CN206931575U - The silicon chip support plate of plated film on solar cell - Google Patents
The silicon chip support plate of plated film on solar cell Download PDFInfo
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- CN206931575U CN206931575U CN201720701392.3U CN201720701392U CN206931575U CN 206931575 U CN206931575 U CN 206931575U CN 201720701392 U CN201720701392 U CN 201720701392U CN 206931575 U CN206931575 U CN 206931575U
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- silicon chip
- support plate
- support
- plated film
- plane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
It the utility model is related to field, a kind of more particularly to silicon chip support plate for plated film on solar cell, compared with the upper plated film support plate of routine, the side of silicon chip four is leaned against on the medium position on support inclined-plane, it can ensure that silicon chip to be processed only exists four sidelines with support plate and contacted, change original face contact form;Sloping platform face can ensure slide downward trend in silicon chip feeding be present, and more stable leans against on support plate, ensure that the stability in technique transmitting procedure, reduce shake and fragmentation figures;Support horizontal plane can reach around plating situation existing for the upper plated film of stop, as protection panel assembly.
Description
Technical field
It the utility model is related to field, more particularly to a kind of silicon chip support plate for plated film on solar cell.
Background technology
What upper plated film support plate used at present design for step-like recesses, it is silicon chip film-coated place up deposit SINx (or
ALOx), down, the upper plated film support plate of this kind of step existing with silicon chip is that face contacts (as shown in Figure 1) to non-coated surface, easily
Cell piece after cleaning is polluted;The SINx deposited after support plate is using long period use etc. is thickening, silicon chip and support plate
Contact site easily occurs that plated film is uneven, places the problems such as out-of-flatness, and due to the unobstructed part of current support plate, can cause compared with
Around plating situation, (winding degree is exactly mainly than if desired for back side coating film, but understands some and bypasses backside deposition to positive side more
Edge region), produce edge effect.
Utility model content
The technical problems to be solved in the utility model is:In order to improve silicon chip contacted with support plate and plated film caused by asked around plating
Topic, reduces pollution silicon chip situation, and the utility model provides a kind of silicon chip support plate for plated film on solar cell.
Technical scheme is used by the utility model solves its technical problem:It is a kind of to be used for plated film on solar cell
Silicon chip support plate, including the support plate body in frame-like, support plate inner body wall have support inclined-plane and support horizontal plane, support level
The bottom on face and support inclined-plane is connected, support inclined-plane from lower to upper gradually outward-dipping, support horizontal plane and support inclined-plane
Between the angle [alpha] that is formed be 100-150 °, the width L2 of the bottom on the support plate body interior edge support inclined-plane is less than to be processed
The width L1 of silicon chip.
Preferably, the α is 120 °.
To improve the stability that silicon chip is placed, the length L3 of bottom of the support plate body along support inclined-plane is less than to be processed
The length L4 of silicon chip.
The beneficial effects of the utility model are the silicon chip support plates of the present utility model for plated film on solar cell, with
Conventional upper plated film support plate is compared, and the side of silicon chip four is leaned against on the medium position on support inclined-plane, it is ensured that silicon chip to be processed is with carrying
Plate only exists the contact of four sidelines, changes original face contact form;Sloping platform face can ensure exist downwards in silicon chip feeding
Tendency toward sliding, more stable leans against on support plate, ensure that the stability in technique transmitting procedure, reduces shake and fragment feelings
Condition;Support horizontal plane can reach around plating situation existing for the upper plated film of stop, as protection panel assembly.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of silicon chip support plate in the prior art.
Fig. 2 is the dimensional structure diagram that the utility model is used for the silicon chip support plate of plated film on solar cell.
Fig. 3 is the top view that the utility model is used for the silicon chip support plate of plated film on solar cell.
Fig. 4 is the A-A sectional views that silicon chip to be processed is put in Fig. 3.
The top view of Fig. 5 silicon chips to be processed.
In figure:1st, support plate body, 11, support inclined-plane, 12, support horizontal plane, 10, silicon chip to be processed.
Embodiment
The utility model is described in further detail presently in connection with accompanying drawing.These accompanying drawings are simplified schematic diagram,
Only illustrate basic structure of the present utility model in a schematic way, therefore it only shows the composition relevant with the utility model.
As shown in Figure 2-5, it is the utility model optimum embodiment, a kind of silicon chip for plated film on solar cell carries
Plate, including the support plate body 1 in frame-like, the inwall of support plate body 1 have support inclined-plane 11 and support horizontal plane 12, support level
The bottom on face 12 and support inclined-plane 11 is connected, support inclined-plane 11 from lower to upper gradually outward-dipping, the He of support horizontal plane 12
The angle [alpha] formed between support inclined-plane 11 is 100-150 ° (preferably 120 °), the bottom of 1 interior edge support inclined-plane of support plate body 11
Width L2 is less than the width L1 of silicon chip 10 to be processed.The length L3 of the bottom of 1 interior edge support inclined-plane of support plate body 11 is less than to be processed
The length L4 of silicon chip 10.
As shown in figure 4, the utility model silicon chip uses gaseous state plated film, the optimum position that silicon chip 10 to be processed is placed is to hold
The middle part on inclined-plane 11 is held in the palm, ensures that silicon chip 10 to be processed only exists four sidelines with support plate and contacted, improvement silicon chip contacts with support plate to be caused
Contamination, be effectively improved due to graphite boat adsorb caused by edge aberration situation, silicon chip 10 and support horizontal plane to be processed
A determining deviation is kept between 12, increase support horizontal plane 12 can preferably stop that air-flow deposits to silicon chip edge around support plate,
In improvement plated film support plate generally existing around plating situation, improve due to silicon chip place it is unstable caused by shake and fragmentation figures.
Using it is above-mentioned according to desirable embodiment of the present utility model as enlightenment, pass through above-mentioned description, related work people
Member can carry out various changes and amendments in the range of without departing from this item utility model technological thought completely.This item is real
The content being not limited to new technical scope on specification, it is necessary to which its technology is determined according to right
Property scope.
Claims (3)
1. a kind of silicon chip support plate for plated film on solar cell, including the support plate body (1) in frame-like, its feature exist
In:Support plate body (1) inwall has support inclined-plane (11) and support horizontal plane (12), support horizontal plane (12) and support inclined-plane
(11) bottom is connected, support inclined-plane (11) from lower to upper gradually outward-dipping, support horizontal plane (12) and support inclined-plane
(11) angle [alpha] formed between is 100-150 °, the width L2 of the bottom of support plate body (1) the interior edge support inclined-plane (11)
Less than the width L1 of silicon chip to be processed (10).
2. the silicon chip support plate for plated film on solar cell as claimed in claim 1, it is characterised in that:The α is 120 °.
3. the silicon chip support plate for plated film on solar cell as claimed in claim 1, it is characterised in that:The support plate body
(1) the length L3 of the bottom of interior edge support inclined-plane (11) is less than the length L4 of silicon chip to be processed (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720701392.3U CN206931575U (en) | 2017-06-15 | 2017-06-15 | The silicon chip support plate of plated film on solar cell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720701392.3U CN206931575U (en) | 2017-06-15 | 2017-06-15 | The silicon chip support plate of plated film on solar cell |
Publications (1)
Publication Number | Publication Date |
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CN206931575U true CN206931575U (en) | 2018-01-26 |
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CN201720701392.3U Active CN206931575U (en) | 2017-06-15 | 2017-06-15 | The silicon chip support plate of plated film on solar cell |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668344A (en) * | 2020-06-29 | 2020-09-15 | 浙江晶科能源有限公司 | Manufacturing method of solar cell |
CN113851559A (en) * | 2021-10-28 | 2021-12-28 | 常州时创能源股份有限公司 | Preparation method of TOPCon battery |
CN114054419A (en) * | 2021-11-17 | 2022-02-18 | 新美光(苏州)半导体科技有限公司 | Silicon electrode cleaning device and cleaning method |
CN116014034A (en) * | 2023-03-24 | 2023-04-25 | 中润新能源(徐州)有限公司 | Carrier plate for solar cell coating equipment |
WO2023246141A1 (en) * | 2022-06-22 | 2023-12-28 | 中威新能源(成都)有限公司 | Chemical vapor deposition method, carrier, battery piece and heterojunction battery |
-
2017
- 2017-06-15 CN CN201720701392.3U patent/CN206931575U/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668344A (en) * | 2020-06-29 | 2020-09-15 | 浙江晶科能源有限公司 | Manufacturing method of solar cell |
CN111668344B (en) * | 2020-06-29 | 2021-12-14 | 浙江晶科能源有限公司 | Manufacturing method of solar cell |
CN113851559A (en) * | 2021-10-28 | 2021-12-28 | 常州时创能源股份有限公司 | Preparation method of TOPCon battery |
CN113851559B (en) * | 2021-10-28 | 2023-02-28 | 常州时创能源股份有限公司 | Preparation method of TOPCon battery |
CN114054419A (en) * | 2021-11-17 | 2022-02-18 | 新美光(苏州)半导体科技有限公司 | Silicon electrode cleaning device and cleaning method |
WO2023246141A1 (en) * | 2022-06-22 | 2023-12-28 | 中威新能源(成都)有限公司 | Chemical vapor deposition method, carrier, battery piece and heterojunction battery |
CN116014034A (en) * | 2023-03-24 | 2023-04-25 | 中润新能源(徐州)有限公司 | Carrier plate for solar cell coating equipment |
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