, vertical board 421 are close to and seted up draw-in groove 424 on the side of base 51, the inside wall sliding fit of card strip 511 and draw-in groove 424. And the side of keeping away from card strip 511 of base 51 and the inside wall of limiting plate 423 cooperation of sliding, wear to be equipped with spacing bolt 425 on the limiting plate 423, spacing bolt 425 pass limiting plate 423 and with base 51 screw-thread fit, card strip 511 is favorable to strengthening being connected between base 51 and the vertical plate 421 with being provided with of draw-in groove 424, limiting plate 423 and spacing bolt 425 be provided with do benefit to and prevent that base 51 breaks away from mounting panel 42, mounting panel 42 can be dismantled with base 51 and be connected and make things convenient for operating personnel to change and wash base 51.

Referring to fig. 2 and 3, the first support columns 52 are provided in two, the two first support columns 52 are arranged side by side in the horizontal direction, the distance between the two first support columns 52 is smaller than the diameter of the semiconductor device 9, the axial direction of the first support columns 52 is perpendicular to the surface of the base 51 away from the clamping strip 511, and the first support columns 52 are rotatably connected with the base 51. The second supporting column 53 is disposed on the upper side of the first supporting column 52, and the second supporting column 53 and the first supporting column 52 are parallel to each other. Annular grooves 521 are formed in the circumferential surfaces of the first supporting column 52 and the second supporting column 53, the annular grooves 521 are multiple, the annular grooves 521 are uniformly arranged along the length direction of the first supporting column 52, and the semiconductor device 9 is abutted to the inner side wall of the annular groove 521.

Referring to fig. 3 and 4, a dovetail block 512 is provided on the base 51, the dovetail block 512 is provided on the upper surface of the base 51, a dovetail groove 513 is provided on the upper surface of the base 51, and the dovetail block 512 is slidably engaged with the inner side wall of the dovetail groove 513. Be provided with connecting plate 514 on the dovetail block 512, the upper end and the dovetail block 512 fixed connection of connecting plate 514, the lower extreme and the base 51 of connecting plate 514 keep away from the lateral surface of card strip 511 and slide the cooperation, and second support column 53 is connected with connecting plate 514 lower extreme rotation. The ends of the first support column 52 and the second support column 53 far away from the base 51 are fixedly connected with a propeller 522, and the axis of the propeller 522 is parallel to the axis of the first support column 52.

Referring to fig. 3 and 4, the base 51 is provided with the adjusting assembly 6, the adjusting assembly 6 includes an iron block 61 and an electromagnet 62, the iron block 61 is disposed at an end portion of the dovetail block 512 close to the screw rod 41, and the iron block 61 is fixedly connected with the dovetail block 512. The electromagnet 62 is disposed in the dovetail groove 513, and the electromagnet 62 is fixedly connected to an inner end surface of the dovetail groove 513. When an operator starts the electromagnet 62, the electromagnet 62 attracts the iron block 61 to move, the iron block 61 moves to drive the dovetail block 512 to move, the dovetail block 512 moves to drive the connecting plate 514 to move, the connecting plate 514 moves to drive the second supporting column 53 to move, the second supporting column 53 moves to the upper side of the semiconductor device 9, and the second supporting column 53 is matched with the first supporting column 52 to fix the position of the semiconductor device 9.

Referring to fig. 3 and 4, a guide rod 21 penetrates through the vertical plate 421, the guide rod 21 is vertically arranged, the guide rod 21 is matched with the vertical plate 421 in a sliding manner, the bottom of the guide rod 21 is fixedly connected with the inner bottom surface of the cleaning barrel 2, an auxiliary assembly 7 is arranged at the upper end of the guide rod 21, the auxiliary assembly 7 comprises a fixing sleeve 71, a moving column 72 and a spring 73, the fixing sleeve 71 is in a circular cylindrical shape, one end of the fixing sleeve 71 is opened, the other end of the fixing sleeve 71 is closed, the closed end of the fixing sleeve 71 is hinged to the top of the vertical plate 421, the moving column 72 penetrates through the open end of the fixing sleeve 71, the moving column 72 is matched with the inner side wall of the fixing sleeve 71 in a sliding manner, and the end, far away from the fixing sleeve 71, of the moving column 72 is hinged to the connecting plate 514. The spring 73 is arranged in the fixed sleeve 71, one end of the spring 73 is fixedly connected with the movable column 72, and the other end of the spring 73 is fixedly connected with the inner end face of the fixed sleeve 71. The moving direction of the moving post 72 in the fixed sleeve 71 is flush with the moving direction of the dovetail block 512 in the dovetail groove 513. When operating personnel is the power supply of electro-magnet 62, electro-magnet 62 adsorbs iron plate 61, at this moment, spring 73 is in tensile state, when operating personnel stops to supply power for electro-magnet 62, it removes post 72 to remove under spring 73's elastic force effect, it removes to remove post 72 and drives dovetail block 512, dovetail block 512 removes and drives connecting plate 514 and remove, finally make second support column 53 remove, thereby make things convenient for operating personnel to take out semiconductor element, the cooperation of two first support columns 52 and second support column 53 is favorable to improving the stability of semiconductor device 9 in the cleaning solution, thereby prevent that semiconductor device 9 from empting in the cleaning solution.

Referring to fig. 1 and 3, an exhaust duct 82 is fixedly connected to the upper surface of the bracket 13, the length direction of the exhaust duct 82 is consistent with the length direction of the first support column 52, a dry gas production mechanism 8 for producing dry gas is installed on the side surface of the bracket 13 away from the cleaning cylinder 2, an exhaust pipe 81 is communicated with the dry gas production mechanism 8, and the end part of the exhaust pipe 81 away from the dry gas production mechanism 8 is communicated with the exhaust duct 82. When the operator moves the mounting plate 42 upwards, the mounting plate 42 moves to drive the base 51 to move, the base 51 moves to drive the first supporting column 52 and the second supporting column 53 to move, finally, the semiconductor device 9 cleaned by the cleaning liquid rises to be separated from the cleaning barrel 2, the operator starts the dry gas production mechanism 8, and the dry gas is blown to the semiconductor device 9 through the exhaust pipe 81 and the exhaust pipe 82 in sequence, so that the semiconductor device 9 is dried.

The implementation principle of the semiconductor surface cleaning processing device in the embodiment of the application is as follows: when the operator moves the semiconductor device 9 into the cleaning barrel 2 using the elevating assembly 4, the operator moves the position of the second supporting column 53 using the adjusting assembly 6. First support column 52, the fixed semiconductor device 9 of operating personnel is made things convenient for in cooperation of second support column 53, then operating personnel pours the cleaning solution into liquid inlet box 3, the cleaning solution in liquid inlet box 3 gets into in the cleaning barrel 2, the cleaning solution of cleaning barrel 2 washs semiconductor device 9, after operating personnel starts water pump 122, mix in the cleaning solution inlet circulation case 12 of impurity in the cleaning barrel 2, being provided with of filter 121 does benefit to the impurity in the filtration cleaning solution, clean cleaning solution gets into liquid inlet box 3 once more through raceway 123, thereby realize the circulation flow of cleaning solution, the cleaning solution is favorable to taking away the particle on the semiconductor device 9, improve semiconductor device 9's cleaning performance.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a semiconductor surface cleaning processing apparatus, includes base (1), set up in a clearance section of thick bamboo (2) on base (1), its characterized in that: the upper end of the outer side wall of the cleaning cylinder (2) is provided with a liquid inlet box (3) for containing cleaning liquid, the liquid inlet box (3) is communicated with the cleaning cylinder (2), the base (1) is provided with a circulating box (12), a water outlet pipe (124) is communicated between the end part of the circulation box (12) far away from the liquid inlet box (3) and the cleaning cylinder (2), a filter plate (121) is arranged in the circulating box (12), a water pump (122) is arranged on the side surface of the filter plate (121) close to the liquid inlet box (3), a water pipe (123) is communicated with the water pump (122), the water pipe (123) penetrates out of the circulating box (12) and is communicated with the liquid inlet box (3), the inner bottom surface of the circulation box (12) close to the water outlet pipe (124) is communicated with a discharge pipe (125), and an electromagnetic valve (126) is mounted on the discharge pipe (125); a fixing component (5) for fixing a semiconductor device (9) is arranged in the cleaning cylinder (2).

2. The semiconductor surface cleaning apparatus according to claim 1, characterized in that: fixed subassembly (5) including base (51), symmetry install in two first support columns (52) on base (51) and slidable mounting in second support column (53) on base (51), semiconductor device (9) set up in first support column (52) with between second support column (53), first support column (52) with all seted up on second support column (53) a plurality of be used for with ring channel (521) of semiconductor device (9) butt, be provided with on base (51) and be used for removing adjusting part (6) of second support column (53), be provided with in clearance section of thick bamboo (2) and be used for the drive lift subassembly (4) that base (51) moved in vertical direction.

3. The semiconductor surface cleaning apparatus according to claim 2, characterized in that: a bracket (13) is arranged on the base (1), the lifting component (4) comprises a vertically arranged screw rod (41), a mounting plate (42) in threaded connection with the screw rod (41) and a lifting motor (43) mounted on the bracket (13), the bottom of the screw rod (41) is rotationally connected with the inner bottom surface of the cleaning barrel (2), a first bevel gear (431) is fixedly sleeved on an output shaft of the lifting motor (43), a second bevel gear (411) is fixedly sleeved on the screw rod (41), the first bevel gear (431) is meshed with the second bevel gear (411), the mounting plate (42) is fixedly connected with the base (51), a guide rod (21) is vertically arranged in the cleaning cylinder (2), the guide rod (21) penetrates through the mounting plate (42), and the guide rod (21) is connected with the mounting plate (42) in a sliding mode.

4. The semiconductor surface cleaning apparatus according to claim 3, characterized in that: sliding on base (51) and being provided with dovetail block (512), seted up on base (51) be used for with dovetail block (512) complex dovetail (513) that slides, adjusting part (6) including set up in iron plate (61) on dovetail block (512) and set up in electro-magnet (62) on dovetail (513) inside wall, dovetail block (512) with be provided with connecting plate (514) between second support column (53).

5. The semiconductor surface cleaning apparatus according to claim 4, wherein: be provided with auxiliary assembly (7) on guide bar (21), auxiliary assembly (7) including articulate in fixed sleeve (71) on guide bar (21) top, wear to locate in fixed sleeve (71) and with fixed sleeve (71) sliding fit's removal post (72) and fixed connection in move spring (73) on post (72), spring (73) are kept away from the tip of removing post (72) with the inside wall fixed connection of fixed sleeve (71), the tip that removes post (72) keep away from fixed sleeve (71) with connecting plate (514) are articulated.

6. The semiconductor surface cleaning apparatus according to claim 4, wherein: first support column (52) with base (51) rotate to be connected, second support column (53) with connecting plate (514) rotate to be connected, first support column (52) are kept away from with second support column (53) all are provided with screw (522) on the tip of base (51), the axis of screw (522) with the axis of first support column (52) is parallel to each other.

7. The semiconductor surface cleaning apparatus according to claim 3, characterized in that: mounting panel (42) including be used for with lead screw (41) screw-thread fit's vertical board (421) and with vertical board (421) fixed connection's horizontal board (422), base (51) are close to fixedly connected with card strip (511) on the side of vertical board (421), offer on vertical board (421) be used for with card strip (511) complex draw-in groove (424) that slides, fixedly connected with limiting plate (423) is gone up in horizontal board (422), wear to be equipped with on limiting plate (423) be used for with base (51) screw-thread fit's stop bolt (425).

8. The semiconductor surface cleaning apparatus according to claim 3, characterized in that: the last fixed surface of support (13) is connected with exhaust pipe (82), install on support (13) and be used for making dry gas's dry gas production mechanism (8), dry gas production mechanism (8) with intercommunication has blast pipe (81) between exhaust pipe (82).