CN206709439U - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
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- CN206709439U CN206709439U CN201720186845.3U CN201720186845U CN206709439U CN 206709439 U CN206709439 U CN 206709439U CN 201720186845 U CN201720186845 U CN 201720186845U CN 206709439 U CN206709439 U CN 206709439U
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- heat exchanger
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- semiconductor refrigerating
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Abstract
A kind of semiconductor cooling device, including casing, semiconductor refrigerating component and fan are the utility model is related to, the semiconductor refrigerating component includes semiconductor refrigerating block and heat exchanger；Heat storage pool is installed on the semiconductor refrigerating block, heat-conducting silicone grease is provided between semiconductor refrigerating block and the heat exchanger, heat-insulated fastener is additionally provided between the semiconductor refrigerating block and heat exchanger；The heat exchanger includes external heat exchanger and interior heat exchanger, and the external heat exchanger includes heat pipe and the finned heat exchanger below heat pipe；Between cabinet door and case lid and semiconductor periphery is respectively provided with the seal for dehumidifying.The semiconductor cooling device provided in above-mentioned technical proposal, simple in construction, making is easily, it can effectively prevent phonon from being flowed back from the surrounding of potsherd, and pass through the thermal conductive resin of vacuum capillary microcirculation copper heat pipe tip heat release, heat is quickly transported to the windward side of fan, heat is promptly dissipated, there is the advantages of efficiency high, decay is weak.
Description
Technical field
It the utility model is related to technical field of refrigerating devices, and in particular to a kind of semiconductor cooling device.
Background technology
With the fast development of China's economy, Cold Chain Logistics have gradually penetrated into our different social sectors,
Such as there are wide market prospects in vaccine dispatching, food delivery, the fresh dispatching industry of food, small semiconductor refrigerator makes
With also becoming universal, semiconductor refrigerating is also known as thermoelectric cooling, is mainly characterized in that：First, it is rapid without mechanical movement, refrigeration；2nd, use
Conveniently, it is widely used；3rd, the supply voltage of refrigerator is changed, it is possible to achieve refrigerating capacity continuously adjusts；4th, weight can be made
Gently, the semiconductor cooler of small volume.The core component of semiconductor cooling device is semiconductor refrigerating module, is imitated using Peltier
Principle is answered to be freezed, the semiconductor refrigerating block of general semiconductor refrigerating plant is clipped in the centre of internal-external heat exchanger device, while refrigeration,
While radiating, with the one independent small space in a casing besieged city, is carried out in the junction with semiconductor piece and internal-external heat exchanger device
Sealing.But there is following problem in current semiconductor cooling device：First, existing semiconductor refrigerating pellet, refrigeration turn
It is low to change efficiency；2nd, the heat-conducting glue used between semiconductor piece and heat exchanger, heat-conducting effect is poor, die-away time is short；3rd, semiconductor
The connection metal fastenings of block and heat exchanger, form heat and flow backwards, loss efficiency is big；4th, the radiating effect of common aluminum profile heat radiator
Rate is low；5th, influence of the moisture in air to refrigeration in device is not considered.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of good heat conduction effect, die-away time short semiconductor refrigerating
Device, it can not only improve the refrigerating efficiency of semiconductor refrigerating block, complete unidirectional high speed heat conduction function, moreover it is possible to effectively prevent external
Latent heat reduce start after post drop speed.
In order to solve the above technical problems, the utility model employs following technical scheme：A kind of semiconductor cooling device, bag
Casing, semiconductor refrigerating component and fan are included, the semiconductor refrigerating component includes semiconductor refrigerating block and heat exchanger；Described half
Heat storage pool is installed on conductor cold-making block, heat-conducting silicone grease is provided between the semiconductor refrigerating block and the heat exchanger, it is described
Heat-insulated fastener is additionally provided between semiconductor refrigerating block and heat exchanger；The heat exchanger includes external heat exchanger and interior heat exchanger,
The external heat exchanger includes heat pipe and installed in the anterior finned heat exchanger of heat pipe；Between the cabinet door and case lid, Yi Jiban
Conductor periphery is respectively provided with the seal for dehumidifying.
Further, the semiconductor refrigerating block includes alternate refrigeration diode group and phonon diode around arrangement
Group, the refrigeration diode group and phonon diode group are in the arrangement mode arrangement that inner ring is close, outer ring is lax.
Further, the semiconductor refrigerating block includes refrigeration diode group and phonon diode of the symmetrical ring around arrangement
Group, the refrigeration diode group and phonon diode group are in the arrangement mode arrangement that inner ring is close, outer ring is lax.
Further, the refrigeration diode group is respectively connected with phonon diode group by the way of series connection.
Further, the heat pipe is c-type vacuum capillary microcirculation copper heat pipe.
The semiconductor cooling device provided in above-mentioned technical proposal, using freeze diode group and phonon diode group it is effective
Arrangement mode, temperature is formed a gradient, central temperature is high, and ambient temperature is low, is easy to prevent phonon four from potsherd
Zhou Huiliu；Plus the combined use of finned heat exchanger and vacuum capillary microcirculation copper heat pipe, pass through vacuum capillary microcirculation copper heat
The thermal conductive resin of tip end heat release, heat is quickly transported to the windward side of fan, heat is promptly dissipated.
The beneficial effect of the utility model semiconductor cooling device is：Simple in construction, making easily, has efficiency high, declined
The advantages of decrease, and the refrigerating efficiency of semiconductor refrigerating block can be effectively improved；Simultaneously using vacuum capillary microcirculation copper heat pipe and
The combined use of finned heat exchanger is completed to make it have individual event high speed heat conduction function.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model semiconductor cooling device；
Fig. 2 is the structural representation of external heat exchanger；
Fig. 3 is a kind of arrangement mode schematic diagram of refrigeration diode group and generating diode group；
Fig. 4 is another arrangement mode schematic diagram of refrigeration diode group and generating diode group；
The structural representation of Fig. 5 seals between cabinet door and case lid；
Fig. 6 is the structural representation of semiconductor refrigerating block perimeter seal.
Embodiment
In order that the purpose of this utility model and advantage are more clearly understood, the utility model is entered with reference to embodiments
Row illustrates.It should be appreciated that following word is only to describe one or more of specific embodiments of the present utility model,
Considered critical is not carried out to the protection domain of the specific request of the utility model.
Embodiment 1
The technical scheme that the present embodiment is taken as shown in FIG. 1 to 3, a kind of semiconductor cooling device, including casing 1, half
Conductor cooling assembly and fan 3, the semiconductor refrigerating component include semiconductor refrigerating block 2 and heat exchanger；The semiconductor system
Heat storage pool is installed on cold piece 2, heat-conducting silicone grease is provided between the semiconductor refrigerating block 2 and the heat exchanger, it is described partly to lead
Heat-insulated fastener 21 is additionally provided between body cold-making block 2 and heat exchanger；The heat exchanger includes external heat exchanger 4 and interior heat exchanger 5,
The external heat exchanger 4 includes heat pipe 41 and installed in the anterior finned heat exchanger 42 of heat pipe 41；Between the cabinet door and case lid,
And semiconductor periphery is respectively provided with the seal 11 for dehumidifying.
Unbalance due to internal and external temperature conduction of velocity, semiconductor internal energy phonon is almost passed with the translational speed of electronics
Pass, but moved in outside in the form of the phonon of slow Brownian movement, such mismatch result in substantial amounts of phonon backflow
In the presence of；Solving phonon reflux problem has three kinds of schemes：First, the speed of slowing down inside phonon；Second, accelerate semiconductor
The speed of outside phonon；3rd, remaining backflow phonon recovery is generated electricity.In order to slow down inside semiconductor in the utility model
Phonon speed, micro- heat storage pool is installed at the both ends of semiconductor, pulls open the distance of upper and lower potsherd；It is to accelerate outside semiconductor simultaneously
The speed of portion's phonon, the utility model reduce the thickness of heat storage pool and fin, between uneven increase diode away from
From, be allowed to the gradient of Brownian movement fully coincide.
Freeze diode group and phonon diode group arrangement mode, institute are carried out in the present embodiment by the way of shown in Fig. 3
State semiconductor refrigerating block include it is alternate around arrangement refrigeration diode group and phonon diode group, it is described refrigeration diode group and
Phonon diode group is in the arrangement mode arrangement that inner ring is close, outer ring is lax.
Refrigeration diode group in above-mentioned technical proposal is respectively connected with phonon diode group by the way of series connection.
As shown in Fig. 2 the heat pipe is c-type vacuum capillary microcirculation copper heat pipe, using c-type vacuum capillary microcirculation copper heat
Pipe is used in combination with finned heat exchanger, by the thermal conductive resin of c-type vacuum capillary microcirculation copper heat pipe tip heat release, heat
Amount is rapidly transported to the windward side of fan, heat is easily pulled away and dissipates.
Heat conductive silica gel in the present embodiment uses the mixture of CNT, graphene and silicone grease, and the CNT,
The ratio of graphene and silicone grease is：1:1:2.Heat conductive silica gel is using with the addition of CNT and graphene, with overlength
Non-volatile cure cycle, liquid state is kept, so as to ensure that good heat conductivility.
Other heat-insulated fastener is the mixture of discontinuous wire and insulating materials, used here as discontinuous wire knot
Close macromolecule engineering thermal insulation material and make heat-insulated fastener, instead of trip bolt of the prior art, can effectively prevent condensation or
Heat flows backwards.
More specifically scheme is that seal 11 is with fluted sealing ring, and the seal is hydrogel and silica gel
Mixture is made.Anti- switch can be used during specific implementation（PNIPAM）With positive switch（Polyacrylamide）Macromolecule mixing dehumidifying work
Journey material hydrogel, makees the sealing ring between cabinet door case lid, as shown in figure 5, using double recess, makes cabinet door and case lid
Engagement it is compact, can effectively prevent external latent heat from reducing the post drop speed after start；Removed using anti-switch macromolecule
Wet engineering material hydrogel mixes with silica gel, makees the sealing ring between semiconductor refrigerating block periphery, as shown in fig. 6, using carrying
The sealing ring of groove, can have and be engaged between casing compact, prevent external latent heat from reducing the post drop speed after start.
Embodiment 2
It is same as Example 1 in addition to following technical proposals in the present embodiment：In the present embodiment by the way of shown in Fig. 4
Freeze diode group and phonon diode group arrangement mode are carried out, the semiconductor refrigerating block includes refrigeration of the symmetrical ring around arrangement
Diode group and phonon diode group, the refrigeration diode group and phonon diode group are in the row that inner ring is close, outer ring is lax
Row mode arranges.
Can be according to the adjustment increased or decreased to practical application effect in the range of 1~3 times when specifically used.This reality
The ratio for applying CNT in example, graphene and silicone grease is set to：1:1:3.
Embodiment 3
It is identical with embodiment 1 or embodiment 2 in addition to following technical proposals in the present embodiment：
Can be according to the adjustment increased or decreased to practical application effect in the range of 1 to 3 times when specifically used.This reality
The ratio for applying CNT in example, graphene and silicone grease is：1:1:1.
In a word, semiconductor cooling device provided by the utility model, make it is simple, using reliable, can effectively improve and partly lead
The refrigerating efficiency of body cold-making block, unidirectional high speed heat conduction function is completed, and can effectively solve the problem that the transformation efficiency that freezes in the prior art
Low, the problem of heat-conducting effect is poor.
Embodiment of the present utility model is explained in detail above in conjunction with accompanying drawing, but the utility model is not limited to
Embodiment is stated, for those skilled in the art, after content described in the utility model is known, not
Under the premise of departing from the utility model principle, some equal conversion can also be made to it and are substituted, these convert and substituted on an equal basis
Also should be regarded as belonging to the scope of protection of the utility model.
Claims (6)
1. a kind of semiconductor cooling device, including casing, semiconductor refrigerating component and fan, the semiconductor refrigerating component include
Semiconductor refrigerating block and heat exchanger；It is characterized in that：Heat storage pool, the semiconductor refrigerating are installed on the semiconductor refrigerating block
Heat-conducting silicone grease is provided between block and the heat exchanger, heat-insulated fastening is additionally provided between the semiconductor refrigerating block and heat exchanger
Part；The heat exchanger includes external heat exchanger and interior heat exchanger, and the external heat exchanger includes heat pipe and installed in the anterior wing of heat pipe
Piece heat exchanger；Between the cabinet door and case lid and semiconductor periphery is respectively provided with the seal for dehumidifying.
2. semiconductor cooling device according to claim 1, it is characterised in that：The semiconductor refrigerating block includes alternate ring
Around the refrigeration diode group and phonon diode group of arrangement, the refrigeration diode group and phonon diode group in inner ring it is close,
The lax arrangement mode arrangement in outer ring.
3. semiconductor cooling device according to claim 1, it is characterised in that：The semiconductor refrigerating block includes symmetrical ring
Around the refrigeration diode group and phonon diode group of arrangement, the refrigeration diode group and phonon diode group in inner ring it is close,
The lax arrangement mode arrangement in outer ring.
4. the semiconductor cooling device according to Claims 2 or 3, it is characterised in that：The refrigeration diode group and phonon
Diode group is respectively connected by the way of series connection.
5. semiconductor cooling device according to claim 1, it is characterised in that：The heat pipe follows for c-type vacuum capillary is micro-
Ring copper heat pipe.
6. semiconductor cooling device according to claim 1, it is characterised in that：The seal is with fluted sealing
Circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720186845.3U CN206709439U (en) | 2017-02-28 | 2017-02-28 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720186845.3U CN206709439U (en) | 2017-02-28 | 2017-02-28 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206709439U true CN206709439U (en) | 2017-12-05 |
Family
ID=60469451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720186845.3U Expired - Fee Related CN206709439U (en) | 2017-02-28 | 2017-02-28 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN206709439U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
| CN110648924A (en) * | 2019-09-04 | 2020-01-03 | 广东芯华微电子技术有限公司 | Large-board fan-out type chip packaging structure and manufacturing method thereof |
| WO2020215725A1 (en) * | 2019-04-24 | 2020-10-29 | 宿迁海沁节能科技有限公司 | Valve for blocking reflux of heat and cold in semiconductor thermoelectric refrigeration |
-
2017
- 2017-02-28 CN CN201720186845.3U patent/CN206709439U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
| WO2020215725A1 (en) * | 2019-04-24 | 2020-10-29 | 宿迁海沁节能科技有限公司 | Valve for blocking reflux of heat and cold in semiconductor thermoelectric refrigeration |
| CN110648924A (en) * | 2019-09-04 | 2020-01-03 | 广东芯华微电子技术有限公司 | Large-board fan-out type chip packaging structure and manufacturing method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171205 Termination date: 20190228 |
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| CF01 | Termination of patent right due to non-payment of annual fee |