CN206781161U - A kind of composite conducting sponge - Google Patents
A kind of composite conducting sponge Download PDFInfo
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- CN206781161U CN206781161U CN201720473719.6U CN201720473719U CN206781161U CN 206781161 U CN206781161 U CN 206781161U CN 201720473719 U CN201720473719 U CN 201720473719U CN 206781161 U CN206781161 U CN 206781161U
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Abstract
The utility model discloses a kind of composite conducting sponge, including naked sponge and naked cloth, naked sponge and naked cloth adhere to the sponge cloth being integrally formed by the mode that glue is compound or fiery patch is compound, nickel dam or layers of copper are plated with sponge cloth using chemical plating or vacuum magnetic-control sputtering, it is being plated with the sponge cloth matrix surface Direct Electroplating nickel dam of nickel dam or layers of copper or first copper electroplating layer re-plating nickel dam, through washing, drying, the Ω of sheet resistance≤0.1 composite conducting sponge is obtained.The utility model has the advantage of entirety sponge cloth in conductive adhesive layer is no longer set, the use of conductive glue can be prevented completely, thoroughly relieve because glue failure and caused by product accident risk.Product resistance is no longer influenced by the interference of glue-line, and technological process is short, and the stability of product quality is lifted.
Description
Technical field
It the utility model is related to conductive material field, and in particular to a kind of composite conducting sponge.
Background technology
Composite conducting sponge is a kind of tridimensional network functional material for integrating conduction and electro-magnetic screen function, by
Grown in its conductive effective phase, the features such as effectiveness is good, and sheet resistance value can be set by practical use and be widely used in
Conductive material field.At present composite conducting sponge on the market it is typically compound using conductive sponge finished product and conductive fabric finished product and
Into its structure is made up of conductive sponge finished product, conductive adhesive layer and conductive fabric finished product, following defect be present：Current conductive sponge
Finished product and conductive fabric finished product are prepared respectively by producer, and composite conducting sponge then need both different materials is firm
Ground is combined together, therefore forms composite interlayer of the conductive adhesive layer as the two combination using conducting resinl or PUR, but
Not environmentally, and conducting resinl or PUR have the risk of failure, can caused conductive adhesive layer in the case of high temperature or long-time use
The quality of composite conducting sponge is unstable.Secondly, middle part is coated with the composite conducting sponge of conductive adhesive layer in use, its
Product resistance can be disturbed by glue, and resistance value is higher or even is extremely difficult to international standard（≦0.1Ω）, resistance value typically exists
0.08-1.5 Ω wide cut section fluctuation.In addition, conductive sponge finished product and conductive fabric finished product need to prepare respectively, wherein conductive sea
The preparation section of continuous finished product includes naked sponge pretreatment conduction, electronickelling etc.；It is pre- that the preparation section of conductive fabric finished product includes naked cloth
Handle conduction, electronickelling etc.；It is again that the conductive sponge finished product being respectively prepared and conductive fabric finished product hot pressing is compound 3-5 times, whole work
Skill flow is oversize, causes product cost to remain high.
The content of the invention
The utility model is in view of the above-mentioned problems, provide a kind of composite conducting sponge.
To achieve these goals, the utility model is realized using following technical scheme：
A kind of composite conducting sponge, it is characterised in that including naked sponge and naked cloth, naked sponge and naked cloth by glue it is compound or
Person's fire pastes compound mode and adheres to the sponge cloth being integrally formed, and is plated with using chemical plating or vacuum magnetic-control sputtering on sponge cloth
Nickel dam or layers of copper, it is being plated with the sponge cloth matrix surface Direct Electroplating nickel dam of nickel dam or layers of copper or first copper electroplating layer re-plating nickel
Layer, through washing, drying, obtain the Ω of sheet resistance≤0.1 composite conducting sponge.
Further, the naked sponge is three-dimensional porous polyurethane or PE, and the naked cloth is polyester fiber cloth or non-woven fabrics.
The compound glue is using glue transfer equipment complex, and naked cloth or naked sponge substrate are adhered to or be sprayed on by environment-friendlyadhesive adhesive
On, compound walking speed is set as 1-20m/min, and spraying glue point number is set as 10-500 points/cm2, naked cloth or naked sponge are combined into
For the sponge cloth of entirety.
It is described fire patch it is compound be use flame equipment complex, to naked sponge surface carry out heated baking, to sponge soften or
Slight burning, quantity combusted are set as 0.5-5m3/ min, compound walking speed are set as 1-50m/min, have in itself using polyurethane sponge
Some adhesive properties make it Nian Jie with naked cloth for overall sponge cloth.
The chemical plating nickel dam or layers of copper, it is that compound good sponge cloth matrix is placed in into pH to be for 8.5 ± 0.2, temperature
Carry out chemical nickel plating or copper metal in 45 ± 2 DEG C of chemical solution, matrix walking speed≤1.35m/min, the matrix table after chemical plating
The Ω of surface resistance≤100.
The vacuum magnetic-control sputtering nickel dam or layers of copper, it is that compound good sponge cloth matrix is placed in magnetron vacuum filming equipment
It is interior, nickel or copper metal powder are sputtered on sponge cloth matrix with nickel target or copper target sputtering principle, realize the pre- conduction of sponge cloth,
Wherein target cavity temperature is set as 60-100 DEG C, and matrix walking speed is set as 0.5-8 m/min, and aeration quantity is set as 100-
200sccm, pressure set 0.1-0.5Pa, the electric current of regulation sputtering needs, speed, vacuum when control sputters are to be sputtered
After process terminates, composite sponge is taken out, and verifies sheet resistance, obtain the Ω of resistance value≤100 conductive layer.
Walking speed when the Direct Electroplating nickel dam or first copper electroplating layer re-plating nickel dam is set as 0.05-0.5 m/min.
The temperature of the drying is set as 120-180 DEG C.
Compared with existing product and production technology, the utility model has the advantage of：1st, naked sponge and naked cloth are answered by glue
Close or fire pastes compound mode and adheres to the sponge cloth being integrally formed, be not required to set conductive adhesive layer, Product Green ring therebetween
Protect, the use of conductive glue can be prevented completely, thoroughly relieve because glue failure and caused by product accident risk.2nd, product electricity
Resistance is no longer influenced by the interference of glue layer, and its resistance average value can be precisely controlled under 0.03-0.08 Ω international standard.3rd, technique
Flow is short, and the preparation compared to conventional composite conductive sponge saves 6 links, and the stability of product quality is lifted, and
Process costs, the cost of raw material, cost of labor and logistics cost are effectively saved, totle drilling cost reduces by 40%, also carried significantly
Output efficiency is risen.4th, product is not by raw material（The conductive sponge finished product and conductive fabric finished product that existing manufacturer prepares respectively）
Qualitative effects, by naked sponge and naked cloth one-shot forming under same process environments, it is ensured that the stability of product quality.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model
In figure：1st, naked sponge, 2, naked cloth, 3, sponge cloth, 4, the nickel dam or layers of copper of chemical plating or vacuum magnetic-control sputtering plating,
5th, the nickel dam or layers of copper of plating.
Embodiment
Implementation of the present utility model is described below below in conjunction with the accompanying drawings.
As shown in figure 1, a kind of composite conducting sponge includes the nickel dam of sponge cloth 3, chemical plating or vacuum magnetic-control sputtering plating
Or layers of copper 4, the nickel dam of plating or layers of copper 5.
Embodiment one
Three-dimensional porous polyurethane 1 and polyester fiber cloth 2 are adhered into the sponge cloth 3 being integrally formed by the compound mode of glue,
Equipment complex is shifted using glue, environment-friendlyadhesive adhesive is adhered to or is sprayed on the base material of three-dimensional porous polyurethane 1 or polyester fiber cloth 2
On, compound walking speed is set as 10m/min, and spraying glue point number is set as 400 points/cm2, three-dimensional porous polyurethane 1 and polyester is fine
Tie up the compound sponge cloth 3 being integrally formed of cloth 2.
Using chemical plating on sponge cloth 3 plating nickel dam or layers of copper 4, i.e., the compound good matrix of sponge cloth 3 is placed in into pH is
8.6th, temperature is that chemical nickel plating or copper metal are carried out in 44 DEG C of chemical solution, and matrix walking speed is less than 1.35m/min, after chemical plating
Matrix surface resistance reach 100 Ω.
The sponge cloth that nickel dam or layers of copper 4 are plated with by chemical plating is put into electroplating bath, it is straight with 0.3m/min walking speed
Connect electroless nickel layer or layers of copper 5.Matrix after plating is washed through rinsing bowl, then in 140 DEG C of drying in oven, obtains surface electricity
Composite conducting sponge of the resistance less than 0.1 Ω.
Embodiment two
PE1 and non-woven fabrics 2 are pasted into compound mode by fire and adhere to the sponge cloth 3 being integrally formed, i.e., it is compound using flame
Equipment, heated baking is carried out to PE1 surfaces, be set as 3m to sponge softening or slight burning, quantity combusted3/ min, compound walking speed
It is set as 45m/min, the adhesive property having in itself using PE sponges 1 makes it Nian Jie with non-woven fabrics 2 for overall sponge cloth 3.
Using vacuum magnetic-control sputtering on sponge cloth 3 plating nickel dam or layers of copper 4, i.e., the compound good matrix of sponge cloth 3 is put
In in magnetron vacuum filming equipment, nickel or copper metal powder are sputtered on the matrix of sponge cloth 3 with nickel target or copper target sputtering principle,
The pre- conduction of sponge cloth 3 is realized, wherein target cavity temperature is set as 80 DEG C, and matrix walking speed is set as 6 m/min, aeration quantity setting
For 180sccm, pressure set 0.4Pa, the electric current of regulation sputtering needs, speed, vacuum when control sputters, mistake to be sputtered
After journey terminates, composite sponge is taken out, and verifies sheet resistance, obtains the conductive layer that resistance value is less than 100 Ω.
