CN103806022A - Electroplating solution for electroplating decorative trivalent chromium on surface of electronic product - Google Patents
Electroplating solution for electroplating decorative trivalent chromium on surface of electronic product Download PDFInfo
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- CN103806022A CN103806022A CN201210451052.1A CN201210451052A CN103806022A CN 103806022 A CN103806022 A CN 103806022A CN 201210451052 A CN201210451052 A CN 201210451052A CN 103806022 A CN103806022 A CN 103806022A
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Abstract
The invention discloses an electroplating solution for electroplating decorative trivalent chromium on the surface of an electronic product. The electroplating solution consists of the following components: 86-90g/L of chromium chloride, 74-78g/L of urea, 52-56g/L of ammonium bromide, 36-40g/L of sodium chloride, 12-14g/L of boric acid, 160-170ml/L of methanol, 80-100ml/L of formic acid, 0.03-0.04g/L of sodium dodecyl sulfate, 8-10g/L of iron chloride and the balance of water.
Description
Technical field
The present invention relates to electroplating technology field, relate in particular to a kind of for the ornamental chromic plating solution of electronic product electroplating surface.
Background technology
Decorative chromium coating becomes one of most widely used decorative coating of industry member owing to having good glossiness and corrosion resistance nature.But for a long time, traditional hexavalent chromium plating technique exists and is much difficult to the shortcoming that overcomes, as dispersive ability and covering power is poor, current efficiency is low, electroplating temperature is high, electroplating process to human and environment seriously polluted and plating solution aftertreatment difficulty etc.In sexavalent chrome electrodeposition process, in waste water and waste gas, contain a large amount of sexavalent chromes, it causes very large pollution to environment, and can cause human body renal failure, heart rate exhaustion, leukemia, strongly cause cancer.At present, the World Health Organization and countries in the world are more and more paid attention to the pollution problem of hexavalent chromium plating technique.Recent " about the instruction that bans use of some objectionable impurities in electronics " of European Union (ROHS) strict regulation after 1 day July in 2006, will forbid the use of sexavalent chrome in electronic product in European whole area." the electronics and IT products pollution control management way " of China also clearly stipulates to control chromic use from 1 day March in 2007.Therefore, the research of current alternative sexavalent chrome electro-deposition techniques has become one of the focus of electroplating industry research and difficult point.
At present, substitute hexavalent chromium plating technology and mainly contain three kinds: vapour deposition chromium coating, electro-deposited alloy coating, Electrodeposition of Trivalent Chromium.That gas phase deposition technology advantage is to pollute is little, deposition evenly, but its cost is high, covering power is poor, can not be used for the deposition of irregular workpiece and pipe fitting inner wall, is also unfavorable for large-scale industrial production.Electro-deposited alloy nickel-base alloy coating mainly comprises Zn-Sn-Co, Ni-P, Ni-W and other ternary alloys, and this kind of method polluted little, but bath stability is poor, can operational condition narrow.By contrast, decorate Electrodeposition of Trivalent Chromium technique toxicity and only have 1% of hexavalent chromium plating technique, and energy consumption is little, efficiency is high, poor poor with bath stability but its shortcoming is coating glossiness.Although the industrialization promotion of the ornamental trivalent chromium plating technique of existing external report, domestic have the ornamental trivalent chromium plating technique that independent intellectual property right also can be applied to suitability for industrialized production and have not been reported.
In order to reduce environmental pollution, the technology that reduces Chinese foreign state aspect chromium plating relies on, and overcomes the fort of green trade, develops and has independent intellectual property right and can be applied to industrial ornamental trivalent chromium plating technique in the urgent need to domestic investigators.
Summary of the invention
The object of the invention is to propose a kind of for the ornamental chromic plating solution of electronic product electroplating surface, by the adjustment to plating solution component, make plating solution more stable, thereby make the coating that adopts this plating solution to electroplate there is good covering power, good with the bonding force of matrix, and appearance looks elegant.
For reaching this object, the present invention by the following technical solutions:
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 86-90g/L, urea 74-78g/L, brometo de amonio 52-56g/L, sodium-chlor 36-40g/L, boric acid 12-14g/L, methyl alcohol 160-170ml/L, formic acid 80-100ml/L, sodium laurylsulfonate 0.03-0.04g/L, iron(ic) chloride 8-10g/L, surplus is water.
Preferably, consisting of of this plating solution: chromium chloride 87-89g/L, urea 75-77g/L, brometo de amonio 53-55g/L, sodium-chlor 37-39g/L, boric acid 12.5-13.5g/L, methyl alcohol 163-167ml/L, formic acid 85-95ml/L, sodium laurylsulfonate 0.033-0.037g/L, iron(ic) chloride 8.5-9.5g/L, surplus is water.
Most preferably, the consisting of of this plating solution: chromium chloride 88g/L, urea 76g/L, brometo de amonio 54g/L, sodium-chlor 38g/L, boric acid 13.0g/L, methyl alcohol 165ml/L, formic acid 90ml/L, sodium laurylsulfonate 0.035g/L, iron(ic) chloride 9.0g/L, surplus is water.
Adopt the electro-plating method of this plating solution to be: when galvanic deposit, anode is titanium base iridium dioxide electrode, after workpiece is cleaned and is activated according to conventional Pre-treatment before plating, control plating temperature at 33-37 ℃, electrolyte ph is controlled at 2-3, and cathode current density is 22-24A/dm
2, within galvanic deposit 4-6 minute, can prepare the bright chromium coating that thickness is 1.3-1.5 μ m.
The additive that the present invention selects can strengthen the polarized action of negative electrode effectively, the grain-size of coating is reduced and show good light.The stability of plating solution is mainly subject to positive column Cr
3+be oxidized to Cr
2o
7 2-impact.Cr
2o
7 2-more than concentration reaches 3ppm, quality of coating declines.In plating solution of the present invention, there is the reductibility of two kinds of materials to be better than Cr
3+, can effectively stop Cr in plating solution
2o
7 2-generation, make plating solution there is satisfactory stability.
The present invention has following beneficial effect:
By the adjustment to solution composition, make plating solution more stable, thereby make the coating that adopts the method to electroplate there is good covering power, good with the bonding force of matrix, and appearance looks elegant, coating is as bright as a sixpence.While utilizing negative pole of right angle method Test coverage ability, the fraction of coverage of workpiece is greater than 88%.Chromium coating flawless, surface roughness Ra≤0.1 μ m.Bath stability, can reach continuous production requirement.Can substitute sexavalent chrome, environment friendly and pollution-free.
Embodiment
Embodiment mono-
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 86g/L, urea 78g/L, brometo de amonio 52g/L, sodium-chlor 40g/L, boric acid 12g/L, methyl alcohol 170ml/L, formic acid 80ml/L, sodium laurylsulfonate 0.04g/L, iron(ic) chloride 8g/L, surplus is water.
Embodiment bis-
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 90g/L, urea 74g/L, brometo de amonio 56g/L, sodium-chlor 36g/L, boric acid 14g/L, methyl alcohol 160ml/L, formic acid 100ml/L, sodium laurylsulfonate 0.03g/L, iron(ic) chloride 10g/L, surplus is water.
Embodiment tri-
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 87g/L, urea 77g/L, brometo de amonio 53g/L, sodium-chlor 39g/L, boric acid 12.5g/L, methyl alcohol 167ml/L, formic acid 85ml/L, sodium laurylsulfonate 0.037g/L, iron(ic) chloride 8.5g/L, surplus is water.
Embodiment tetra-
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 89g/L, urea 75g/L, brometo de amonio 55g/L, sodium-chlor 37g/L, boric acid 13.5g/L, methyl alcohol 163ml/L, formic acid 95ml/L, sodium laurylsulfonate 0.033g/L, iron(ic) chloride 9.5g/L, surplus is water.
Embodiment five
A kind of for the ornamental chromic plating solution of electronic product electroplating surface, consisting of of this plating solution: chromium chloride 88g/L, urea 76g/L, brometo de amonio 54g/L, sodium-chlor 38g/L, boric acid 13g/L, methyl alcohol 165ml/L, formic acid 90ml/L, sodium laurylsulfonate 0.035g/L, iron(ic) chloride 9g/L, surplus is water.
Claims (3)
1. one kind for the ornamental chromic plating solution of electronic product electroplating surface, it is characterized in that the consisting of of this plating solution: chromium chloride 86-90g/L, urea 74-78g/L, brometo de amonio 52-56g/L, sodium-chlor 36-40g/L, boric acid 12-14g/L, methyl alcohol 160-170ml/L, formic acid 80-100ml/L, sodium laurylsulfonate 0.03-0.04g/L, iron(ic) chloride 8-10g/L, surplus is water.
2. one as claimed in claim 1 is for the ornamental chromic plating solution of electronic product electroplating surface, it is characterized in that the consisting of of this plating solution: chromium chloride 87-89g/L, urea 75-77g/L, brometo de amonio 53-55g/L, sodium-chlor 37-39g/L, boric acid 12.5-13.5g/L, methyl alcohol 163-167ml/L, formic acid 85-95ml/L, sodium laurylsulfonate 0.033-0.037g/L, iron(ic) chloride 8.5-9.5g/L, surplus is water.
3. one as claimed in claim 2 is for the ornamental chromic plating solution of electronic product electroplating surface, it is characterized in that the consisting of of this plating solution: chromium chloride 88g/L, urea 76g/L, brometo de amonio 54g/L, sodium-chlor 38g/L, boric acid 13.0g/L, methyl alcohol 165ml/L, formic acid 90ml/L, sodium laurylsulfonate 0.035g/L, iron(ic) chloride 9.0g/L, surplus is water.
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CN201210451052.1A CN103806022A (en) | 2012-11-12 | 2012-11-12 | Electroplating solution for electroplating decorative trivalent chromium on surface of electronic product |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104388989A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Trivalent chromium electroplating liquid and preparation method thereof |
CN105177651A (en) * | 2015-10-27 | 2015-12-23 | 姜少群 | Nickel-plating method of steel shell |
CN108130570A (en) * | 2017-12-15 | 2018-06-08 | 北京科技大学 | A kind of compound trivalent plating chromium process |
CN110760900A (en) * | 2019-11-29 | 2020-02-07 | 扬州大学 | Method for reducing hexavalent chromium wastewater to be used as chromium electroplating source and electroplating method thereof |
-
2012
- 2012-11-12 CN CN201210451052.1A patent/CN103806022A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104388989A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Trivalent chromium electroplating liquid and preparation method thereof |
CN105177651A (en) * | 2015-10-27 | 2015-12-23 | 姜少群 | Nickel-plating method of steel shell |
CN108130570A (en) * | 2017-12-15 | 2018-06-08 | 北京科技大学 | A kind of compound trivalent plating chromium process |
CN110760900A (en) * | 2019-11-29 | 2020-02-07 | 扬州大学 | Method for reducing hexavalent chromium wastewater to be used as chromium electroplating source and electroplating method thereof |
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Application publication date: 20140521 |