CN218404476U - Special plating bath for local gold plating - Google Patents
Special plating bath for local gold plating Download PDFInfo
- Publication number
- CN218404476U CN218404476U CN202222405457.3U CN202222405457U CN218404476U CN 218404476 U CN218404476 U CN 218404476U CN 202222405457 U CN202222405457 U CN 202222405457U CN 218404476 U CN218404476 U CN 218404476U
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- China
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- plate
- curb plate
- curb
- bottom plate
- plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model belongs to the technical field of electroplate, especially, special plating bath of local gilding, comprising a base plate, curb plate one, curb plate two, curb plate three and curb plate four are installed respectively to the top four sides position of bottom plate, the flow distribution plate is installed at the top of bottom plate, and the flow distribution plate is located curb plate one, curb plate two, curb plate three and between the curb plate four, one side of curb plate four is provided with five curb plates of fixed mounting on the bottom plate, and fixed mounting has the overflow board between four curb plates of curb plate and five. The utility model discloses the product that needs to electroplate is placed and is electroplated in the plating bath, and the plating bath design is in order to merge into one through the processing mode former 5 traditional plating baths to the coproduction product, and then save production space, improve productivity and energy saving and consumption reduction, the inslot liquid level is adjustable, in order to electroplate the region in response to different product portion copper.
Description
Technical Field
The utility model relates to an electroplate technical field, especially relate to special plating bath of local gilding.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
However, in the prior art, the liquid level of the plating tank cannot be adjusted according to the copper plating areas of different product parts, and the plating tank is independently plated, so that the efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a special plating bath for local gold plating.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the special plating bath for local gold plating comprises a bottom plate, wherein a first side plate, a second side plate, a third side plate and a fourth side plate are respectively arranged on four sides of the top of the bottom plate, a splitter plate is arranged on the top of the bottom plate and located among the first side plate, the second side plate, the third side plate and the fourth side plate, a fifth side plate fixedly installed on the bottom plate is arranged on one side of the fourth side plate, and an overflow plate is fixedly installed between the fourth side plate and the fifth side plate through screws.
Preferably, all install into medicine mouth on the both sides of bottom plate, seted up a plurality of pipelines on the bottom plate, and go into medicine mouth and bottom plate pipeline and be linked together.
Preferably, a plurality of small holes are formed in the flow distribution plate, and the small holes are arranged corresponding to the bottom plate pipelines.
Preferably, the second side plate and the fifth side plate are fixedly provided with anode plates.
Preferably, the first side plate and the third side plate are provided with electroplating jigs.
The utility model discloses in, local special plating bath of gilding, the product that needs to electroplate are placed and are electroplated in the plating bath, and the plating bath design is in order to merge into one through processing mode former 5 traditional plating baths to the coproduction product, and then save the production space, improve productivity and energy saving and consumption reduction, the inslot liquid level is adjustable, in order to electroplate regional in response to different product portion copper.
Drawings
FIG. 1 is a schematic structural view of a special plating bath for local gold plating according to the present invention;
FIG. 2 is a schematic top view of the special electroplating bath for local gold plating according to the present invention;
fig. 3 is a schematic side view of the electroplating bath for local gold plating according to the present invention.
In the figure: 1 bottom plate, 2 medicine inlets, 3 flow distribution plates, 4 side plates I, 5 side plates II, 6 side plates III, 7 side plates IV, 8 overflow plates and 9 side plates V.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the special plating bath for local gold plating comprises a bottom plate 1, wherein four sides of the top of the bottom plate 1 are respectively provided with a side plate I4, a side plate II 5, a side plate III 6 and a side plate IV 7, the top of the bottom plate 1 is provided with a splitter plate 3, the splitter plate 3 is positioned between the side plate I4, the side plate II 5, the side plate III 6 and the side plate IV 7, one side of the side plate IV 7 is provided with a side plate V9 fixedly installed on the bottom plate 1, an overflow plate 8 is fixedly installed between the side plate IV 7 and the side plate V9 through screws, the overflow plate is used for adjusting the liquid level height of the plating bath, and the splitter plate is used for uniformly flowing out a liquid medicine in a medicine bath and filling the plating bath.
The utility model discloses in, all install into medicine mouth 2 on bottom plate 1's the both sides, seted up a plurality of pipelines on bottom plate 1, and go into medicine mouth 2 and be linked together with bottom plate 1 pipeline, go into the medicine mouth and be used for connecting tube, the liquid medicine gets into the bottom plate pipeline via this.
The utility model discloses in, seted up a plurality of apertures on flow distribution plate 3, aperture and the corresponding setting of 1 pipeline of bottom plate.
The utility model discloses in, fixed mounting has the anode plate on two 5 of curb plates and the five 9 of curb plate.
In the utility model, the electroplating jig is arranged on the first 4 and the third 6 side plates.
The utility model discloses in, theory of operation, liquid medicine are by going into the medicine mouth and get into the bottom plate pipeline, and the liquid medicine flows to collection medicine groove respectively via the pipeline, stays each aperture to the flow distribution plate via collection medicine groove again, and the outflow aperture is in order to be full of the plating bath, and the liquid medicine after being full of flows back to the female groove of liquid medicine via the overflow plate.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. Local gilding special plating bath, including bottom plate (1), its characterized in that, curb plate (4), curb plate two (5), curb plate three (6) and curb plate four (7) are installed respectively to the top four sides position of bottom plate (1), flow distribution plate (3) are installed to the top of bottom plate (1), and flow distribution plate (3) are located between curb plate one (4), curb plate two (5), curb plate three (6) and curb plate four (7), one side of curb plate four (7) is provided with five (9) of curb plate fixed mounting on bottom plate (1), and has overflow plate (8) through screw fixed mounting between curb plate four (7) and five (9) of curb plate.
2. The special electroplating bath for local gold plating according to claim 1, wherein the two sides of the bottom plate (1) are both provided with a medicine inlet (2), the bottom plate (1) is provided with a plurality of pipelines, and the medicine inlet (2) is communicated with the pipelines of the bottom plate (1).
3. The special plating bath for local gold plating according to claim 1, wherein the flow distribution plate (3) is provided with a plurality of small holes, and the small holes are arranged corresponding to the pipelines of the bottom plate (1).
4. The special plating tank for local gold plating according to claim 1, characterized in that anode plates are fixedly arranged on the second side plate (5) and the fifth side plate (9).
5. The special plating tank for local gold plating according to claim 1, wherein plating jigs are mounted on the first side plate (4) and the third side plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222405457.3U CN218404476U (en) | 2022-09-09 | 2022-09-09 | Special plating bath for local gold plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222405457.3U CN218404476U (en) | 2022-09-09 | 2022-09-09 | Special plating bath for local gold plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218404476U true CN218404476U (en) | 2023-01-31 |
Family
ID=85032491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222405457.3U Active CN218404476U (en) | 2022-09-09 | 2022-09-09 | Special plating bath for local gold plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218404476U (en) |
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2022
- 2022-09-09 CN CN202222405457.3U patent/CN218404476U/en active Active
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