CN206847841U - A kind of MEMS pressure sensor - Google Patents
A kind of MEMS pressure sensor Download PDFInfo
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- CN206847841U CN206847841U CN201720751630.1U CN201720751630U CN206847841U CN 206847841 U CN206847841 U CN 206847841U CN 201720751630 U CN201720751630 U CN 201720751630U CN 206847841 U CN206847841 U CN 206847841U
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Abstract
The utility model embodiment provides a kind of MEMS pressure sensor, including substrate and sensor chip；The substrate electrically connects with the sensor chip；The sensor chip is used to detect the pressure value size acted on the sensor chip；The sensor chip and/or the relative side of the substrate form at least one projection.The utility model embodiment provides a kind of MEMS pressure sensor, to realize the measurement accuracy for improving MEMS pressure sensor.
Description
Technical field
The utility model embodiment is related to microelectromechanical systems field, more particularly to a kind of MEMS pressure sensor.
Background technology
Pressure sensor is a kind of sensor the most commonly used in industrial practice, and traditional mechanical quantity pressure sensor is base
In metallic elastic body stress deformation, exported by mechanical quantity elastic deformation to electricity conversion, volume is big, and cost is high.MEMS pressure passes
Sensor can use similar integrated circuit (IC) designing technique and manufacturing process, carry out the production in enormous quantities of high accuracy, low cost, from
And be that consumer electronics and industrial stokehold product largely open convenience with cheap cost using MEMS sensor, make pressure
Power control becomes easy to use and intelligent.Relative to traditional mechanical quantity sensor, MEMS pressure sensor it is smaller,
Maximum is no more than 0.5cm, cost performance is increased substantially relative to traditional " machinery " manufacturing technology.
MEMS MEMSs (Microelectro Mechanical Systems) pressure sensor is widely used in vapour
Car electronics：Such as TPMS, engine oil pressure sensor, automobile brake system air pressure probe, car engine air admittance
Manifold pressure sensor (TMAP), common rail for diesel engine pressure sensor；Consumer electronics：Such as tire gauge, sphygmomanometer, cupboard scale, strong
Health scale, washing machine, dish-washing machine, refrigerator, micro-wave oven, baking box, dust catcher pressure sensor, A/C pressure sensor, laundry
Machine, water dispenser, dish-washing machine, solar water heater Liquid level pressure sensor；Industrial electronic：Such as digital pressure gauge, numeral
Flowmeter, industrial batching weighing etc..Such as automobile, pressure sensor is well worth doing.In metrological service, auto industry, boat
Sky, oil exploitation, household appliances, it is widely used in Medical Instruments.
In general, pressure sensor is passed by the deformation of pressure sensor membrane come the change of detection pressure, usual pressure
Sensor chip is needed after encapsulating using, it is necessary to be pasted onto on the substrates such as pcb board.But substrate and pressure sensor chip is hot swollen
Swollen coefficient is different, causes sensor chip to be influenceed MEMS pressure sensor by tension caused by substrate deformation or compression
Measurement accuracy.
Utility model content
The utility model embodiment provides a kind of MEMS pressure sensor, to realize the measurement for improving MEMS pressure sensor
Precision.
The utility model embodiment provides a kind of MEMS pressure sensor, including substrate and sensor chip；The base
Plate electrically connects with the sensor chip；The sensor chip is used to detect the pressure value acted on the sensor chip
Size；
The sensor chip and/or the relative side of the substrate form at least one projection.
Alternatively, the sensor chip includes chip base and the sensitive membrane being fixed in the chip base；It is described
Sensitive membrane forms cavity with the chip base.
Alternatively, the sensor chip also includes forming the Wheatstone bridge in the sensitive membrane.
Alternatively, the MEMS pressure sensor, in addition to the viscose glue between the chip base and the substrate
Layer, the adhesive-layer are used to fix the chip base on the substrate.
Alternatively, the raised height is 20 μm~70 μm.
Alternatively, the adhesive-layer contacts and hanging with the chip base with the substrate.
Alternatively, the adhesive-layer contacts with the substrate；The adhesive-layer contacts with the chip base.
Alternatively, including a projection, the raised upright projection on the substrate are located at the chip base
The center of bottom upright projection on the substrate.
Alternatively, the raised planimetric area S1 on the substrate, the chip base is on the substrate
Planimetric area S2, S2/3<S1<S2.
Alternatively, the edge of the raised upright projection on the substrate with the chip base on the substrate
Minimum range between the edge of upright projection is more than or equal to 100 μm.
Alternatively, the MEMS pressure sensor, including multiple projections, multiple projections are evenly distributed.
Alternatively, the sensor chip has multiple first projections in the side relative with the substrate；The substrate
There are multiple second projections in the side relative with the sensor chip；The multiple first raised hanging down on the substrate
Deliver directly shadow and the multiple second raised upright projection on the substrate overlaps.
The MEMS pressure sensor that the utility model embodiment provides includes substrate and sensor chip, and substrate for example can be with
It is pcb board, sensor chip is used to detect the pressure size acted on sensor chip, and substrate is electrically connected with sensor chip
Connect, the circuit part on sensor chip can be driven by the drive circuit on substrate and believe the voltage detected, electric current etc.
Number it is conducted to substrate, it is important that it is not directly to be bonded between sensor chip and substrate during the utility model is implemented, but
By the projection contacts formed positioned at sensor chip and/or substrate opposite side, therefore reduce sensor chip and substrate
Contact area, add the distance between sensor chip and substrate, reduce substrate and sensor chip because of thermal expansion system
Stress caused by number is different is conducted to the process of sensor chip, and reduces the thermal expansion deformation of substrate to sensor chip
Caused by influence, improve the measurement accuracy of MEMS pressure sensor.
Brief description of the drawings
Fig. 1 a are a kind of cross-sectional view for MEMS pressure sensor that the utility model embodiment provides；
Fig. 1 b are the top view of MEMS pressure sensor in Fig. 1 a；
Fig. 2 is a kind of schematic diagram for sensitive membrane that the utility model embodiment provides；
Fig. 3 is the cross-sectional view for another MEMS pressure sensor that the utility model embodiment provides；
Fig. 4 a are the cross-sectional view for another MEMS pressure sensor that the utility model embodiment provides；
Fig. 4 b are the top view of MEMS pressure sensor in Fig. 4 a；
Fig. 5 is the cross-sectional view for another MEMS pressure sensor that the utility model embodiment provides.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than to restriction of the present utility model.Further need exist for
It is bright, for the ease of description, the part related to the utility model rather than entire infrastructure are illustrate only in accompanying drawing.
A kind of cross-sectional view for MEMS pressure sensor that Fig. 1 a provide for the utility model embodiment, reference chart
1a, the MEMS pressure sensor that the utility model embodiment provides include substrate 10 and sensor chip 20, substrate 10 and sensing
Device chip 20 electrically connects, and sensor chip 20 is used to detect the pressure value size acted on sensor chip 20, sensor core
Piece 20 and/or the relative side of substrate 10 form at least one raised 30.It should be noted that formed in Fig. 1 a with projection 30
Explanation is explained exemplified by sensor chip 20, but is not limited thereto, in other embodiments, projection 30 can be with
Formed on the substrate 10, or projection 30 is formed on sensor chip 20 and substrate 10 simultaneously.
The MEMS pressure sensor that the utility model embodiment provides includes substrate and sensor chip, and substrate for example can be with
It is pcb board, sensor chip is used to detect the pressure size acted on sensor chip, and substrate is electrically connected with sensor chip
Connect, the circuit part on sensor chip can be driven by the drive circuit on substrate and believe the voltage detected, electric current etc.
Number it is conducted to substrate, it is important that it is not directly to be bonded between sensor chip and substrate during the utility model is implemented, but
By the projection contacts formed positioned at sensor chip and/or substrate opposite side, therefore reduce sensor chip and substrate
Contact area, add the distance between sensor chip and substrate, reduce substrate and sensor chip because of thermal expansion system
Stress caused by number is different is conducted to the process of sensor chip, and reduces the thermal expansion deformation of substrate to sensor chip
Caused by influence, improve the measurement accuracy of MEMS pressure sensor.
Alternatively, chip base 50 and the sensitivity being fixed in chip base 50 are included with reference to figure 1a, sensor chip 20
Film 40, sensitive membrane 40 form cavity with chip base 50.When the sensitive membrane 40 for thering is impressed pressure to act on sensor chip 20
When upper, it is that sensitive membrane 40 provides the space for being available for bending that sensitive membrane 40 forms cavity with chip base 50.
Alternatively, the viscose glue between chip base 50 and substrate 10 is also included with reference to figure 1a, MEMS pressure sensor
Layer 60, adhesive-layer 60 is used to fix chip base 50 on the substrate 10, so as to which sensor chip 20 is fixed on the substrate 10,
And then cause sensor chip 20 and substrate 10 to be used as an entirety, prevent sensor chip 20 from moving on the substrate 10.Viscose glue
Layer 60 can be glue or double faced adhesive tape, and adhesive-layer 60 can be one or more layers, and the utility model embodiment is not done to this
Limit.
Alternatively, with reference to figure 1a, the height of projection 30 is 20 μm~70 μm, when the height of projection 30 is less than 20 μm, drop
The thermal expansion deformation of low substrate 10 is not good enough on the effect influenceed caused by sensor chip 20, it is to be understood that projection 30
Height it is bigger reduce substrate 10 thermal expansion deformation it is better on the effect influenceed caused by sensor chip 20, but when projection
When 30 height is more than 70 μm, sensor chip 20 on the one hand can be caused to be reduced with the fastness that substrate 10 bonds, i.e. sensor
Chip 20 is easily toppled over, and on the other hand will also result in the volume increase of the finished product after MEMS pressure sensor is encapsulated.
Alternatively, with reference to figure 1a, adhesive-layer 60 contacts and hanging with chip base 50 with substrate 10.Due in chip base
50 towards the side of substrate 10 formed with projection 30, adhesive-layer 60 be formed only into projection 30 and substrate 10 between, projection 30 increase
Big the distance between chip base 50 and substrate 10, and by chip base 50 vacantly, thus chip base 50 just with substrate 10
Isolation, the thermal expansion deformation of substrate 10 is greatly reduced on influence caused by sensor chip 20, improves MEMS pressure sensings
The measurement accuracy of device.
Fig. 1 b are the top view of MEMS pressure sensor in Fig. 1 a, with reference to figure 1a and Fig. 1 b, alternatively, MEMS pressure sensings
Device includes a projection 30, and raised 30 upright projection on the substrate 10 is located at the upright projection on the substrate 10 of chip base 50
Center, now the center of gravity of sensor chip 20 is the center of circle of shade annulus in Fig. 1 b, and the stability of sensor chip 20 is good.Need
Illustrate, be exemplarily illustrated by taking cylindrical protrusions as an example in Fig. 1 a and Fig. 1 b, may be used also in other embodiments
Round platform, prism or terrace with edge etc. are shaped as with setting projection.The utility model embodiment for sensor chip shape not yet
Limit, it can be rectangle, circle or hexagon etc..
Alternatively, with reference to figure 1a and Fig. 1 b, the area S1 of raised 30 upright projection 31 on the substrate 10, chip base 50
The area S2, S2/3 of upright projection 51 on the substrate 10<S1<S2, now there are enough adhesive-layers between projection 30 and substrate 10
60, therefore have enough cohesive forces, sensor chip 20 can be securely fixed on substrate 10.
Alternatively, exist with reference to figure 1a and Fig. 1 b, the edge of raised 30 upright projection on the substrate 10 with chip base 50
Minimum range L on substrate 10 between the edge of upright projection is more than or equal to 100 μm.Because MEMS pressure sensor is to pass through
The deformation of sensitive membrane 40 carrys out detection pressure, and the EDGE CONTACT of the edge of sensitive membrane 40 and chip base 50 and forms cavity,
So the deformation at the edge of chip base 50 relative to chip base 50 elsewhere for be easier to cause sensitive membrane 40
Deformation, therefore projection 30 is set remote enough apart from the edge of chip base 50, it can be drawn with effectively weakening material heat expansion
Influence of the stress risen for sensitive membrane 40, so as to further increase the measurement accuracy of MEMS pressure sensor.
