CN109181566A - A kind of conductie buffer adhesive tape and preparation method thereof - Google Patents
A kind of conductie buffer adhesive tape and preparation method thereof Download PDFInfo
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- CN109181566A CN109181566A CN201811028839.0A CN201811028839A CN109181566A CN 109181566 A CN109181566 A CN 109181566A CN 201811028839 A CN201811028839 A CN 201811028839A CN 109181566 A CN109181566 A CN 109181566A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
Abstract
The present invention relates to a kind of conductie buffer adhesive tapes and preparation method thereof, belong to tape technology field.Conductie buffer adhesive tape includes cushioned material layer, layers of two-sided and separated type material layer；Layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer；Cushioned material layer includes substrate and the coated metal for being plated on substrate surface.The surface of separated type material layer is disposed with the second adhesive layer, shielded layer, the first adhesive layer and cushioned material layer from bottom to top.The conductie buffer adhesive tape is thin soft and is provided simultaneously with excellent conductie buffer performance, advantageously ensures that the conduction between part and part, buffering and fixation and saves space.Preparation method includes: that the second adhesive layer of layers of two-sided is fitted in the surface of separated type material layer, and cushioned material layer is fitted in a side surface of the separate shielded layer of the first adhesive layer of layers of two-sided, receives parent roll.This method is simple, easy to operate, and technique is controllable, and cost is relatively low.
Description
Technical field
The present invention relates to tape technology fields, and in particular to a kind of conductie buffer adhesive tape and preparation method thereof.
Background technique
With the rapid development of electronic industry, each class of electronic devices and its components are badly in need of the conductie buffer material haveing excellent performance
It is connected between each component inside material, electronic equipment and its components and also becomes increasingly complex, and space is then smaller and smaller.
Existing shielding tape, thickness just have preferable cushion performance at 300 microns or more；When thickness is micro- less than 300
Within rice, buffering effect is poor.
Summary of the invention
One of the objects of the present invention is to provide a kind of conductie buffer adhesive tapes, and the conductie buffer adhesive tape is thin soft and is provided simultaneously with
Excellent conductie buffer performance advantageously ensures that the conduction between part and part, buffering and fixation and saves space.
The second object of the present invention is to provide a kind of preparation method of above-mentioned conductie buffer adhesive tape, and this method is simple, easily
Operation, technique is controllable, and cost is relatively low.
The present invention solves its technical problem and adopts the following technical solutions to realize:
The present invention proposes a kind of conductie buffer adhesive tape comprising cushioned material layer, layers of two-sided and separated type material layer；It is two-sided
Glue-line includes the first adhesive layer, shielded layer and the second adhesive layer；Cushioned material layer is by substrate and the coating gold for being plated on substrate surface
Belong to and constituting.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
The present invention also proposes a kind of preparation method of above-mentioned conductie buffer adhesive tape, comprising the following steps: the following steps are included:
Cushioned material layer is fitted in the first of layers of two-sided by the surface that the second adhesive layer of layers of two-sided is fitted in separated type material layer
Parent roll is received in one side surface of the separate shielded layer of adhesive layer.
The beneficial effect for the conductie buffer adhesive tape and preparation method thereof that present pre-ferred embodiments provide includes:
The conductie buffer adhesive tape that present pre-ferred embodiments provide is thin soft and is provided simultaneously with excellent conductie buffer performance, has
Conducive to the conduction, buffering and the fixation that guarantee between part and part and save space.Preparation method is simple, easy to operate, technique
Controllably, cost is relatively low.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described.
Fig. 1 is the structural schematic diagram of conductie buffer adhesive tape in embodiment 1；
Fig. 2 in embodiment 10 substrate punching according to drawing schematic diagram；
Fig. 3 is the contact resistance of adhesive tape to be measured in test example and the result figure of rebound stress.
Icon: 10- conductie buffer adhesive tape；1- cushioned material layer；The first adhesive layer of 2-；3- shielded layer；The second adhesive layer of 4-；
5- separated type material layer.
Specific embodiment
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be in the embodiment of the present invention
Technical solution be clearly and completely described.The person that is not specified actual conditions in embodiment, according to normal conditions or manufacturer builds
The condition of view carries out.Reagents or instruments used without specified manufacturer is the conventional production that can be obtained by commercially available purchase
Product.
