CN205611131U - Multicore piece formula heat abstractor that floats - Google Patents
Multicore piece formula heat abstractor that floats Download PDFInfo
- Publication number
- CN205611131U CN205611131U CN201620197240.XU CN201620197240U CN205611131U CN 205611131 U CN205611131 U CN 205611131U CN 201620197240 U CN201620197240 U CN 201620197240U CN 205611131 U CN205611131 U CN 205611131U
- Authority
- CN
- China
- Prior art keywords
- radiator
- floating
- screw
- assembly
- radiating subassembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a multicore piece formula heat abstractor that floats, includes: radiator unit and function veneer float, unsteady radiator unit is located the function veneer, the radiator unit that floats includes transportation support plate component and individual heat sink component, and individual radiator links to each other with the upper surface of transporting the layer board, transport the lower surface and the function veneer of layer board and fix, unsteady radiator unit passes through the heat pipe and establishes ties. The utility model discloses contrast prior art, can protect the radiator transportation in the heat pipe indeformable, when realizing the soaking, can satisfy a plurality of high consumption chips and correspond float the simultaneously effect of assembly of radiator. The utility model discloses a fixed mode of the unsteady radiator of technical scheme multicore piece formula is simple, but can improve the assembling and the productibility of product.
Description
[technical field]
The utility model discloses a kind of floating heat abstractor, a kind of multi-chip type floating heat abstractor that may be used for electronics or communication apparatus.
[background technology]
In electronics and communication apparatus, heat sink applications ratio is wide.Along with the development of industry, chip power-consumption is increasing, and then, the heat-sinking capability of radiator is required more and more higher.Especially for some high power dissipating chip, traditional radiator and heat-pipe radiator cannot meet higher requirement, the heat radiation of multiple high power dissipating chip in the most same function veneer.
Applying more radiator in the market is Hard link fixed form or the fixed form of single radiator band flexible member.But, these radiators are not suitable for multiple high power dissipating chip on function veneer and dispel the heat and soaking simultaneously.It addition, two floating radiators that in industry, useful heat pipe connects, by analyzing, this floating radiator is not suitable for multiple high power dissipating chip and dispels the heat or soaking simultaneously.
[utility model content]
For drawbacks described above, this utility model provides a kind of multi-chip type floating heat abstractor.
A kind of multi-chip type floating heat abstractor, including: floating radiating subassembly and function veneer, described floating radiating subassembly is positioned on function veneer, floating radiating subassembly is corresponding with installation site on function veneer, described floating radiating subassembly includes transshipment brace assembly and individual heat sink assembly, individual radiator is connected with the upper surface of transshipment brace, and the lower surface of transshipment brace is fixed with function veneer, and described floating radiating subassembly is connected by heat pipe.
Described transshipment brace assembly includes transshipment brace and does not deviate from screw assembly, and individual heat sink assembly is connected on transshipment brace by not deviating from screw assembly, and realizes the Relative Floating between individual radiator and transshipment brace.
Described transshipment brace includes crimp and via, described do not deviate from screw assembly and can include screw, spring and interstage sleeve, does not deviate from screw and can be screwed into the threaded portion on interstage sleeve top.
Described each individual floating radiating subassembly includes that two are not deviate from screw, described do not deviate from screw and is positioned at the centre position of radiating subassembly, is connected on transshipment brace by described screw.
Described floating radiating subassembly is fixed on function veneer by anti-loosing screw assembly.
Described anti-loosing screw assembly includes that anti-loosing screw, spring and E buckle back-up ring, and described individual heat sink assembly includes fixing screwed hole.
Described each floating radiating subassembly includes that four Anti-extrusion screws, four anti-loosing screws lay respectively at four angles of radiator.
Described function veneer includes chip and Surface Mount nut, when in described anti-loosing screw assembly, anti-loosing screw is gradually screwed into Surface Mount nut in function veneer, function list chip on board can put on individual radiator upwards active force, so that spring and do not deviate from spring stress in screw assembly in anti-loosing screw assembly.
Described function veneer includes that chip and Surface Mount nut, function list chip on board can put on individual radiating subassembly upwards active force.
This utility model against existing technologies, can protect heat pipe in radiator transportation indeformable, while realizing soaking, can meet the effect of multiple high power dissipating chip correspondence radiator floating assembly simultaneously.This utility model art solutions multi-chip type floating radiator fixed form is simple, can improve assembling capacity and the productibility of product.
[accompanying drawing explanation]
Fig. 1 is schematic diagram after this utility model multi-chip type floating radiator assembles with function veneer
Fig. 2 is this utility model multi-chip type floating heat sink assembly figure
Fig. 3 is that this utility model multi-chip type floating heat sink assembly hides schematic diagram after transshipment brace
Fig. 4 is this utility model multi-chip type floating heat sink assembly heat pipe distribution schematic diagram
Fig. 5 is this utility model multi-chip type radiator transshipment brace component drawings
Fig. 6 is that this utility model transshipment brace assembly assembles enlarged partial sectional view
Fig. 7 is this utility model individuality heat sink assembly assembly structure figure
Fig. 8 is floating effect figure after the assembling of this utility model multi-chip type floating radiator
[detailed description of the invention]
It is described in detail below in conjunction with-8 couples of present invention of Fig. 1:
A kind of multi-chip type floating heat abstractor, including: floating radiating subassembly 20 and function veneer 10, described floating radiating subassembly is positioned on function veneer, floating radiating subassembly is corresponding with installation site on function veneer, described floating radiating subassembly includes transshipment brace assembly 200 and individual heat sink assembly, individual radiator is connected with the upper surface of transshipment brace, and the lower surface of transshipment brace is fixed with function veneer, and described floating radiating subassembly is connected by heat pipe.
Fig. 1 be this utility model multi-chip type floating heat sink assembly 20 the assembling with function veneer 10 after schematic diagram.Multi-chip type floating radiating subassembly 20 is arranged on function single-plate component 10, fixes with anti-loosing screw assembly between multi-chip type floating heat sink assembly 20 and function single-plate component 10.
Fig. 2 is this utility model multi-chip type floating heat sink assembly figure.Multi-chip type floating heat sink assembly 20 includes transshipment brace assembly 200, radiator 201, radiator 202, radiator 203, radiator 204, radiator 205, radiator 206.
Fig. 3 is that this utility model multi-chip type floating heat sink assembly hides schematic diagram after transshipment brace.Radiator 201, radiator 202, radiator 203, radiator 204, radiator 205, radiator 206 are connected with heat pipe in heat pipe layout region 207 the most respectively, depending on concrete heat pipe series connection and layout type can be according to heat emulation optimum efficiencies, in this patent, heat pipe layout is with reference to Fig. 4.
Fig. 5 is this utility model multi-chip type radiator transshipment brace component drawings.Transshipment brace assembly 200 includes transshipment brace 30, does not deviate from screw assembly 40.Wherein, transshipment brace 30 includes bending edges 301, via 302；Do not deviate from screw assembly 40 and can not include screw 401, spring 402 and interstage sleeve 40.Have four on each radiator and do not deviate from screw assembly 40, lay respectively at the middle part of radiator.Transshipment brace assembly assembling process is as it is shown in figure 5, after implementing assembling floating effect is as shown in Figure 6.Assembling procedure declaration: do not deviate from or not in screw assembly 40 screw 401 through via 302 on bending edges 301 in transshipment brace 30, afterwards through spring 402, finally the threaded portion 4011 not deviating from screw 401 is screwed into interstage sleeve threaded portion 4031 on interstage sleeve 403, until being fully screwed into.Now, spring 402 falls into interstage sleeve 4030 region, do not deviate from or not on screw 401 screw body part 4010 can on interstage sleeve 403 4031 in movable.Screw assembly 40 profile is not deviate from effect such as figure after assembling.
Fig. 7 is this utility model individuality heat sink assembly assembly structure figure.The individual heat sink assembly 206 of diagram only explanation, remaining is similar.Individual heat sink assembly includes anti-loosing screw assembly 50 and individual radiator.Anti-loosing screw assembly 50 includes that back-up ring 503 buckled by anti-loosing screw 501, spring 502 and E；Including fixing screwed hole 2061 on radiator on individual radiator, fixing screwed hole 2061 is for the threaded securing bores between transshipment brace assembly and individual radiator, after fixing as shown in Figure 2.
Fig. 8 is that multi-chip type floating radiator is assembled to floating effect figure after function veneer 10.The individual heat sink assembly 206 of diagram only explanation, remaining is similar.Procedure declaration: multi-chip type floating heat sink assembly 20 is corresponding with function veneer 10 installation site；Anti-loosing screw assembly 50 on fixing individual heat sink assembly 206, described anti-loosing screw assembly has four, lay respectively at the surrounding of radiator, when Surface Mount nut 102 during anti-loosing screw 501 is gradually screwed into function veneer 10 in anti-loosing screw assembly 50, on function veneer 10, chip 101 puts on individual radiator upwards active force.Now, spring 502 and do not deviate from spring 402 pressurized in screw assembly 40 in anti-loosing screw assembly 50, meanwhile, the heat pipe in heat pipe region floats.Radiator 201, individual radiator 202, radiator 203, radiator 204, radiator 205 all use above-mentioned assembling process, finally realize multi-chip the most individual the most corresponding radiator, and entirety realizes multi-chip type floating effect.
This patent, on the premise of considering the market demand and product attribute, devises a kind of relocatable radiator of multi-chip type, and on the one hand this kind of radiator freely can regulate according to different chip heights, without limitations；On the one hand use heat-conducting silicone grease as heat-conducting medium, improve heat transfer efficiency；It addition, this patent is connected with heat pipe between radiator with radiator, also embody the feature of soaking each other between radiator.
Above example is preferred embodiment of the present utility model; this utility model is not limited to above-described embodiment; for those of ordinary skills; the any obvious change done on the basis of without departing substantially from this utility model know-why, broadly falls into the protection domain of design of the present utility model and claims.
Claims (9)
1. a multi-chip type floating heat abstractor, it is characterized in that, including: floating radiating subassembly and function veneer, described floating radiating subassembly is positioned on function veneer, floating radiating subassembly is corresponding with installation site on function veneer, and described floating radiating subassembly includes transshipment brace assembly and individual heat sink assembly, and individual radiator is connected with the upper surface of transshipment brace, the lower surface of transshipment brace is fixed with function veneer, and described floating radiating subassembly is connected by heat pipe.
Multi-chip type floating heat abstractor the most according to claim 1, it is characterized in that: described transshipment brace assembly includes transshipment brace and do not deviates from screw assembly, individual heat sink assembly is connected on transshipment brace by not deviating from screw assembly, and realizes the Relative Floating between individual radiator and transshipment brace.
Multi-chip type floating heat abstractor the most according to claim 2, it is characterized in that: described transshipment brace includes crimp and via, described do not deviate from screw assembly and can not include screw, spring and interstage sleeve, do not deviate from screw and can be screwed into the threaded portion on interstage sleeve top.
4. according to the multi-chip type floating heat abstractor described in Claims 2 or 3, it is characterized in that: described each floating radiating subassembly includes that two are not deviate from screw, described do not deviate from screw and be positioned at the centre position of individual radiating subassembly, be connected on transshipment brace by described screw.
Multi-chip type floating heat abstractor the most according to claim 1, it is characterised in that: described floating radiating subassembly is fixed on function veneer by anti-loosing screw assembly.
Multi-chip type floating heat abstractor the most according to claim 5, it is characterised in that: described anti-loosing screw assembly includes that anti-loosing screw, spring and E buckle back-up ring, and described individual heat sink assembly includes fixing screwed hole.
7. according to the multi-chip type floating heat abstractor described in claim 5 or 6, it is characterised in that: described each floating radiating subassembly includes that four Anti-extrusion screws, four anti-loosing screws lay respectively at four angles of radiator.
Multi-chip type floating heat abstractor the most according to claim 5, it is characterized in that: described function veneer includes chip and Surface Mount nut, when in described anti-loosing screw assembly, anti-loosing screw is gradually screwed into Surface Mount nut in function veneer, function list chip on board can put on individual radiator upwards active force, so that spring and do not deviate from spring stress in screw assembly in anti-loosing screw assembly.
Multi-chip type floating heat abstractor the most according to claim 1, it is characterised in that: described function veneer includes that chip and Surface Mount nut, function list chip on board can put on individual radiating subassembly upwards active force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620197240.XU CN205611131U (en) | 2016-03-15 | 2016-03-15 | Multicore piece formula heat abstractor that floats |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620197240.XU CN205611131U (en) | 2016-03-15 | 2016-03-15 | Multicore piece formula heat abstractor that floats |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611131U true CN205611131U (en) | 2016-09-28 |
Family
ID=56962130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620197240.XU Active CN205611131U (en) | 2016-03-15 | 2016-03-15 | Multicore piece formula heat abstractor that floats |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611131U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788911A (en) * | 2019-11-08 | 2021-05-11 | 中兴通讯股份有限公司 | Radiator and circuit board heat radiation structure |
| CN113050762A (en) * | 2019-12-27 | 2021-06-29 | 华为技术有限公司 | Heat dissipation device and server |
| WO2024098790A1 (en) * | 2022-11-10 | 2024-05-16 | 华为技术有限公司 | Electronic assembly and electronic device |
-
2016
- 2016-03-15 CN CN201620197240.XU patent/CN205611131U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788911A (en) * | 2019-11-08 | 2021-05-11 | 中兴通讯股份有限公司 | Radiator and circuit board heat radiation structure |
| CN113050762A (en) * | 2019-12-27 | 2021-06-29 | 华为技术有限公司 | Heat dissipation device and server |
| WO2021129046A1 (en) * | 2019-12-27 | 2021-07-01 | 华为技术有限公司 | Heat dissipation device and server |
| US12089376B2 (en) | 2019-12-27 | 2024-09-10 | Huawei Technologies Co., Ltd. | Heat dissipation device and server including a fixing bracket and heat sinks |
| WO2024098790A1 (en) * | 2022-11-10 | 2024-05-16 | 华为技术有限公司 | Electronic assembly and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205611131U (en) | Multicore piece formula heat abstractor that floats | |
| US20140069611A1 (en) | Heat Dissipater | |
| KR970072372A (en) | Stack modules | |
| CN104159437B (en) | Composite heat dissipation device | |
| US7372702B2 (en) | Heat spreader | |
| CN105472942B (en) | Radiator and electronic product | |
| US20110048677A1 (en) | Heat-conducting assembly for heat pipes of different diameters and heat sink having the same | |
| CN104105380B (en) | Heat sink device | |
| CN204180460U (en) | A kind of fin | |
| CN107134975B (en) | Multichannel manifold system for heat dissipation of concentrating photovoltaic cell | |
| CN205566947U (en) | Heat abstractor and function board subassembly | |
| CN204962678U (en) | High -power LED lamp radiator unit of efficient | |
| MX2007015498A (en) | Heat exchanger for solar energy generators. | |
| CN206820723U (en) | A kind of novel concentrator photovoltaic cell heat transmission multichannel manifolding | |
| US20070285897A1 (en) | Thermal module with heat pipe | |
| CN205305321U (en) | Thermal insulation piece | |
| CN206130774U (en) | LED lamps and lanterns suitable for road lighting | |
| CN205830212U (en) | A kind of vacuum sealed radiating device of electronic system | |
| CN205179620U (en) | Heat conduction aluminium foil | |
| CN205609520U (en) | Ultra -large -power NULL light source | |
| CN208268907U (en) | Fruit dredges light filling special lamp | |
| CN204707389U (en) | A kind of flexible heat sink fin | |
| CN206481552U (en) | A kind of radiator being combined | |
| CN210694714U (en) | Heat dissipation device for inverter | |
| CN206098381U (en) | Power tube mounting structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |