CN206991953U

CN206991953U - film bus capacitor

Info

Publication number: CN206991953U
Application number: CN201720554718.4U
Authority: CN
Inventors: 黄海
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Priority date: 2017-05-18
Filing date: 2017-05-18
Publication date: 2018-02-09
Anticipated expiration: 2027-05-18

Abstract

The utility model provides a kind of film bus capacitor, including shell, pin and the fuse being potted in the shell, busbar and film, the embedding face of the pin through the film bus capacitor is extended to outside shell, the film bus capacitor also includes radiating surface, and the radiating surface includes dielectric film and heat-conducting substrate；Embedding Material surface is affixed on the inside of the dielectric film, the heat-conducting substrate is affixed on the outside of the dielectric film.The utility model is remarkably improved the thermal conductivity factor of the radiating surface of film bus capacitor, so as to improve the stability of film bus capacitor by increasing heat-conducting substrate in film bus capacitor.

Description

Film bus capacitor

Technical field

Capacitor area is the utility model is related to, more specifically to a kind of film bus capacitor.

Background technology

As shown in figure 1, be the schematic diagram of traditional capacitance, the fuse of the electric capacity, busbar, film etc. are encapsulated by Embedding Material 12 In shell 11, pin 13 stretches out from the embedding face of bottom.

In electric machine controller, the bus capacitor of power device and DC support plays and its important effect, bus electricity The quality of appearance is also directly connected to the performance of power device performance.When capacitance applications are in the electric machine controller of new-energy automobile, lead to Often using miniaturization, efficient, cost degradation as target.Above-mentioned target is realized, maximally effective measure is exactly to allow overall losses most It is low.Two great factors of capacitance, the pressure-resistant volume for being influence electric capacity.Existing electric capacity typically has two kinds of forms to occur, Yi Zhongshi Standard capacitance is reached needed for system by series-parallel mode；A kind of is to reach system requirements by way of producer customizes.

Reached using standard capacitance (circular electrochemical capacitor or film square bus capacitor standard items) series-parallel mode Into the scheme of system requirements, the space of complete machine occupied by electric capacity is larger, ESL (Equivalent Series Inductance, Equivalent inductance) it is also larger.And in the program, because the installation dimension of electric capacity and control panel is inconsistent, cause electric capacity and control Plate distance is remote, bad installation.Further, since the standard capacitance number included in whole electric capacity is more, copper bar walks line length, easily occurs The problems such as current unevenness, cause control performance not give full play to, and bring electric capacity and power model that height is lost.

In the scheme of system requirements is reached by the way of being customized using producer, the customization electricity different by optimizing configuration design Hold, the cost of electric capacity installation can be reduced, total layout can also be optimized.Pass through the side customized with electric capacity producer depth Formula, power supply producer can carry out pre-designed with experience to electric capacity outward appearance according to demand.

However, due to by capactive film technical work temperature limiting (105 DEG C of maximum operating temperature), either electric capacity string simultaneously Connection mode or producer's customization mode, the performance of capacitive property is still by capacity loss and radiating (as shown in Fig. 2 its pin Substantial amounts of heat has been gathered at 13, has caused its temperature very high) limitation, i.e., by electric capacity embedding material and thickness effect, cause electricity Appearance can only use under some not harsh environment, can not meet high power density, hot environment demand.

Utility model content

The technical problems to be solved in the utility model is, can not meet high power density, height for above-mentioned bus capacitor A kind of the problem of warm environment, there is provided film bus capacitor.

The technical scheme that the utility model solves above-mentioned technical problem is to provide a kind of film bus capacitor, including shell, The pin and fuse being potted in the shell, busbar and film, the pin pass through the embedding face of the film bus capacitor Extend to outside shell, the film bus capacitor also includes radiating surface, and the radiating surface includes dielectric film and heat-conducting substrate；Institute State and Embedding Material surface is affixed on the inside of dielectric film, the heat-conducting substrate is affixed on the outside of the dielectric film.

In film bus capacitor described in the utility model, the radiating surface is vertical with the embedding face.

In film bus capacitor described in the utility model, there is fixing hole, and institute on the shell and heat-conducting substrate Fixing hole is stated perpendicular to the heat-conducting substrate.

In film bus capacitor described in the utility model, the thickness of the dielectric film is less than or equal to 0.3mm.

In film bus capacitor described in the utility model, the thermal conductivity factor of the heat-conducting substrate is not less than 200W/mK.

In film bus capacitor described in the utility model, the thickness of the heat-conducting substrate is not less than 1mm.

In film bus capacitor described in the utility model, the heat-conducting substrate is copper base.

In film bus capacitor described in the utility model, safety electric capacity is integrated with the shell.

In film bus capacitor described in the utility model, the Embedding Material, the dielectric film and the heat conduction base Plate is adhesively fixed.

In film bus capacitor described in the utility model, the long side that the radiating surface is located at the embedding face is adjacent On face.

Film bus capacitor of the present utility model has the advantages that：Led by having in the increase of film bus capacitor The radiating surface of hot substrate, the thermal conductivity factor of film bus capacitor is remarkably improved, so as to improve the stability of film bus capacitor.

Brief description of the drawings

Fig. 1 is the schematic diagram of existing electric capacity；

Fig. 2 is the radiating emulation schematic diagram of existing electric capacity；

Fig. 3 is the schematic diagram of the utility model film bus capacitor embodiment；

Fig. 4 is the stereogram of film bus capacitor in Fig. 3；

Fig. 5 is the schematic diagram of the utility model film bus capacitor radiating emulation.

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

Heat condition when being worked for electric capacity, such as it can be passed through by improving three convection current, conduction, radiation aspects Radiating surface is increased, coefficient of heat transfer etc. is improved, to improve electric capacity radiating effect.In the case of capacity loss is certain：

Wherein Q_PassFor heat loss through conduction amount, unit W；For heat loss through conduction coefficient, unit is W/m. DEG C；S is conductors cross Product, unit m²；Δ T is the both ends temperature difference of conducting path, and unit is DEG C；L is conduction path length, unit m.

According to above-mentioned formula, under certain capacity loss operating mode, want to improve the performance and radiating effect of electric capacity, just must Thermal conductivity factor must be increased, reduce conducting path, thus the utility model proposes a kind of film in bottom increase heat-conducting substrate is female Line capacitance.

As shown in Figure 3,4, it is the schematic diagram of the utility model film bus capacitor embodiment.Film in the present embodiment is female Line capacitance includes shell 31, pin 33 (pin 33 is used to connect dc bus and IGBT module etc.) and radiating surface, its China and foreign countries Shell 31 is generally process by plastic material, and has fuse, busbar and film etc. by Embedding Material embedding in the shell 31.Pin 33 are passed out of Embedding Material and are extended to outside shell 31 by embedding face 32.Radiating surface includes dielectric film and heat-conducting substrate 34, and the Embedding Material surface being affixed on the inside of dielectric film in shell 31；Heat-conducting substrate 34 is then located at the outside of dielectric film.

Above-mentioned film bus capacitor improves radiating surface heat conduction system by setting dielectric film and heat-conducting substrate 34 in bottom Number, so as to improve heat loss through conduction amount.Knowable to comparison diagram 2 and Fig. 5 radiating emulation schematic diagram, the film bus in the present embodiment Electric capacity can quickly reduce the temperature at the pin 33 of film bus capacitor so that film bus capacitor performance more stability.

Specifically, on radiating surface, Embedding Material, dielectric film and heat-conducting substrate 34 can be fixed by bonding way.Certainly, Also can be by the way that shell 31 and heat-conducting substrate 34 be mechanically fixed, such as pass through screw etc..The thickness of above-mentioned dielectric film be smaller than or Equal to 0.3mm, so as to while safety requirement is met, the heat transfer between heat-conducting substrate 34 and encapsulating material is influenceed compared with It is small.

Especially, above-mentioned radiating surface can be located on the face vertical with embedding face 32, and the layout of the radiating surface is advantageous to film The installation of bus capacitor is fixed.Also, there can be fixing hole 35 on above-mentioned shell 31 and heat-conducting substrate 34, and fixing hole 35 hangs down Directly in heat-conducting substrate 34.By fixing hole 35, film bus capacitor can be fixed in mounting structure, such as the table of radiator Face etc..

To improve radiating efficiency, radiating surface can be made to be located on the adjacent face of long side in embedding face 32, can so make radiating surface Area it is maximum.

To make film bus capacitor quick heat radiating, the thermal conductivity factor of above-mentioned heat-conducting substrate 34 is preferably not less than 200W/mK, tool Body can use copper base of the thermal conductivity factor for 385W/mK.Relative to the shell for the plastic material that thermal conductivity factor is 0.3~0.4 31, the radiating efficiency of above-mentioned heat-conducting substrate 34 greatly improves.

The thickness of heat-conducting substrate 34 can determine according to the design needs, but under normal circumstances, the thickness of the heat-conducting substrate 34 1mm should be not less than.

Especially, safety electric capacity (i.e. Y capacitance) can be also integrated into above-mentioned shell 31 by customizing the scheme of electric capacity In Embedding Material, consequently facilitating automated production.

It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not This is confined to, any one skilled in the art can readily occur in the technical scope that the utility model discloses Change or replacement, should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should It is defined by scope of the claims.

Claims

1. a kind of film bus capacitor, including shell, pin and the fuse being potted in the shell, busbar and film, described The embedding face of pin through the film bus capacitor is extended to outside shell, it is characterised in that：The film bus capacitor also wraps Radiating surface is included, and the radiating surface includes dielectric film and heat-conducting substrate；Embedding Material surface, institute are affixed on the inside of the dielectric film State the outside that heat-conducting substrate is affixed on the dielectric film.

2. film bus capacitor according to claim 1, it is characterised in that：The radiating surface is vertical with the embedding face.

3. film bus capacitor according to claim 1, it is characterised in that：Have on the shell and heat-conducting substrate and fix Hole, and the fixing hole is perpendicular to the heat-conducting substrate.

4. film bus capacitor according to claim 1, it is characterised in that：The thickness of the dielectric film is less than or equal to 0.3mm。

5. film bus capacitor according to claim 1, it is characterised in that：The thermal conductivity factor of the heat-conducting substrate is not less than 200W/mK。

6. film bus capacitor according to claim 1, it is characterised in that：The thickness of the heat-conducting substrate is not less than 1mm.

7. film bus capacitor according to claim 1, it is characterised in that：The heat-conducting substrate is copper base.

8. film bus capacitor according to claim 1, it is characterised in that：Safety electric capacity is integrated with the shell.

9. film bus capacitor according to claim 1, it is characterised in that：The Embedding Material, the dielectric film and institute Heat-conducting substrate is stated to be adhesively fixed.

10. film bus capacitor according to claim 1, it is characterised in that：The radiating surface is located at the embedding face On the adjacent face of long side.