CN106761320A - A kind of radiation window heated based on semiconductor refrigerating - Google Patents

A kind of radiation window heated based on semiconductor refrigerating Download PDF

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Publication number
CN106761320A
CN106761320A CN201611248029.7A CN201611248029A CN106761320A CN 106761320 A CN106761320 A CN 106761320A CN 201611248029 A CN201611248029 A CN 201611248029A CN 106761320 A CN106761320 A CN 106761320A
Authority
CN
China
Prior art keywords
window
metallic conductor
radiation
semiconductor
internal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611248029.7A
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Chinese (zh)
Inventor
林波荣
孙弘历
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Tsinghua University
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Tsinghua University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University filed Critical Tsinghua University
Priority to CN201611248029.7A priority Critical patent/CN106761320A/en
Publication of CN106761320A publication Critical patent/CN106761320A/en
Pending legal-status Critical Current

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Classifications

    • EFIXED CONSTRUCTIONS
    • E06DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06BFIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B7/00Special arrangements or measures in connection with doors or windows
    • E06B7/28Other arrangements on doors or windows, e.g. door-plates, windows adapted to carry plants, hooks for window cleaners
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible

Abstract

A kind of radiation window heated based on semiconductor refrigerating, including window outer layer and window internal layer and the polylith semiconductor subassembly that is arranged between window outer layer and window internal layer;Semiconductor subassembly includes power line, metallic conductor and PN section, and the PN sections are directly connected to by the metallic conductor with the window layers, and are connected with the power line by metallic conductor.The present invention heats principle and quickly window inner surface is lowered the temperature or heated up using semiconductor refrigerating, without using blower fan, effectively reduces system energy consumption and noise;Intermittent radiation cooling heating is realized, is thermal environment of the indoor construction compared with high degree of comfort;And simple structure, stable and safe in operation is high, can be arranged with personalization, and aesthetic property is strong.