Fig. 2 is a kind of schematic diagram for sensitive membrane that the utility model embodiment provides, alternatively, as shown in Fig. 2 sensor
Chip 20 also includes forming the Wheatstone bridge in sensitive membrane 40.Wheatstone bridge is schematically illustrated in Fig. 2 in sensitivity
The arrangement of film 40 and the restriction for electrically connecting situation, the not specific setting to resistance in Wheatstone bridge and cabling, actually should
In, resistance R1, R2, R3 and R4 are piezo-resistance, and sensitive membrane 40 can be made using silicon materials, piezo-resistance R1, R2, R3 and
R4 can use the techniques such as photoetching, mask, diffusion or ion implanting, and 4 resistance are made in monocrystalline silicon membrane edge and are electrically connected
Into wheatstone bridge configuration, piezo-resistance R1, R2, R3 and R4 is set to be located at the edge of sensitive membrane 40, when sensitive membrane 40 is pressed
During power, the stress that each piezo-resistance is subject to is maximum, maximum so as to the change in resistance of piezo-resistance, therefore can improve the spirit of detection
Sensitivity.
The principle of pressure detection is：When extraneous no pressure, Wheatstone bridge beinthebalancestate, sensor chip 20 exports
Voltage is zero；When ambient pressure deforms upon sensitive membrane 40, sensor chip 20 exports a non-zero voltage, and can be according to this
Non-zero voltage obtains the size of ambient pressure, and then realizes pressure detection.
Fig. 3 is the cross-sectional view for another MEMS pressure sensor that the utility model embodiment provides, optional
Ground, as shown in figure 3, adhesive-layer 60 contacts with substrate 10, adhesive-layer 60 contacts with chip base 10.Adhesive-layer 60 wraps projection 30
Wrap up in, and possess the contact area of maximum with substrate 10 and sensor chip 20, therefore the cohesive force of maximum can be provided, will pass
Sensor chip 20 is firmly determined on the substrate 10.
The cross-sectional view for another MEMS pressure sensor that Fig. 4 a provide for the utility model embodiment, Fig. 4 b
For the top view of MEMS pressure sensor in Fig. 4 a, with reference to shown in Fig. 4 a and Fig. 4 b, MEMS pressure sensor includes multiple projections
30, multiple raised 30 is evenly distributed.Set multiple raised 30 it is evenly distributed simplify manufacture craft, and make sensor chip 20
Pressure on gravity and acting sensor chip 20 can be evenly distributed in substrate 10, enhance the He of sensor chip 20
The stability that substrate 10 bonds.It should be noted that the utility model embodiment does not limit for multiple raised distribution shapes
Fixed, it can be the square array shown in Fig. 4 b, or circular array etc..
The cross-sectional view for another MEMS pressure sensor that Fig. 5 provides for the utility model embodiment, such as Fig. 5
Shown, sensor chip 20 has multiple first projections 301 in the side relative with substrate 10, substrate 10 with sensor chip
20 relative sides have multiple second projections 302, the upright projection and multiple second of multiple first projections 301 on the substrate 10
The upright projection of projection 302 on the substrate 10 overlaps.I.e. first projection 301 and the second projection 302 are correspondingly arranged, first convex having
The position correspondence for playing 301 is provided with the second projection 302, and the length of the first raised 301 and second projection 302 can also may be used with identical
With difference, it is preferable that the first projection 301 and the second projection 302 height and for 20 μm~70 μm.
Pay attention to, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carried out for a person skilled in the art various bright
Aobvious change, readjust and substitute without departing from the scope of protection of the utility model.Therefore, although passing through above example
The utility model is described in further detail, but the utility model is not limited only to above example, is not departing from
In the case that the utility model is conceived, other more equivalent embodiments can also be included, and the scope of the utility model is by appended
Right determine.
Claims (12)
1. a kind of MEMS pressure sensor, it is characterised in that including substrate and sensor chip；The substrate and the sensor
Chip electrically connects；The sensor chip is used to detect the pressure value size acted on the sensor chip；
The sensor chip and/or the relative side of the substrate form at least one projection.
2. MEMS pressure sensor according to claim 1, it is characterised in that the sensor chip includes chip base
With the sensitive membrane being fixed in the chip base；The sensitive membrane forms cavity with the chip base.
3. MEMS pressure sensor according to claim 2, it is characterised in that the sensor chip also includes being formed
Wheatstone bridge in the sensitive membrane.
4. MEMS pressure sensor according to claim 2, it is characterised in that also include being located at the chip base and institute
The adhesive-layer between substrate is stated, the adhesive-layer is used to fix the chip base on the substrate.
5. MEMS pressure sensor according to claim 1, it is characterised in that the raised height is 20 μm~70 μ
m。
6. MEMS pressure sensor according to claim 4, it is characterised in that the adhesive-layer contacts simultaneously with the substrate
It is hanging with the chip base.
7. MEMS pressure sensor according to claim 4, it is characterised in that the adhesive-layer contacts with the substrate；
The adhesive-layer contacts with the chip base.
8. MEMS pressure sensor according to claim 1, it is characterised in that including a projection, the projection
Upright projection on the substrate is located at the center of chip base upright projection on the substrate.
9. MEMS pressure sensor according to claim 8, it is characterised in that raised on the substrate vertical
Projected area S1, the chip base planimetric area S2, S2/3 on the substrate<S1<S2.
10. MEMS pressure sensor according to claim 8, it is characterised in that raised the hanging down on the substrate
The minimum range of the edge and the chip base of shadow on the substrate between the edge of upright projection is delivered directly to be more than or equal to
100μm。
11. MEMS pressure sensor according to claim 1, it is characterised in that multiple described including multiple projections
It is raised evenly distributed.
12. MEMS pressure sensor according to claim 1, it is characterised in that the sensor chip with the base
The relative side of plate has multiple first projections；The substrate has multiple second in the side relative with the sensor chip
It is raised；The multiple first raised upright projection on the substrate and the multiple second raised hanging down on the substrate
Deliver directly shadow coincidence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720751630.1U CN206847841U (en) | 2017-06-26 | 2017-06-26 | A kind of MEMS pressure sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720751630.1U CN206847841U (en) | 2017-06-26 | 2017-06-26 | A kind of MEMS pressure sensor |
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| CN206847841U true CN206847841U (en) | 2018-01-05 |
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| CN201720751630.1U Active CN206847841U (en) | 2017-06-26 | 2017-06-26 | A kind of MEMS pressure sensor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645548A (en) * | 2018-05-10 | 2018-10-12 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and forming method thereof, touch device |
| CN109115391A (en) * | 2017-06-26 | 2019-01-01 | 上海微联传感科技有限公司 | A kind of MEMS pressure sensor |
| CN110501097A (en) * | 2019-08-29 | 2019-11-26 | 苏州感芯微系统技术有限公司 | A kind of silicon pressure sensor module of low stress |
| CN110793689A (en) * | 2019-11-30 | 2020-02-14 | 南通远辰测控设备有限公司 | High-efficient electric dynamometer machine |
-
2017
- 2017-06-26 CN CN201720751630.1U patent/CN206847841U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109115391A (en) * | 2017-06-26 | 2019-01-01 | 上海微联传感科技有限公司 | A kind of MEMS pressure sensor |
| CN109115391B (en) * | 2017-06-26 | 2024-06-04 | 华景传感科技（无锡）有限公司 | MEMS pressure sensor |
| CN108645548A (en) * | 2018-05-10 | 2018-10-12 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and forming method thereof, touch device |
| CN108645548B (en) * | 2018-05-10 | 2022-04-01 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure, forming method thereof and touch device |
| CN110501097A (en) * | 2019-08-29 | 2019-11-26 | 苏州感芯微系统技术有限公司 | A kind of silicon pressure sensor module of low stress |
| CN110793689A (en) * | 2019-11-30 | 2020-02-14 | 南通远辰测控设备有限公司 | High-efficient electric dynamometer machine |
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Effective date of registration: 20190125 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Huajing sensor technology (Wuxi) Co., Ltd. Address before: 201203 2, 3 building, 439 Chunchun Road, Pudong New Area, Shanghai. Patentee before: Microlink SensTech Shanghai Co., Ltd. |