Conductie buffer adhesive tape of the embodiment of the present invention and preparation method thereof is specifically described below.
Conductie buffer adhesive tape provided in an embodiment of the present invention includes cushioned material layer, layers of two-sided and separated type material layer.
Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.
Cushioned material layer is made of substrate with the coated metal for being plated on substrate surface.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
The coated metal of the side surface namely cushioned material layer that are set to the separate shielded layer of the first adhesive layer is connected to the first bonding
One side surface of the separate shielded layer of layer.
By a side surface of the separate shielded layer in the first adhesive layer, cushioned material layer is set, can tape thickness compared with
Also it can make adhesive tape that there is good cushion performance in the case where thin, and the above-mentioned setting position of cushioned material layer can also make simultaneously
Adhesive tape has good conductive property.
In some embodiments, the thickness of cushioned material layer can be 0.1-0.25mm, such as 0.1mm, 0.15mm,
0.2mm or 0.25mm.
In some embodiments, the overall thickness of conductie buffer adhesive tape can be 0.15-0.3mm, such as 0.15mm,
0.2mm, 0.25mm or 0.3mm.
In some specific embodiment modes, the overall thickness of conductie buffer adhesive tape can be 0.15mm, wherein fender
The thickness of the bed of material can be 0.1mm；The overall thickness for being also possible to conductie buffer adhesive tape is 0.2mm, wherein the thickness of cushioned material layer
Degree is 0.1mm or 0.15mm；Be also possible to conductie buffer adhesive tape overall thickness be 0.25mm, wherein cushioned material layer with a thickness of
0.1mm or 0.15mm or 0.2mm；The overall thickness for being also possible to conductie buffer adhesive tape is 0.3mm, wherein the thickness of cushioned material layer
For 0.1mm or 0.15mm or 0.2mm or 0.25mm.
Preferably, the substrate of cushioned material layer may include silica gel foam films class buffering substrate, PE foam films in the application
Class buffers any one in substrate and PET reinforcement PU foam films class buffering substrate, by using above-mentioned padded coaming as buffering
The material of material layer can be in cushioned material layer thickness less than 300 μm (0.3mm) in conjunction with the setting position of cushioned material layer
Under the conditions of make it have good cushion performance, while can ensure its thickness be greater than 300 μm under conditions of conductie buffer glue
Band has good conductive property.
Preferably, coated metal may include such as nickel, copper, gold and silver plating metal in the application, for example, may include nickel,
At least one of copper, Jin Heyin, or the alloy including above-mentioned a variety of plating metals.
By plating above-mentioned coated metal in substrate surface, the surface nature of substrate can be changed, improve the conduction of substrate
Property, and it is avoided that substrate is worn.
Preferably, the first adhesive layer and the second adhesive layer can be by solvent type acrylic class adhesives (third in the application
Olefin(e) acid ester adhesive) it solidifies, the adhesive curing rate is very fast, and bonding force and binding force are relatively strong.Pass through the first bonding
Layer can effectively be realized bonding between cushioned material layer and shielded layer, improve the firmness of cushioned material layer.In addition, first
Adhesive layer and the second adhesive layer can also provide certain supporting role for conductie buffer adhesive tape.
Preferably, the shielding material of shielded layer may include copper foil, aluminium foil, conductive fabric or conductive non-woven fabrics in the application,
Above-mentioned shielding material is capable of forming electrostatic shielding body, terminates electric field on the metal surface of shield, shields electromagnetic wave or electricity
The interference in magnetic field.
Preferably, the material of separated type material layer can be transparent PET separated type material or release paper in the application.Release material
The bed of material can not have viscosity with specific material after limited contact or with slight viscosity, play isolation strip toughness
Object effect.When using adhesive tape, the layer is removed.
It holds, conductie buffer adhesive tape provided herein can compress under the pressure condition of 2N to 40N, guarantee part
Arrangement between part is close, not easily shifted.When decrement reaches the 40-80% of tape thickness, the power that adhesive tape generates is sufficient
To play supporting function and not damage part by pressure.When decrement reach tape thickness 20% within when, adhesive tape resistance be lower than certain value
(about 0.1 Ω), it is ensured that part direct conduction performance.In addition, conductie buffer adhesive tape provided herein can be kept for a long time
The power and resistance for supporting buffering to have between part and part.
The embodiment of the invention also provides a kind of preparation methods of above-mentioned conductie buffer adhesive tape, such as may include following step
It is rapid: the second adhesive layer of layers of two-sided being fitted in the surface of separated type material layer, cushioned material layer is fitted in into layers of two-sided
Parent roll is received in one side surface of the separate shielded layer of the first adhesive layer.
Wherein, cushioned material layer can be obtained through following steps: it is punched by substrate of the required drawing shape to cushioned material layer,
In the electroplating surface coated metal of substrate.
Feature and performance of the invention are described in further detail with reference to embodiments.
Embodiment 1
The present embodiment provides the conductie buffer adhesive tapes 10 that a kind of overall thickness is 0.15mm, please refer to Fig. 1, the conductie buffer glue
Band 10 includes cushioned material layer 1, layers of two-sided and separated type material layer 5.Wherein, layers of two-sided includes the first adhesive layer 2, shielded layer
3 and second adhesive layer 4.Cushioned material layer 1 with a thickness of 0.1mm, cushioned material layer 1 is by substrate and the coating for being plated on substrate surface
Metal is constituted.
Second adhesive layer 4 is set to a side surface of separated type material layer 5, and shielded layer 3 is set to the separate of the second adhesive layer 4
One side surface of separated type material layer 5, the first adhesive layer 2 are set to the side surface far from the second adhesive layer 4 of shielded layer 3, delay
Rush the side surface that material layer 1 is set to the separate shielded layer 3 of the first adhesive layer 2.
Wherein, the substrate of cushioned material layer 1 is that silica gel foam films class buffers substrate, and coated metal is nickel, the screen of shielded layer 3
Covering material is copper foil, the material of separated type material layer 5 be transparent PET separated type material, the first adhesive layer 2 and the second adhesive layer 4 by
Acrylate adhesive solidifies.
Embodiment 2
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.2mm, which includes fender
The bed of material, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.Buffering
Material layer with a thickness of 0.1mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PE foam films class buffers substrate, and coated metal is copper, the shielding material of shielded layer
Material is copper foil, and the material of separated type material layer is that release paper, the first adhesive layer and the second adhesive layer are solidifying by acrylate adhesive
Admittedly forming.
Embodiment 3
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.2mm, which includes fender
The bed of material, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.Buffering
Material layer with a thickness of 0.15mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PET reinforces PU foam films class buffering substrate, and coated metal is gold, shielded layer
Shielding material be aluminium foil, the material of separated type material layer is release paper, and the first adhesive layer and the second adhesive layer are by acrylate
Adhesive solidifies.
Embodiment 4
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.25mm, which includes fender
The bed of material, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.Buffering
Material layer with a thickness of 0.1mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that silica gel foam films class buffers substrate, and coated metal is bazar metal, shielded layer
Shielding material be conductive fabric, the material of separated type material layer is transparent PET separated type material, and the first adhesive layer and the second adhesive layer are equal
It is solidified by acrylate adhesive.
Embodiment 5
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.25mm, which includes fender
The bed of material, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.Buffering
Material layer with a thickness of 0.15mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PE foam films class buffers substrate, and coated metal is copper-gold alloy, shielded layer
Shielding material is conductive non-woven fabrics, and the material of separated type material layer is release paper, and the first adhesive layer and the second adhesive layer are by propylene
Acid esters adhesive solidifies.
Embodiment 6
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.25mm, which includes fender
The bed of material, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer.Buffering
Material layer with a thickness of 0.2mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PET reinforces PU foam films class buffering substrate, and coated metal is nickel billon,
The shielding material of shielded layer is copper foil, and the material of separated type material layer is release paper, and the first adhesive layer and the second adhesive layer are by third
Olefin(e) acid ester adhesive solidifies.
Embodiment 7
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.3mm, please refer to Fig. 1, the conductie buffer adhesive tape
Including cushioned material layer, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and second
Adhesive layer.Cushioned material layer with a thickness of 0.1mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that silica gel foam films class buffers substrate, and coated metal is Kufil, shielded layer
Shielding material be aluminium foil, the material of separated type material layer be transparent PET separated type material, the first adhesive layer and the second adhesive layer by
Acrylate adhesive solidifies.
Embodiment 8
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.3mm, please refer to Fig. 1, the conductie buffer adhesive tape
Including cushioned material layer, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and second
Adhesive layer.Cushioned material layer with a thickness of 0.15mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PE foam films class buffers substrate, and coated metal is copper electrum, shielded layer
Shielding material be conductive fabric, the material of separated type material layer is transparent PET separated type material, and the first adhesive layer and the second adhesive layer are equal
It is solidified by acrylate adhesive.
Embodiment 9
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.3mm, please refer to Fig. 1, the conductie buffer adhesive tape
Including cushioned material layer, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and second
Adhesive layer.Cushioned material layer with a thickness of 0.2mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that PET reinforces PU foam films class buffering substrate, and coated metal is the conjunction of copper gold and silver
Gold, the shielding material of shielded layer are conductive non-woven fabrics, and the material of separated type material layer is release paper, the first adhesive layer and the second bonding
Layer is solidified by acrylate adhesive.
Embodiment 10
The present embodiment provides the conductie buffer adhesive tapes that a kind of overall thickness is 0.3mm, please refer to Fig. 1, the conductie buffer adhesive tape
Including cushioned material layer, layers of two-sided and separated type material layer.Wherein, layers of two-sided includes the first adhesive layer, shielded layer and second
Adhesive layer.Cushioned material layer with a thickness of 0.25mm, cushioned material layer is by substrate and is plated on the coated metal of substrate surface and constitutes.
Second adhesive layer is set to a side surface of separated type material layer, and shielded layer is set to the separate release of the second adhesive layer
One side surface of material layer, the first adhesive layer are set to the side surface far from the second adhesive layer of shielded layer, cushioned material layer
It is set to a side surface of the separate shielded layer of the first adhesive layer.
Wherein, the substrate of cushioned material layer is that silica gel foam films class buffers substrate, and coated metal is copper electrum, shielding
The shielding material of layer is conductive non-woven fabrics, the material of separated type material layer be release paper, the first adhesive layer and the second adhesive layer by
Acrylate adhesive solidifies.
Embodiment 11
The present embodiment provides a kind of preparation methods of conductie buffer adhesive tape, and conductie buffer adhesive tape is referring in embodiment 1-10
Any conductie buffer adhesive tape.
By required drawing shape to the substrate perforation processing of cushioned material layer, drawing can refer to Fig. 2, in the surface of substrate electricity
Coated coating metal, obtains cushioned material layer.
Cushioned material layer is fitted in double-sided adhesive by the surface that the second adhesive layer of layers of two-sided is fitted in separated type material layer
One side surface of the separate shielded layer of the first adhesive layer of layer receives parent roll, conductie buffer adhesive tape is made.
Test example
It repeats to implement above-described embodiment 1-10, obtains enough conductie buffer adhesive tapes.
By taking the conductie buffer adhesive tape with a thickness of 200 μm of embodiment 2 and embodiment 3 as an example, with commercially available conventional shielding glue
Band is control group, measures each adhesive tape in the electric conductivity of the direction X-Y and Z-direction and anti-when measuring each adhesive tape in different decrements
Stress is played, result is as shown in table 1 and Fig. 3.
Note: the electric conductivity of 200 μm of the application product is the flat of electric conductivity corresponding to embodiment 2 and embodiment 3 in table 1
Mean value.
A curve represents the resistance (R/ Ω) of commercially available conventional shielding tape in Fig. 3, and b curve represents the embodiment of the present application and mentioned
The resistance (R/ Ω) of the conductie buffer adhesive tape of confession, c curve represent the rebound stress (F/N) of commercially available conventional shielding tape, d curve generation
The rebound stress (F/N) of conductie buffer adhesive tape provided by table the embodiment of the present application.
1 measurement result of table
| Thickness (μm) | Electric conductivity X-Y (m Ω) | Electric conductivity Z (m Ω) | |
| Commercial product | 300 | 50 | 42 |
| The application product | 200 | 49 | 38 |
As can be seen from Table 1, the electric conductivity of conductie buffer adhesive tape provided by the embodiment of the present application is good.It can by Fig. 3
To find out, in resistance, contact of the conductie buffer adhesive tape provided by the embodiment of the present application than commercially available conventional shielding tape
Resistance is more stable.In terms of stress, conductie buffer adhesive tape provided by the embodiment of the present application is when decrement is 50%, instead
The rebound stress for playing stress and there was only 2N, but be commercially available conventional shielding tape is 20N, illustrates to apply for conduction provided by embodiment
Buffering adhesive band is more soft than commercially available conventional shielding tape, and cushion performance is stronger.
Hold, conductie buffer adhesive tape provided by the embodiment of the present application can it is thin it is soft have both, and be provided simultaneously with excellent lead
Electric cushion performance can guarantee conduction, buffering and fixation between part and part, moreover it is possible to save space.
In conclusion the conductie buffer adhesive tape that provides of present pre-ferred embodiments is thin soft and to be provided simultaneously with excellent conduction slow
Punching performance advantageously ensures that the conduction between part and part, buffering and fixation and saves space.Preparation method is simple, easily
Operation, technique is controllable, and cost is relatively low.
Embodiments described above is a part of the embodiment of the present invention, instead of all the embodiments.Reality of the invention
The detailed description for applying example is not intended to limit the range of claimed invention, but is merely representative of selected implementation of the invention
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
Claims (10)
1. a kind of conductie buffer adhesive tape, which is characterized in that it includes cushioned material layer, layers of two-sided and separated type material layer；It is described
Layers of two-sided includes the first adhesive layer, shielded layer and the second adhesive layer；The cushioned material layer is by substrate and is plated on the substrate
Surface coated metal constitute；
Second adhesive layer is set to a side surface of the separated type material layer, and the shielded layer is set to second bonding
The side surface far from the separated type material layer of layer, first adhesive layer are set to separate described the second of the shielded layer
One side surface of adhesive layer, the cushioned material layer are set to the side table far from the shielded layer of first adhesive layer
Face.
2. conductie buffer adhesive tape according to claim 1, which is characterized in that the cushioned material layer with a thickness of 0.1-
0.25mm。
3. conductie buffer adhesive tape according to claim 1, which is characterized in that the overall thickness of the conductie buffer adhesive tape is
0.15-0.3mm。
4. conductie buffer adhesive tape according to claim 1, which is characterized in that the substrate of the cushioned material layer includes
Silica gel foam films class buffers any one in substrate, PE foam films class buffering substrate and PET reinforcement PU foam films class buffering substrate
Kind.
5. conductie buffer adhesive tape according to claim 1, which is characterized in that the coated metal includes nickel, copper, Jin Heyin
At least one of.
6. conductie buffer adhesive tape according to claim 1, which is characterized in that first adhesive layer and second bonding
Layer is solidified by solvent type acrylic class adhesive.
7. conductie buffer adhesive tape according to claim 1, which is characterized in that the shielding material of the shielded layer includes copper
Foil, aluminium foil, conductive fabric or conductive non-woven fabrics.
8. conductie buffer adhesive tape according to claim 1, which is characterized in that the material of the separated type material layer is transparent
PET separated type material or release paper.
9. such as the preparation method of the described in any item conductie buffer adhesive tapes of claim 1-8, which is characterized in that including following step
It is rapid: second adhesive layer of the layers of two-sided to be fitted in the surface of the separated type material layer, by the cushioned material layer
The side surface far from the shielded layer for fitting in first adhesive layer of the layers of two-sided, receives parent roll.
10. preparation method according to claim 9, which is characterized in that the cushioned material layer is obtained through following steps: being pressed
Required drawing shape punches the substrate of the cushioned material layer, the coated metal described in the electroplating surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811028839.0A CN109181566A (en) | 2018-09-03 | 2018-09-03 | A kind of conductie buffer adhesive tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811028839.0A CN109181566A (en) | 2018-09-03 | 2018-09-03 | A kind of conductie buffer adhesive tape and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN109181566A true CN109181566A (en) | 2019-01-11 |
Family
ID=64914651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811028839.0A Pending CN109181566A (en) | 2018-09-03 | 2018-09-03 | A kind of conductie buffer adhesive tape and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN109181566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116640522A (en) * | 2023-05-08 | 2023-08-25 | 极天羽技术股份有限公司 | Conductive aluminum foil adhesive tape and preparation method thereof |
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