CN107977060A - A kind of cpu heat - Google Patents
A kind of cpu heat Download PDFInfo
- Publication number
- CN107977060A CN107977060A CN201711200947.7A CN201711200947A CN107977060A CN 107977060 A CN107977060 A CN 107977060A CN 201711200947 A CN201711200947 A CN 201711200947A CN 107977060 A CN107977060 A CN 107977060A
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- heat
- side plates
- component
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This application involves a kind of cpu heat, the radiator includes bottom plate, two side plates being arranged on bottom plate, two side plates are mutually perpendicular to the bottom plate, two side plates are arranged in parallel, multiple first heat sinks are provided with the downside of the bottom plate, multiple second heat sinks are provided with the side plate, first heat sink is mutually perpendicular to the bottom plate, and second heat sink is arranged in a mutually vertical manner with the side plate.This application involves a kind of cpu heat, the effect for being provided with heat sink, can farthest playing heat dissipation on the bottom plate of radiator and three side plates, the heat spreader structures are simple, easily manufactured.
Description
Technical field
This application involves a kind of cpu heat.
Background technology
In the prior art, radiator is hot water（Or steam）Important in heating system, basic building block.Hot water
Cool down in radiator（Or steam condenses in radiator）To indoor heating, achieve the purpose that heating.The metal consumption of radiator
Amount and cost occupy sizable ratio in heating system, and therefore, the correct of radiator selects the economic indicator for being related to system
And operational effect.
The content of the invention
The main purpose of the application is to provide a kind of cpu heat, the problems such as to overcome the prior art.
To realize aforementioned application purpose, the technical solution that the application uses includes：
This application involves a kind of cpu heat, the radiator includes bottom plate, two side plates being arranged on bottom plate, described
Two side plates be mutually perpendicular to the bottom plate, described two side plates are arranged in parallel, set on the downside of the bottom plate
Be equipped with multiple first heat sinks, be provided with multiple second heat sinks on the side plate, first heat sink with it is described
Bottom plate is mutually perpendicular to, and second heat sink is arranged in a mutually vertical manner with the side plate.
Preferably, installation space is formed between two side plates.
Preferably, two side plates are that the both sides of the bottom plate are folded upward at being formed.
Preferably, the upper end of multiple first heat sinks is connected by welding with the bottom plate.
Preferably, the one end of multiple second heat sinks is fixedly connected on the side plate by welding
On.
Preferably, multiple first heat sinks are arranged in parallel, and multiple second heat sinks are parallel to each other
Set.
Preferably, the radiator is made of aluminum material.
Technical solution more than, the beneficial effect of the application are：
This application involves a kind of cpu heat, and heat sink is provided with the bottom plate of radiator and three side plates, can be maximum
The effect for playing heat dissipation of degree, the heat spreader structures are simple, easily manufactured.
With reference to following explanation and attached drawing, the particular implementation of the application is disclose in detail, specifies the original of the application
Reason can be in a manner of adopted.It should be understood that presently filed embodiment is not so limited in scope.In appended power
In the range of the spirit and terms that profit requires, presently filed embodiment includes many changes, modifications and is equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
Used in a other embodiment, it is combined with the feature in other embodiment, or substitute the feature in other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when being used herein, but simultaneously
It is not excluded for the presence or additional of one or more further features, one integral piece, step or component.
Brief description of the drawings
Attached drawing described here is only used for task of explanation, and is not intended in any way to limit model disclosed in the present application
Enclose.In addition, shape and proportional sizes of each component in figure etc. are only schematical, the understanding to the application is used to help, and
It is not the specific shape and proportional sizes for limiting each component of the application.Those skilled in the art, can under teachings of the present application
To select various possible shapes and proportional sizes to implement the application as the case may be.In the accompanying drawings：
Attached drawing 1 is a kind of structure diagram of cpu heat,
In the figures above：1st, bottom plate；2nd, side plate；11st, the first heat sink；21st, the second heat sink.
Embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu, be fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute without creative efforts
The every other embodiment obtained, shall fall in the protection scope of this application.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article and the technical field of the application is belonged to
The normally understood implication of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more
The arbitrary and all combination of relevant Listed Items.
As shown in the figure, this application involves a kind of cpu heat, the radiator includes bottom plate 1, is arranged on bottom plate 1
Two side plates 2, described two side plates 2 are mutually perpendicular to the bottom plate 1, and described two side plates 2 are arranged in parallel,
The downside of the bottom plate 1 is provided with multiple first heat sinks 11, and multiple second heat sinks 21 are provided with the side plate 2,
First heat sink 11 is mutually perpendicular to the bottom plate 1, and second heat sink 21 mutually hangs down with the side plate 2
It is straight to set.Installation space is formed between two side plates 2.Two side plates 2 are that the both sides of the bottom plate 1 are upward
It is bent to form.The upper end of multiple first heat sinks 11 is connected by welding with the bottom plate 1.Described
The one end of multiple second heat sinks 21 is fixedly connected on the side plate 2 by welding.Described multiple first
Heat sink 11 is arranged in parallel, and multiple second heat sinks 21 are arranged in parallel.The radiator is aluminum material
Material is made.
This application involves a kind of cpu heat, and heat sink, energy are provided with the bottom plate 1 of radiator and three side plates 2
Enough effects for farthest playing heat dissipation, the heat spreader structures are simple, easily manufactured.
