CN105774132B - A kind of thermal conductivity foam tape - Google Patents
A kind of thermal conductivity foam tape Download PDFInfo
- Publication number
- CN105774132B CN105774132B CN201610245197.4A CN201610245197A CN105774132B CN 105774132 B CN105774132 B CN 105774132B CN 201610245197 A CN201610245197 A CN 201610245197A CN 105774132 B CN105774132 B CN 105774132B
- Authority
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- China
- Prior art keywords
- thermal conductivity
- ink
- foam
- sucking hole
- line
- Prior art date
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- 239000006260 foam Substances 0.000 title claims abstract description 64
- 239000011888 foil Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000005030 aluminium foil Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002390 adhesive tape Substances 0.000 description 21
- 238000005520 cutting process Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920000742 Cotton Polymers 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012458 free base Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Laminated Bodies (AREA)
Abstract
A kind of thermal conductivity foam tape; it is mainly used in electronic unit heat-conducting buffer and electrostatic protection; it includes metallic foil substrates; the upper and lower surface of the metallic foil substrates is respectively equipped with the first thermal conductivity glue-line and the second thermal conductivity glue-line; the first thermal conductivity film surface pastes one layer of foam; the second thermal conductivity film surface pastes one layer of mould release membrance; the first ink-sucking hole is offered on the foam; described one layer of thermal conductivity ink of foam surface attachment, the thermal conductivity ink penetrates into the first ink-sucking hole and contacted with the first thermal conductivity glue-line.The thermal conductivity foam tape simple production process, can arbitrarily be cut according to actual needs.
Description
Technical field
The present invention relates to a kind of thermal conductivity foam tape, it is mainly used in electronic unit heat-conducting buffer and electrostatic protection.
Background technology
In electronic product, such as TV, LCD displays, LCD TV, mobile phone, notebook, MP3, communication cabinet and doctor
Instrument etc. is treated, patch last layer conducting foam on some electronic units inside it is generally required, so as to play conductive, antistatic
With the effect of buffering antidetonation, this kind of conducting foam is needed with good flexibility, relatively low impedance and good heat conductivility.
Traditional conducting foam adhesive tape is the whole coated with conductive heat-conducting layer on the surface of foam（In bubble for example by way of Vacuum Deposition
The coat of metal or the graphite linings such as cotton surface plated with nickel）, Chinese patent 201520681192.7 discloses a kind of conducting foam, should
Conducting foam uses the structure in one layer of electrically conductive graphite layer of Surface coating of foam body, although it can play conductive, anti-quiet
The effect of electricity and buffering antidetonation, but production technology is relative complex, it is even more important that adhesive tape is accomplished by determining it before manufacture
Specific width, adhesive tape finished product can not be cut again as needed, and concrete reason is：First, the adhesive tape finished product is directly in bubble
Cotton Surface coating graphite linings, because foam has high-compressibility, during cutting, foam, which significantly compresses, easily there is graphite linings cracking very
To situation about peeling off, secondly, even if smoothly completing cutting, its conductive and heat conduction effect of the adhesive tape after cutting is also greatly reduced very
To forfeiture（If the adhesive tape is cut into two parts by width, the adhesive tape obtained after cutting can only utilize unilateral graphite
Layer carries out conductive and heat conduction, and the conduction and heat conduction effect of adhesive tape are greatly reduced, if the adhesive tape is cut into three by width
Point, then the adhesive tape of center section is due to being spaced one layer of heat-insulated foam between its upper strata graphite linings and lower floor's graphite linings, therefore in this
Between the adhesive tape of part will not possess conductive and heat conduction effect）.
The content of the invention
The technical problem to be solved in the present invention is：A kind of simple production process is provided, can arbitrarily be entered according to actual needs
The thermal conductivity foam tape of row cutting.
In order to solve the above-mentioned technical problem, the present invention is adopted the following technical scheme that：A kind of thermal conductivity foam tape, including
Metallic foil substrates, the upper and lower surface of the metallic foil substrates is respectively equipped with the first thermal conductivity glue-line and the second thermal conductivity glue
Layer, the first thermal conductivity film surface pastes one layer of foam, and the second thermal conductivity film surface pastes a leafing type
The first ink-sucking hole, described one layer of thermal conductivity ink of foam surface attachment, the thermal conductivity oil are offered on film, the foam
Ink penetrates into the first ink-sucking hole and contacted with the first thermal conductivity glue-line.
Further, the second ink-sucking hole communicated with the first ink-sucking hole is offered on the first thermal conductivity glue-line, it is described
Thermal conductivity ink penetrates into the second ink-sucking hole and contacted with metallic foil substrates.
Further, the 3rd ink-sucking hole communicated with the second ink-sucking hole is offered on the metallic foil substrates, the heat conduction is led
Electric ink penetrates into the 3rd ink-sucking hole and contacted with the second thermal conductivity glue-line.
Wherein, first ink-sucking hole, the second ink-sucking hole and the 3rd ink-sucking hole pass through die punching/high-voltage electric shock perforate one
Secondary property is processed.
Wherein, the thermal conductivity ink silk screen printing/be coated on foam surface, the foam by 0.5mm polyethylene/poly- ammonia
Ester/melamine foam is formed in the solid rear thermocompression forming of thermal conductivity ink to 0.1-0.3mm.
It is preferred that, the first thermal conductivity glue-line and the second thermal conductivity glue-line are by third added with thermal conductivity powder
Olefin(e) acid pressure sensitive adhesive is made.
It is preferred that, the thermal conductivity powder includes nickel, gold, powdered graphite.
Wherein, the metallic foil substrates are copper foil or aluminium foil.
Wherein, the temperature of the thermocompression forming is more than 120 degrees Celsius.
The beneficial effect that the present invention is obtained is：It is thermal conductivity foam tape collection heat conduction that the present invention is provided, conductive and slow
The functions such as shake are eaten up part of in one, in the present invention, thermal conductivity ink can make it be attached to bubble by way of silk-screen/coating
Cotton surface, offers the first ink-sucking hole because foam surface is intensive, and thermal conductivity ink penetrates into the first ink-sucking hole and with the
One thermal conductivity glue-line is contacted, therefore adhesive tape finished product can carry out the cutting of any specification as needed, be led in the absence of because of cutting
The situation for causing adhesive tape conduction and heat conduction effect to be greatly reduced or lose, simultaneously as metallic foil substrates are added in the present invention,
While ensureing that adhesive tape is easier cutting, its heat conduction and electric conductivity are improved.
Brief description of the drawings
Fig. 1 is the overall structure diagram of embodiments of the invention；
Fig. 2 is the structural representation of metallic foil substrates in embodiment illustrated in fig. 1；
Fig. 3 is the structural representation of the first thermal conductivity glue-line in embodiment illustrated in fig. 1；
Fig. 4 is the structural representation of foam in embodiment illustrated in fig. 1；
Reference is：
1 --- metallic foil substrates 2 --- first thermal conductivity glue-line
3 --- the first thermal conductivity glue-line 4 --- foam 5 --- mould release membrances
6 --- thermal conductivity ink 1a --- the 3rd ink-sucking hole 2a --- second ink-sucking holes
4a --- the first ink-sucking hole.
Embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further with reference to embodiment and accompanying drawing
It is bright, the content that embodiment is referred to not limitation of the invention.
It is term " on ", " under ", "front", "rear", "left", "right", " perpendicular it is emphasized that in the description of the invention
Directly ", the orientation or position relationship of the instruction such as " level ", " top ", " bottom ", " interior ", " outer " are based on orientation shown in the drawings or position
Relation is put, the description present invention is for only for ease of and simplifies description, rather than indicate or imply that the device or element of meaning are necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.In the description of the invention, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
As Figure 1-4, a kind of thermal conductivity foam tape, including metallic foil substrates 1, the upper and lower table of metallic foil substrates 1
Face is respectively equipped with the first thermal conductivity glue-line 2 and the second thermal conductivity glue-line 3, and the surface of the first thermal conductivity glue-line 2 pastes one layer
Foam 4, the surface of the second thermal conductivity glue-line 3, which is pasted, offers the first ink-sucking hole 4a, foam surface on one layer of mould release membrance 5, foam 4
Adhere to one layer of thermal conductivity ink 6, thermal conductivity ink 6 penetrates into the first ink-sucking hole 4a and connect with the first thermal conductivity glue-line 2
Touch.
The thermal conductivity foam tape that above-described embodiment is provided integrates the functions such as heat conduction, conductive and bumper and absorbing shock,
In above-described embodiment, thermal conductivity ink 6 can be by way of silk-screen/coating（It will be appreciated by those skilled in the art that, it is above-mentioned
Thermal conductivity ink 6 by other mode of printings using in addition to silk-screen/coating except by it can also being attached to the surface of foam 4）Make it
The surface of foam 4 is attached to, the first ink-sucking hole 4a is offered because the surface of foam 4 is intensive, and thermal conductivity ink 6 penetrates into first and inhaled
Contacted in ink hole 4a and with the first thermal conductivity glue-line 2, therefore the adhesive tape finished product finally given can be carried out arbitrarily as needed
Specification（It should be noted that the cutting described in the present invention refers to carrying out the width of adhesive tape the cutting of all size）Point
Cut, in the absence of because of the situation that cutting causes adhesive tape conductive and heat conduction effect is greatly reduced or lost, simultaneously as above-described embodiment
Add metallic foil substrates 1 in the thermal conductivity foam tape of offer, the additions of metallic foil substrates 1 is ensureing that adhesive tape is easier point
While cutting, its heat conduction and electric conductivity are also improved.
In the above-described embodiments, further, it can also be opened up on the first thermal conductivity glue-line 2 and the first ink-sucking hole 4a phases
The second logical ink-sucking hole 2a, thermal conductivity ink 6 penetrates into the second ink-sucking hole 2a and contacted with metallic foil substrates 1 simultaneously.It is above-mentioned
Structure can make it that the thermal conductivity ink 6 on the surface of foam 4 and the connection of adhesive tape other components are closer, in cutting not
It is easily peelable, come off, while the thermal conductivity that adhesive tape can also be allowed overall is more excellent.
In addition, in the above-described embodiments, communicated with the second ink-sucking hole 2a can also be offered on metallic foil substrates 1
Three ink-sucking hole 1a, thermal conductivity ink 6 penetrates into the 3rd ink-sucking hole 1a and contacted with the second thermal conductivity glue-line 3.Open up the 3rd
Ink-sucking hole 1a starting point is similar with the second ink-sucking hole 2a, will not be repeated here.
Wherein, in above-described embodiment the first ink-sucking hole 4a, the second ink-sucking hole 2a and the 3rd ink-sucking hole 1a is beaten by mould
Hole/high-voltage electric shock perforate is disposably processed.For example, first metallic foil substrates 1, the first thermal conductivity glue-line 2 and foam 4 are answered
It is combined together, above-mentioned first ink-sucking hole 4a, is then disposably processed by way of mold cavity or high-voltage electric shock perforate
Two ink-sucking hole 2a and the 3rd ink-sucking hole 1a, the first ink-sucking hole 4a, the second ink-sucking hole 2a and the 3rd are obtained using above-mentioned processing mode
Ink-sucking hole 1a concentricitys are high, and more conducively thermal conductivity ink 6 penetrates into, while above-mentioned processing mode technique is simple and convenient to operate, plus
Work cost is relatively low.
As preferred scheme, the silk-screen of thermal conductivity ink 6/the be coated on surface of foam 4, foam 4 by 0.5mm poly- second
Alkene/polyurethane/melamine foam is formed in the solid rear thermocompression forming of thermal conductivity ink 6 to 0.1-0.3mm.In thermal conductivity
Thermal conductivity ink 6 can be improved in the first ink-sucking hole 4a, the second blotting by carrying out thermocompression forming to foam 4 again after ink 6 is solid
Compactedness in hole 2a and the 3rd ink-sucking hole 1a, so as to possess excellent while ensureing that adhesive tape has comfort cushioning damping performance
Thermal conductivity.
Wherein, the first thermal conductivity glue-line 2 and the second thermal conductivity glue-line 3 are by the acrylic acid added with thermal conductivity powder
Pressure sensitive adhesive is made, and above-mentioned thermal conductivity powder preferably includes nickel, gold, powdered graphite, and metallic foil substrates 1 are preferably copper foil or aluminium
Paper tinsel, finally, the above-mentioned temperature to the thermocompression forming of foam 4 is preferably more than 120 degrees Celsius.Temperature to the thermocompression forming of foam 4 exists
More than 120 degrees Celsius primarily for following 2 points considerations：First, thermocompression forming can be shortened using more than 120 degrees Celsius of high temperature
Time；2nd, under 120 degrees Celsius of hot conditions, the mobility of thermal conductivity ink 6 can strengthen（Although ink is in normal temperature
Under have been cured, but under the high temperature conditions its start softening, mobility increase）, it is more beneficial for raising thermal conductivity ink 6 and exists
Compactedness in first ink-sucking hole 4a, the second ink-sucking hole 2a and the 3rd ink-sucking hole 1a.It should be noted that in the present invention, gold
The thermocompression forming effect of foam 4 has been effectively ensured in the addition of category paper tinsel base material 1, if metal-foil-free base material 1 makees end liner, the heat of foam 4
Pressure shaping process will need the thickness after longer shaping time and sizing also to become to be difficult to control to, the fraction defective of final products
It will rise.
Above-described embodiment is the present invention preferably implementation, and in addition, the present invention can be realized with other manner,
Any obvious replacement is within protection scope of the present invention on the premise of not departing from the technical program design.
In order to allow those of ordinary skill in the art more easily to understand improvements of the present invention relative to prior art, this
Some accompanying drawings of invention and description have been simplified, and for the sake of clarity, present specification is omitted some other members
Element, those of ordinary skill in the art should be aware that these elements omitted also may make up present disclosure.
Claims (9)
1. a kind of thermal conductivity foam tape, including metallic foil substrates（1）, the metallic foil substrates（1）Upper and lower surface difference
Provided with the first thermal conductivity glue-line（2）With the second thermal conductivity glue-line（3）, the first thermal conductivity glue-line（2）Surface is pasted
One layer of foam（4）, the second thermal conductivity glue-line（3）Surface pastes one layer of mould release membrance（5）, the foam（4）On offer
First ink-sucking hole（4a）, described one layer of thermal conductivity ink of foam surface attachment（6）, the thermal conductivity ink（6）Penetrate into the
One ink-sucking hole（4a）In and with the first thermal conductivity glue-line（2）Contact.
2. thermal conductivity foam tape according to claim 1, it is characterised in that：The first thermal conductivity glue-line（2）
On offer and the first ink-sucking hole（4a）The second ink-sucking hole communicated（2a）, the thermal conductivity ink（6）Penetrate into the second blotting
Hole（2a）In and and metallic foil substrates（1）Contact.
3. thermal conductivity foam tape according to claim 2, it is characterised in that：The metallic foil substrates（1）On open up
Have and the second ink-sucking hole（2a）The 3rd ink-sucking hole communicated（1a）, the thermal conductivity ink（6）Penetrate into the 3rd ink-sucking hole（1a）
In and with the second thermal conductivity glue-line（3）Contact.
4. thermal conductivity foam tape according to claim 3, it is characterised in that：First ink-sucking hole（4a）, second
Ink-sucking hole（2a）With the 3rd ink-sucking hole（1a）Disposably processed by die punching/high-voltage electric shock perforate.
5. the thermal conductivity foam tape according to any one in claim 1-4, it is characterised in that：The thermal conductivity
Ink（6）Silk-screen/be coated on foam（4）Surface, the foam（4）By 0.5mm polyethylene/polyurethane/melamine foam
In thermal conductivity ink（6）Solid rear thermocompression forming is formed to 0.1-0.3mm.
6. thermal conductivity foam tape according to claim 5, it is characterised in that：The first thermal conductivity glue-line（2）
With the second thermal conductivity glue-line（3）It is made up of the acrylate pressure sensitive adhesive added with thermal conductivity powder.
7. thermal conductivity foam tape according to claim 6, it is characterised in that：The thermal conductivity powder include nickel,
Gold, powdered graphite.
8. thermal conductivity foam tape according to claim 6, it is characterised in that：The metallic foil substrates（1）For copper foil
Or aluminium foil.
9. thermal conductivity foam tape according to claim 5, it is characterised in that：The temperature of the thermocompression forming is 120
More than degree Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245197.4A CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245197.4A CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105774132A CN105774132A (en) | 2016-07-20 |
| CN105774132B true CN105774132B (en) | 2017-07-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610245197.4A Active CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
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| Country | Link |
|---|---|
| CN (1) | CN105774132B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273790A (en) * | 2016-08-12 | 2017-01-04 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, heat conduction, antidetonation, the preparation method of shielding tape |
| JP7012207B2 (en) * | 2017-01-31 | 2022-01-28 | パナソニックＩｐマネジメント株式会社 | Graphite composite film and its manufacturing method |
| CN107033802A (en) * | 2017-05-12 | 2017-08-11 | 东华大学 | A kind of polyimides elastic heat conducting adhesive tape easily torn off |
| CN108650872B (en) * | 2018-05-15 | 2019-09-17 | 苏州盛达飞智能科技股份有限公司 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
| CN108471702B (en) * | 2018-05-15 | 2021-01-01 | 苏州盛达飞智能科技股份有限公司 | Heat-conducting and electric-conducting foam adhesive tape and manufacturing method thereof |
| CN108546524A (en) * | 2018-07-26 | 2018-09-18 | 东莞捷邦实业有限公司 | The anti-tampering copper foil foam component of electronic circuit board static conductive |
| CN109273145B (en) * | 2018-11-06 | 2023-09-22 | 美信新材料股份有限公司 | Coated conductive foam and preparation method thereof |
| CN109353083A (en) * | 2018-11-22 | 2019-02-19 | 深圳市宏能胶粘制品有限公司 | A kind of compound foam tape of novel heat-conducting conduction shading |
| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
| CN112226173B (en) * | 2020-10-16 | 2022-06-17 | 苏州盛达飞智能科技股份有限公司 | Conductive foam double-sided adhesive tape |
| CN112194993B (en) * | 2020-10-16 | 2022-09-13 | 苏州盛达飞智能科技股份有限公司 | Conductive foam adhesive tape with good thermal conductivity |
| CN113747749B (en) * | 2021-07-29 | 2024-07-05 | 苏州锟荣精密电子有限公司 | Manufacturing process of heat dissipation foam |
| CN114379100A (en) * | 2021-12-20 | 2022-04-22 | 隆扬电子(昆山)股份有限公司 | Integrated forming process for aluminum foil local back foam |
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| US6217983B1 (en) * | 1998-03-25 | 2001-04-17 | Mcdonnell Douglas Helicopter Company | R-foam and method of manufacturing same |
| JP2002283481A (en) * | 2001-03-27 | 2002-10-03 | Showa Denko Packaging Co Ltd | Laminate and cover material constituted of laminate |
| CN203373308U (en) * | 2013-06-20 | 2014-01-01 | 苏州斯迪克新材料科技股份有限公司 | Stretch-resisting foam double sided tape |
| CN204131820U (en) * | 2014-04-14 | 2015-01-28 | 深圳科诺桥科技有限公司 | Electromagnetic shielding film and comprise the flexible circuit board of this electromagnetic shielding film |
| CN205601285U (en) * | 2016-04-20 | 2016-09-28 | 衡山县佳诚新材料有限公司 | Electrically conductive bubble celloidin area of heat conduction |
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