CN207037026U - 用于试验箱的隔热结构 - Google Patents
用于试验箱的隔热结构 Download PDFInfo
- Publication number
- CN207037026U CN207037026U CN201721012112.4U CN201721012112U CN207037026U CN 207037026 U CN207037026 U CN 207037026U CN 201721012112 U CN201721012112 U CN 201721012112U CN 207037026 U CN207037026 U CN 207037026U
- Authority
- CN
- China
- Prior art keywords
- consent
- casing
- heat insulation
- insulation structural
- seben
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Thermal Insulation (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721012112.4U CN207037026U (zh) | 2017-08-14 | 2017-08-14 | 用于试验箱的隔热结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721012112.4U CN207037026U (zh) | 2017-08-14 | 2017-08-14 | 用于试验箱的隔热结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207037026U true CN207037026U (zh) | 2018-02-23 |
Family
ID=61487583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721012112.4U Active CN207037026U (zh) | 2017-08-14 | 2017-08-14 | 用于试验箱的隔热结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207037026U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108761236A (zh) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Rfid标签在高低温条件下的性能测试系统和测试方法 |
-
2017
- 2017-08-14 CN CN201721012112.4U patent/CN207037026U/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108761236A (zh) * | 2018-05-28 | 2018-11-06 | 北京智芯微电子科技有限公司 | Rfid标签在高低温条件下的性能测试系统和测试方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207037026U (zh) | 用于试验箱的隔热结构 | |
CN103884415A (zh) | 一种基于无线传感技术的变压器振动监测系统及测试方法 | |
CN203759560U (zh) | 快速温度变化试验箱 | |
CN108134149A (zh) | 电池模组及电池管理系统 | |
CN207397720U (zh) | 一种测试箱及测试系统 | |
CN108036822A (zh) | 一种线束总成电性能及气密性测试设备及其测试方法 | |
CN105021471B (zh) | 基于瓦斯气的热流固耦合煤体真三轴剪切渗流实验装置及其实验方法 | |
CN103527053B (zh) | 一种高低温环境试验箱的外门门扇 | |
CN218728067U (zh) | 一种地震仪防护罩 | |
CN106057258B (zh) | 核电站电气贯穿件压力表在线计量方法及其压力监测装置 | |
CN208959927U (zh) | 一种药品稳定性试验装置 | |
CN206609521U (zh) | 异响检测装置 | |
CN206725169U (zh) | 电力电容器箱体的检漏系统 | |
CN208396903U (zh) | 一种压缩机的马达零件寿命测试装置 | |
CN211043576U (zh) | 激光芯片用高效测试系统 | |
CN103816949A (zh) | 一种防扩散恒温恒湿箱 | |
CN103914362B (zh) | 一种串口自检方法、电路及装置 | |
CN102011908A (zh) | 防结露法兰 | |
CN205373898U (zh) | 便携式机柜温度检测装置 | |
CN206848396U (zh) | 一种电能质量监测装置检测台 | |
CN105445605A (zh) | 一种测线器及其测线方法 | |
CN101521045A (zh) | 一种用于海洋仪器的机壳 | |
CN206906515U (zh) | 一种电源插头线综合测试仪 | |
CN202111969U (zh) | 密封电器盒及设有该密封电器盒的除湿机 | |
CN214373174U (zh) | 一种用于反应室盘漏真空测试的氦气测漏装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee after: STATE GRID CORPORATION OF CHINA Address before: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee before: State Grid Corporation of China |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210126 Address after: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee after: Beijing core Kejian Technology Co.,Ltd. Patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee after: STATE GRID CORPORATION OF CHINA Address before: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee before: STATE GRID CORPORATION OF CHINA |
|
TR01 | Transfer of patent right |