The sponge cloth that nickel dam or layers of copper 4 are plated with by vacuum magnetic-control sputtering is put into electroplating bath, with 0.5 m/min's
Walking speed elder generation copper electroplating layer re-plating nickel dam 5.Matrix after plating is washed through rinsing bowl, then in 160 DEG C of drying in oven, obtained
It is less than 0.1 Ω composite conducting sponge to sheet resistance.
Detected using surface impedance detection method and vertical resistivity detection method, after testing, composite guide of the present utility model
Electric sponge and the conductive sponge various performance parameters contrast of same specification on the market are as shown in the table.
The power for being only preferred embodiment of the present utility model, the utility model can not being limited with this certainly recorded above
Sharp scope, therefore the equivalent variations made according to the utility model claims, still belong to the scope that the utility model is covered.
Claims (6)
- A kind of 1. composite conducting sponge, it is characterised in that including naked sponge and naked cloth, naked sponge and naked cloth by glue it is compound or Fire pastes compound mode and adheres to the sponge cloth being integrally formed, and nickel is plated with sponge cloth using chemical plating or vacuum magnetic-control sputtering Layer or layers of copper, are being plated with the sponge cloth matrix surface Direct Electroplating nickel dam of nickel dam or layers of copper or first copper electroplating layer re-plating nickel Layer, through washing, drying, obtain the Ω of sheet resistance≤0.1 composite conducting sponge.
- 2. composite conducting sponge as claimed in claim 1, it is characterised in that the naked sponge be three-dimensional porous polyurethane or PE, the naked cloth are polyester fiber cloth or non-woven fabrics.
- 3. composite conducting sponge as claimed in claim 1 or 2, it is characterised in that the compound glue is compound using glue transfer Equipment, environment-friendlyadhesive adhesive is adhered to or is sprayed on naked cloth or naked sponge substrate, by naked cloth or the compound sponge being integrally formed of naked sponge Cloth.
- 4. composite conducting sponge as claimed in claim 3, it is characterised in that the compound fire patch is set using flame is compound It is standby, heated baking is carried out to naked sponge surface, to sponge softening or slight burning, the bonding having in itself using polyurethane sponge Performance makes it Nian Jie with naked cloth for overall sponge cloth.
- 5. composite conducting sponge as claimed in claim 3, it is characterised in that the chemical plating nickel dam or layers of copper, being will be multiple The sponge cloth matrix got togather, which is placed in chemical solution, carries out chemical nickel plating or copper metal.
- 6. composite conducting sponge as claimed in claim 3, it is characterised in that the vacuum magnetic-control sputtering nickel dam or layers of copper, be Compound good sponge cloth matrix is placed in magnetron vacuum filming equipment, principle is sputtered by nickel or copper metal powder with nickel target or copper target End is sputtered on sponge cloth matrix, realizes the pre- conduction of sponge cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720473719.6U CN206781161U (en) | 2017-05-02 | 2017-05-02 | A kind of composite conducting sponge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720473719.6U CN206781161U (en) | 2017-05-02 | 2017-05-02 | A kind of composite conducting sponge |
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| Publication Number | Publication Date |
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| CN206781161U true CN206781161U (en) | 2017-12-22 |
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| CN201720473719.6U Active CN206781161U (en) | 2017-05-02 | 2017-05-02 | A kind of composite conducting sponge |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108531860A (en) * | 2018-03-30 | 2018-09-14 | 深圳市飞荣达科技股份有限公司 | Conductive fabric and preparation method thereof |
| CN109181566A (en) * | 2018-09-03 | 2019-01-11 | 惠州市美信电子有限公司 | A kind of conductie buffer adhesive tape and preparation method thereof |
| CN109440157A (en) * | 2018-12-05 | 2019-03-08 | 常德力元新材料有限责任公司 | A kind of preparation method of brown conductive sponge |
-
2017
- 2017-05-02 CN CN201720473719.6U patent/CN206781161U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108531860A (en) * | 2018-03-30 | 2018-09-14 | 深圳市飞荣达科技股份有限公司 | Conductive fabric and preparation method thereof |
| CN109181566A (en) * | 2018-09-03 | 2019-01-11 | 惠州市美信电子有限公司 | A kind of conductie buffer adhesive tape and preparation method thereof |
| CN109440157A (en) * | 2018-12-05 | 2019-03-08 | 常德力元新材料有限责任公司 | A kind of preparation method of brown conductive sponge |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A composite conductive sponge Effective date of registration: 20210628 Granted publication date: 20171222 Pledgee: Yiyang branch of China Everbright Bank Co.,Ltd. Pledgor: YIYANG FOAMMETAL NEW MATERIAL Co.,Ltd. Registration number: Y2021980005351 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220811 Granted publication date: 20171222 Pledgee: Yiyang branch of China Everbright Bank Co.,Ltd. Pledgor: YIYANG FOAMMETAL NEW MATERIAL CO.,LTD. Registration number: Y2021980005351 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |