CN206885460U - 一种集成电路塑封设备的树脂料移送装置 - Google Patents
一种集成电路塑封设备的树脂料移送装置 Download PDFInfo
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- CN206885460U CN206885460U CN201720622823.7U CN201720622823U CN206885460U CN 206885460 U CN206885460 U CN 206885460U CN 201720622823 U CN201720622823 U CN 201720622823U CN 206885460 U CN206885460 U CN 206885460U
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- resin material
- resin
- clamping
- transfer mechanism
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CN201720622823.7U CN206885460U (zh) | 2017-05-31 | 2017-05-31 | 一种集成电路塑封设备的树脂料移送装置 |
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CN206885460U true CN206885460U (zh) | 2018-01-16 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107054739A (zh) * | 2017-05-31 | 2017-08-18 | 安徽大华半导体科技有限公司 | 一种集成电路塑封设备的树脂料移送装置 |
CN110589389A (zh) * | 2019-08-30 | 2019-12-20 | 安徽耐科装备科技股份有限公司 | 一种有效消除物料离心力影响的树脂运输装置 |
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2017
- 2017-05-31 CN CN201720622823.7U patent/CN206885460U/zh not_active Withdrawn - After Issue
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107054739A (zh) * | 2017-05-31 | 2017-08-18 | 安徽大华半导体科技有限公司 | 一种集成电路塑封设备的树脂料移送装置 |
CN107054739B (zh) * | 2017-05-31 | 2022-08-26 | 安徽大华半导体科技有限公司 | 一种集成电路塑封设备的树脂料移送装置 |
CN110589389A (zh) * | 2019-08-30 | 2019-12-20 | 安徽耐科装备科技股份有限公司 | 一种有效消除物料离心力影响的树脂运输装置 |
CN110589389B (zh) * | 2019-08-30 | 2022-03-15 | 安徽耐科装备科技股份有限公司 | 一种有效消除物料离心力影响的树脂运输装置 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Resin material transferring device for integrated circuit plastic-packaging equipment Effective date of registration: 20180606 Granted publication date: 20180116 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2018340000203 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210705 Granted publication date: 20180116 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2018340000203 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20180116 Effective date of abandoning: 20220826 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20180116 Effective date of abandoning: 20220826 |
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AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |