CN207007897U

CN207007897U - Semiconductor probe

Info

Publication number: CN207007897U
Application number: CN201720803769.6U
Authority: CN
Inventors: 费保兴; 黄绍伟
Original assignee: CHIP SHINE ELECTRONICS TECHNOLOGIES Co Ltd
Current assignee: CHIP SHINE ELECTRONICS TECHNOLOGIES Co Ltd
Priority date: 2017-07-05
Filing date: 2017-07-05
Publication date: 2018-02-13
Anticipated expiration: 2027-07-05

Abstract

The utility model discloses a kind of semiconductor probe, including upper prop, lower prop, and it is arranged on the overcoat between upper prop and lower prop, the upper prop includes end, and the upper contact being connected with end, and spring is set in the overcoat, and it is arranged on the conductive wind spring on spring, the lower prop includes lower contact, and be connected with lower contact cylinder, end, the upper contact, lower contact contact with spring.Semiconductor probe provided by the utility model, when additional conductive member is set within the probe, test signal can be transmitted stably；Relatively simple structure can be obtained, and conductibility can be improved；Testing cost can be reduced.

Description

Semiconductor probe

Technical field

A kind of probe is the utility model is related to, more particularly to a kind of semiconductor probe for stably transmitting test signal.

Background technology

The semiconductor device of semiconductor chip or chip will test its quality, and test probe is used to electrically connect tester and half Conductor device, the matter that tester tests the semiconductor device of such as semiconductor chip or chip by applying predetermined testing signal Amount.Probe is provided in wherein so that predetermined testing signal to be applied to the probe of the soldered ball of semiconductor device or pad.Probe Both ends are connected respectively to the support plate of semiconductor device and tester to electrically connect semiconductor device and tester.Probe, which will be tested, to be believed Number semiconductor device is sent to, transmits test signal afterwards.In the prior art, semiconductor probe is in the stable sender of test signal Have much room for improvement in terms of face, complex degree of structure, in terms of conductive performance, in terms of testing cost.

The content of the invention

The utility model is to provide a kind of semiconductor probe to solve the technical scheme that above-mentioned technical problem uses, its In, concrete technical scheme is：

Including upper prop, lower prop, and the overcoat being arranged between upper prop and lower prop, the upper prop include end, Yi Jiyu The upper contact of end connection, the overcoat is interior to set spring, and the conductive wind spring being arranged on spring, the lower prop to include Lower contact, and be connected with lower contact cylinder, end, the upper contact, lower contact contact with spring.

Above-mentioned semiconductor probe, wherein：The groove of fixed jacket, the bottom of the overcoat are provided on the upper prop It is provided for fixing the body end of lower prop.

Above-mentioned semiconductor probe, wherein：One end that the upper contact, lower contact contact with spring is tapered.

Above-mentioned semiconductor probe, wherein：The side of the end to be cross, the upper prop, end, groove, on connect Contact element, lower prop, lower contact, cylinder, the outside of latter end are gold-plated.

The utility model has the advantages that relative to prior art：Had the following effects that according to the probe of the present invention ：1）When additional conductive member is set within the probe, test signal can be transmitted stably；2) can obtain relatively easy Structure, and conductibility can be improved；3) testing cost can be reduced.

Brief description of the drawings

Fig. 1 is the structural representation of semiconductor probe.

In figure：

The overcoat of 2 lower prop of contact, 21 times contacts, 22 cylinder, 23 latter end 3 on the groove 13 of 1 upper prop, 11 end 12 31 salient point, 32 body end, 4 spring, 5 conductive wind spring.

Embodiment

The utility model will be further described with reference to the accompanying drawings and examples.

The invention provides a kind of semiconductor probe, including upper prop, lower prop, and it is arranged on outer between upper prop and lower prop Set, the upper prop includes end, and the upper contact being connected with end, spring is set in the overcoat, and be arranged on bullet Conductive wind spring on spring, the lower prop include lower contact, and be connected with lower contact cylinder, end, the upper contact Part, lower contact contact with spring；The groove of fixed jacket is provided on the upper prop, the bottom of the overcoat, which is set, to be used In the body end of fixed lower prop；One end that the upper contact, lower contact contact with spring is tapered；The one of the end Side is cross, and the upper prop, end, groove, upper contact, lower prop, lower contact, cylinder, the outside of latter end are gold-plated.

The semiconductor probe electrical connection semiconductor device and the tester for testing semiconductor device, the upper prop electricity It is connected to semiconductor device；Lower prop is electrically connected to tester；Bias spring upper prop described in upper prop and lower prop and lower prop that This is separated；Conductive wind spring be arranged on spring it is internal or external in and electrically connect upper prop and lower prop；

Spring is only just electrically connected when another movement towards in upper prop and lower prop of at least one in upper prop and lower prop Connect post and lower prop；Conductive wind spring selective contacts with least one in upper prop and lower prop.The spring applies elastic force It is at least one so that upper prop and lower prop are separated from one another into upper prop and lower prop.

Although the utility model is disclosed as above with preferred embodiment, so it is not limited to the utility model, any Those skilled in the art, do not departing from spirit and scope of the present utility model, when a little modification and perfect, therefore this can be made The protection domain of utility model is worked as to be defined by what claims were defined.

Claims

A kind of 1. semiconductor probe, it is characterised in that：Including upper prop, lower prop, and the overcoat being arranged between upper prop and lower prop, The upper prop includes end, and the upper contact being connected with end, spring is set in the overcoat, and be arranged on spring Conductive wind spring, the lower prop includes lower contact, and be connected with lower contact cylinder, end, the upper contact, under Contact contacts with spring.
2. the semiconductor probe as described in claim 1, it is characterised in that：The ditch of fixed jacket is provided on the upper prop Groove, the bottom of the overcoat are provided for fixing the body end of lower prop.
3. the semiconductor probe as described in claim 2, it is characterised in that：The upper contact, lower contact and spring connect Tactile one end is tapered.
4. the semiconductor probe as described in claim 3, it is characterised in that：The side of the end to be cross, it is described on Post, end, groove, upper contact, lower prop, lower contact, cylinder, the outside of latter end are gold-plated.