CN206780702U - A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology - Google Patents
A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology Download PDFInfo
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- CN206780702U CN206780702U CN201720694204.9U CN201720694204U CN206780702U CN 206780702 U CN206780702 U CN 206780702U CN 201720694204 U CN201720694204 U CN 201720694204U CN 206780702 U CN206780702 U CN 206780702U
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- degumming
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- cold water
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Abstract
The utility model is a kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology.The degumming device is made up of three independent sectors, and heat water-spraying's groove, ultrasonic wave acidity degumming agent groove and cold water spray groove are followed successively by according to cleaning order；Wherein, described Water spray groove, ultrasonic wave acidity degumming agent groove are identical with the size of cold water spray groove, are 650mm × 450mm × 450mm；Heat water-spraying's groove and cold water spray groove are provided with total 80 100 on respective 4 interior plates can sweep formula spray head up and down, and bottom sets 6 centimetres of osculums of diameter.The utility model can significantly reduce degumming cost while silicon wafer stripping quality is ensured, calculated by 1,000,000 silicon chips of monthly output, can monthly save 10,000 yuan of degumming cost.
Description
Technical field
The utility model is related to it is a kind of reduce N-type minority carrier life time used for solar batteries be more than the silicon wafer strippings of 1000 microseconds into
This device, it is especially a kind of to be used to reduce silicon wafer stripping water consumption of the solar energy N-type minority carrier life time more than 1000 microseconds and take off
The device of jelly dosage.Design by changing degumming system reaches the purpose for reducing cost.
Background technology
N-type minority carrier life time be more than 1000 microseconds silicon chip be made the characteristic of high conversion efficiency solar cell increasingly by
The attention of photovoltaic industry.In terms of silicon chip cutting, it is necessary to carry out cleaning and degumming to silicon chip after silicon chip, which is cut, to be completed.Fig. 1 is
A kind of currently used silicon chip cleaning device, the device are for being cut by what the steps such as steel wire+suspension+silicon-carbide particle formed
Cut technique and design, cleaned successively by precleaning spout, cold water spray groove, hot water degumming agent groove, heat water-spraying's groove, hot water overflow
Five devices such as groove are formed, because overflow rinse bath needs the overflow of big flow water and hot water degumming agent groove that degumming agent is used alone
The reason for (no intensified by ultrasonic wave), the deficiency that degumming water consumption is big, degumming agent dosage is big be present.
With technological progress, golden steel wire cutting technique (golden steel wire (steel wire for carrying cutting blade material)+water-based cooling agent) is
Through more and more being applied in silicon chip cutting.The technology is asked except preferably resolving silicon chip surface metallic pollution
Topic, is more reduction of cutting cost.However, the manufacturing cost of silicon wafer stripping process is still very high.Therefore, design is a kind of is adapted to gold
The device of the cleaning and degumming silicon chip process of steel wire cutting, becomes the problem of anxious to be resolved.
Utility model content
The technical problems to be solved in the utility model is to overcome in current techniques that silicon slice degumming device water consumption is excessive, degumming
The problem of agent consumption is excessive, there is provided a kind of reduction degumming cost device.Device provided by the utility model includes silicon chip
The design of degumming system, the position of heat water-spraying and cold water spray is exchanged, the quantity of spray head in spray groove has been added, saves
Precleaning spout and hot water overflow rinse bath.Therefore while cleaning performance is reached, can a large amount of using water wisely, reduce de-
Glue cost.
The technical solution of the utility model is：
A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology, the degumming device are made up of three independent sectors,
Heat water-spraying's groove, ultrasonic wave acidity degumming agent groove and cold water spray groove are followed successively by according to cleaning order；
Wherein, described Water spray groove, ultrasonic wave acidity degumming agent groove are identical with the size of cold water spray groove, are
650mm×450mm×450mm；Ultrasonic wave acidity degumming agent trench bottom sets 6 centimetres of osculums of diameter and inlet opening respectively；Heat
Water spray groove and cold water spray groove are provided with total 80-100 on respective 4 interior plates and sweeping formula can sprayed up and down
Head, bottom set 6 centimetres of osculums of diameter.
The beneficial effects of the utility model are：
Silicon slice degumming device described in the utility model applied to Buddha's warrior attendant wire cutting technology can ensure silicon wafer stripping matter
Degumming cost is significantly reduced while amount.Calculated using the utility model by 1,000,000 silicon chips of monthly output, can monthly save degumming into
This 10,000 yuan.Specific such as application example.
Brief description of the drawings
Fig. 1 routinely N-type minority carrier life time used for solar batteries be more than 1000 microseconds silicon slice degumming device design diagram；
Fig. 2 the utility model designs silicon slice degumming device process flow diagram；
Fig. 3 is heat water-spraying's groove figure, wherein, Fig. 3 a are heat water-spraying's groove front view, and Fig. 3 b are heat water-spraying's groove top view；
1 is spray cell body, and 2 be spray head, and 3 be osculum；
Fig. 4 is ultrasonic wave acidity degumming agent groove figure, wherein, Fig. 4 a are ultrasonic wave acidity degumming agent groove front view, and Fig. 4 b are
Ultrasonic wave acidity degumming agent groove top view；4 be acid degumming cell body, and 5 be ultrasonic wave vibration plate, and 6 be osculum, and 7 be inlet opening；
Fig. 5 is cold water spray groove figure, wherein, Fig. 5 a are cold water spray groove front view, and Fig. 5 b are cold water spray groove top view；
8 be spray cell body, and 9 be spray head, and 10 be osculum.
Embodiment
Whole degumming device is divided into 3 independent parts, and it is acid to be followed successively by heat water-spraying's groove, ultrasonic wave according to cleaning order
Degumming agent groove, cold water spray groove；Treat that the silicon rod of degumming passes sequentially through heat water-spraying's groove, ultrasonic wave acidity degumming agent groove, cold water spray
Drench groove and complete scouring processes；
Described Water spray groove, ultrasonic wave acidity degumming agent groove are identical with the size of cold water spray groove, be long 650mm ×
Wide 450mm × high 450mm.Wherein, ultrasonic wave acidity degumming agent trench bottom sets 6 centimetres of osculums of diameter and inlet opening respectively；
Formula spray head can be swept up and down by setting on heat water-spraying's groove and respective 4 interior plates of cold water spray groove length to be 25 centimetres
(overall design quantity is 80-100 (50-70 are arranged in current device)；The present embodiment is 100, the long side of spray groove
Side is provided with 30 per side, and short brink is 20 per side), bottom sets 6 centimetres of osculums of diameter.
Application example one：The utility model device loads 4 in single and treats degumming silicon rod, the inch silicon wafer N-type list of degumming 6.5
Chip.N type single crystal silicon wherein used is that the n type single crystal silicon of Jing Long groups production (is specially resistivity 5-10 ohmcms, less
The sub- life-span is more than 1000 microseconds).
Application example two：The utility model device loads 4 in single and treats degumming silicon rod, the inch silicon wafer N-type monocrystalline of degumming 8
Piece.N type single crystal silicon wherein used is n type single crystal silicon (specially resistivity 5-10 ohmcms, the few son of Jing Long groups production
Life-span is more than 1000 microseconds).
All application examples use identical degumming tech.Specially：First heat water-spraying's groove spray 4 minutes, second
Step sprays 4 minutes in ultrasonic wave acidity degumming agent groove degumming 8 minutes, the 3rd step cold water spray groove.
Fragmentation number is defined by inspector's actual inspection, and flowmeter of the water measuring and calculating based on routine, degumming agent dosage is with routine
Electronic scale measures.The utility model contrasts with conventional equipment degumming fragmentation quantitative comparison and degumming agent consumption and water consume dosage
Such as following table：
Correction data illustrates that the silicon slice degumming device described in the utility model applied to Buddha's warrior attendant wire cutting technology can protected
Card fragmentation quantity significantly reduces degumming agent consumption and water consumption while increase, and the utility model can significantly reduce solar energy
Battery is more than the silicon wafer stripping cost of 1000 microseconds with N-type minority carrier life time.Every silicon chip can reduce water consumption (pure water) about 400g,
Equivalent running water 800g (yield ratio of photovoltaic industry pure water is known in the industry), is 5 yuan by water price per ton and calculates, the present apparatus
Every can using water wisely 800*5/1000/1000=0.004 members；Every can economize on cleaning agent about 0.3g, by per kilogram degumming
Agent price is 20 yuan and calculates (degumming agent price is known in the industry), and it is 0.3*20/1000=0.006 that every silicon chip, which saves degumming agent,
Member；Degumming cost 0.004+0.006=0.01 members can be saved using every silicon chip of the utility model, by monthly output, 1,000,000 calculate,
10,000 yuan of degumming cost can monthly be saved.
The utility model unaccomplished matter is known technology.
Claims (1)
- A kind of 1. silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology, it is characterized in that the composition of the degumming device is according to cleaning Order is followed successively by heat water-spraying's groove, ultrasonic wave acidity degumming agent groove and cold water spray groove；Wherein, described Water spray groove, ultrasonic wave acidity degumming agent groove are identical with the size of cold water spray groove, be 650mm × 450mm×450mm；Ultrasonic wave acidity degumming agent trench bottom sets 6 centimetres of osculums of diameter and inlet opening respectively；Heat water-spraying's groove It is provided with cold water spray groove on respective 4 interior plates and amounts to 80-100 sweeping formula spray head, bottom sets diameter 6 Centimetre osculum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720694204.9U CN206780702U (en) | 2017-06-15 | 2017-06-15 | A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720694204.9U CN206780702U (en) | 2017-06-15 | 2017-06-15 | A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology |
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| CN206780702U true CN206780702U (en) | 2017-12-22 |
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| CN201720694204.9U Active CN206780702U (en) | 2017-06-15 | 2017-06-15 | A kind of silicon slice degumming device applied to Buddha's warrior attendant wire cutting technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111490127A (en) * | 2019-10-22 | 2020-08-04 | 国家电投集团西安太阳能电力有限公司 | Pre-cleaning process suitable for solar single crystal slices |
-
2017
- 2017-06-15 CN CN201720694204.9U patent/CN206780702U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111490127A (en) * | 2019-10-22 | 2020-08-04 | 国家电投集团西安太阳能电力有限公司 | Pre-cleaning process suitable for solar single crystal slices |
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