CN206614138U - 激光输出装置 - Google Patents

激光输出装置 Download PDF

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Publication number
CN206614138U
CN206614138U CN201720101985.6U CN201720101985U CN206614138U CN 206614138 U CN206614138 U CN 206614138U CN 201720101985 U CN201720101985 U CN 201720101985U CN 206614138 U CN206614138 U CN 206614138U
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China
Prior art keywords
laser
light
output device
along
axis
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Active
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CN201720101985.6U
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English (en)
Chinese (zh)
Inventor
奥间惇治
长尾光洋
伊崎泰则
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Priority to CN201721290849.2U priority Critical patent/CN207606395U/zh
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Publication of CN206614138U publication Critical patent/CN206614138U/zh
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  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN201720101985.6U 2016-01-28 2017-01-26 激光输出装置 Active CN206614138U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721290849.2U CN207606395U (zh) 2016-01-28 2017-01-26 激光输出装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-014513 2016-01-28
JP2016014513A JP6925778B2 (ja) 2016-01-28 2016-01-28 レーザ出力装置及びレーザ加工装置

Related Child Applications (1)

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CN201721290849.2U Division CN207606395U (zh) 2016-01-28 2017-01-26 激光输出装置

Publications (1)

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CN206614138U true CN206614138U (zh) 2017-11-07

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CN201721290849.2U Active CN207606395U (zh) 2016-01-28 2017-01-26 激光输出装置
CN201720101985.6U Active CN206614138U (zh) 2016-01-28 2017-01-26 激光输出装置

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CN201721290849.2U Active CN207606395U (zh) 2016-01-28 2017-01-26 激光输出装置

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JP (2) JP6925778B2 (ja)
CN (2) CN207606395U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111886760A (zh) * 2018-03-27 2020-11-03 株式会社藤仓 激光模块及激光装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021086902A (ja) * 2019-11-27 2021-06-03 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04200892A (ja) * 1990-11-29 1992-07-21 Kitagawa Iron Works Co Ltd レーザ加工装置におけるレーザビーム伝送装置
JPH0521463U (ja) * 1991-08-30 1993-03-19 安藤電気株式会社 2波合波光モジユール
JP3509226B2 (ja) * 1994-10-31 2004-03-22 ソニー株式会社 レーザ加工装置及び方法
JP2000202655A (ja) * 1999-01-08 2000-07-25 Toray Eng Co Ltd レ―ザ―マ―キング装置
WO2008053915A1 (fr) * 2006-11-02 2008-05-08 Nabtesco Corporation Système optique de balayage, dispositif de traitement laser et dispositif optique de balayage
US8126028B2 (en) * 2008-03-31 2012-02-28 Novasolar Holdings Limited Quickly replaceable processing-laser modules and subassemblies
JP5254761B2 (ja) * 2008-11-28 2013-08-07 浜松ホトニクス株式会社 レーザ加工装置
JP2010155258A (ja) * 2008-12-26 2010-07-15 Toray Eng Co Ltd 基板処理装置
JP5467345B2 (ja) * 2009-06-05 2014-04-09 パナソニック株式会社 ディスプレイパネルへの塗布方法およびディスプレイパネルの製造方法
JP4651731B2 (ja) * 2009-07-29 2011-03-16 西進商事株式会社 レーザースクライブ加工方法
JP5349406B2 (ja) * 2010-06-01 2013-11-20 三菱電機株式会社 偏光方位角調整装置およびレーザ加工装置
JP5506646B2 (ja) * 2010-12-03 2014-05-28 住友重機械工業株式会社 レーザ加工装置及び光軸調整方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111886760A (zh) * 2018-03-27 2020-11-03 株式会社藤仓 激光模块及激光装置
CN111886760B (zh) * 2018-03-27 2023-07-28 株式会社藤仓 激光模块及激光装置

Also Published As

Publication number Publication date
JP2021100766A (ja) 2021-07-08
JP6925778B2 (ja) 2021-08-25
JP2017131947A (ja) 2017-08-03
JP7182654B2 (ja) 2022-12-02
CN207606395U (zh) 2018-07-13

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