CN206976791U - A kind of C mount encapsulate semiconductor laser ageing device - Google Patents
A kind of C mount encapsulate semiconductor laser ageing device Download PDFInfo
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- CN206976791U CN206976791U CN201720756953.XU CN201720756953U CN206976791U CN 206976791 U CN206976791 U CN 206976791U CN 201720756953 U CN201720756953 U CN 201720756953U CN 206976791 U CN206976791 U CN 206976791U
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Abstract
It the utility model is related to a kind of C mount encapsulation semiconductor laser ageing device, belong to Semiconductor Optic Electronics burn-in screen technical field, device includes base, base is provided with boss, boss surface is provided with the heat sink necks of C mount, the boss vertical plane of C mount are heat sink neck side is provided with negative plate, insulating barrier is provided between negative plate and boss, base is provided with positive pole fixed support and negative pole fixed support, positive pole fixed support and negative pole fixed support are equipped with through hole, positive pole fixed support is threadedly coupled by through hole with positive pole fixed column, negative pole fixed support is threadedly coupled by through hole with negative pole fixed column.The present apparatus improves production efficiency on the premise of product quality is ensured, small volume, easy to operate, cost is low；C mount encapsulation semiconductor laser positive poles and negative pole are secured in ageing process well, support and radiating is ensure that, solves the problems, such as that ageing results are bad unstable.
Description
Technical field
It the utility model is related to a kind of C-mount encapsulation semiconductor laser ageing device, particularly high-power C-
Mount encapsulates the device of semiconductor laser ageing, belongs to Semiconductor Optic Electronics burn-in screen technical field.
Background technology
With the development of society and the continuous progress of science and technology, laser constantly highlights it importantly in social every field
Position.Especially semiconductor laser has the advantages that small volume, efficiency high, long lifespan, is widely used in industry, medical treatment, communication
With military field etc..The reliability of device is an a crucial factor, this be also be related to they whether can commercialization master
Want factor.The Reliability Check of semiconductor laser, typically tested using voltage ageing, be exactly to observe device under certain electric current to exist
Aging period exports.The ageing process of semiconductor laser determines the durability of product, reliability to a certain extent, and old
Change used aging device and key effect is just played to product.
At present all can noise spectra of semiconductor lasers progress voltage ageing in the industry.Because semiconductor laser is in energization aging
Heating problem in journey be present, heating have impact on the ageing process of whole semiconductor laser to a certain extent, if radiating is not
The performance of whole product will fully be influenceed.Thus the performance of aging equipment determines whole old to a certain extent with workmanship
Disguise the final working result put.
At present in semicon industry, particularly in field of semiconductor lasers, there is miscellaneous burn-in screen device, all
There is the characteristics of respective and be directed to, but existing aging equipment is typically the aging equipment for products such as TO56 products and COS, such as
Chinese patent (application number 201010550883.5) discloses test and the ageing adapter of a kind of semiconductor laser, including suitable
Orchestration base, adapter electrode, semiconductor laser, spring pressure head, adapter Shang Gai, upper bolt of cover setting, semiconductor laser
Device is placed on the centre of adapter shoe, and semiconductor laser is fixed and compressed with adapter electrode and spring pressure head above,
Covered on adapter and provide mechanical protection effect for adapter shoe, adapter electrode, semiconductor laser, spring pressure head, simultaneously
There is provided for semiconductor laser test and aging by flattening bench, to ensure the uniform cooling of adapter shoe, patent document public affairs
What is opened is a kind of test for semiconductor laser ChiponSubmount (CoS) and burn-in screen adapter.But do not have at present
There is the aging equipment that document is related to C-mount encapsulated lasers, the development range of laser is wider in semicon industry
It is general, the figure of semiconductor laser can be seen in many places field now, good development prospect is also to its quality
Challenge, the aging equipment for being thus related to quality are particularly important.
The content of the invention
In view of the shortcomings of the prior art, the utility model provides a kind of C-mount encapsulation semiconductor laser ageing dress
Put.
Term is explained：
C-mount, refer to a kind of general individual laser package form.
The technical solution of the utility model is as follows：
A kind of C-mount encapsulates semiconductor laser ageing device, including base, base are provided with boss, boss table
Face is provided with the heat sink necks of C-mount, and the boss vertical plane of C-mount is heat sink neck side is provided with negative plate, negative plate and boss
Between be provided with insulating barrier, base is provided with positive pole fixed support and negative pole fixed support, and positive pole fixed support and negative pole fix branch
Frame is equipped with through hole, and positive pole fixed support is threadedly coupled by through hole with positive pole fixed column, negative pole fixed support by through hole with
Negative pole fixed column is threadedly coupled.
During experiment, C-mount semiconductor lasers are put into the heat sink necks of C-mount, the lead of corresponding laser
Contacted with negative plate, C-mount semiconductor lasers is compressed with boss by adjusting positive pole fixed column up and down, adjusted by level
Save negative pole fixed column to compress laser pin and negative plate, boss is connected in the positive pole of aging power supply, negative plate is connected old
Change the negative pole of power supply, carry out voltage ageing experiment.By the present apparatus, positive pole fixed column can be made to can be good at partly leading C-mount
Body laser compresses with base, ensure that radiating, because in experiment, can there is gap or laser thermal sediment face not plain, thus
Contact it is bad, contact it is bad the temperature difference can be caused big, for the radiating in experiment, thermal resistance is very crucial, and the tighter thermal resistance of pressure is smaller, because
This can ensure to radiate using the present apparatus.
Preferable according to the utility model, positive pole fixed support is connected with whorl of base, and negative pole fixed support is consolidated with base
Fixed connection.Positive pole fixed support is set freely to rotate, it is ensured that the convenience of handling C-mount encapsulation semiconductor lasers.
Preferable according to the utility model, C-mount encapsulation semiconductor laser ageing devices also include radiator, convex
Platform is hollow with chassis interior, and base is on radiator, and radiator is housing made of aluminium, and enclosure interior is provided with fan.Enter
One step strengthens radiating effect.
It is further preferred that boss is wholely set with base, insulating barrier is provided between base and radiator.Base connection is old
Change the positive pole of power supply, base and radiator are dielectrically separated from, make experiment safer.
Preferable according to the utility model, negative pole fixed column is negative pole fixed column made of insulating materials, and base is copper
Into base.Insulating materials is existing customary insulation material, such as plastics.
Preferable according to the utility model, C-mount is heat sink, and neck is cuboid, and the volume of C-mount is heat sink neck is big
In the volume of C-mount encapsulation semiconductor laser thermal sediments.In this way, when laser is put into the heat sink necks of C-mount, laser
Device is heat sink, and only bottom surface contacts with bottom land, and its lap of laser does not contact with neck, and area of dissipation is big, will in positive pole fixed column
When laser thermal sediment compresses, it is more beneficial for radiating.
The beneficial effects of the utility model are：
The utility model improves the burn-in screen yield rate of C-mount encapsulation semiconductor lasers, is ensureing product matter
Production efficiency is improved on the premise of amount, existing operating defect in production is solved, there is advantages below：
(1) small volume, simple structure, easy to operate, reduces cost of manufacture.
(2) in ageing process, C-mount encapsulation semiconductor laser positive poles and negative pole are secured well, makes laser
The device contact good with base, ensure that the radiating of laser, while serve the effect of fixed support, solve in aging
Easily occurring the loosening of aging device, the problem of causing ageing results bad, while the aging equipment in journey has handling C-mount
Encapsulate the convenience of semiconductor laser.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model C-mount encapsulation semiconductor laser ageing devices.
Wherein：1st, base, 2, C-mount is heat sink neck, 3, negative plate, 4, negative pole fixed support, 5, screw, 6, screw,
7th, negative pole fixed column, 8, positive pole fixed support, 9, screw, 10, positive pole fixed column.
Embodiment
The utility model is described further by way of example and in conjunction with the accompanying drawings, but not limited to this.
Embodiment 1：
A kind of C-mount encapsulates semiconductor laser ageing device, including base, as shown in figure 1, base is provided with convex
Platform, boss surface are provided with the heat sink necks of C-mount, and C-mount is heat sink, and neck is used to lay C-mount encapsulation semiconductor lasers
It is heat sink, the boss vertical plane of C-mount is heat sink neck side is provided with negative plate, and insulating barrier is provided between negative plate and boss,
Base is provided with positive pole fixed support and negative pole fixed support, and positive pole fixed support and negative pole fixed support are equipped with through hole, just
Pole fixed support is threadedly coupled by through hole with positive pole fixed column, and negative pole fixed support is fixed male screw by through hole and negative pole and connected
Connect.Respectively there is a fixing hole the support bracket fastened both sides of negative pole, are screwed and are connected on base.
Boss is wholely set with base, and insulating barrier is provided between base and radiator, and insulating barrier is insulation gummed paper；Negative pole is consolidated
Fixed column is negative pole fixed column made of insulating materials, and insulating materials is plastics, and base is base made of copper.
Embodiment 2：
A kind of C-mount encapsulates semiconductor laser ageing device, its structure as described in Example 1, except that,
Positive pole fixed support is connected with whorl of base, and negative pole fixed support is fixedly connected with base.Allow positive pole fixed support free
Rotate, it is ensured that the convenience of handling C-mount encapsulation semiconductor lasers.
Embodiment 3：
A kind of C-mount encapsulates semiconductor laser ageing device, its structure as described in Example 1, except that,
C-mount encapsulation semiconductor laser ageings also include radiator with device, and boss is hollow with chassis interior, and base is located at radiating
On device, radiator is housing made of aluminium, and enclosure interior is provided with fan, further enhances radiating effect.
During normal experiment, C-mount semiconductor lasers are put into the heat sink necks of C-mount, corresponding laser
Lead contacts with negative plate, C-mount semiconductor lasers is compressed with boss by adjusting positive pole fixed column up and down, passes through water
Heibei provincial opera section negative pole fixed column compresses laser pin and negative plate, sticks insulation gummed paper in base bottom, is then attached to scattered
On hot device, boss is connected in the positive pole of aging power supply, negative plate is connected to the negative pole of aging power supply, carries out voltage ageing experiment.Through
The aging of certain time (being provided according to the characteristic of product in itself) is crossed, product is screened according to technological requirement.
Embodiment 4：
A kind of C-mount encapsulates semiconductor laser ageing device, its structure as described in Example 1, except that,
C-mount is heat sink, and neck is cuboid, and the volume of C-mount is heat sink neck is more than C-mount encapsulation semiconductor laser thermal sediments
Volume.In this way, when laser is put into the heat sink necks of C-mount, laser thermal sediment only has bottom surface to be contacted with bottom land, laser
Its lap of device does not contact with neck, and area of dissipation is big, when positive pole fixed column compresses laser thermal sediment, is more beneficial for dissipating
Heat.
Claims (6)
1. a kind of C-mount encapsulates semiconductor laser ageing device, it is characterised in that including base, base is provided with convex
Platform, boss surface are provided with the heat sink necks of C-mount, and the boss vertical plane of C-mount is heat sink neck side is provided with negative plate, negative pole
It is provided with insulating barrier between piece and boss, base is provided with positive pole fixed support and negative pole fixed support, positive pole fixed support and negative
Pole fixed support is equipped with through hole, and positive pole fixed support is threadedly coupled by through hole with positive pole fixed column, and negative pole fixed support leads to
Through hole is crossed to be threadedly coupled with negative pole fixed column.
2. C-mount according to claim 1 encapsulates semiconductor laser ageing device, it is characterised in that positive pole is solid
Fixed rack is connected with whorl of base, and negative pole fixed support is fixedly connected with base.
3. C-mount according to claim 1 encapsulates semiconductor laser ageing device, it is characterised in that C-mount
Encapsulation semiconductor laser ageing also includes radiator with device, and boss is hollow with chassis interior, and base is located on radiator,
Radiator is housing made of aluminium, and enclosure interior is provided with fan.
4. C-mount according to claim 3 encapsulates semiconductor laser ageing device, it is characterised in that boss with
Base is wholely set, and insulating barrier is provided between base and radiator.
5. C-mount according to claim 1 encapsulates semiconductor laser ageing device, it is characterised in that negative pole is solid
Fixed column is negative pole fixed column made of insulating materials, and base is base made of copper.
6. C-mount according to claim 1 encapsulates semiconductor laser ageing device, it is characterised in that C-mount
Heat sink neck is cuboid, and the volume of C-mount is heat sink neck is more than the volume of C-mount encapsulation semiconductor laser thermal sediments.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720756953.XU CN206976791U (en) | 2017-06-27 | 2017-06-27 | A kind of C mount encapsulate semiconductor laser ageing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720756953.XU CN206976791U (en) | 2017-06-27 | 2017-06-27 | A kind of C mount encapsulate semiconductor laser ageing device |
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| Publication Number | Publication Date |
|---|---|
| CN206976791U true CN206976791U (en) | 2018-02-06 |
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| CN201720756953.XU Active CN206976791U (en) | 2017-06-27 | 2017-06-27 | A kind of C mount encapsulate semiconductor laser ageing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324213A (en) * | 2018-11-02 | 2019-02-12 | 武汉电信器件有限公司 | A kind of aging equipment and aging method of chip of laser |
| CN117147920A (en) * | 2023-08-29 | 2023-12-01 | 武汉永力睿源科技有限公司 | Chip clamp for aging test |
-
2017
- 2017-06-27 CN CN201720756953.XU patent/CN206976791U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324213A (en) * | 2018-11-02 | 2019-02-12 | 武汉电信器件有限公司 | A kind of aging equipment and aging method of chip of laser |
| CN117147920A (en) * | 2023-08-29 | 2023-12-01 | 武汉永力睿源科技有限公司 | Chip clamp for aging test |
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