CN206799768U - A kind of electroplating assembly line high velocity projector - Google Patents
A kind of electroplating assembly line high velocity projector Download PDFInfo
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- CN206799768U CN206799768U CN201720458373.2U CN201720458373U CN206799768U CN 206799768 U CN206799768 U CN 206799768U CN 201720458373 U CN201720458373 U CN 201720458373U CN 206799768 U CN206799768 U CN 206799768U
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- solution cavity
- overflow plate
- sparge pipe
- cavity
- assembly line
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Abstract
The utility model discloses a kind of electroplating assembly line high velocity projector, it is characterised in that：Including solution cavity, the top of the solution cavity is provided with the outlet of bar shaped water spray, and bottom is provided with a water inlet；A sparge pipe and overflow plate are additionally provided with the solution cavity, the overflow plate is arranged at the middle part of the solution cavity, the solution cavity is divided into epicoele and cavity of resorption by the overflow plate, the middle part of the sparge pipe is provided with a water inlet pipe, and the bottom of the water inlet pipe is arranged at the lower section of the solution cavity through the water inlet；The sparge pipe and overflow plate be arranged in parallel with the outlet of bar shaped water spray, the bottom of the sparge pipe is arranged with a plurality of water jets, bearing of trend of a plurality of water jets along the sparge pipe is uniform, and the water jet is set towards the inwall bottom of the solution cavity, the both sides of the overflow plate are evenly equipped with a plurality of spout holes, and the spout hole connects the epicoele and cavity of resorption.The utility model improves the electroplating efficiency and electroplating quality of product.
Description
Technical field
It the utility model is related to a kind of electroplating assembly line, more particularly to a kind of electroplating assembly line high velocity projector.
Background technology
Plating (it is exactly the process for plating the other metal or alloy of a thin layer on some metal surfaces using electrolysis principle,
It is the technique of the surface attachment layer of metal film of metal or other materials product is prevented metal so as to play using electrolysis
Aoxidize (such as corrosion), improve the effect such as wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
When being electroplated to product, typically product is electroplated using electroplating assembly line.In the prior art, opposite end
When son is electroplated, directly terminal is electroplated using electroplating liquid medicine, but electroplating liquid medicine lacks secondary agitation, can cause to expect
The terminal uneven coating taken is even, and thickness difference is big, influences the electroplating quality of terminal.
The content of the invention
The utility model purpose is to provide a kind of electroplating assembly line high velocity projector, by using the structure, effectively improves
The uniformity of electroplating liquid medicine, the uniformity of coating, improves electroplating quality when improving the plating of product.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of electroplating assembly line high velocity projector, bag
Solution cavity is included, the solution cavity is hollow structure, and the top of the solution cavity is provided with the outlet of bar shaped water spray, and bottom is provided with a water inlet
Mouthful；A sparge pipe and overflow plate are additionally provided with the solution cavity, the overflow plate is arranged at the middle part of the solution cavity, described to overflow
The solution cavity is divided into epicoele and cavity of resorption by flowing plate, and the sparge pipe is arranged at the lower intracavitary of the lower section of the overflow plate, institute
The middle part for stating sparge pipe is provided with a water inlet pipe, and the bottom of the water inlet pipe is arranged under the solution cavity through the water inlet
Side；The outlet of the sparge pipe and overflow plate and the bar shaped water spray be arranged in parallel, and the bottom of the sparge pipe is arranged with a plurality of
Water jet, bearing of trend of a plurality of water jets along the sparge pipe is uniform, and the water jet is towards the solution
The inwall bottom of chamber is set, and the both sides of the overflow plate are evenly equipped with a plurality of spout holes, the spout hole connect the epicoele and
Cavity of resorption.
In above-mentioned technical proposal, the solution cavity is connected by left cover and right cover plate to be formed, and the left cover is front end face
The hollow structure of opening, the right cover plate are the hollow structure of rear end face opening, the front end face of the left cover and right cover plate
Rear end face is connected, and the space between the left and right cover plate forms the solution cavity.
In above-mentioned technical proposal, a liquid outlet is additionally provided with the middle part of the overflow plate.
In above-mentioned technical proposal, complex root support bar is additionally provided with below the overflow plate, the overflow plate is butted on described
On the top surface of support bar, and medial surface of the both ends of the support bar respectively with the left and right cover plate is connected.
In above-mentioned technical proposal, the top both sides of the solution cavity are respectively equipped with two clamping plates, the both ends point of the clamping plate
It is not sandwiched on the lateral surface of the left and right cover plate.
In above-mentioned technical proposal, the bottom both ends of the solution cavity are respectively equipped with a support block, the both ends of the solution cavity
It is butted on respectively in the support block.
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：
1. by setting sparge pipe and overflow plate in the utility model, overflow plate is arranged at the top of sparge pipe, due to spray
The water spray mouth down of water pipe is set, and electroplating liquid medicine is sprayed downwards by water jet, due to the stop of solution cavity bottom, electroplating liquid medicine
It can be refracted on overflow plate, using the refraction of electroplating liquid medicine, overflow plate plays a part of stirring, and electroplating liquid medicine can be made more equal
Even, electroplating liquid medicine evenly is sprayed by overflow plate, then is sprayed by bar shaped outlet of spraying water, and product is electroplated, and conventional
The structure of directly water spray plating is compared, and using the refraction of water jet and overflow plate, plays and electroplating liquid medicine is again stirring for acting on,
The uniformity of electroplating liquid medicine can be improved, ensures the uniformity of product coating, improves product electroplating quality.
Brief description of the drawings
Fig. 1 is the structural representation in the utility model embodiment one；
Fig. 2 is Fig. 1 decomposition texture schematic diagram.
Wherein：1st, solution cavity；2nd, bar shaped water spray outlet；3rd, sparge pipe；4th, overflow plate；5th, water inlet pipe；6th, spout hole；7th, it is left
Cover plate；8th, right cover plate；9th, liquid outlet；10th, support bar；11st, clamping plate；12nd, support block；13rd, water jet.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model：
Embodiment one：Referring to shown in Fig. 1,2, a kind of electroplating assembly line high velocity projector, including solution cavity 1, the solution
Chamber 1 is hollow structure, and the top of the solution cavity 1 is provided with bar shaped water spray outlet 2, and bottom is provided with a water inlet；The solution cavity 1
Inside it is additionally provided with a sparge pipe 3 and overflow plate 4, the overflow plate 4 is arranged at the middle part of the solution cavity 1, and the overflow plate 4 is by institute
State solution cavity 1 and be divided into epicoele and cavity of resorption, the sparge pipe 3 is arranged at the lower intracavitary of the lower section of the overflow plate 4, the water spray
The middle part of pipe 3 is provided with a water inlet pipe 5, and the bottom of the water inlet pipe 5 is arranged under the solution cavity 1 through the water inlet
Side；The sparge pipe 3 and overflow plate 4 are be arranged in parallel with bar shaped water spray outlet 2, and the bottom of the sparge pipe 3 is arranged with again
Several water jets 13, bearing of trend of a plurality of water jets 13 along the sparge pipe 3 is uniform, and the court of the water jet 13
Set to the inwall bottom of the solution cavity 1, the both sides of the overflow plate 4 are evenly equipped with a plurality of spout holes 6, the spout hole 6
Connect the epicoele and cavity of resorption.
In the present embodiment, when in use, electroplate liquid is entered in sparge pipe by water inlet pipe, the then plating in sparge pipe
Liquid is sprayed by water jet, is sprayed on lower intracavitary, and because water spray mouth down is set, the electroplate liquid of ejection is splash, and splashes overflow plate
On, electroplate liquid is sputtered by the bottom of cavity of resorption and the stop of overflow plate, generation, is played and be again stirring for acting on, after stirring twice
Electroplate liquid it is more uniform, the electroplate liquid after then stirring in upper intracavitary, passes through the outlet spray of bar shaped water spray by spout hole stream
Go out.Wherein, product is to spray water to export from bar shaped to pass through, and the electroplate liquid for exporting and spraying of being sprayed water using bar shaped, completes the electricity to product
Plating.In the present embodiment, set by the setting of overflow plate, and water spray mouth down, repeatedly stirring to electroplate liquid can be realized
Mix, improve the uniformity of electroplate liquid, also just improve the uniformity of the electrodeposited coating of product, improve the electroplating quality of product.
In the present embodiment, the bore of water jet is far smaller than the diameter of water inlet pipe, and such electroplate liquid can pass through water spray
Mouth sprays at a high speed, recycles the bottom of cavity of resorption and the stop of overflow plate, causes the sputtering of electroplate liquid, play and electroplate liquid is stirred
Mix, increase the exchange of electroplate liquid intermediate ion, improve electroplating efficiency, the distribution of plating film thickness can be improved, improve plating thickness
The uniformity of degree, make the crystallization of plating finer and smoother, improve the quality of electrodeposited coating.
Shown in Figure 2, the solution cavity 1 is connected by left cover 7 and right cover plate 8 to be formed, and the left cover 7 is front end face
The hollow structure of opening, the right cover plate 8 are the hollow structure of rear end face opening, the front end face of the left cover 7 and right cover plate 8
Rear end face be connected, space between the left and right cover plate forms the solution cavity.
In the present embodiment, because solution cavity is the hollow structure that top offers the outlet of bar shaped water spray, in order to protect
Card is processed, wherein, solution cavity is connected and composed using left and right cover plate, is easy to the processing of solution cavity, while also allows for overflowing
The installation of flowing plate and sparge pipe, it is easy to assemble.
The middle part of the overflow plate 4 is additionally provided with a liquid outlet 9.When the flooding velocity of spout hole is inadequate, using liquid outlet,
It can ensure liquid efficiency, that is, ensure electroplating efficiency.
Referring to shown in Fig. 1,2, the lower section of the overflow plate 4 is additionally provided with complex root support bar 10, and the overflow plate 4 is butted on institute
On the top surface for stating support bar 10, and medial surface of the both ends of the support bar 10 respectively with the left and right cover plate is connected.By setting
Support bar is put, the installation of overflow plate can be easy to, can also ensure the intensity of overflow plate.Meanwhile utilize the setting of support bar, energy
Be enough in the left and right cover plate of support, prevent left and right cover plate from receiving the hydrojet pressure of water jet and deforming, can also play connection it is left,
The effect of right cover plate.
The top both sides of the solution cavity 1 are respectively equipped with two clamping plates 11, and the both ends of the clamping plate 11 are sandwiched in described respectively
On the lateral surface of left and right cover plate.It by setting clamping plate, can either be used to fix left and right cover plate, also can be used in producing with plating
Line assembles.
The bottom both ends of the solution cavity 1 are respectively equipped with a support block 12, and the both ends of the solution cavity 1 are butted on described respectively
In support block 12.By the setting of support block, it is easy to the installation of solution cavity.Meanwhile the both ends of sparge pipe are also directly mounted at two
In the support block of side, play a supporting role.
Claims (6)
- A kind of 1. electroplating assembly line high velocity projector, it is characterised in that：Including solution cavity, the solution cavity is hollow structure, institute The top for stating solution cavity is provided with the outlet of bar shaped water spray, and bottom is provided with a water inlet；Be additionally provided with the solution cavity sparge pipe and Overflow plate, the overflow plate are arranged at the middle part of the solution cavity, the overflow plate by the solution cavity be divided into epicoele and under Chamber, the sparge pipe are arranged at the lower intracavitary of the lower section of the overflow plate, and the middle part of the sparge pipe is provided with a water inlet pipe, described The bottom of water inlet pipe is arranged at the lower section of the solution cavity through the water inlet；The sparge pipe and overflow plate and the bar shaped Water spray outlet be arranged in parallel, and the bottom of the sparge pipe is arranged with a plurality of water jets, and a plurality of water jets are along described The bearing of trend of sparge pipe is uniform, and the water jet is set towards the inwall bottom of the solution cavity, and the two of the overflow plate Side is evenly equipped with a plurality of spout holes, and the spout hole connects the epicoele and cavity of resorption.
- 2. electroplating assembly line high velocity projector according to claim 1, it is characterised in that：The solution cavity by left cover and Right cover plate connects composition, and the left cover is the hollow structure of front end face opening, and the right cover plate is hollow for rear end face opening Structure, the front end face of the left cover are connected with the rear end face of right cover plate, and the space between the left and right cover plate forms described molten Sap cavity.
- 3. electroplating assembly line high velocity projector according to claim 2, it is characterised in that：The middle part of the overflow plate is also set There is a liquid outlet.
- 4. electroplating assembly line high velocity projector according to claim 2, it is characterised in that：The lower section of the overflow plate is also set Have complex root support bar, the overflow plate is butted on the top surface of the support bar, and the both ends of the support bar respectively with it is described The medial surface of left and right cover plate is connected.
- 5. electroplating assembly line high velocity projector according to claim 2, it is characterised in that：The top both sides of the solution cavity Two clamping plates are respectively equipped with, the both ends of the clamping plate are sandwiched on the lateral surface of the left and right cover plate respectively.
- 6. electroplating assembly line high velocity projector according to claim 1, it is characterised in that：The bottom both ends of the solution cavity A support block is respectively equipped with, the both ends of the solution cavity are butted in the support block respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720458373.2U CN206799768U (en) | 2017-04-27 | 2017-04-27 | A kind of electroplating assembly line high velocity projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720458373.2U CN206799768U (en) | 2017-04-27 | 2017-04-27 | A kind of electroplating assembly line high velocity projector |
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| Publication Number | Publication Date |
|---|---|
| CN206799768U true CN206799768U (en) | 2017-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720458373.2U Active CN206799768U (en) | 2017-04-27 | 2017-04-27 | A kind of electroplating assembly line high velocity projector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110629261A (en) * | 2019-09-23 | 2019-12-31 | 谢云真 | High corrosion resistance zinc-iron alloy electroplater of car connecting rod based on operation is simplified |
| CN113026080A (en) * | 2021-04-25 | 2021-06-25 | 山王电子(无锡)有限公司 | Special nickel plating solution nozzle for electroplating production line |
-
2017
- 2017-04-27 CN CN201720458373.2U patent/CN206799768U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110629261A (en) * | 2019-09-23 | 2019-12-31 | 谢云真 | High corrosion resistance zinc-iron alloy electroplater of car connecting rod based on operation is simplified |
| CN113026080A (en) * | 2021-04-25 | 2021-06-25 | 山王电子(无锡)有限公司 | Special nickel plating solution nozzle for electroplating production line |
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