CN206977894U - A kind of ceramic heat-dissipating part of microelectronic component - Google Patents
A kind of ceramic heat-dissipating part of microelectronic component Download PDFInfo
- Publication number
- CN206977894U CN206977894U CN201720661770.XU CN201720661770U CN206977894U CN 206977894 U CN206977894 U CN 206977894U CN 201720661770 U CN201720661770 U CN 201720661770U CN 206977894 U CN206977894 U CN 206977894U
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- China
- Prior art keywords
- support bar
- mounting hole
- ceramic heat
- dissipating part
- electronic component
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Abstract
This application discloses the ceramic heat-dissipating part that the application is related to a kind of microelectronic component, described ceramic heat-dissipating part includes radiating piece body, multiple support bar mounting holes and multiple electronic component mounting holes are provided with described radiating piece body, support bar is installed on described support bar mounting hole, electronic component is installed, described radiating piece body is made up with described support bar of ceramic material on described electronic component mounting hole.A kind of ceramic heat-dissipating part body and support bar described herein are dismountable connection, and the structure of radiating piece can be adjusted according to actual use, and beneficial to installation electronic component.
Description
Technical field
The application belongs to a kind of ceramic heat-dissipating part of microelectronic component.
Background technology
In the prior art, ceramic heat sink generally has high temperature resistant, corrosion resistant advantage, it is possible to use ceramic heat-dissipating
Device is used in various high temperature, and the fluid of high corrosion is radiated, good heat dissipation effect, and in service life, ceramics dissipate under square one
Hot device is several times or tens times of metal heat sink.But generally ceramic heat sink is formed in one, it is impossible to flexibly repacking.
Utility model content
The application is related to a kind of ceramic heat-dissipating part of microelectronic component, and described ceramic heat-dissipating part includes radiating piece sheet
Body, multiple support bar mounting holes and multiple electronic component mounting holes, described support bar are provided with described radiating piece body
Support bar is installed on mounting hole, electronic component is installed on described electronic component mounting hole, described radiating piece body with
Described support bar is made up of ceramic material.
Preferably, described support bar includes the installation portion for being fastened on described support bar mounting hole and is arranged on
Support bar body under described installation portion, described installation portion and described support bar body are square column construction,
The area of section of described installation portion is less than the area of section of described support bar body.
Preferably, it is mutually be bonded by viscose glue between described installation portion and described support bar mounting hole.
Preferably, described electronic component is LED bulb.
Preferably, the back side of described radiating piece body is provided with the Wiring trough of installation power line, and described Wiring trough prolongs
Extend the edge of described electronic component mounting hole.
Preferably, the inwall of described electronic component mounting hole is provided with connection screw thread, and described electronic component passes through spiral shell
The mode of line connection is arranged in described electronic component mounting hole.
Preferably, connection screw thread, the installation portion of described support bar are provided with the inwall of described support bar mounting hole
Outer wall on be also equipped with connection screw thread, the mode that described support bar is connected through a screw thread is arranged on described support bar and installed
In hole.
Preferably, described support bar mounting hole is uniformly arranged on described radiating piece body.
Technical scheme more than, the beneficial effect of the application are：
A kind of ceramic heat-dissipating part body and support bar described herein are dismountable connection, and the structure of radiating piece can be with
It is adjusted according to actual use, and beneficial to installation electronic component.
With reference to following explanation and accompanying drawing, the particular implementation of the application is disclose in detail, specifies the original of the application
Reason can be in a manner of adopted.It should be understood that presently filed embodiment is not so limited in scope.In appended power
In the range of the spirit and terms that profit requires, presently filed embodiment includes many changes, modifications and is equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
Used in individual other embodiment, it is combined with the feature in other embodiment, or substitute the feature in other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when being used herein, but simultaneously
It is not excluded for the presence or additional of one or more further features, one integral piece, step or component.
Brief description of the drawings
Accompanying drawing described here is only used for task of explanation, and is not intended in any way to limit model disclosed in the present application
Enclose.In addition, shape and proportional sizes of each part in figure etc. are only schematical, the understanding to the application is used to help, and
It is not the specific shape and proportional sizes for limiting each part of the application.Those skilled in the art, can under teachings of the present application
To select various possible shapes and proportional sizes to implement the application as the case may be.In the accompanying drawings：
Fig. 1 is a kind of structural representation of the ceramic heat-dissipating part of microelectronic component described herein；
Fig. 2 is a kind of cross-sectional view of the ceramic heat-dissipating part of microelectronic component described herein；
Fig. 3 is the structural representation of support bar described herein,
Wherein：1st, radiating piece body；2nd, support bar mounting hole；3rd, electronic component mounting hole；4th, support bar；41st, installation portion；
42nd, bar body is supported.
Embodiment
Below in conjunction with the accompanying drawing in the application embodiment, the technical scheme in the application embodiment is carried out clear
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under the premise of creative work is not made
The every other embodiment obtained, belong to the scope of the application protection.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article and the technical field of the application is belonged to
The implication that technical staff is generally understood that is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more
The arbitrary and all combination of related Listed Items.
