CN206628458U - Power module package structure - Google Patents
Power module package structure Download PDFInfo
- Publication number
- CN206628458U CN206628458U CN201720225942.9U CN201720225942U CN206628458U CN 206628458 U CN206628458 U CN 206628458U CN 201720225942 U CN201720225942 U CN 201720225942U CN 206628458 U CN206628458 U CN 206628458U
- Authority
- CN
- China
- Prior art keywords
- power module
- framework
- module package
- package structure
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of power module package structure, the power module package structure includes：DBC substrates, located at the chip of the DBC substrates, and the lead frame with the DBC substrate connections；Wherein, the DBC substrates include printed circuit, and the chip and the lead frame are electrically connected in the printed circuit, so that the chip is electrically connected to each other with the lead frame.The traditional tactic pattern of power module package structural change of the present utility model, the chip of product and lead frame are mounted on DBC substrates, and using the printed circuit on DBC substrates, being electrically connected to each other between each component is realized, so as to meet the performance requirement of product.
Description
Technical field
It the utility model is related to technical field of semiconductors, more particularly to a kind of power module package structure.
Background technology
Chip carrier of the lead frame as integrated circuit is one kind by means of bonding material (spun gold, aluminium wire, copper wire etc.)
Realize the electrical connection of chip internal circuits exit and outer lead, form the key structure part of electric loop, it serve and
The function served as bridge of outer lead connection, is required for using lead frame in most semiconductor integrated blocks, is electronic information
Important basic material in industry.
There is the island for loading chip, chip is assemblied in by island on lead frame in existing power device packaging structure
On lead frame, there is the requirement that embedding power model makes plastic packaging power model into however as client, existing lead frame can not meet
The performance requirement of product.
Utility model content
In view of this, asked the utility model proposes a kind of power package structure of new structure with solving above-mentioned technology
Topic.
In order to achieve the above object, technical scheme is used by the utility model：
A kind of power module package structure, including：DBC substrates, located at the chip of the DBC substrates, and with the DBC
The lead frame of substrate connection；
Wherein, the DBC substrates include printed circuit, and the chip and the lead frame are electrically connected in the printing
Circuit, so that the chip is electrically connected to each other with the lead frame.
The utility model power module package structure further improvement is that, the lead frame includes the first framework and the
Two frameworks；First framework is located at the opposite end of the DBC substrates with the second framework respectively, and the chip is located at institute
State between the first framework and the second framework.
The utility model power module package structure further improvement is that, first framework includes the first pin,
The second framework includes second pin；Wherein, first framework is connected to the printed circuit by first pin
One end, the other end that the printed circuit is connected to by the second pin.
The utility model power module package structure further improvement is that, in addition on the DBC substrates
Circuit brake, the circuit brake are electrically connected to the printed circuit.
The utility model power module package structure further improvement is that, the circuit brake to be multiple, point
The both sides of the DBC substrates are not arranged at.
The utility model power module package structure further improvement is that, the circuit brake include electric capacity and
Resistance.
The technical scheme that embodiment of the present utility model provides can include the following benefits：Power of the present utility model
Module encapsulation construction changes traditional tactic pattern, and the chip of product and lead frame are mounted on DBC substrates, and is utilized
Printed circuit on DBC substrates, being electrically connected to each other between each component is realized, so as to meet the performance need of product
Ask.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
The utility model can be limited.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram of power module package structure shown in the exemplary embodiment of the application one；
Fig. 2 is a kind of top view of power module package structure shown in the exemplary embodiment of the application one；
Fig. 3 is a kind of side view of power module package structure shown in the exemplary embodiment of the application one；
Fig. 4 is the structural representation of multiple lead frames shown in the exemplary embodiment of the application one；
Fig. 5 is the structural representation of the single lead frame shown in the exemplary embodiment of the application one.
Embodiment
The utility model is described in detail below with reference to embodiment shown in the drawings.But these embodiment party
Formula is not intended to limit the utility model, structure that one of ordinary skill in the art is made according to these embodiments, method or
Conversion functionally is all contained in the scope of protection of the utility model.
It is only merely for the purpose of description specific embodiment in the term that the utility model uses, and is not intended to be limiting this reality
With new." one kind ", " described " and "the" of singulative used in the utility model and appended claims
It is intended to include most forms, unless context clearly shows that other implications.It is also understood that term used herein " and/
Or " refer to and any or all may be combined comprising the associated list items purposes of one or more.
As shown in Figure 1 to Figure 3, power module package structure of the present utility model is based on using DBC substrates (Direct
Bonding Copper, cover copper ceramic substrate) 11 it is further improved, replaced using DBC substrates 11 on traditional lead frame
Island, chip 12 is arranged on DBC substrates 11, while lead frame 13 also is secured on DBC substrates 11, pass through this kind of structure
Connected mode, the design for solving the problems, such as existing lead frame can not meet the performance requirement of product.
Power module package structure 100 of the present utility model includes：DBC substrates 11, located at the chip 12 of DBC substrates 11,
And the lead frame 13 being connected with DBC substrates 11.Wherein, DBC substrates 11 include printed circuit (not shown), chip 12 and lead
Frame 13 is electrically connected in printed circuit, so that chip 12 is electrically connected to each other with lead frame 13.In the utility model, why make
With DBC substrates 11 replace conventional lead frame on island, be because DBC substrates 11 have excellent thermal conduction characteristic, high-insulativity,
High current bearing capacity, excellent soldering resistance and high-adhesion, and can be as PCB (Printed Circuit Board, print
Printed circuit board) various line patterns can be equally etched, can meet the needs of chip coexists with multiple components.In this implementation
In example, chip 12 is by SMT (Surface Mount Technology, surface mounting technology) process Installation in DBC substrates 11
On.
As shown in Figures 1 to 5, in embodiment of the present utility model, the lead frame 13 includes the first framework 131 and second
Framework 132.First framework 131 is located at the opposite end of DBC substrates 11 with second framework 132 respectively, and chip 12 is located at the first frame
Between body 131 and second framework 132.In the present embodiment, the first framework 131 and second framework 132 are arranged on DBC substrates 11
Edge, it can not only reduce and take the space surface of DBC substrates 11, and be easy to be electrically connected by lead frame 13 and other modules
Connect.
Further, the first framework 131 includes the first pin (not shown), and second framework 132 (is not schemed including second pin
Show)；Wherein, the first framework 131 is connected to one end of printed circuit by the first pin, and second framework 132 passes through second pin
It is connected to the other end of printed circuit.Given zone of first pin with second pin by way of routing with DBC substrates 11
Domain is connected, so that the first pin and second pin are connected to printed circuit.Wherein it is possible to according to the design of DBC substrates 11,
The rational size and length for arranging pin.
In addition, power module package structure 100 of the present utility model also includes the circuit brake on DBC substrates 11
Part 14, to protect the circuit of power module package structure 100, the circuit brake 14 is electrically connected to printed circuit.This reality
Apply in example, circuit brake 14 is multiple, is respectively arranged at the both sides of DBC substrates 11.Wherein, circuit brake 14 includes
Electric capacity and resistance, certainly, circuit brake 14 of the present utility model are not limited to electric capacity and resistance, and other kinds of circuit is protected
Shield device is also contained in the utility model.
The traditional tactic pattern of power module package structural change of the present utility model, by the chip and lead frame of product
It is mounted on DBC substrates, and using the printed circuit on DBC substrates, realizes being electrically connected to each other between each component, from
And the performance requirement of product can be met.
Those skilled in the art will readily occur to this practicality after considering specification and putting into practice utility model disclosed herein
New other embodiments.The application is intended to any modification, purposes or adaptations of the present utility model, these
Modification, purposes or adaptations follow general principle of the present utility model and including undocumented skills of the utility model
Common knowledge or conventional techniques in art field.Description and embodiments be considered only as it is exemplary, it is of the present utility model
True scope and spirit are pointed out by claims hereof.
It should be appreciated that the accurate knot that the utility model is not limited to be described above and is shown in the drawings
Structure, and various modifications and changes can be being carried out without departing from the scope.The scope of the utility model only will by appended right
Ask to limit.
Claims (6)
- A kind of 1. power module package structure, it is characterised in that including：DBC substrates, located at the chip of the DBC substrates, and With the lead frame of the DBC substrate connections；Wherein, the DBC substrates include printed circuit, and the chip and the lead frame are electrically connected in the printing electricity Road, so that the chip is electrically connected to each other with the lead frame.
- 2. power module package structure according to claim 1, it is characterised in that the lead frame include the first framework and Second framework；First framework is located at the opposite end of the DBC substrates with the second framework respectively, and the chip is located at Between first framework and the second framework.
- 3. power module package structure according to claim 2, it is characterised in that first framework is drawn including first Pin, the second framework include second pin；Wherein, first framework is connected to the printing electricity by first pin The one end on road, the other end that the printed circuit is connected to by the second pin.
- 4. power module package structure according to claim 1, it is characterised in that also include on the DBC substrates Circuit brake, the circuit brake is electrically connected to the printed circuit.
- 5. power module package structure according to claim 4, it is characterised in that the circuit brake to be multiple, It is respectively arranged at the both sides of the DBC substrates.
- 6. the power module package structure according to claim 4 or 5, it is characterised in that the circuit brake includes Electric capacity and resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720225942.9U CN206628458U (en) | 2017-03-08 | 2017-03-08 | Power module package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720225942.9U CN206628458U (en) | 2017-03-08 | 2017-03-08 | Power module package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206628458U true CN206628458U (en) | 2017-11-10 |
Family
ID=60211775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720225942.9U Active CN206628458U (en) | 2017-03-08 | 2017-03-08 | Power module package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206628458U (en) |
-
2017
- 2017-03-08 CN CN201720225942.9U patent/CN206628458U/en active Active
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| GR01 | Patent grant |