Description

A kind of radiation window heated based on semiconductor refrigerating
Technical field
The present invention relates to a kind of window, more particularly to a kind of radiation window heated based on semiconductor refrigerating, belong to building Component technology field.
Background technology
Window as a part indispensable in building, with translucency it is strong, heat transfer coefficient is big the characteristics of, but This considerably increases the air conditioning and heating load of building.Therefore how on the premise of daylighting demand is ensured, the thermal technology of window is improved Performance is research emphasis.Window is mainly made up of low-e glass, vacuum glass etc. in the prior art.Low-e glass can be reduced The solar radiation got in by window, so as to reduce the refrigeration duty in room;Vacuum glass can increase the heat transfer system of window Number, improves the heat-insulating property of window, reduces the cooling and heating load in room.And arrange that semi-conducting material can realize interior in window The reverse of the outer temperature difference, decreases or even eliminates the air conditioning and heating load being passed to by window in building.
Chinese patent application discloses a kind of window semiconductor air-conditioner (application number 201610196825.4), and the window is empty Adjust device can with window integrative installation technology, by semiconductor subassembly produce it is hot or cold being passed in air by radiator, using wind Machine drives air circulation, interior is freezed or is heated, and belongs to convection type air-conditioning, but semiconductor group in this air conditioning mode The temperature difference is big in part running, and efficiency is low, and system has fan energy consumption, there is noise;The room that other convection type air-conditioning is built Interior thermal environment comfort level is not high.
Chinese patent application discloses a kind of photovoltaic shutter semiconductor temperature-control Energy Saving Windows (application number: 201510346572.X), the Energy Saving Windows using solar energy for semiconductor subassembly is powered, semiconductor subassembly produce heat and cold By fin pass to by blower fan drive air in, also belong to convection type air-conditioning, this Energy Saving Windows volume is larger, aesthetic property , while the temperature difference causes efficiency low greatly in there is semiconductor subassembly operation, and there is fan energy consumption in difference, there is noise;It is right in addition The indoor thermal environment comfort level that streaming air-conditioning is built is not high.
The content of the invention
The purpose of the present invention is to propose to a kind of radiation window heated based on semiconductor refrigerating, heated using semiconductor refrigerating Working characteristics, the direct personalization of semi-conducting material is arranged on window inner surface, make use of radiation cooling, heating have compared with The advantage of thermal comfort high, realizes summer radiation cooling, winter radiant heating.The present invention can solve semiconductor subassembly and run Middle excessive temperature differentials and cause inefficient problem, simplify the structure of semiconductor subassembly, eliminate fin, blower fan etc. composition, The practicality and aesthetic property of window are ensure that simultaneously, and feasibility is strong.Technology is heated based on semiconductor refrigerating, the present invention has reaction Rapidly, the characteristics of heating efficiency is high and stable, and can intermittent work, green high-efficient.The present invention can solve the problem that in summer Outdoor is by window to, by problem of the window to outdoor radiating, the air-conditioning for reducing room is supplied in indoor heat transfer and winter room Warm load, plays a role in building energy saving field.
Technical scheme is as follows:
A kind of radiation window heated based on semiconductor refrigerating, including window outer layer and window internal layer, it is characterised in that: Polylith semiconductor subassembly 1 is provided between window outer layer and window internal layer, includes that PN sections 4, outer metal are led per block semiconductor component 1 Body and interior metallic conductor;The radiation window arrangement is followed successively by window outer layer, outer metallic conductor, PN sections, interior metal and leads from outside to inside Body and window internal layer.
In above-mentioned technical proposal, it is characterised in that:In window outer layer, outer metallic conductor, PN sections, interior metallic conductor and window Contact position is coated with heat-conducting silicone grease or installs heat conductive silica gel pad layer each other.
In above-mentioned technical proposal, it is characterised in that:Semiconductor subassembly in often fan radiation window is one another in series by wire.
Preferably, outer metallic conductor and interior metallic conductor are iron, copper or aluminium;Its thickness is 0.5-1mm.
Technique effect of the present invention with advantages below and high-lighting:1. semiconductor assembly structure is simplified, makes it low The heating of direct radiation cooling, can improve thermal comfort under temperature difference operating mode.2. blower fan is not used, system energy consumption is reduced, was run Journey does not have noise.3. avoid outside summer room by window in indoor heat transfer and winter room by window to outdoor radiating Problem, reduces the air conditioning and heating load in room, is played a role in building energy saving field.4. the present invention utilizes semiconductor The characteristics of cooling and warming is swift in response, can accomplish personalized regulation, and stable and safe in operation is high.5. the heat transfer of radiation is used Form cooling heats, and thermal comfort is higher.
Brief description of the drawings
Fig. 1 is radiation window profile.
Fig. 2 is semiconductor subassembly profile.
Specific embodiment
The present invention is described in detail below in conjunction with the accompanying drawings.
A kind of structural representation of radiation window heated based on semiconductor refrigerating that Fig. 1 is provided for the present invention, the radiation Window includes window outer layer 2a and window internal layer 2b, and polylith semiconductor group is provided between window outer layer 2a and window internal layer 2b Part 1, PN sections 4, outer metallic conductor 5a and interior metallic conductor 5b are included per block semiconductor component 1;The radiation window arrangement is by outward extremely Inside it is followed successively by window outer layer 2a, outer metallic conductor 5a, PN section 4, interior metallic conductor 5b and window internal layer 2b.It is window outer layer 2a, outer Contact position is coated with heat-conducting silicone grease or installs heat conduction metallic conductor 5a, PN section 4, interior metallic conductor 5b and window internal layer 2b each other Silica gel pad.
Window outer layer 2a and window internal layer 2b can be made up of common glass material;Whole window does encapsulation process, prevents rain Water etc. is entered into semiconductor subassembly 1.Window outer layer 2a and window internal layer 2b intermediate courses are except semiconductor subassembly 1 and wire 3 In addition, vacuumize process is done, the heat transfer between window outer layer 2a and window internal layer 2b is reduced.
Semiconductor subassembly 1 in radiation window can be one another in series by wire 3.Outer metallic conductor 5a and interior metallic conductor The material of 5b is generally iron, copper or aluminium, and its thickness is 0.5-1mm.
Window size is selected according to actual building demand, and semiconductor group is arranged on window according to personalization hobby Part 1.
As shown in Fig. 2 PN sections 4, outer metallic conductor 5a, interior metallic conductor 5b and wire 3 can be carried out according to window is attractive in appearance Personalized designs, the aesthetic of user's needs is reached in the case where daylighting demand and the uniform precondition of heat transfer is ensured simultaneously.
In order to ensure that window does not condense, it should control its cold surface temperature to be not less than outside air dew-point temperature, Yi Jiwei Guarantee hot-surface temperature is no more than upper safety limit, and window outer layer 2a and window internal layer 2b all should set temperature sensor and electricity The automatic Protection control system in source.
Operation principle of the invention and process are as follows:
In summer condition, PN sections 4 form hot face with outer metallic conductor 5a contact surfaces after being powered, and heated windows outer layer 2a makes Its surface temperature is higher than outside air temperature, and realization is outwardly radiated;PN sections 4 form huyashi-chuuka (cold chinese-style noodles) with interior metallic conductor 5b contact surfaces, For window internal layer 2b is lowered the temperature, to indoor formation radiation cooling.The electric energy for being input to PN sections 4 is converted into heat energy, and with pass through Heat in window internal layer 2b absorption chambers, is scattered in outside air commonly through window outer layer 2a.
Operating mode in the winter time, the voltage being added on PN sections 4 is opposite with summer condition so that PN saves 4 and connect with outer metallic conductor 5a Contacting surface forms huyashi-chuuka (cold chinese-style noodles), is window outer layer 2a coolings, makes its surface temperature less than outside air temperature, realizes from extraneous heat absorption; PN sections 4 form hot face with interior metallic conductor 5b contact surfaces, are that window internal layer 2b is heated up, to indoor formation radiant heating.It is defeated The electric energy entered to PN sections 4 is converted into heat energy, and absorbs outdoor heat with by window outer layer 2a, commonly through window internal layer 2b It is indoor heating.

Claims (4)

1. a kind of radiation window heated based on semiconductor refrigerating, including window outer layer (2a) and window internal layer (2b), its feature It is:Polylith semiconductor subassembly (1) is provided between window outer layer (2a) and window internal layer (2b), per block semiconductor component (1) including PN sections (4), outer metallic conductor (5a) and interior metallic conductor (5b);The radiation window arrangement is followed successively by window from outside to inside Outdoor layer (2a), outer metallic conductor (5a), PN sections (4), interior metallic conductor (5b) and window internal layer (2b).
2. according to a kind of radiation window heated based on semiconductor refrigerating described in claim 1, it is characterised in that:Window outer layer (2a), outer metallic conductor (5a), PN sections (4), interior metallic conductor (5b) and window internal layer (2b) it is adjacent between contact position be coated with and lead Hot silicone grease or installation heat conductive silica gel pad.
3. according to a kind of radiation window heated based on semiconductor refrigerating described in claim 1 or 2, it is characterised in that:Radiation Semiconductor subassembly (1) in window is one another in series by wire (3).
4. according to a kind of radiation window heated based on semiconductor refrigerating described in claim 1, it is characterised in that:Outer metal is led The material of body (5a) and interior metallic conductor (5b) is iron, copper or aluminium;Its thickness is 0.5-1mm.
CN201611248029.7A 2016-12-29 2016-12-29 A kind of radiation window heated based on semiconductor refrigerating Pending CN106761320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611248029.7A CN106761320A (en) 2016-12-29 2016-12-29 A kind of radiation window heated based on semiconductor refrigerating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611248029.7A CN106761320A (en) 2016-12-29 2016-12-29 A kind of radiation window heated based on semiconductor refrigerating

Publications (1)

Publication Number Publication Date
CN106761320A true CN106761320A (en) 2017-05-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109555451A (en) * 2018-12-07 2019-04-02 范永浩 Semiconductor air-freshening window

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106223A2 (en) * 1982-10-08 1984-04-25 Optical Coating Laboratory, Inc. Energy control window film systems and methods for manufacturing the same
CN2082839U (en) * 1990-08-23 1991-08-14 李世龙 Heating and refrigerating device
CN102569285A (en) * 2010-12-27 2012-07-11 北京印刷学院 Solar refrigeration and heating automatic temperature control vacuum glass
CN104879051A (en) * 2015-06-23 2015-09-02 湖南大学 Photovoltaic shutter semiconductor temperature-control energy-saving window
CN105757816A (en) * 2016-03-31 2016-07-13 青岛海尔空调器有限总公司 Window type semiconductor air conditioner

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106223A2 (en) * 1982-10-08 1984-04-25 Optical Coating Laboratory, Inc. Energy control window film systems and methods for manufacturing the same
CN2082839U (en) * 1990-08-23 1991-08-14 李世龙 Heating and refrigerating device
CN102569285A (en) * 2010-12-27 2012-07-11 北京印刷学院 Solar refrigeration and heating automatic temperature control vacuum glass
CN104879051A (en) * 2015-06-23 2015-09-02 湖南大学 Photovoltaic shutter semiconductor temperature-control energy-saving window
CN105757816A (en) * 2016-03-31 2016-07-13 青岛海尔空调器有限总公司 Window type semiconductor air conditioner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109555451A (en) * 2018-12-07 2019-04-02 范永浩 Semiconductor air-freshening window
CN109555451B (en) * 2018-12-07 2020-06-26 深圳朗信建筑装饰集团有限公司 Semiconductor fresh air window

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Application publication date: 20170531