CN206753416U - A kind of radiation window based on semiconductor refrigerating heating - Google Patents

A kind of radiation window based on semiconductor refrigerating heating Download PDF

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Publication number
CN206753416U
CN206753416U CN201621467625.XU CN201621467625U CN206753416U CN 206753416 U CN206753416 U CN 206753416U CN 201621467625 U CN201621467625 U CN 201621467625U CN 206753416 U CN206753416 U CN 206753416U
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window
metallic conductor
internal layer
semiconductor
layer
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Chinese (zh)
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林波荣
孙弘历
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Tsinghua University
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Tsinghua University
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Abstract

A kind of radiation window based on semiconductor refrigerating heating, including window outer layer and window internal layer and the polylith semiconductor subassembly that is arranged between window outer layer and window internal layer;Semiconductor subassembly includes power line, metallic conductor and PN sections, and the PN sections are directly connected to by the metallic conductor and the window layers, and are connected by metallic conductor with the power line.The utility model is quickly cooled or heated up to window inner surface using semiconductor refrigerating heating principle, without using blower fan, effectively reduces system energy consumption and noise;Intermittent radiation cooling heating is realized, is thermal environment of the indoor construction compared with high degree of comfort;And it is simple in construction, stable and safe in operation is high, personalized can arrange, aesthetic property is strong.

Description

A kind of radiation window based on semiconductor refrigerating heating
Technical field
A kind of window, more particularly to a kind of radiation window based on semiconductor refrigerating heating are the utility model is related to, is belonged to Building element technical field.
Background technology
Window has the characteristics of translucency is strong, heat transfer coefficient is big as an indispensable part in building, but This considerably increases the air conditioning and heating load of building.Therefore how on the premise of daylighting demand is ensured, the thermal technology that improves window Performance is research emphasis.Window is mainly made up of low-e glass, vacuum glass etc. in the prior art.Low-e glass can be reduced The solar radiation got in by window, so as to reduce the refrigeration duty in room;Vacuum glass can increase the heat transfer system of window Number, the heat-insulating property of window is improved, reduce the cooling and heating load in room.And arrange that semi-conducting material can realize interior in window The reverse of the outer temperature difference, decrease or even eliminate the air conditioning and heating load being passed to by window in building.
Chinese patent application discloses a kind of window semiconductor air-conditioner (application number 201610196825.4), and the window is empty Adjust device can with window integrative installation technology, by it is hot caused by semiconductor subassembly or it is cold passed to by radiator in air, utilize wind Machine drives air circulation, and interior is freezed or heated, and belongs to convection type air-conditioning, but semiconductor group in this air conditioning mode The temperature difference is big in part running, and efficiency is low, and system has fan energy consumption, there is noise;The room that other convection type air-conditioning is built Interior thermal environment comfort level is not high.
Chinese patent application discloses a kind of photovoltaic shutter semiconductor temperature-control Energy Saving Windows (application number: 201510346572.X), the Energy Saving Windows are powered using solar energy for semiconductor subassembly, heat and cold caused by semiconductor subassembly Passed to by fin in the air driven by blower fan, also belong to convection type air-conditioning, this Energy Saving Windows volume is larger, aesthetic property Difference, while it is big and cause efficiency low the temperature difference in semiconductor subassembly operation to be present, and fan energy consumption be present, there is noise;It is right in addition The indoor thermal environment comfort level that streaming air-conditioning is built is not high.
Utility model content
The purpose of this utility model is to propose a kind of radiation window based on semiconductor refrigerating heating, utilizes semiconductor refrigerating The working characteristics of heating, the direct personalization of semi-conducting material is arranged on window inner surface, make use of radiation cooling, heating tool There is the advantages of higher thermal comfort, realize summer radiation cooling, winter radiant heating.The utility model can solve semiconductor group Part ran middle excessive temperature differentials and caused the problem of inefficient, simplified the structure of semiconductor subassembly, eliminated fin, blower fan Deng composition, while the practicality and aesthetic property of window are ensure that, feasibility is strong.Technology, this practicality are heated based on semiconductor refrigerating It is new have be swift in response, heating efficiency is high and it is stable the characteristics of, and can intermittent work, green high-efficient.This practicality is new Type can solve the problem that outside summer room by window into interior heat transfer and winter room by window to the problem of the radiating of outdoor, subtract The air conditioning and heating load in room is lacked, has been played a role in building energy saving field.
The technical solution of the utility model is as follows:
A kind of radiation window based on semiconductor refrigerating heating, including window outer layer and window internal layer, it is characterised in that: Polylith semiconductor subassembly 1 is provided between window outer layer and window internal layer, PN sections 4 are included per block semiconductor component 1, outer metal is led Body and interior metallic conductor;The radiation window arrangement is followed successively by window outer layer, outer metallic conductor, PN sections, interior metal and led from outside to inside Body and window internal layer.
In above-mentioned technical proposal, it is characterised in that:In window outer layer, outer metallic conductor, PN sections, interior metallic conductor and window Contact position is coated with heat-conducting silicone grease or installation heat conductive silica gel pad to layer between each other.
In above-mentioned technical proposal, it is characterised in that:Semiconductor subassembly in radiation window is one another in series by wire.
Preferably, the thickness of outer metallic conductor and interior metallic conductor is 0.5-1mm.
The utility model has the technique effect of advantages below and high-lighting:1. simplifying semiconductor assembly structure, make it Direct radiation cooling heating, can improve thermal comfort under Low Temperature Difference operating mode.2. without using blower fan, system energy consumption, fortune are reduced Row process does not have noise.Dissipated 3. avoiding outside summer room by window into interior heat transfer and winter room by window to outdoor The problem of hot, reduce the air conditioning and heating load in room, played a role in building energy saving field.4. the utility model is sharp The characteristics of being swift in response with semiconductor refrigerating heating, personalized regulation can be accomplished, and stable and safe in operation is high.5. use spoke The heat transfer form cooling heating penetrated, thermal comfort are higher.
Brief description of the drawings
Fig. 1 is radiation window profile.
Fig. 2 is semiconductor subassembly profile.
Embodiment
The utility model is described in detail below in conjunction with the accompanying drawings.
Fig. 1 is a kind of structural representation of radiation window based on semiconductor refrigerating heating provided by the utility model, should Radiation window includes window outer layer 2a and window internal layer 2b, and being provided with polylith between window outer layer 2a and window internal layer 2b partly leads Body component 1, PN sections 4, outer metallic conductor 5a and interior metallic conductor 5b are included per block semiconductor component 1;The radiation window arrangement by It is outer to be followed successively by window outer layer 2a, outer metallic conductor 5a, PN section 4, interior metallic conductor 5b and window internal layer 2b to interior.Window outer layer 2a, outer metallic conductor 5a, PN section 4, interior metallic conductor 5b and window internal layer 2b it is adjacent between contact position be coated with heat-conducting silicone grease or peace Fill heat conductive silica gel pad.
Window outer layer 2a and window internal layer 2b can be made up of common glass material;Whole window does encapsulation process, prevents rain Water etc. is entered in semiconductor subassembly 1.Window outer layer 2a and window internal layer 2b intermediate courses are except semiconductor subassembly 1 and wire 3 In addition, vacuumize process is done, reduces the heat transfer between window outer layer 2a and window internal layer 2b.
Multiple semiconductor subassemblies 1 in radiation window can be one another in series by wire 3.Outer metallic conductor 5a and interior metal Conductor 5b material is generally iron, copper or aluminium, and its thickness is 0.5-1mm.
The big I of window is selected according to actual building demand, and semiconductor is arranged on window according to personalization hobby Component 1.
As shown in Fig. 2 PN sections 4, outer metallic conductor 5a, interior metallic conductor 5b and wire 3 can be according to window progress attractive in appearance Personalized designs, reach the aesthetic of user's needs simultaneously in the case where ensureing daylighting demand and the uniform precondition of heat transfer.
In order to ensure that window does not condense, it should control its cold surface temperature to be not less than outside air dew-point temperature, Yi Jiwei Guarantee hot-surface temperature is no more than upper safety limit, and window outer layer 2a and window internal layer 2b all should set temperature sensor and electricity The automatic Protection control system in source.
Operation principle and process of the present utility model are as follows:
In summer condition, PN sections 4 form hot face with outer metallic conductor 5a contact surfaces after being powered, and heated windows outer layer 2a makes Its surface temperature is higher than outside air temperature, and realization is outwardly radiated;PN sections 4 form huyashi-chuuka (cold chinese-style noodles) with interior metallic conductor 5b contact surfaces, Cooled for window internal layer 2b, to indoor formation radiation cooling.The electric energy for being input to PN sections 4 is converted into heat energy, and with passing through Heat in window internal layer 2b absorption chambers, is scattered in outside air commonly through window outer layer 2a.
Operating mode in the winter time, the voltage being added on PN sections 4 are opposite with summer condition so that PN sections 4 connect with outer metallic conductor 5a Contacting surface forms huyashi-chuuka (cold chinese-style noodles), cools for window outer layer 2a, its surface temperature is less than outside air temperature, realizes the heat absorption from the external world; PN sections 4 form hot face with interior metallic conductor 5b contact surfaces, are heated up for window internal layer 2b, to indoor formation radiant heating.It is defeated The electric energy entered to PN sections 4 is converted into heat energy, and with by the heat outside window outer layer 2a absorption chambers, commonly through window internal layer 2b For indoor heating.

Claims (3)

1. a kind of radiation window based on semiconductor refrigerating heating, including window outer layer (2a) and window internal layer (2b), its feature It is:Polylith semiconductor subassembly (1) is provided between window outer layer (2a) and window internal layer (2b), per block semiconductor component (1) PN sections (4), outer metallic conductor (5a) and interior metallic conductor (5b) are included;The radiation window arrangement is followed successively by window from outside to inside Outdoor layer (2a), outer metallic conductor (5a), PN sections (4), interior metallic conductor (5b) and window internal layer (2b);Window outer layer (2a), Outer metallic conductor (5a), PN section (4), interior metallic conductor (5b) and window internal layer (2b) it is adjacent between contact position be coated with heat-conducting silicone grease Or installation heat conductive silica gel pad;Window outer layer (2a) and window internal layer (2b) are respectively provided with temperature sensor and power supply automatic protection Control system.
2. according to a kind of radiation window based on semiconductor refrigerating heating described in claim 1, it is characterised in that:Radiate window In semiconductor subassembly (1) be one another in series by wire (3).
3. according to a kind of radiation window based on semiconductor refrigerating heating described in claim 1, it is characterised in that:Outer metal is led The thickness of body (5a) and interior metallic conductor (5b) is 0.5-1mm.
CN201621467625.XU 2016-12-29 2016-12-29 A kind of radiation window based on semiconductor refrigerating heating Active CN206753416U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621467625.XU CN206753416U (en) 2016-12-29 2016-12-29 A kind of radiation window based on semiconductor refrigerating heating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621467625.XU CN206753416U (en) 2016-12-29 2016-12-29 A kind of radiation window based on semiconductor refrigerating heating

Publications (1)

Publication Number Publication Date
CN206753416U true CN206753416U (en) 2017-12-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621467625.XU Active CN206753416U (en) 2016-12-29 2016-12-29 A kind of radiation window based on semiconductor refrigerating heating

Country Status (1)

Country Link
CN (1) CN206753416U (en)

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