CN207021247U - Full-automatic silicon chip inserting machine - Google Patents

Full-automatic silicon chip inserting machine Download PDF

Info

Publication number
CN207021247U
CN207021247U CN201720890034.1U CN201720890034U CN207021247U CN 207021247 U CN207021247 U CN 207021247U CN 201720890034 U CN201720890034 U CN 201720890034U CN 207021247 U CN207021247 U CN 207021247U
Authority
CN
China
Prior art keywords
gib block
conveyer belt
silicon chip
stage
level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201720890034.1U
Other languages
Chinese (zh)
Inventor
管南南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Funing Pv Technology Co Ltd
Original Assignee
Funing Pv Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Funing Pv Technology Co Ltd filed Critical Funing Pv Technology Co Ltd
Priority to CN201720890034.1U priority Critical patent/CN207021247U/en
Application granted granted Critical
Publication of CN207021247U publication Critical patent/CN207021247U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A kind of Full-automatic silicon chip inserting machine is the utility model is related to, including:Silicon wafer conveying mechanism, including the first gib block and the second gib block, it is disposed with along silicon chip direction of advance and motor-driven first order conveyer belt is transmitted by the first order, motor-driven second level conveyer belt is transmitted by the second level, motor-driven third level conveyer belt is transmitted by the third level, motor-driven fourth stage conveyer belt is transmitted by the fourth stage, wherein in the range of the top of first order conveyer belt to the top of fourth stage conveyer belt, the first gib block and the second gib block continuously extension and between spacing be consistent;Shang Pian mechanisms, transferring silicon chip to first order conveyer belt;The inserted sheet gaily decorated basket, to receive the silicon chip of fourth stage conveyer belt conveying;Elevating mechanism, to drive the inserted sheet gaily decorated basket to lift.Silicon chip advances during advancing by the first gib block and the guiding of the second gib block, in the absence of the transition of reshaping device, it is ensured that silicon chip transporting velocity, in the absence of the risk of card, reduces disintegrating tablet fraction defective.