It should be noted that in the description of the present application, in the description of the present application, unless otherwise indicated, " multiples' "
It is meant that two or more.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot
Together in this.Identified element, component, component or step and reality should be included by describing the term " substantially by ... form " of combination
Other elements, component, component or the step of the basic novel feature of the combination are not influenced in matter.Using term "comprising" or
" comprising " describes the combination of element here, component, component or step it is also contemplated that substantially by these elements, component, component
Or the embodiment that step is formed.Here by using term " can with ", it is intended to it is described any to illustrate that " can with " includes
Attribute is all optional.
Multiple element, component, component or step can be provided by single integrated component, component, component or step.It is alternative
Ground, single integrated component, component, component or step can be divided into separated multiple element, component, component or step.It is used for
The open "a" or "an" for describing element, component, component or step is not said to exclude other elements, component, component
Or step.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
State, many embodiments and many applications outside the example provided all will be aobvious and easy for a person skilled in the art
See.Therefore, the scope of this teaching should not be determined with reference to foregoing description, but should with reference to preceding claims and this
The four corner of the equivalent that a little claims are possessed determines.It is for comprehensive purpose, all articles and special with reference to including
The disclosure of profit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as applicant the theme is not thought of as it is disclosed
Apply for a part for theme.
Claims (7)
- A kind of 1. cpu heat, it is characterised in that：The radiator includes bottom plate, two side plates being arranged on bottom plate, institute Two side plates and the bottom plate stated are mutually perpendicular to, and described two side plates are arranged in parallel, the downside of the bottom plate Be provided with multiple first heat sinks, be provided with multiple second heat sinks on the side plate, first heat sink with it is described Bottom plate be mutually perpendicular to, second heat sink is arranged in a mutually vertical manner with the side plate.
- 2. cpu heat according to claim 1, it is characterised in that：Installation space is formed between two side plates.
- 3. cpu heat according to claim 2, it is characterised in that：Two side plates are the two of the bottom plate It is bent to form on lateral.
- 4. cpu heat according to claim 3, it is characterised in that：The upper end of multiple first heat sinks with The bottom plate connects by welding.
- 5. cpu heat according to claim 4, it is characterised in that：The one end of multiple second heat sinks leads to The mode for crossing welding is fixedly connected on the side plate.
- 6. cpu heat according to claim 5, it is characterised in that：Multiple first heat sinks, which are parallel to each other, to be set Put, multiple second heat sinks are arranged in parallel.
- 7. cpu heat according to claim 6, it is characterised in that：The radiator is made of aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711200947.7A CN107977060A (en) | 2017-11-27 | 2017-11-27 | A kind of cpu heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711200947.7A CN107977060A (en) | 2017-11-27 | 2017-11-27 | A kind of cpu heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107977060A true CN107977060A (en) | 2018-05-01 |
Family
ID=62011856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711200947.7A Pending CN107977060A (en) | 2017-11-27 | 2017-11-27 | A kind of cpu heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107977060A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2852618Y (en) * | 2004-10-23 | 2006-12-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN204633576U (en) * | 2015-05-22 | 2015-09-09 | 深圳市德瑞斯电气技术有限公司 | A kind of radiator on frequency converter |
| CN106921301A (en) * | 2017-03-24 | 2017-07-04 | 张家港润盛科技材料有限公司 | A kind of aluminium shell for solar inverter |
-
2017
- 2017-11-27 CN CN201711200947.7A patent/CN107977060A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2852618Y (en) * | 2004-10-23 | 2006-12-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN204633576U (en) * | 2015-05-22 | 2015-09-09 | 深圳市德瑞斯电气技术有限公司 | A kind of radiator on frequency converter |
| CN106921301A (en) * | 2017-03-24 | 2017-07-04 | 张家港润盛科技材料有限公司 | A kind of aluminium shell for solar inverter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014016144A (en) | Plate for heat exchanger, heat exchanger, and air cooler comprising heat exchanger | |
| WO2007100595A3 (en) | Triangular shaped heat exchanger | |
| CN107977060A (en) | A kind of cpu heat | |
| CN107995828A (en) | A kind of radiating piece for pcb board | |
| CN108022705A (en) | A kind of resistive dissipation part | |
| CN107966061A (en) | A kind of heat dissipation element | |
| CN107949245A (en) | A kind of power supply heat sinking part | |
| CN107978401A (en) | A kind of manufacture method of resistive dissipation part | |
| CN107983803A (en) | A kind of preparation method of pcb board radiating piece | |
| CN107769019A (en) | A kind of sheet metal component distribution box | |
| CN103486886B (en) | The box-like stacking heat exchanger of different plates thickness difference plate spacing runner height | |
| CN206977894U (en) | A kind of ceramic heat-dissipating part of microelectronic component | |
| CN206973504U (en) | A kind of ceramic device for electronic device | |
| CN107797624A (en) | A kind of casing | |
| CN107881860A (en) | A kind of metal plate clamping track | |
| CN207529776U (en) | Corrugated tank of transformer | |
| CN206991198U (en) | A kind of notebook computer casing for being easy to radiating | |
| CN108304052A (en) | A kind of radiator of tablet computer | |
| CN108196653A (en) | A kind of rotatable tablet computer radiating subassembly | |
| CN108211452A (en) | A kind of grid component to purify water | |
| CN108253567A (en) | A kind of energy conservation environmental protection air conditioner | |
| CN107956786A (en) | A kind of metal plate attachment device of rotation | |
| CN107956767A (en) | A kind of pipeline metal plate connector | |
| CN108143097A (en) | A kind of desk | |
| CN206976323U (en) | A kind of graphite heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180501 |