CN108645548A - Pressure sensor packaging structure and forming method thereof, touch device - Google Patents
Pressure sensor packaging structure and forming method thereof, touch device Download PDFInfo
- Publication number
- CN108645548A CN108645548A CN201810441484.1A CN201810441484A CN108645548A CN 108645548 A CN108645548 A CN 108645548A CN 201810441484 A CN201810441484 A CN 201810441484A CN 108645548 A CN108645548 A CN 108645548A
- Authority
- CN
- China
- Prior art keywords
- pressure sensor
- packaging structure
- circuit board
- sensor packaging
- sensitive membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
- G01L1/2262—Measuring circuits therefor involving simple electrical bridges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
Abstract
The present invention relates to a kind of pressure sensor packaging structure and forming method thereof, a kind of touch device, the pressure sensor packaging structure includes：At least one pressure sensor, the pressure sensor include：Substrate has cavity between the sensitive membrane of the substrate surface, the sensitive membrane and the substrate；At least one soldered ball is located at the sensitive film surface；The first surface of circuit board, the circuit board is welded by the soldered ball and at least one pressure sensor, realizes being electrically connected between circuit board and pressure sensor.The pressure sensor packaging structure formation process is simple and sensitive thin film is hardly damaged.
Description
Technical field
The present invention relates to MEMS technology fields more particularly to a kind of pressure sensor packaging structure and forming method thereof.
Background technology
The consumer electronics products such as toy, mobile phone, tablet, remote controler increasingly develop towards intelligent direction at present, at it
In increase more and more a variety of sensors so that more physical quantitys can be perceived.Wherein for by contacts such as human body especially fingers
The stress of generation or the measurement demand of pressure also gradually increase.
In order to meet the requirement of consumer electronics product, this sensor for detecting stress or pressure is proposed
Some particular/special requirements, it is necessary first to pressure or stress can effectively be passed to the film of pressure sensor chip, secondly also
It protects the various pieces on chip not to be damaged, further also needs to keep smaller volume, to meet portable consumer class
The trend that electronic product increasingly minimizes.
Pressure sensor chip technology based on film comparative maturity, but what this pressure sensor chip used
Film thickness is very easy to that film is caused to damage, therefore generally at tens microns hereinafter, if pressure is directly delivered on film
In the prior art, typically film is isolated by encapsulation technology.But it the encapsulation technology that uses at present or protected
Degree so that the stress being in direct contact cannot effectively pass to the film of pressure sensor chip or protect not in place, Bu Nengyou
Effect protection chip easily damaged part or technique is excessively complicated.
Therefore, it is necessary to a kind of films to be neither easy to damage, technique and relatively simple pressure sensor packaging structure.
Invention content
The technical problem to be solved by the invention is to provide a kind of pressure sensor packaging structure and forming method thereof, touch
Control device so that the sensitive thin film of sensor chip can be hardly damaged.
To solve the above-mentioned problems, the present invention provides a kind of pressure sensor packaging structures, including：At least one pressure
Sensor, the pressure sensor include：Substrate, positioned at the sensitive membrane of the substrate surface, the sensitive membrane and the substrate
Between have cavity；At least one soldered ball is located at the sensitive film surface；The first surface of circuit board, the circuit board passes through
The soldered ball is welded at least one pressure sensor, realizes being electrically connected between circuit board and pressure sensor.
Optionally, the thickness of the sensitive membrane is 10 μm~15 μm.
Optionally, the height of the cavity is 5 μm~12 μm.
Optionally, the sensitive membrane has at least one pressure drag item.
Optionally, there are the sensitive membrane 4 or 8 pressure drag items, the pressure drag item to form wheatstone bridge configuration.
Optionally, the circuit board is flexible PCB.
To solve the above problems, technical scheme of the present invention also provides a kind of formation side of pressure sensor packaging structure
Method, including：At least one pressure sensor is provided, the pressure sensor includes：Substrate, positioned at the sensitivity of the substrate surface
Film has cavity between the sensitive membrane and the substrate；Circuit board is provided；Using reviewing packaging technology, in the sensitive membrane
Surface forms at least one soldered ball, and by the ball bond to the first surface of the circuit board, realizes circuit board and pressure
Electrical connection between force snesor.
Optionally, the thickness of the sensitive membrane is 10 μm~15 μm.
Optionally, the height of the cavity is 5 μm~12 μm.
Optionally, the sensitive membrane has at least one pressure drag item.
Optionally, there are the sensitive membrane 4 or 8 pressure drag items, the pressure drag item to form wheatstone bridge configuration.
Optionally, the circuit board is flexible PCB.
Technical scheme of the present invention also provides a kind of touch device, including：At least one above-mentioned pressure sensor package
Structure；Touch tablet；Holder, the holder are bonded with the touch tablet, and are had between the holder and the touch tablet
Chamber；The pressure sensor packaging structure is installed in the cavity, and the circuit board of the pressure sensor packaging structure
Second surface is bonded with the touch tablet, and the second surface is opposite with the first surface.
Optionally, it is bonded by colloid between the second surface of the circuit board and the touch tablet.
Optionally, there is an elastic insert, the elasticity between the substrate and holder of the pressure sensor packaging structure
Bed course supports the pressure sensor packaging structure so that the second surface of the circuit board of the pressure sensor packaging structure with
The touch tablet fitting.
Optionally, the pressure sensor packaging structure is installed on the formed folding angular position of lateral edges intersection of touch tablet
Or the pressure sensor packaging structure is installed on the edge of touch tablet.
Optionally, the touch tablet is rectangle, and the pressure sensor packaging structure is installed on the right angle of the touch tablet
At position or the pressure sensor packaging structure is installed on the side edge of touch tablet.
Optionally, the touch tablet is display screen.
The pressure sensor packaging structure of the present invention has soldered ball in the sensitive membrane of pressure sensor, is welded with circuit board
It connects, package dimension can be reduced, improve sensitivity.Further, the cavity size of the pressure sensor is smaller, can prevent quick
The excessive deformation for feeling film, to avoid sensitive membrane impaired.
Description of the drawings
Fig. 1 to Fig. 3 is that the structure of the forming process of the pressure sensor packaging structure of the embodiment of the invention is shown
It is intended to；
Fig. 4 A are the partial structural diagram before the touch device installation of the embodiment of the invention；
Fig. 4 B are the partial structural diagram after the touch device installation of the embodiment of the invention；
Fig. 4 C are to be transferred to pressure sensing to touch tablet stress after the touch device of the embodiment of the invention is installed
The schematic diagram of device encapsulating structure；
Fig. 5 A are the partial structural diagram before the touch device installation of the embodiment of the invention；
Fig. 5 B are the partial structural diagram after the touch device installation of the embodiment of the invention；
Fig. 6 A~6B are the structural schematic diagram of the touch device of the embodiment of the invention；
Fig. 7 A are the structural schematic diagram of the touch device of the embodiment of the invention；
Fig. 7 B are the structural schematic diagram of the pressure sensor packaging structure of the touch device of the embodiment of the invention.
Specific implementation mode
Below in conjunction with the accompanying drawings to the tool of pressure sensor packaging structure provided by the invention and forming method thereof, touch device
Body embodiment elaborates.
It please refers to Fig.1 to Fig. 3, the forming process for the pressure sensor packaging structure of the embodiment of the invention is shown
It is intended to.
Referring to FIG. 1, providing at least one pressure sensor 10, the pressure sensor 10 includes：Substrate 11 is located at institute
The sensitive membrane 13 for stating 11 surface of substrate has cavity 12 between the sensitive membrane 13 and the substrate 11.
The substrate 11 can be semiconductor substrate, glass or organic glass etc..In a specific embodiment, described
Substrate 11 is monocrystalline substrate.
The pressure sensor 10 can pass through SENSA (Silicon Epitaxial-layer on Sealed Air-
cavity；Silicon epitaxy layer on blanket gas cavity) technique forms, specifically comprises the following steps：It is formed and is schemed on 11 surface of substrate
Shape mask layer performs etching 11 surface of substrate using the mask layer as mask, forms several deep holes；It is etched along the deep hole
Substrate 11 forms cavity 12, and the monocrystalline silicon piece for being able to retain below dielectric layer forms netted silicon fiml, and several deep holes are in monocrystalline
The inside of silicon chip is interconnected by cavity；It further gets rid of and is deposited on the positive dielectric layer of monocrystalline silicon piece, make netted silicon fiml
It is exposed；Finally, using epitaxy single-crystal silicon technology, using netted silicon fiml as monocrystalline silicon, son is brilliant, extends be covered in web-like silicon outside
Monocrystalline silicon thin film on film, the monocrystalline silicon thin film cover deep hole, and cavity 12 is made to be located at the lower section of monocrystalline silicon thin film.The list
Polycrystal silicon film is as sensitive membrane 13.
In other specific implementation modes, the substrate 11 of pressure sensor 10 can also be SOI substrate or substrate 11 is
Monocrystalline substrate forms buried silicon oxide layer by O +ion implanted in substrate 11.By the silica for etching the substrate 11
Buried layer forms the cavity 12, and the silicon layer above cavity is as sensitive membrane 13.
The sensitive film thickness for the pressure sensor 10 that the above method is formed is relatively low, advantageously reduces the body of pressure sensor
Product.In a specific embodiment, the thickness of the sensitive membrane 13 is 10 μm~15 μm.
Further, the forming process of control pressure sensor can be passed through so that the cavity 12 of formation is smaller, serves as a contrast in this way
Bottom 11 can play the role of preventing 13 excessive deformation of sensitive membrane.When sensitive membrane 13 is deformed by extraneous stress, substrate
11 can limit the deformation extent of sensitive membrane, avoid sensitive membrane excessive deformation and are damaged.In the specific embodiment party of the present invention
In formula, the height of the cavity 12 is 5 μm~12 μm.In other specific implementation modes, the height of the cavity 12, Ke Yigen
Reasonably it is arranged according to the sensitivity requirement of the thickness of sensitive membrane 13, intensity and pressure sensor.
The sensitive membrane 13 also has at least one pressure drag item 14.Pressure drag item 14 can be by carrying out the sensitive membrane 13
Ion implanting is formed.In the specific embodiment of the present invention, the sensitive membrane 13 has 4 or 8 pressure drag items 14, institute
It states pressure drag item 14 and forms wheatstone bridge configuration, carry out the variation for the power that feedback sensitive film 13 receives.In other specific implementation modes
In, the sensitive membrane 13 can also form the circuit structure of other forms with the pressure drag item 14 of other quantity.
Referring to FIG. 2, forming at least one soldered ball 15 on 13 surface of the sensitive membrane.
The metallic circuit being connect with pressure drag item 14, the soldered ball 15 and metal wire can also be formed in the sensitive membrane 13
Road connects, for inputting and/or exporting electrical signal.Specifically, the soldered ball 15 is formed in the sensitive membrane 13 of 12 top of cavity
Surface can either transmit electrical signal, additionally it is possible to transmit force signal.
In order to uniformly and effectively transmit force signal to sensitive membrane 13, in the specific embodiment of the present invention,
The soldered ball 15 of multiple uniform array arrangements is formed on 13 surface of the sensitive membrane, part soldered ball 15 connect with metallic circuit, transmits
Electric signal is transmitted while force signal, part soldered ball 15 is not connect with metallic circuit, is only used for transmitting force signal.It is specific at other
In embodiment, it can form what 1~10 welded ball array formed on 13 surface of the sensitive membrane, such as form 2 or 4
Welded ball array, each welded ball array include more than two soldered balls 15.
Referring to FIG. 3, providing circuit board 16, (Flip-Chip) technique is encapsulated using reviewing, is welded by the soldered ball 15
To the circuit board 16, being electrically connected between circuit board 16 and pressure sensor 10 (please referring to Fig.1) is realized.
The circuit board 16 can be flexible PCB, be easy to happen deformation under pressure, thus by stress transfer
To sensitive membrane 13, pressure detecting is realized.The circuit board 16 can be that single-sided circuit board can also be double-sided PCB.The electricity
There is the connection circuit being connect with the pressure sensor 10, the circuit board 16 also to have on the first surface 161 of road plate 16
Processing circuit can be formed in the first surface 161, can also be formed in the second surface 162, for detecting signal
It is handled.
The pressure sensor 10 (please referring to Fig.1) encapsulates (Flip-Chip) technique by reviewing and is affixed on the circuit board
16 first surface 161 forms pressure sensor packaging structure 20.There is connection on the first surface 161 of the circuit board 16
To the pad of connection circuit, the pad is connect in 10 sensitive membrane 13 of pressure sensor for transmitting the soldered ball 15 of electric signal,
To realize being electrically connected between pressure sensor and circuit board 16.
Package dimension can be reduced using reviewing encapsulation (Flip-Chip) technique, also do not need additional encapsulating structure
Protect welding structure.Also, soldered ball 15 is formed in sensitive membrane 13, is capable of acting on for the power that is subject to of sensor circuit plate 16, and pass
Sensitive membrane is passed, by the effect of the change in resistance feedback force of the pressure drag item in sensitive membrane.Transmitting force signal by soldered ball 15 can
The sensitivity of pressure sensor can be adjusted by adjusting the layout of soldered ball 15 by improving sensitivity.
In other specific implementation modes, the pressure sensor packaging structure may include multiple pressure sensors
10, using the above method, (Flip-Chip) technique is encapsulated by reviewing and is affixed on the first surface 161 of circuit board 16, to shape
At sensor array.
The forming method of pressure sensor packaging structure in the specific implementation mode of the present invention, in the quick of pressure sensor
Soldered ball is formed on sense film, with welding circuit board, package dimension can be reduced, improve sensitivity.Further, the pressure sensor
Cavity size it is smaller, the excessive deformation of sensitive membrane can be prevented, to avoid sensitive membrane impaired.
Referring to FIG. 3, for the pressure sensor packaging structure of the embodiment of the invention.
The pressure sensor packaging structure includes：At least one pressure sensor 10, the pressure sensor 10 include：
Substrate 11, the sensitive membrane 13 positioned at 11 surface of the substrate have cavity 12 between the sensitive membrane 13 and the substrate 11；Extremely
A few soldered ball 15, is located at 13 surface of the sensitive membrane；Circuit board 16, the first surface 161 of the circuit board 16 is described in
Soldered ball 15 is welded at least one pressure sensor 10, realizes being electrically connected between circuit board 16 and pressure sensor 10.
In the specific implementation mode, the thickness of the sensitive membrane 13 is 10 μm~15 μm；13 thickness of the sensitive membrane is relatively low,
So that the small volume of the pressure sensor 10.The height of the cavity 12 is 5 μm~12 μm；The size of the cavity 12 compared with
Small, such substrate 11 can play the role of preventing 13 excessive deformation of sensitive membrane；When sensitive membrane 13 is become by extraneous stress
When shape, substrate 11 can limit the deformation extent of sensitive membrane, avoid 13 excessive deformation of sensitive membrane and be damaged.
The sensitive membrane 13 also has at least one pressure drag item 14.Pressure drag item 14 can be by carrying out the sensitive membrane 13
Ion implanting is formed.In the specific embodiment of the present invention, the sensitive membrane 13 has 4 or 8 pressure drag items 14, institute
It states pressure drag item 14 and forms wheatstone bridge configuration, carry out the variation for the power that feedback sensitive film 13 receives.In other specific implementation modes
In, the sensitive membrane 13 can also form the circuit structure of other forms with the pressure drag item 14 of other quantity.
Can also have the metallic circuit being connect with pressure drag item 14, soldered ball 15 to connect with metallic circuit in the sensitive membrane 13
It connects, for inputting and/or exporting electrical signal.Specifically, the soldered ball 15 is formed in 13 surface of sensitive membrane of 12 top of cavity,
Electrical signal can either be transmitted, additionally it is possible to transmit force signal.In order to uniformly and effectively transmit force signal to sensitive membrane 13,
In the specific embodiment of the present invention, 13 surface of the sensitive membrane is formed with the soldered ball 15 of multiple uniform array arrangements, portion
Dividing soldered ball 15 to be connect with metallic circuit, electric signal is transmitted while transmitting force signal, part soldered ball 15 is not connect with metallic circuit,
It is only used for transmitting force signal.In other specific implementation modes, 13 surface of the sensitive membrane is also formed with 1~10 welded ball array
Composition, such as 2 or 4 welded ball arrays, each welded ball array include more than two soldered balls 15.
The circuit board 16 can be flexible PCB, be easy to happen deformation under pressure, thus by stress transfer
To sensitive membrane 13, pressure detecting is realized.The circuit board 16 can be that single-sided circuit board can also be double-sided PCB.The electricity
There is the connection circuit being connect with the pressure sensor 10, the circuit board 16 also to have on the first surface 161 of road plate 16
Processing circuit can be formed in the first surface 161, can also be formed in the second surface 162, for detecting signal
It is handled.The pressure sensor 10 encapsulates the first table that (Flip-Chip) technique is affixed on the circuit board 16 by reviewing
Face 161.There is the pad for being connected to connection circuit, the pad and pressure sensing on the first surface 161 of the circuit board 16
It is connected in 10 sensitive membrane 13 of device for transmitting the soldered ball 15 of electric signal, to realize between pressure sensor 10 and circuit board 16
Electrical connection.
Pressure sensor packaging structure in above-mentioned specific implementation mode has weldering in the sensitive membrane of pressure sensor
Ball can reduce package dimension with welding circuit board, improve sensitivity.Further, the cavity size of the pressure sensor compared with
It is small, the excessive deformation of sensitive membrane can be prevented, to avoid sensitive membrane impaired.
The specific implementation mode of the present invention also provides a kind of touch device with pressure sensor packaging structure.
A and 4B are please referred to Fig.4, Fig. 4 A are that the partial structurtes before the touch device installation of the embodiment of the invention are shown
It is intended to；Fig. 4 B are the partial structural diagram after the touch device installation of the embodiment of the invention.
B is please referred to Fig.4, the touch device includes：At least one pressure sensor packaging structure 20；Touch tablet 21；Branch
Frame 22, the holder 22 are bonded with the touch tablet 21, and have a cavity 24 between the holder 22 and the touch tablet 21；
The pressure sensor packaging structure 20 is installed in the cavity 24, and the circuit board of the pressure sensor packaging structure 20
16 second surface 162 is bonded with the touch tablet 21, and second surface 162 and the first surface 161 of the circuit board (are asked
With reference to figure 4) it is opposite.
The concrete structure of the pressure sensor packaging structure 20 please refers to the specific of aforementioned pressure sensor-packaging structure
Embodiment, therefore not to repeat here.
The touch device can be that touch-controlled electronic devices, the touch tablets 21 such as mobile phone, tablet can be various displays
Screen, such as OLED display screen, LCD display etc.；The holder 22 can be that the mounting bracket at 21 back side of touch tablet is either touched
Control the shell of device.In other specific implementation modes, the touch device can also be other electronic equipments, not limit herein
System.
In the specific implementation mode, there is a bullet between the substrate 11 and holder 22 of the pressure sensor packaging structure 20
Property bed course 23, the elastic insert 23 support the pressure sensor packaging structure 20 so that the pressure sensor package knot
The second surface 162 of the circuit board 16 of structure 20 is bonded with the touch tablet 21.
The elastic insert 23 has elasticity in the height direction, and height is compressible, in a specific embodiment, institute
The material for stating elastic insert 23 can be rubber.The elastic insert 23 can be sticked to 22 inner surface of the holder by glue-line.
A is please referred to Fig.4, before the installation to touch tablet 21 of holder 22, the elastic insert 23 keeps original state；Please refer to figure
4B forms cavity 24 after the installation to touch tablet 21 of holder 22 between touch tablet 21 and holder 22,24 height of the cavity is less than
Height before installation, the thickness of elastic insert 23 are less than the thickness before installation, make the circuit of pressure sensor packaging structure 20
Plate 16 is fitted closely to touch tablet 21, wherein the holder 22 can closely be pasted by the modes such as viscose glue or buckle and touch tablet 21
Conjunction is integral.C is please referred to Fig.4, when strong act on touch tablet 21, touch tablet 21 generates faint deformation, passes through electricity
Road plate 16, soldered ball 15 are transmitted to sensitive membrane 13 so that sensitive film resistance changes, and the variation of resistance is transmitted to by soldered ball 15
The signal processing circuit of circuit board 16.
Fig. 5 A~5B are please referred to, Fig. 5 A are that the partial structurtes before the touch device installation of the embodiment of the invention are shown
It is intended to；Fig. 5 B are the partial structural diagram after the touch device installation of the embodiment of the invention.
Fig. 5 B are please referred to, the touch device includes：At least one pressure sensor packaging structure 20；Touch tablet 21；Branch
Frame 22, the holder 22 are bonded with the touch tablet 21, and have a cavity 24 between the holder 22 and the touch tablet 21；
The pressure sensor packaging structure 20 is installed in the cavity 24, and the circuit board of the pressure sensor packaging structure 20
16 second surface 162 is bonded with the touch tablet 16, the second surface 162 and the first surface 161 (please referring to Fig.3)
Relatively.
The concrete structure of the pressure sensor packaging structure 20 please refers to the specific of aforementioned pressure sensor-packaging structure
Embodiment, therefore not to repeat here.
In the specific implementation mode, pass through colloid between the second surface 162 and the touch tablet 21 of the circuit board 16
Fitting.The colloid can be the uniform mucilage materials such as AB glue, epoxy resin.When holder 22 and touch tablet 21 fit closely,
There is certain gap between pressure sensor 10 and holder 22.When strong act on touch tablet 31, touch tablet 31 occurs
Faint deformation is transmitted to sensitive membrane 13 by soldered ball 15, and the variation of resistance is transmitted to subsequent signal processing electricity by soldered ball 15
Road.
Fig. 6 A~6B are please referred to, are the structural schematic diagram of the touch device in the embodiment of the invention.It should
In specific implementation mode, the touch device is mobile phone, and touch tablet 41 is mobile phone display screen.Fig. 6 A are the front of mobile phone display screen
Schematic diagram, Fig. 6 B are the side schematic view of mobile phone display screen.
The touch tablet 41 is rectangle, and the touch device includes 4 pressure sensor packaging structures 20, is respectively arranged in
At the square position of the touch tablet 41, for experiencing position and the size of the power that screen receives.
Specifically, the pressure sensor packaging structure 20 is installed between touch tablet 41 and holder 42, the specific implementation
In mode, the holder 42 is mobile phone shell.
In other specific implementation modes, the touch device can also be that other electronics with touch display screen are set
Standby, the touch tablet is also with for other shapes, such as round, pentagon and hexagon etc., the pressure sensor package knot
Structure 20 can be installed on the formed folding angular position of lateral edges intersection of touch tablet.
The touch device includes multiple independent pressure sensor packaging structures 20, each pressure sensor packaging structure
20 have and independent circuit board and processing circuit；In other specific implementation modes, the touch device can also only include
One pressure sensor packaging structure 20, and the pressure sensor packaging structure 20 has fitting on a circuit board
Multiple pressure sensors；Or the touch device includes multiple pressure sensor packaging structures 20, and all pressure sensings
The circuit board of device encapsulating structure 20 links together.
Please refer to the structural schematic diagram that Fig. 7 A are the touch device in the embodiment of the invention.
In the specific implementation mode, touch device is mobile phone, and touch tablet 51 is mobile phone display screen, and Fig. 7 A are mobile phone display screen
Front schematic view.
In the specific implementation mode, the pressure sensor packaging structure 20 is installed on the edge of touch tablet 51, can be with
For replacing mechanical function keys or for increasing some other inductive operation keys.
Fig. 7 B are please referred to, are to touch pressure sensor used by structure shown in Fig. 7 A in a specific implementation mode
The structural schematic diagram of encapsulating structure 20.In the pressure sensor packaging structure 20, including 4 pressure sensors 10, it is affixed on electricity
On road plate 16.Circuit board 16 is affixed on mobile phone screen side again, when force effect is on side, each pressure sensing can be passed through
The different of device 10 export to carry out operation judges.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (18)
1. a kind of pressure sensor packaging structure, which is characterized in that including：
At least one pressure sensor, the pressure sensor include：Substrate, positioned at the sensitive membrane of the substrate surface, it is described
There is cavity between sensitive membrane and the substrate；
At least one soldered ball is located at the sensitive film surface；
The first surface of circuit board, the circuit board is welded by the soldered ball and at least one pressure sensor, is realized
Being electrically connected between circuit board and pressure sensor.
2. pressure sensor packaging structure according to claim 1, which is characterized in that the thickness of the sensitive membrane is 10 μm
~15 μm.
3. pressure sensor packaging structure according to claim 1, which is characterized in that the height of the cavity be 5 μm~
12μm。
4. pressure sensor packaging structure according to claim 1, which is characterized in that the sensitive membrane has at least one
Pressure drag item.
5. pressure sensor packaging structure according to claim 4, which is characterized in that the sensitive membrane has 4 or 8
Pressure drag item, the pressure drag item form wheatstone bridge configuration.
6. pressure sensor packaging structure according to claim 1, which is characterized in that the circuit board is flexible circuit
Plate.
7. a kind of forming method of pressure sensor packaging structure, which is characterized in that including：
At least one pressure sensor is provided, the pressure sensor includes：Substrate, positioned at the sensitive membrane of the substrate surface,
There is cavity between the sensitive membrane and the substrate；
Circuit board is provided；
Using reviewing packaging technology, at least one soldered ball is formed in the sensitive film surface, and pass through the ball bond to institute
The first surface of circuit board is stated, realizes being electrically connected between circuit board and pressure sensor.
8. the forming method of pressure sensor packaging structure according to claim 7, which is characterized in that the sensitive membrane
Thickness is 10 μm~15 μm.
9. the forming method of pressure sensor packaging structure according to claim 7, which is characterized in that the height of the cavity
Degree is 5 μm~12 μm.
10. the forming method of pressure sensor packaging structure according to claim 7, which is characterized in that the sensitive membrane
With at least one pressure drag item.
11. the forming method of pressure sensor packaging structure according to claim 10, which is characterized in that the sensitive membrane
With 4 or 8 pressure drag items, the pressure drag item forms wheatstone bridge configuration.
12. the forming method of pressure sensor packaging structure according to claim 7, which is characterized in that the circuit board
For flexible PCB.
13. a kind of touch device, which is characterized in that including：
At least one such as pressure sensor packaging structure according to any one of claims 1 to 6；
Touch tablet,
Holder, the holder are bonded with the touch tablet, and have a cavity between the holder and the touch tablet；
The pressure sensor packaging structure is installed in the cavity, and the circuit board of the pressure sensor packaging structure
Second surface is bonded with the touch tablet, and the second surface is opposite with the first surface.
14. touch device according to claim 13, which is characterized in that the second surface of the circuit board and the touch
It is bonded by colloid between plate.
15. touch device according to claim 13, which is characterized in that the substrate of the pressure sensor packaging structure with
There is an elastic insert, the elastic insert to support the pressure sensor packaging structure so that the pressure passes between holder
The second surface of the circuit board of sensor encapsulating structure is bonded with the touch tablet.
16. touch device according to claim 13, which is characterized in that the pressure sensor packaging structure is installed on tactile
The formed folding angular position of lateral edges intersection of template or the pressure sensor packaging structure are installed on the edge of touch tablet
Place.
17. touch device according to claim 16, which is characterized in that the touch tablet is rectangle, the pressure sensing
Device encapsulating structure is installed at the square position of the touch tablet or the pressure sensor packaging structure is installed on touch tablet
Side edge.
18. touch device according to claim 13, which is characterized in that the touch tablet is display screen.
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| CN108645548B (en) | 2022-04-01 |
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