Description

Full-automatic silicon chip inserting machine
Technical field
Silicon chip inserted sheet frock field is the utility model is related to, more particularly to a kind of Full-automatic silicon chip inserting machine.
Background technology
Traditional Full-automatic silicon chip inserting machine silicon chip slice conveying shaping uses mechanical reels shaping, and this Training system causes Silicon chip transporting velocity is slow, while reshaping device roller senile abrasion is easily caused silicon chip slice card, inclined tab, and it is hidden chipping to be present Suffer from.
Utility model content
Based on this, it is necessary to for silicon chip slice card, inclined tab, and the problem of chipping hidden danger be present, there is provided one kind is complete certainly Dynamic silicon chip inserting machine.
A kind of Full-automatic silicon chip inserting machine, including:
Silicon wafer conveying mechanism, including the first gib block and the second gib block, edge between the first gib block and the second gib block Silicon chip direction of advance is disposed with transmits motor-driven first order conveyer belt, by second level transmission motor driving by the first order Second level conveyer belt, motor-driven third level conveyer belt transmitted by the third level, transmit the motor-driven 4th by the fourth stage Level conveyer belt, wherein in the range of the top of first order conveyer belt to the top of fourth stage conveyer belt, first gib block And second gib block continuously extension and the spacing between the first gib block and the second gib block be consistent;
Shang Pian mechanisms, to transferring silicon chip to the first order conveyer belt;
The inserted sheet gaily decorated basket, to receive the silicon chip of the fourth stage conveyer belt conveying;
Elevating mechanism, to drive the inserted sheet gaily decorated basket to lift.
Above-mentioned plug-in sheet machine, silicon chip are advanced by the first gib block and the guiding of the second gib block, not deposited always during advancing In the transition of reshaping device, it is ensured that silicon chip transporting velocity, in the absence of the risk of card, so as to reduce disintegrating tablet fraction defective.
In one of the embodiments, it is attached with polytetrafluoro on first gib block surface relative with the second gib block Ethene Teflon adhesive tape, the length of the adhesive tape are consistent with the length of the first gib block.
In one of the embodiments, it is attached with polytetrafluoro on second gib block surface relative with the first gib block Ethene Teflon adhesive tape, the length of the adhesive tape are consistent with the length of the second gib block.
In one of the embodiments, first gib block close on the Shang Pian mechanisms one end be provided with guiding silicon chip before The arc angling entered, one end that second gib block closes on the Shang Pian mechanisms are provided with the arc angling that guiding silicon chip advances.
In one of the embodiments, in addition to board, first order transmission motor, first order conveyer belt, the second level are transmitted Motor, second level conveyer belt, third level transmission motor, third level conveyer belt, fourth stage transmission motor, fourth stage conveyer belt are all provided with Put on the board, first order transmission motor, second level transmission motor, third level transmission motor, fourth stage transmission motor are equal It is fixed on by fastener on board, wherein first gib block and the second gib block are fixed on machine by the fastener simultaneously On platform.
In one of the embodiments, first gib block and position at least one in the second gib block are adjustable, make Spacing between first gib block and the second gib block is adjustable.
In one of the embodiments, the top of the first order conveyer belt between the top of fourth stage conveyer belt away from From the length less than the first gib block, and the top of the top of first order conveyer belt and fourth stage conveyer belt is located at the first gib block Both ends between.
In one of the embodiments, the top of the first order conveyer belt between the top of fourth stage conveyer belt away from From the length less than the second gib block, and the top of the top of second level conveyer belt and fourth stage conveyer belt is located at the second gib block Both ends between.
In one of the embodiments, the Shang Pian mechanisms include some rollers and are arranged on the roller to form closed loop The conveyer belt of motion.
In one of the embodiments, first gib block is the polypropylene plastic of rectangular-shape, and described second leads To the polypropylene plastic that bar is rectangular-shape.
Brief description of the drawings
Fig. 1 illustrates the vertical view signal of the Shang Pian mechanisms and slice mechanism of the Full-automatic silicon chip inserting machine of one embodiment Figure;
Fig. 2 illustrates the side signal of the Shang Pian mechanisms and slice mechanism of the Full-automatic silicon chip inserting machine of one embodiment Figure.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model The understanding of disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " when, Intermediary element is then not present.Term as used herein " vertically ", " horizontal ", "left", "right" and similar statement are only It is for illustrative purposes.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include The arbitrary and all combination of one or more related Listed Items.
Below in conjunction with the accompanying drawings, the better embodiment of Full-automatic silicon chip inserting machine is described in detail.
Fig. 1 and 2, the Full-automatic silicon chip inserting machine of the application one embodiment, including Shang Pian mechanisms 10, silicon chip is refer to pass Send mechanism 20, the inserted sheet gaily decorated basket 30 and elevating mechanism 40.Wherein, Shang Pian mechanisms 10 play transition transferance, silicon chip to be picked up The silicon chip transition that mechanism pickup comes is to silicon wafer conveying mechanism 20.Silicon chip 50 is constantly conveyed to inserted sheet by silicon wafer conveying mechanism 20 The gaily decorated basket 30.Elevating mechanism 40 constantly drives the inserted sheet gaily decorated basket 30 to rise during inserted sheet, so that the inserted sheet gaily decorated basket 30 can be continuous Ground receives the silicon chip 50 that conveying comes.If finally stacked on the supporting region of the inserted sheet gaily decorated basket 30 and form dried layer silicon chip.
Silicon wafer conveying mechanism 20, including the first gib block 21 and the second gib block 22, and be arranged on the first gib block 21 with Transmission line between second gib block 22.Transmission line includes transmitting motor by the first order along what the direction of advance of silicon chip 50 was set gradually The first order conveyer belts 232 of 231 drivings, the second level conveyer belt 234 driven by second level transmission motor 233, passed by the third level The third level conveyer belt 236 that power transmission machine 235 drives, the fourth stage conveyer belt 238 driven by fourth stage transmission motor 237.Silicon chip The directions of 50 transmission and order are to second level conveyer belt 234, then to third level conveyer belt 236, so by first order conveyer belt 232 Afterwards to fourth stage conveyer belt 238, the inserted sheet gaily decorated basket 30 is finally conveyed to by fourth stage conveyer belt 238.
In the range of the top of first order conveyer belt 232 to the top of fourth stage conveyer belt 238, the He of the first gib block 21 Second gib block 22 is continuous extension, and the spacing between the first gib block 21 and the second gib block 22 is consistent.
In conventional art, the defeated shaping of silicon chip is the linking being related between rollers at different levels using the guiding shaping of multistage roller type Transition so that silicon chip transporting velocity is slow, and if roller abrasion silicon chip easily occur card situation between rollers at different levels.And utilize The plug-in sheet machine of above-described embodiment, when continuous inserted sheet, by the first gib block 21 and the second gib block 22 during silicon chip advance Guiding is advanced, and in the absence of the transition of reshaping device, therefore can ensure silicon chip transporting velocity, in the absence of the risk of card, so as to reduce Disintegrating tablet is bad.
In one embodiment, the top of first order conveyer belt 232 is small to the distance between the top of fourth stage conveyer belt 238 In the length of the first gib block 21, and the top of the top of first order conveyer belt 232 and fourth stage conveyer belt is oriented to positioned at first Between the both ends of bar 21.Similarly, the distance between the top of first order conveyer belt 232 to top of fourth stage conveyer belt 238 Less than the length of the second gib block 22, and the top of the top of first order conveyer belt 232 and fourth stage conveyer belt 238 is located at second Between the both ends of gib block 22.Therefore, silicon chip 50 prior to first order conveyer belt 232 conveying and by the first gib block 21 and second Gib block 22 guides, and improves shaping efficiency.And at fourth stage conveyer belt 238, then only ensure that fourth stage conveyer belt 238 can be opened Beginning, which works, makes silicon chip 50 successfully start to be conveyed to the inserted sheet gaily decorated basket 300 by fourth stage conveyer belt 238, and reduction first is oriented to The unnecessary length of the gib block 22 of bar 21 and second.
In one embodiment, the first gib block 21 is the polypropylene plastic of rectangular-shape.Second gib block page 22 is length The polypropylene plastic of cube shape.Polypropylene plastic has the advantages of lightweight, plasticity are good, deformation resistance is good, and it is oblique to reduce silicon chip The risk of chipping during piece.
In one embodiment, on the inner surface of the first gib block 21, i.e., on its surface relative with the second gib block 22 Polytetrafluoroethylene (PTFE) Teflon adhesive tape (not shown) is attached with, the length of adhesive tape is consistent with the length of the first gib block 21.By viscous Polytetrafluoroethylene (PTFE) Teflon adhesive tape is pasted, the buffering between increase and silicon chip, reduces silicon chip chipping probability.
In one embodiment, on the inner surface of the second gib block 22, i.e., on its surface relative with the first gib block 21 Polytetrafluoroethylene (PTFE) Teflon adhesive tape (not shown) is attached with, the length of adhesive tape is consistent with the length of the second gib block 22.By viscous Polytetrafluoroethylene (PTFE) Teflon adhesive tape is pasted, the buffering between increase and silicon chip, reduces silicon chip chipping probability.
In one embodiment, one end that the first gib block 21 closes on Shang Pian mechanisms 10 is provided with the arc that guiding silicon chip 50 advances Chamfering, silicon chip is set to smoothly enter between the first gib block 21 and the second gib block 22.
In one embodiment, one end that the second gib block 22 closes on Shang Pian mechanisms 10 is provided with the arc that guiding silicon chip 50 advances Chamfering, silicon chip is set to smoothly enter between the first gib block 21 and the second gib block 22.
In one embodiment, Full-automatic silicon chip inserting machine also includes board (not illustrated).Wherein, first order transmission motor 231st, first order conveyer belt 232, second level transmission motor 233, second level conveyer belt 234, third level transmission motor the 235, the 3rd Level conveyer belt 236, fourth stage transmission motor 237, fourth stage conveyer belt 238 are arranged on board.The first order transmits motor 231st, second level transmission motor 233, third level transmission motor 235, fourth stage transmission motor 237 are fixed on machine by fastener On platform, and fastener is simultaneously the first gib block 21 and the second gib block 22 are fixed on board.The He of first gib block 21 Fixed bit of second gib block 22 on board is the position of transmission motor, and without changing board, any part, raising change in itself Efficiency is made, reduces improvement cost.
Further, the position of at least one in the first gib block 21 and the second gib block 22 is adjustable, makes the first guiding Spacing between the gib block 22 of bar 21 and second is adjustable, so as to adapt to the conveying shaping requirement of the silicon chip of different size.For example, the The position of one gib block 21 is adjustable so that the spacing between the first gib block 21 and the second gib block 22 can be by 156 millimeters of tune Whole is 176 millimeters, or just on the contrary, so as to adapt to the silicon chip of two kinds of specifications.
In one embodiment, Shang Pian mechanisms 10 include some rollers 11 and are arranged on roller 11 to form the defeated of closed loop moving Send band 12.The silicon chip of silicon chip mechanism for picking such as sucker pickup is oriented to through the transition of conveyer belt 12 into the first gib block 21 and second Between bar 22.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