As shown in Fig. 1 ~ 3, the application is related to a kind of ceramic heat-dissipating part of microelectronic component, described ceramic heat-dissipating part bag
Radiating piece body 1 is included, multiple support bar mounting holes 2 and multiple electronic component mounting holes are provided with described radiating piece body 1
3, support bar 4 is installed on described support bar mounting hole 2, electronic component is installed on described electronic component mounting hole 3, institute
The radiating piece body 1 stated is made up with described support bar 4 of ceramic material.Described support bar 4 includes described for being fastened on
Support bar mounting hole 2 on installation portion 41 and the support bar body 42 that is arranged under described installation portion 41, described installation
Portion 41 and described support bar body 42 are square column construction, and the area of section of described installation portion 41 is less than described
Support the area of section of bar body 42.It is mutually be bonded by viscose glue between described installation portion 41 and described support bar mounting hole 2.
Described electronic component is LED bulb.The back side of described radiating piece body 1 is provided with the Wiring trough of installation power line, described
Wiring trough extend to the edge of described electronic component mounting hole 3.The inwall of described electronic component mounting hole 3 is provided with
Connection screw thread, the mode that described electronic component is connected through a screw thread are arranged in described electronic component mounting hole 3.Described
It is provided with connection screw thread on the inwall of support bar mounting hole 2, the company of being also equipped with the outer wall of the installation portion 41 of described support bar 4
Screw thread is connect, the mode that described support bar 4 is connected through a screw thread is arranged in described support bar mounting hole 2.Described support
Bar mounting hole 2 is uniformly arranged on described radiating piece body 1.
A kind of ceramic heat-dissipating part body 1 and support bar 4 described herein are dismountable connection, and the structure of radiating piece can
To be adjusted according to actual use, and beneficial to installation electronic component.
It should be noted that in the description of the present application, in the description of the present application, unless otherwise indicated, " multiples' "
It is meant that two or more.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot
Together in this.Describe the term " substantially by ... forms " of combination should include determined by element, composition, part or step and reality
Other elements, composition, part or the step of the basic novel feature of the combination are not influenceed in matter.Using term "comprising" or
" comprising " describes the combination of element here, composition, part or step it is also contemplated that substantially by these elements, composition, part
Or the embodiment that step is formed.Here by using term " can with ", it is intended to which illustrate that " can with " include is described any
Attribute is all optional.
Multiple element, composition, part or step can be provided by single integrated component, composition, part or step.It is alternative
Ground, single integrated component, composition, part or step can be divided into multiple element, composition, part or the step of separation.It is used for
The open "a" or "an" for describing element, composition, part or step is not said to exclude other elements, composition, part
Or step.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
State, many embodiments and many applications outside the example provided all will be aobvious and easy for a person skilled in the art
See.Therefore, the scope of this teaching should not determine with reference to foregoing description, but should with reference to preceding claims and this
The four corner of the equivalent that a little claims are possessed determines.It is for comprehensive purpose, all articles and special with reference to including
The disclosure of profit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as applicant the theme is not thought of as it is disclosed
Apply for a part for theme.
Claims (8)
- A kind of 1. ceramic heat-dissipating part of microelectronic component, it is characterised in that：Described ceramic heat-dissipating part includes radiating piece body, Multiple support bar mounting holes and multiple electronic component mounting holes, the installation of described support bar are provided with described radiating piece body Support bar is installed on hole, electronic component is installed on described electronic component mounting hole, described radiating piece body with it is described Support bar be made up of ceramic material.
- A kind of 2. ceramic heat-dissipating part of microelectronic component according to claim 1, it is characterised in that：Described support bar Including for the installation portion being fastened on described support bar mounting hole and the support bar body being arranged under described installation portion, Described installation portion is square column construction with described support bar body, and the area of section of described installation portion is less than institute The area of section for the support bar body stated.
- A kind of 3. ceramic heat-dissipating part of microelectronic component according to claim 2, it is characterised in that：Described installation portion It is mutually be bonded by viscose glue between described support bar mounting hole.
- A kind of 4. ceramic heat-dissipating part of microelectronic component according to claim 3, it is characterised in that：Described electronics member Part is LED bulb.
- A kind of 5. ceramic heat-dissipating part of microelectronic component according to claim 4, it is characterised in that：Described radiating piece The back side of body is provided with the Wiring trough of installation power line, and described Wiring trough extends to the side of described electronic component mounting hole At edge.
- A kind of 6. ceramic heat-dissipating part of microelectronic component according to claim 3, it is characterised in that：Described electronics member The inwall of part mounting hole is provided with connection screw thread, and the mode that described electronic component is connected through a screw thread is arranged on described electronics In element mounting hole.
- A kind of 7. ceramic heat-dissipating part of microelectronic component according to claim 1, it is characterised in that：Described support bar Connection screw thread is provided with the inwall of mounting hole, connection screw thread, institute are also equipped with the outer wall of the installation portion of described support bar The mode that the support bar stated is connected through a screw thread is arranged in described support bar mounting hole.
- A kind of 8. ceramic heat-dissipating part of microelectronic component according to claim 7, it is characterised in that：Described support bar Mounting hole is uniformly arranged on described radiating piece body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661770.XU CN206977894U (en) | 2017-06-08 | 2017-06-08 | A kind of ceramic heat-dissipating part of microelectronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661770.XU CN206977894U (en) | 2017-06-08 | 2017-06-08 | A kind of ceramic heat-dissipating part of microelectronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206977894U true CN206977894U (en) | 2018-02-06 |
Family
ID=61407392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720661770.XU Expired - Fee Related CN206977894U (en) | 2017-06-08 | 2017-06-08 | A kind of ceramic heat-dissipating part of microelectronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206977894U (en) |
-
2017
- 2017-06-08 CN CN201720661770.XU patent/CN206977894U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180206 Termination date: 20210608 |
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| CF01 | Termination of patent right due to non-payment of annual fee |