CN206685408U - A kind of LED wafer support material guide device - Google Patents

A kind of LED wafer support material guide device Download PDF

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Publication number
CN206685408U
CN206685408U CN201720379609.3U CN201720379609U CN206685408U CN 206685408 U CN206685408 U CN 206685408U CN 201720379609 U CN201720379609 U CN 201720379609U CN 206685408 U CN206685408 U CN 206685408U
Authority
CN
China
Prior art keywords
pusher
led wafer
guide device
chip support
guide groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720379609.3U
Other languages
Chinese (zh)
Inventor
梅阳寒
舒雨锋
李笑勉
熊长炜
胡宗辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Polytechnic
Original Assignee
Dongguan Polytechnic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Polytechnic filed Critical Dongguan Polytechnic
Priority to CN201720379609.3U priority Critical patent/CN206685408U/en
Application granted granted Critical
Publication of CN206685408U publication Critical patent/CN206685408U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model discloses a kind of LED wafer support material guide device, it is characterised in that:It is provided with chip support guide groove, pusher and drive mechanism, the chip support guide groove side is provided with horizontal hollow slots, the pusher is provided with pusher pawl, the pusher pawl can transverse shifting be plugged in hollow slots side, the drive mechanism is provided with drive belt, the drive belt is set in parallel in chip support guide groove side, and the pusher connects the drive belt.The drive belt by drive mechanism of utility model drives pusher or so to slide laterally, pusher pawl ratchet when forward direction is mobile blocks chip support and slided in promoting chip support by chip support guide groove, pusher pawl ratchet in reverse movement departs from chip support and is moved to rear, then carries out chip support transfer next time.

Description

A kind of LED wafer support material guide device
Technical field
It the utility model is related to the technical field of LED wafer production equipment, and in particular to a kind of LED wafer support guide dress Put.
Background technology
LED circuit board after formation, typically has operator worker to be put into LED circuit board one piece in material frame for one piece, this Kind mode of operation labor strength is big, and operating efficiency is low, waste of manpower financial resources.
Utility model content
In order to solve the above problems, a kind of LED wafer support material guide device disclosed in the utility model.
Used technical scheme is the utility model to achieve the above object:
A kind of LED wafer support material guide device, it is characterised in that:It is provided with chip support guide groove, pusher and drive Motivation structure, the chip support guide groove side are provided with horizontal hollow slots, and the pusher is provided with pusher pawl, the pusher pawl Can transverse shifting be plugged in hollow slots side, the drive mechanism is provided with drive belt, and the drive belt is set in parallel in crystalline substance Plate rack guide groove side, the pusher connect the drive belt.
As a further improvement, described LED wafer support material guide device is additionally provided with mounting and fixing support, the chip support Guide groove is arranged on the left surface of mounting and fixing support, and the pusher and drive mechanism are arranged on the right side of mounting and fixing support Face.
As a further improvement, described LED wafer support material guide device is additionally provided with position-limit mechanism, the position-limit mechanism bag Two photoelectric sensors are included, are separately positioned on the both ends of mounting and fixing support bottom.
As a further improvement, the mounting and fixing support right flank is provided with guide rail, the guide rail be arranged in parallel with hollow slots.
As a further improvement, the pusher is provided with sliding block, the sliding block is flexibly connected with guide rail, the sliding block with Drive belt is fixedly connected.
As a further improvement, the drive mechanism is provided with two belt pulleys, the both ends of mounting and fixing support, institute are separately positioned on State drive belt and connect two belt pulleys.
As a further improvement, the pusher pawl is rotatably provided in upper end of slide block face.
As a further improvement, the pusher pawl front end is provided with ratchet, the ratchet is plugged in hollow slots.
As a further improvement, the chip support guide groove is Y-shaped structure, the chip support guide groove top is provided with and opened Mouthful.
The utility model has the advantage of:Drive belt of the present utility model by drive mechanism drives pusher left The right side slides laterally, and pusher pawl ratchet when forward direction is mobile blocks chip support and promotes chip support to pass through in chip support guide groove Slide, pusher pawl ratchet in reverse movement departs from chip support and is moved to rear, then carries out chip support next time Transfer.
Below in conjunction with the accompanying drawings with embodiment, the utility model is further illustrated.
Brief description of the drawings
Fig. 1 is the LED wafer support material guide device overall structure diagram of the present embodiment;
Fig. 2 is the pusher structural representation of the present embodiment;
Fig. 3 is the chip support guide barrel construction schematic diagram of the present embodiment.
In figure:1. chip support guide groove, 11. hollow slots, 12. openings, 2. pushers, 21. pusher pawls, 22. sliding blocks, 23. ratchet, 3. drive mechanisms, 31. drive belts, 32. belt pulleys, 4. mounting and fixing supports, 41. guide rails, 5. position-limit mechanisms, 51. Photoelectric sensor.
Embodiment
Embodiment, the LED wafer support material guide device provided referring to Fig. 1 ~ 3, the present embodiment, it is provided with chip support guide groove 1st, pusher 2, drive mechanism 3 and mounting and fixing support 4, the side of chip support guide groove 1 are provided with horizontal hollow slots 11, The pusher 2 is provided with pusher pawl 21, the pusher pawl 21 can transverse shifting be plugged in the side of hollow slots 11, the driving machine Structure 3 is provided with drive belt 31, and the drive belt 31 is set in parallel in the side of chip support guide groove 1, and the pusher 2 connects The drive belt 31, the chip support guide groove 1 are arranged on the left surface of mounting and fixing support 4, the pusher 2 and drive Motivation structure 3 is arranged on the right flank of mounting and fixing support 4.The right flank of mounting and fixing support 4 is provided with guide rail 41, the guide rail 41 with Hollow slots 11 be arranged in parallel.The chip support guide groove 1 is Y-shaped structure, and the top of chip support guide groove 1 is provided with opening 12. The pusher 2 is provided with sliding block 22, and the sliding block 22 is flexibly connected with guide rail 41, and the sliding block 22 is fixed with drive belt 31 Connection.
The LED wafer support material guide device is additionally provided with position-limit mechanism 5, and the position-limit mechanism 5 includes two photoelectric sensors 51, it is separately positioned on the both ends of the bottom of mounting and fixing support 4.
The drive mechanism 3 is provided with two belt pulleys 32, is separately positioned on the both ends of mounting and fixing support 4, the drive belt 31 two belt pulleys 32 of connection.
The pusher pawl 21 is rotatably provided in the upper surface of sliding block 22.The front end of pusher pawl 21 is provided with ratchet 23, described Ratchet 23 is plugged in hollow slots 11.
Operation principle of the present utility model:After motor receives LED support feeding signal, drive belt 31 drives pusher Structure 2 and pusher pawl 21 move to the left end of guide rail 41, during left end is moved to, the ratchet 23 of pusher pawl 21 and chip support Depart from;
After pusher pawl 21 moves to the left end of guide rail 41, motor reversion, drive belt 31 drives pusher 2 and pusher pawl 21 move to the right, and in moving process, the ratchet 23 of pusher pawl 21 is caught in chip support hollow part from hollow slots 11 and promotes chip Support moves in chip support guide groove 1, moves to the right-hand member of guide rail 41, completes a material transfer;
The extreme position that pusher pawl 21 moves on guide rail 41 is controlled by two photoelectric sensors 51.
The utility model is not limited to above-mentioned embodiment, using identical with the utility model above-described embodiment or approximate knot Structure or device, and other obtained are used for LED wafer support material guide device, within the scope of protection of the utility model.

Claims (9)

  1. A kind of 1. LED wafer support material guide device, it is characterised in that:It is provided with chip support guide groove, pusher and driving Mechanism, the chip support guide groove side are provided with horizontal hollow slots, and the pusher is provided with pusher pawl, and the pusher pawl can Transverse shifting is plugged in hollow slots side, and the drive mechanism is provided with drive belt, and the drive belt is set in parallel in chip Support guide groove side, the pusher connect the drive belt.
  2. 2. LED wafer support material guide device according to claim 1, it is characterised in that:It is additionally provided with mounting and fixing support, institute The left surface that chip support guide groove is arranged on mounting and fixing support is stated, the pusher and drive mechanism are arranged on installation and fixed The right flank of frame.
  3. 3. LED wafer support material guide device according to claim 2, it is characterised in that:It is additionally provided with position-limit mechanism, described Position-limit mechanism includes two photoelectric sensors, is separately positioned on the both ends of mounting and fixing support bottom.
  4. 4. LED wafer support material guide device according to claim 2, it is characterised in that:The mounting and fixing support right flank Provided with guide rail, the guide rail be arranged in parallel with hollow slots.
  5. 5. LED wafer support material guide device according to claim 4, it is characterised in that:The pusher is provided with sliding block, The sliding block is flexibly connected with guide rail, and the sliding block is fixedly connected with drive belt.
  6. 6. LED wafer support material guide device according to claim 4, it is characterised in that:The drive mechanism is provided with two skins Belt wheel, is separately positioned on the both ends of mounting and fixing support, and the drive belt connects two belt pulleys.
  7. 7. LED wafer support material guide device according to claim 5, it is characterised in that:The pusher pawl is rotatably set In upper end of slide block face.
  8. 8. LED wafer support material guide device according to claim 5, it is characterised in that:The pusher pawl front end is provided with spine Tooth, the ratchet are plugged in hollow slots.
  9. 9. LED wafer support material guide device according to claim 1, it is characterised in that:The chip support guide groove is Y words Shape structure, the chip support guide groove top are provided with opening.
CN201720379609.3U 2017-04-12 2017-04-12 A kind of LED wafer support material guide device Expired - Fee Related CN206685408U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720379609.3U CN206685408U (en) 2017-04-12 2017-04-12 A kind of LED wafer support material guide device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720379609.3U CN206685408U (en) 2017-04-12 2017-04-12 A kind of LED wafer support material guide device

Publications (1)

Publication Number Publication Date
CN206685408U true CN206685408U (en) 2017-11-28

Family

ID=60399726

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720379609.3U Expired - Fee Related CN206685408U (en) 2017-04-12 2017-04-12 A kind of LED wafer support material guide device

Country Status (1)

Country Link
CN (1) CN206685408U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113285000A (en) * 2021-05-14 2021-08-20 衢州职业技术学院 Film, mounting structure, LED chip structure, LED lamp and light beam angle adjusting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113285000A (en) * 2021-05-14 2021-08-20 衢州职业技术学院 Film, mounting structure, LED chip structure, LED lamp and light beam angle adjusting method

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171128

Termination date: 20180412

CF01 Termination of patent right due to non-payment of annual fee