  1. A kind of 1. Full-automatic silicon chip inserting machine, it is characterised in that including:
    Silicon wafer conveying mechanism, including the first gib block and the second gib block, along silicon chip between the first gib block and the second gib block Direction of advance is disposed with and transmits motor-driven first order conveyer belt by the first order, transmits motor-driven by the second level Two level conveyer belt, motor-driven third level conveyer belt transmitted by the third level, transmitting the motor-driven fourth stage by the fourth stage passes Band is sent, wherein in the range of the top of first order conveyer belt to the top of fourth stage conveyer belt, first gib block and Two gib blocks continuously extend and the spacing between the first gib block and the second gib block is consistent;
    Shang Pian mechanisms, to transferring silicon chip to the first order conveyer belt;
    The inserted sheet gaily decorated basket, to receive the silicon chip of the fourth stage conveyer belt conveying;
    Elevating mechanism, to drive the inserted sheet gaily decorated basket to lift.
  2. 2. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that first gib block and second is oriented to Polytetrafluoroethylene (PTFE) Teflon adhesive tape, the length of the adhesive tape and the length one of the first gib block are attached with the relative surface of bar Cause.
  3. 3. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that second gib block and first is oriented to Polytetrafluoroethylene (PTFE) Teflon adhesive tape, the length of the adhesive tape and the length one of the second gib block are attached with the relative surface of bar Cause.
  4. 4. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that first gib block is closed on described One end of piece mechanism is provided with the arc angling that guiding silicon chip advances, and one end that second gib block closes on the Shang Pian mechanisms is set There is the arc angling that guiding silicon chip advances.
  5. 5. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that also including board, first order transmission electricity Machine, first order conveyer belt, second level transmission motor, second level conveyer belt, third level transmission motor, third level conveyer belt, the 4th Level transmission motor, fourth stage conveyer belt are arranged on the board, first order transmission motor, second level transmission motor, the 3rd Level transmission motor, fourth stage transmission motor are fixed on board by fastener, wherein the fastener is simultaneously by described the One gib block and the second gib block are fixed on board.
  6. 6. Full-automatic silicon chip inserting machine according to claim 5, it is characterised in that first gib block and second is oriented to At least one position is adjustable in bar, makes the spacing between first gib block and the second gib block adjustable.
  7. 7. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that the top of the first order conveyer belt is extremely The distance between top of fourth stage conveyer belt is less than the length of the first gib block, and the top and the fourth stage of first order conveyer belt The top of conveyer belt is located between the both ends of the first gib block.
  8. 8. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that the top of the first order conveyer belt is extremely The distance between top of fourth stage conveyer belt is less than the length of the second gib block, and the top and the fourth stage of second level conveyer belt The top of conveyer belt is located between the both ends of the second gib block.
  9. 9. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that the Shang Pian mechanisms include some rollers And it is arranged in the conveyer belt that closed loop moving is formed on the roller.
  10. 10. Full-automatic silicon chip inserting machine according to claim 1, it is characterised in that first gib block is cuboid The polypropylene plastic of shape, second gib block are the polypropylene plastic of rectangular-shape.
CN201720890034.1U 2017-07-20 2017-07-20 Full-automatic silicon chip inserting machine Active CN207021247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720890034.1U CN207021247U (en) 2017-07-20 2017-07-20 Full-automatic silicon chip inserting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720890034.1U CN207021247U (en) 2017-07-20 2017-07-20 Full-automatic silicon chip inserting machine

Publications (1)

Publication Number Publication Date
CN207021247U true CN207021247U (en) 2018-02-16

Family

ID=61481937

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720890034.1U Active CN207021247U (en) 2017-07-20 2017-07-20 Full-automatic silicon chip inserting machine

Country Status (1)

Country Link
CN (1) CN207021247U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111416019A (en) * 2020-03-30 2020-07-14 中赣新能源股份有限公司 Inserting piece device for solar cell silicon wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111416019A (en) * 2020-03-30 2020-07-14 中赣新能源股份有限公司 Inserting piece device for solar cell silicon wafer
CN111416019B (en) * 2020-03-30 2022-10-25 中赣新能源股份有限公司 Inserting piece device for solar cell silicon wafer

Similar Documents

Publication Publication Date Title
CN106429492B (en) Quick stacking machine in container
CN205855529U (en) A kind of automatic stacker of carton production line
CN206050164U (en) Ceramic tile automated packaging equipment
CN106333604A (en) Solid material feeding system of intelligent cooking device
CN207021247U (en) Full-automatic silicon chip inserting machine
CN108341266B (en) Device and method for reversing and conveying plate glass and automatic sorting system
TWM594493U (en) Mahjong machine and tile picking and carrying system thereof
CN209601339U (en) Body feed tank transmission device and body feed tank conveyer system
CN105129303A (en) Synchronous belt type sheet storing and taking mechanism
CA1061585A (en) Cooling or freezing apparatus
CN206886015U (en) A kind of rail transmission mechanism
CN206610798U (en) Single driving conveying neatening device
CN203269024U (en) Speed difference conveying device
CN209758430U (en) Workpiece platform transferring and conveying device
CN108176043B (en) Slope tile-discharging type full-automatic mahjong machine
CN207158331U (en) Silicon chip flower basket conveying device
CN212512031U (en) Full-automatic vaccine intelligent management storage system
CN205340092U (en) Full -automatic mahjong machine
CN207781557U (en) Solar cell fragment equipment
CN208165851U (en) A kind of Bidirectional differential conveying device for glass storage stacking
CN210392541U (en) Bean product spreading and cooling conveyor
CN206813813U (en) Elevator and food processing line
CN103419975A (en) Straw continuous inserting mechanism
CN207157639U (en) Automatic guide conveyer
CN209427723U (en) Multiple row plate unloader

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant