CN206908939U - HDI wiring boards containing blind hole - Google Patents
HDI wiring boards containing blind hole Download PDFInfo
- Publication number
- CN206908939U CN206908939U CN201720645079.2U CN201720645079U CN206908939U CN 206908939 U CN206908939 U CN 206908939U CN 201720645079 U CN201720645079 U CN 201720645079U CN 206908939 U CN206908939 U CN 206908939U
- Authority
- CN
- China
- Prior art keywords
- hole
- heat sink
- upper strata
- lower floor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Floor Finish (AREA)
Abstract
It the utility model is related to wiring board manufacturing technology field, more particularly to a kind of HDI wiring boards containing blind hole, including top substrate layer, Intermediate substrate, underlying substrate, upper strata heat sink, lower floor's heat sink and through heat emission hole, top substrate layer is located at the top of Intermediate substrate, and Intermediate substrate is located at the top of underlying substrate；The upper surface of the top substrate layer is covered with solder mask, the lower surface of the underlying substrate is covered with lower solder mask, the upper surface of the upper solder mask and the lower surface of lower solder mask are respectively covered with identical lumarith, upper strata heat emission hole is provided between the lumarith and lower floor's heat sink of the upper solder mask upper surface, lower floor's heat emission hole is provided between the lumarith and upper strata heat sink of the lower solder mask lower surface；Heat on upper strata heat sink and lower floor's heat sink effectively can be dispersed into outside by upper heat emission hole with lower heat emission hole, and rubber damping plate is provided between substrate, can effectively strengthen anti-vibration resistance.
Description
Technical field
It the utility model is related to wiring board manufacturing technology field, and in particular to the HDI wiring boards containing blind hole.
Background technology
With the continuous progress of electronic technology, electronic product gradually develops to light, thin, small direction, this development trend
Integrated requirement to wiring board is more and more next high, and wiring board just gradually develops to the highly dense arrangement of multilayer, and the number of plies of HDI plates is got over
More, the interconnection of circuit is more intensive, and thermal diffusivity will be affected between plate and plate, and line width line-spacing is also gradually increasingly thinner,
So also there is certain requirement to the anti-vibration resistance of sheet material, therefore to provide a kind of thermal diffusivity good for the utility model, has certain
The HDI wiring boards of anti-vibration resistance.
Utility model content
HDI wiring boards provided by the utility model have the characteristics of simple in construction, convenient use, have good thermal diffusivity
And anti-vibration resistance.
In order to solve the above-mentioned technical problem, the utility model provides a kind of HDI wiring boards containing blind hole, including upper strata
Substrate, Intermediate substrate, underlying substrate, upper strata heat sink, lower floor's heat sink, dissipate through heat emission hole, buried via hole, lower floor's blind hole, lower floor
Hot hole, through hole, upper strata heat emission hole and upper strata blind hole, the top substrate layer are located at the top of Intermediate substrate, the Intermediate substrate position
It is sequentially provided with upper strata heat sink and upper rubber from bottom to up between the top of underlying substrate, the Intermediate substrate and top substrate layer
Damping sheet, lower floor's heat sink and lower rubber damping plate are sequentially provided between the Intermediate substrate and underlying substrate from top to bottom；Institute
The upper surface for stating top substrate layer is covered with solder mask, and the lower surface of the underlying substrate is covered with lower solder mask, the upper solder mask
Upper surface and the lower surface of lower solder mask be respectively covered with identical lumarith；The buried via hole runs through Intermediate substrate, it is described on
Layer blind hole sequentially passes through top substrate layer, upper rubber damping plate and upper strata heat sink from top to bottom, and lower floor's blind hole is from bottom to up
Underlying substrate, lower rubber damping plate and lower floor's heat sink, the through hole is sequentially passed through to be through to down from the upper surface of top substrate layer
The lower surface of laminar substrate；The upper strata heat emission hole is through to the upper surface of lower floor's heat sink from the lumarith of wiring board upper surface,
Lower floor's heat emission hole is through to the lower surface of upper strata heat sink from the lumarith of wiring board lower surface, and the heat emission hole runs through line
Road plate.
Preferably, the upper strata blind hole, buried via hole, lower floor's blind hole and through hole hole in respectively deposition have copper foil.
Preferably, the upper strata blind hole and lower floor's blind hole are laser hole.
Preferably, the upper strata heat sink and lower floor's heat sink are ceramic heat-dissipating plate.
Beneficial effect：
(1), HDI plates provided by the utility model have the characteristics of simple in construction, convenient use, upper strata heat emission hole and lower floor
The setting of heat emission hole, the circuit for not influenceing not run through flaggy connects, and the ceramic heat-dissipating plate used has high temperature resistant, radiating effect
The characteristics of good, outside can be effectively distributed heat to,.
(2) upper rubber damping plate, is provided between Intermediate substrate and top substrate layer, is provided between Intermediate substrate and underlying substrate
Lower rubber damping plate, rubber damping plate can effectively mitigate the vibratility between substrate, prevent thinner circuit from being broken, broken
Damage, can effective enhancement line plate anti-vibration resistance.
Brief description of the drawings
The structural representation of Fig. 1 the utility model HDI wiring boards；
Accompanying drawing marks：1- top substrate layers, 2- Intermediate substrates, 3- underlying substrates, 4- upper stratas heat sink, 5- lower floors heat sink,
6- is blind through heat emission hole, 7- buried via holes, 8- lower floors blind hole, 9- lower floors heat emission hole, 10- through holes, 11- upper stratas heat emission hole, 12- upper stratas
Rubber damping plate under hole, 13- lumariths, the upper rubber damping plates of 14-, 15-.
Embodiment
Embodiment of the present utility model is further illustrated below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of HDI wiring boards containing blind hole, including top substrate layer 1, Intermediate substrate 2, underlying substrate 3,
Upper strata heat sink 4, lower floor's heat sink 5, dissipate through heat emission hole 6, buried via hole 7, lower floor's blind hole 8, lower floor's heat emission hole 9, through hole 10, upper strata
Hot hole 11 and upper strata blind hole 12, the top substrate layer 1 are located at the top of Intermediate substrate 2, and the Intermediate substrate 2 is located at underlying substrate
3 top, upper strata heat sink 4 and upper rubber damping plate are sequentially provided between the Intermediate substrate 2 and top substrate layer 1 from bottom to up
14, lower floor's heat sink 5 and lower rubber damping plate 15 are sequentially provided between the Intermediate substrate 2 and underlying substrate 3 from top to bottom；Institute
The upper surface for stating top substrate layer 1 is covered with solder mask, and the lower surface of the underlying substrate 3 is covered with lower solder mask, the upper welding resistance
The upper surface of layer and the lower surface of lower solder mask are respectively covered with identical lumarith 13；The buried via hole 7 runs through Intermediate substrate 2,
The upper strata blind hole 12 sequentially passes through top substrate layer 1, upper rubber damping plate 14 and upper strata heat sink 4, the lower floor from top to bottom
Blind hole 8 sequentially passes through underlying substrate 3, lower rubber damping plate 15 and lower floor's heat sink 5 from bottom to up；The through hole 10 is from upper strata base
The upper surface of plate 1 is through to the lower surface of underlying substrate 3；The upper strata heat emission hole 11 passes through from the lumarith 13 of wiring board upper surface
Wear to the upper surface of lower floor's heat sink 5, lower floor's heat emission hole 9 and be through to upper strata radiating from the lumarith 13 of wiring board lower surface
The lower surface of plate 4, the heat emission hole 6 run through wiring board；The upper strata blind hole 12, buried via hole 7, the hole of lower floor's blind hole 8 and through hole 10
Inside respectively deposition has copper foil.
Upper strata blind hole 12 and lower floor's blind hole 8 in the present embodiment are laser hole, the upper strata heat sink 4 and lower floor's heat sink
5 be ceramic heat-dissipating plate.The circuit of the upper surface of top substrate layer 1 is real by upper strata blind hole 12 with the upper surface circuit of Intermediate substrate 2
Now it is electrically connected with, the circuit of the lower surface of underlying substrate 3 is realized electrically with the lower surface circuit of Intermediate substrate 2 by lower floor's blind hole 8
Connection, the circuit on 2 upper and lower surface of Intermediate substrate is realized by buried via hole 7 to be electrically connected with, the upper surface circuit of top substrate layer 1 and lower floor
The lower surface circuit of substrate 2 is realized by through hole 10 and is electrically connected with, it is achieved that interconnection between layers.
Upper strata heat emission hole 11 is through to lower floor's heat sink 5, the radiating of approach upper strata from the lumarith 13 of upper solder mask upper surface
Plate 4, lower floor's heat emission hole 9 are through to upper strata heat sink 4 from the lumarith 13 of lower solder mask lower surface, and approach lower floor heat sink 5 can
So that effectively the heat inside wiring board to be distributed；And upper rubber damping plate is provided between Intermediate substrate and top substrate layer,
Lower rubber damping plate is provided between Intermediate substrate and underlying substrate, rubber damping plate can effectively mitigate the shake between substrate
It is dynamic, prevent thinner circuit from being broken in vibration, be damaged, can effective enhancement line plate anti-vibration resistance.
Specific embodiment of the utility model is described in detail above, but it is intended only as example, and this practicality is new
Type is not restricted to above description specific embodiment.To those skilled in the art, it is any to the utility model carry out
Equivalent modifications and substitute also all among category of the present utility model.Therefore, spirit and scope of the present utility model are not being departed from
Lower made impartial conversion and modification, all cover in the scope of the utility model.
Claims (4)
1. a kind of HDI wiring boards containing blind hole, it is characterised in that including top substrate layer (1), Intermediate substrate (2), underlying substrate
(3), upper strata heat sink (4), lower floor's heat sink (5), through heat emission hole (6), buried via hole (7), lower floor's blind hole (8), lower floor's heat emission hole
(9), through hole (10), upper strata heat emission hole (11) and upper strata blind hole (12), the top substrate layer (1) are located at the upper of Intermediate substrate (2)
Side, the Intermediate substrate (2) is located at the top of underlying substrate (3), between the Intermediate substrate (2) and top substrate layer (1) under
It is supreme to be sequentially provided with upper strata heat sink (4) and upper rubber damping plate (14), between the Intermediate substrate (2) and underlying substrate (3)
Lower floor's heat sink (5) and lower rubber damping plate (15) are sequentially provided with from top to bottom；The upper surface of the top substrate layer (1) is covered with
Solder mask, the lower surface of the underlying substrate (3) are covered with lower solder mask, under the upper surface of the upper solder mask and lower solder mask
Surface is respectively covered with identical lumarith (13)；The buried via hole (7) runs through Intermediate substrate (2), the upper strata blind hole (12) from
Top substrate layer (1), upper rubber damping plate (14) and upper strata heat sink (4) are up to sequentially passed through down, and lower floor's blind hole (8) is under
Supreme to sequentially pass through underlying substrate (3), lower rubber damping plate (15) and lower floor's heat sink (5), the through hole (10) is from upper strata base
The upper surface of plate (1) is through to the lower surface of underlying substrate (3)；
The upper strata heat emission hole (11) is through to the upper surface of lower floor's heat sink (5) from the lumarith (13) of wiring board upper surface,
Lower floor's heat emission hole (9) is through to the lower surface of upper strata heat sink (4) from the lumarith (13) of wiring board lower surface, described to dissipate
Hot hole (6) runs through wiring board.
A kind of 2. HDI wiring boards containing blind hole according to claim 1, it is characterised in that the upper strata blind hole (12),
Respectively deposition has copper foil in the hole of buried via hole (7), lower floor's blind hole (8) and through hole (10).
A kind of 3. HDI wiring boards containing blind hole according to claim 2, it is characterised in that the upper strata blind hole (12)
It is laser hole with lower floor's blind hole (8).
4. a kind of HDI wiring boards containing blind hole as claimed in any of claims 1 to 3, it is characterised in that described
Upper strata heat sink (4) and lower floor's heat sink (5) are ceramic heat-dissipating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645079.2U CN206908939U (en) | 2017-06-06 | 2017-06-06 | HDI wiring boards containing blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720645079.2U CN206908939U (en) | 2017-06-06 | 2017-06-06 | HDI wiring boards containing blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206908939U true CN206908939U (en) | 2018-01-19 |
Family
ID=61287000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720645079.2U Active CN206908939U (en) | 2017-06-06 | 2017-06-06 | HDI wiring boards containing blind hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206908939U (en) |
-
2017
- 2017-06-06 CN CN201720645079.2U patent/CN206908939U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204272486U (en) | Ceramic embedded circuit board | |
| CN106031315B (en) | Circuit substrate and circuit substrate component | |
| CN206728366U (en) | A kind of high-order HDI circuit boards | |
| CN104968138B (en) | A kind of printed circuit board (PCB) | |
| CN206908939U (en) | HDI wiring boards containing blind hole | |
| CN207491300U (en) | A kind of epoxy acrylic resin mixed circuit board | |
| US9257358B2 (en) | Chip stacking packaging structure | |
| CN110446328A (en) | A kind of pcb board and its manufacturing method | |
| CN206728367U (en) | A kind of high density HDI plates that can be interconnected with random layer | |
| CN101600292A (en) | Circuit board | |
| KR101018231B1 (en) | Circuit board and manufacturing method of the same | |
| CN105128454B (en) | A kind of double-side aluminum copper-clad plate of LED lamp | |
| CN206908940U (en) | Three rank HDI high-density lamination circuit boards | |
| CN206251432U (en) | A kind of high efficiency and heat radiation FPC | |
| CN202178296U (en) | Composite radiating board structure | |
| CN208094876U (en) | A kind of heat radiating type multilayer circuit board | |
| CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers | |
| CN206908941U (en) | The multi-layer H DI wiring boards of internal layer interconnection | |
| CN207382669U (en) | A kind of double-sided PCB board with radiator structure | |
| CN206851133U (en) | A kind of novel corrosion resistant multilayer circuit board | |
| CN206542631U (en) | A kind of novel flexible wiring board | |
| CN206525021U (en) | A kind of novel double-layer wiring board | |
| CN210432028U (en) | Printed circuit board with double-layer structure | |
| CN208523049U (en) | A kind of high-layer HDI plate | |
| CN206963176U (en) | A kind of new FPC plates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |