CN205751550U - A kind of all-directional conductive sponge - Google Patents

A kind of all-directional conductive sponge Download PDF

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Publication number
CN205751550U
CN205751550U CN201620516949.1U CN201620516949U CN205751550U CN 205751550 U CN205751550 U CN 205751550U CN 201620516949 U CN201620516949 U CN 201620516949U CN 205751550 U CN205751550 U CN 205751550U
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matrix
plating
conductive sponge
plating layer
layer
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CN201620516949.1U
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吴中和
吴庆锋
余欢喜
李�权
吴曙东
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HUNAN AN-HOME SCIENCE TECHNOLOGY Co Ltd
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HUNAN AN-HOME SCIENCE TECHNOLOGY Co Ltd
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Abstract

The utility model discloses a kind of all-directional conductive sponge, including matrix, conduction latex, pre-plating layer and electrodeposited coating, described matrix is three-dimensional porous polyurethane or PE, matrix by infiltrating one layer of conduction latex on top layer after pretreatment, pre-plating layer, pre-plating layer top layer is had to be electroplate with nickel dam or copper nickel dam through secondary chemical coating.The coating thickness of this utility model all-directional conductive sponge is uniform, sheet resistance is little, volume resistance is evenly distributed, and has good permanent electric conductivity and chemical stability can be widely applied to conductive sponge and conductive foam.

Description

A kind of all-directional conductive sponge
Technical field
This utility model belongs to conductive material field, is specifically related to a kind of all-directional conductive sponge.
Background technology
Conductive sponge is a kind of tridimensional network functional material integrating conduction and electro-magnetic screen function, due to it The conductive effective phase is long, and effectiveness is good, and sheet resistance value can be widely used in conduction by features such as practical use settings Material Field.At present, the preparation methoies such as chemical plating, Vacuum Deposition, ion sputtering, vapour deposition, painting conducting resinl method are used to produce Conductive sponge also exists that coating easily comes off, plating property is poor, uneven coating is even causes that sheet resistance is unstable, fire-proof and damp-proof The defects such as difference, the easy dry linting of embrittlement, resilience is poor, service life is not long, it is difficult to adapt to the modern electronic product requirement to quality.At electricity It is current that sub-technology develops rapidly, and the saturating property of a kind of plating is good, coating difficult drop-off, and can meet ultra-thin electromagnetic shielding material requirement Become the necessity of conductive sponge development.
Utility model content
This utility model is for the problems referred to above, it is provided that a kind of all-directional conductive sponge.
This utility model realizes by the following technical solutions:
A kind of all-directional conductive sponge, including matrix, conduction latex, pre-plating layer and electrodeposited coating, it is characterised in that described base Body is three-dimensional porous polyurethane or PE, and matrix by infiltrating one layer of conduction latex on top layer after pretreatment, through secondary chemical plating plating Being covered with pre-plating layer, pre-plating layer top layer is electroplate with nickel dam or copper nickel dam.
Further, described pre-plating layer includes the first chemical pre-plating layer and the second chemical pre-plating layer, and pre-plating layer is used Pre-plating solution is nickel preplating liquid, and secondary pre-plating solution is nickel preplating liquid.
Further, described nickel preplating liquid is by nickel sulfate 18g/l, sodium hypophosphite 32g/l, sodium citrate 15g/l, ammonium chloride 30g/l is formulated.
Further, described conduction latex be solid content be the bi-component electrically conductive type electrophoretic latexes of 10 ± 2%, component includes The isocyanates that high hydroxyl value anionic acrylic resin and methyl ethyl ketoxime are closed, this latex is electrically conductive under wet film state, Deblocking solidification when 130-180 DEG C.By under hot setting so that foam base plate have with institute metal cladding excellence bonding by force Degree, reduces the dry linting rate of sponge, extends its service life.
Further, described conduction latex is conducting solution, or is the mixture of conducting solution and conductive black.
Above-mentioned all-directional conductive sponge is prepared from as follows:
(1) matrix is put in ethanol solution, at a temperature of 45 ± 5 DEG C, use after 5min being cleaned in its concussion with ultrasound wave Clear water pressure is rinsed, and then soaks pressure 10min with the NaOH of 1mol/L, then is made into the HCl solution of 1mol/L with 37% HCl After soaking pressure 10min, roll clean with clear water, after join in clear water ultrasonic wave concussion and clean 5min;
(2) matrix after treatment being placed in solid content is 10 ± 2% conducting resinl Ruzhongs, soaks, and carries out in latex Roll, then take out roll, clear water rinse, matrix surface conduction latex at room temperature from dry become wet film state;
(3) by be impregnated with conducting electricity the matrix of latex be placed in pH be 8.5 ± 0.2, temperature be that the pre-plating solution of 45 ± 2 DEG C enters Row preplating for the first time, makes matrix surface adhere to conducting metal, and matrix walking speed is less than or equal to 1.35m/min, matrix after a preplating Sheet resistance reaches 105 ± 2 Ω, then aoxidizes the matrix through a preplating and reduction treatment;
(4) matrix in step (3) is carried out through the secondary pre-plating solution that to be placed in pH be 8.5 ± 0.2, temperature is 45 ± 2 DEG C Secondary preplating, makes matrix surface adhere to conducting metal, and matrix walking speed is less than or equal to 1.35m/min, matrix surface after secondary preplating Resistance is 108 ± 1 Ω, then activates the matrix through secondary preplating and anti-oxidant treatment;
(5) will put in electroplating bath through the matrix of the pre-plating of secondary, at matrix surface Direct Electroplating nickel dam or first electroplate Layers of copper re-plating nickel dam;
(6) matrix after plating is washed through rinsing bowl, then dry at 130-180 DEG C, and conduction latex is handed over Connection solidification, is all-directional conductive sponge.
The beneficial effects of the utility model are: directly take between this all-directional conductive sponge its matrix and coating is Thermal deblocking crosslinking curing so that there is between matrix and coating adhesive strength, thermostability, corrosion resistance and the moisture resistance of excellence Can, in pretreatment and impregnation process, matrix is rolled continuously so that intrinsic silicon can preferably cover, use classification chemical plating Plating, not only greatly reduces plating leakage rate, can form stable homogeneous coating, and the product dry linting rate that comes off is low, and solves one Secondary plating process requires high defect to solution;The coating thickness of all-directional conductive sponge is uniform, sheet resistance is little, volume Distribution of resistance is uniform, and has good permanent electric conductivity and chemical stability can be widely applied to conductive sponge and conduction bubble Foam.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment one conductive sponge
Fig. 2 is the structural representation of embodiment two conductive sponge
In figure: 1, matrix, 2, conduction latex, 3 first chemical pre-plating layers, the 4, second chemical pre-plating layer, 5, copper electroplating layer, 6, electroless nickel layer.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the application, feature and advantage to become apparent from, real with concrete below in conjunction with the accompanying drawings The application is described in further detail by mode of executing.
A kind of all-directional conductive sponge includes matrix 1, conduction latex 2, pre-plating layer and electrodeposited coating, and described matrix 1 is three-dimensional Cellular polyurethane or PE, matrix 1, by infiltrating one layer of conduction latex 2 after pretreatment on top layer, has pre-through secondary chemical coating Coating, pre-plating layer top layer is electroplate with nickel dam 6 or layers of copper 5, nickel dam 6.Described pre-plating layer includes that the first chemical pre-plating layer 3 and second is changed Learn pre-plating layer 4.
Nickel preplating liquid is prepared with nickel sulfate 18g/l, sodium hypophosphite 32g/l, sodium citrate 15g/l, ammonium chloride 30g/l.Lead Electricity latex 2 is the bi-component electrically conductive type electrophoretic latexes that solid content is 10 ± 2%, and component includes high hydroxyl value anionic acrylic resin The isocyanates closed with methyl ethyl ketoxime.
Embodiment 1:
All-directional conductive sponge is prepared as follows this example:
(1) three-dimensional porous for matrix polyurethane is put in ethanol solution, at a temperature of 45 ± 5 DEG C, with ultrasound wave, it is shaken Rinse by clear water pressure after swinging cleaning 5min, then soak pressure 10min with the NaOH of 1mol/L, then be made into 37% HCl After the HCl solution of 1mol/L soaks pressure 10min, compress and wash only with clear water, after join ultrasonic wave concussion cleaning in clear water 5min;
(2) matrix after treatment being placed in solid content is 10 ± 2% conducting resinl Ruzhongs, soaks, and carries out in latex Roll, then take out roll, clear water rinse, matrix surface conduction latex at room temperature from dry become wet film state;
(3) by be impregnated with conducting electricity the matrix of latex be placed in pH be 8.5 ± 0.2, temperature be that the pre-plating solution of 45 ± 2 DEG C enters Row preplating for the first time, makes matrix surface adhere to conducting metal, matrix walking speed 1.35m/min, matrix surface resistance after a preplating Reach 105 ± 2 Ω, then the matrix through a preplating is aoxidized and reduction treatment;
(4) matrix in step (3) is carried out through the secondary pre-plating solution that to be placed in pH be 8.5 ± 0.2, temperature is 45 ± 2 DEG C Secondary preplating, makes matrix surface adhere to conducting metal, and matrix walking speed is less than or equal to 1.35m/min, matrix surface after secondary preplating Resistance is 108 ± 1 Ω, then activates the matrix through secondary preplating and anti-oxidant treatment;
(5) will put in electroplating bath through the matrix of the pre-plating of secondary, at matrix surface Direct Electroplating nickel dam;
(6) matrix after plating is washed through rinsing bowl, then dry at 130-180 DEG C, and conduction latex is handed over Connection solidification, is all-directional conductive sponge, shown in Figure 1.
Embodiment 2:
All-directional conductive sponge is prepared as follows this example:
(1) matrix PE is put in ethanol solution, at a temperature of 45 ± 5 DEG C, after 5min being cleaned in its concussion with ultrasound wave Rinse by clear water pressure, then soak pressure 10min with the NaOH of 1mol/L, then it is molten to be made into the HCl of 1mol/L with 37% HCl After immersion bubble pressure 10min, compress and wash only with clear water, after join in clear water ultrasonic wave concussion cleaning 5min;
(2) matrix after treatment being placed in solid content is 10 ± 2% conducting resinl Ruzhongs, soaks, and carries out in latex Roll, then take out roll, clear water rinse, matrix surface conduction latex at room temperature from dry become wet film state;
(3) by be impregnated with conducting electricity the matrix of latex be placed in pH be 8.5 ± 0.2, temperature be that the pre-plating solution of 45 ± 2 DEG C enters Row preplating for the first time, makes matrix surface adhere to conducting metal, matrix walking speed 1.35m/min, matrix surface resistance after a preplating Reach 105 ± 2 Ω, then the matrix through a preplating is aoxidized and reduction treatment;
(4) matrix in step (3) is carried out through the secondary pre-plating solution that to be placed in pH be 8.5 ± 0.2, temperature is 45 ± 2 DEG C Secondary preplating, makes matrix surface adhere to conducting metal, and matrix walking speed is less than or equal to 1.35m/min, matrix surface after secondary preplating Resistance is 108 ± 1 Ω, then activates the matrix through secondary preplating and anti-oxidant treatment;
(5) will put in electroplating bath through the matrix of the pre-plating of secondary, at matrix surface elder generation copper electroplating layer re-plating nickel dam;
(6) matrix after plating is washed through rinsing bowl, then dry at 130-180 DEG C, and conduction latex is handed over Connection solidification, is all-directional conductive sponge, shown in Figure 2.
After testing, all-directional conductive sponge of the present utility model and the all-directional conductive sponge various performance parameters of same specification Contrast as shown in the table.

Claims (2)

1. an all-directional conductive sponge, including matrix, conduction latex, pre-plating layer and electrodeposited coating, it is characterised in that described matrix For three-dimensional porous polyurethane or PE, matrix by infiltrating one layer of conduction latex on top layer after pretreatment, through secondary chemical coating Pre-plating layer, pre-plating layer top layer is had to be electroplate with nickel dam or copper nickel dam.
2. a kind of all-directional conductive sponge as claimed in claim 1, it is characterised in that described pre-plating layer includes that the first chemistry is pre- Coating and the second chemical pre-plating layer, the pre-plating solution that pre-plating layer is used is nickel preplating liquid, and secondary pre-plating solution is nickel preplating liquid.
CN201620516949.1U 2016-06-01 2016-06-01 A kind of all-directional conductive sponge Active CN205751550U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107419243A (en) * 2017-07-03 2017-12-01 西北工业大学 A kind of preparation method of open celled foam cupro-nickel composite
CN107452433A (en) * 2016-06-01 2017-12-08 益阳市菲美特新材料有限公司 A kind of all-directional conductive sponge and preparation method thereof
CN108070888A (en) * 2017-12-18 2018-05-25 常德力元新材料有限责任公司 A kind of electro-plating method of electromagnetic shielding material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107452433A (en) * 2016-06-01 2017-12-08 益阳市菲美特新材料有限公司 A kind of all-directional conductive sponge and preparation method thereof
CN107452433B (en) * 2016-06-01 2023-06-02 益阳市菲美特新材料有限公司 Omnibearing conductive sponge and preparation method thereof
CN107419243A (en) * 2017-07-03 2017-12-01 西北工业大学 A kind of preparation method of open celled foam cupro-nickel composite
CN107419243B (en) * 2017-07-03 2020-03-20 西北工业大学 Preparation method of open-cell foam copper-nickel composite material
CN108070888A (en) * 2017-12-18 2018-05-25 常德力元新材料有限责任公司 A kind of electro-plating method of electromagnetic shielding material

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Denomination of utility model: A kind of omnidirectional conductive sponge

Effective date of registration: 20210628

Granted publication date: 20161130

Pledgee: Yiyang branch of China Everbright Bank Co.,Ltd.

Pledgor: YIYANG FOAMMETAL NEW MATERIAL Co.,Ltd.

Registration number: Y2021980005351

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Date of cancellation: 20220811

Granted publication date: 20161130

Pledgee: Yiyang branch of China Everbright Bank Co.,Ltd.

Pledgor: YIYANG FOAMMETAL NEW MATERIAL CO.,LTD.

Registration number: Y2021980005351

PC01 Cancellation of the registration of the contract for pledge of patent right