CN206594617U - The cooling stand of fixed heat conducting pipe - Google Patents

The cooling stand of fixed heat conducting pipe Download PDF

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Publication number
CN206594617U
CN206594617U CN201720308267.6U CN201720308267U CN206594617U CN 206594617 U CN206594617 U CN 206594617U CN 201720308267 U CN201720308267 U CN 201720308267U CN 206594617 U CN206594617 U CN 206594617U
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China
Prior art keywords
base
heat conducting
conducting pipe
cover plate
cooling stand
Prior art date
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Active
Application number
CN201720308267.6U
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Chinese (zh)
Inventor
姚镇涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Same Trade Electronic Technology Co Ltd
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Suzhou Same Trade Electronic Technology Co Ltd
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Priority to CN201720308267.6U priority Critical patent/CN206594617U/en
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Publication of CN206594617U publication Critical patent/CN206594617U/en
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides the cooling stand of fixed heat conducting pipe, and it includes base and cover plate, and base and cover plate are formed by magnesium alloy cast, and cover plate is covered in the front of base, and is screwed;The side of cover plate, which has to be provided with altogether in a die cavity to lower recess, die cavity on one piece of support plate stretched out, base and straight panel, to be used to place heat conducting pipe;There is a through hole, through hole is provided with the bridge arched upward upwards close to support plate end in support plate.After heat conducting pipe is placed in die cavity, its one end is passed through from the lower section of bridge, then with cover plate is limited heat conducting pipe and to be fixed on base being permanently fixed for i.e. achievable heat conducting pipe.

Description

The cooling stand of fixed heat conducting pipe
Technical field
The utility model is related to radiator, more particularly to a kind of cooling stand of fixed heat conducting pipe.
Background technology
Heat dissipation element in notebook computer is mainly made up of radiator fan and heat radiation module, heat radiation module by heat absorbing member, Heat conducting pipe and radiating piece composition, radiating piece are arranged on radiator fan, and heat absorbing member is fitted on the mainboard of notebook, and heat conducting pipe connects It is connected between heat absorbing member and radiating piece.Be substantially prolate shape for the heat conducting pipe in notebook computer, the length of heat conducting pipe compared with Long, it is therefore desirable to a cooling stand for being used to fix heat conducting pipe is set in notebook computer, heat conducting pipe relies primarily on heat conduction Glue is fixed in the plane of cooling stand, and under operation high temperature, heat-conducting glue easily aging, heat conducting pipe takes off easily from cooling stand From becoming no stationary state.
Utility model content
In order to solve the above technical problems, the purpose of this utility model is to provide a kind of cooling stand of fixed heat conducting pipe, It fixes heat conducting pipe by the way of sealed fixation.
To reach above-mentioned purpose, the technical solution of the utility model is as follows:
The cooling stand of fixed heat conducting pipe, it includes base and cover plate, and the base and cover plate are by magnesium alloy cast Into the cover plate covers the front in the base, and is screwed;What the side of the cover plate stretched out with one piece Being provided with altogether in a die cavity to lower recess, the die cavity on support plate, the base and straight panel is used to place heat conducting pipe;The branch There is a through hole, the through hole is provided with the bridge arched upward upwards close to support plate end in plate.
It is preferred that, the bottom of the base has several double wedges, and the double wedge is pressed on the mainboard of notebook.
Preferably, screw hole is provided with four angles of the cover plate and base, through the screw of the screw hole Just it is locked on the mainboard of notebook.
Compared with prior art, the utility model has the advantages that:After 1. heat conducting pipe is placed in die cavity, its one end is from bridge Lower section pass through, then with cover plate heat conducting pipe is limited and to be fixed on base being permanently fixed for i.e. achievable heat conducting pipe;2. magnesium is closed Gold utensil has preferably heat conductivility, and the partial heat on mainboard can be delivered to heat conducting pipe, enhanced by the double wedge of base bottom The heat dispersion of notebook;3. the fixation of cover plate and base, and the fixation of base and notebook mainboard use same group of spiral shell Silk, assembling of being more convenient for.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the utility model embodiment The accompanying drawing to be used is briefly described.
Fig. 1 is the explosive view of the cooling stand disclosed in embodiment;
Fig. 2 is the stereogram of the cooling stand for being mounted with heat conducting pipe disclosed in embodiment;
Fig. 3 is the stereogram of the base disclosed in embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe.
Referring to the cooling stand shown in Fig. 1 and 2, it includes base 1 and cover plate 2, and base and cover plate are by magnesium alloy cast Form, cover plate is covered in the front of base, and is screwed;The side of cover plate has one piece of support plate 3 stretched out, base It is used to place heat conducting pipe with being provided with altogether in straight panel in a die cavity 4 to lower recess, die cavity;There is a through hole 5 in support plate, lead to Hole is provided with the bridge 6 arched upward upwards close to support plate end.After heat conducting pipe 7 is placed in die cavity, its one end is from the lower section of bridge Pass through, then with cover plate heat conducting pipe is limited and to be fixed on base being permanently fixed for i.e. achievable heat conducting pipe.Preferably, it is described Screw hole 9 is provided with four angles of cover plate and base, the screw through the screw hole is just locked in the mainboard of notebook On.The fixation of cover plate and base, and the fixation of base and notebook mainboard use same group of screw, assembling of being more convenient for.
Referring to Fig. 3, the bottom of base has several double wedges 8, and double wedge is pressed on the mainboard of notebook.Magnesium alloy have compared with Partial heat on mainboard can be delivered to heat conducting pipe by good heat conductivility, the double wedge of base bottom, enhance notebook Heat dispersion.
A variety of modifications to these embodiments will be apparent for those skilled in the art, herein Defined General Principle can be real in other embodiments in the case where not departing from spirit or scope of the present utility model It is existing.Therefore, the utility model is not intended to be limited to the embodiments shown herein, and be to fit to it is disclosed herein The principle most wide scope consistent with features of novelty.

Claims (3)

1. fix the cooling stand of heat conducting pipe, it is characterised in that it includes base and cover plate, and the base and cover plate are closed by magnesium Gold casting is formed, and the cover plate covers the front in the base, and is screwed;The side of the cover plate have one piece to Being provided with altogether in a die cavity to lower recess, the die cavity on the support plate of outer extension, the base and straight panel is used to place heat conduction Pipe;There is a through hole, the through hole is provided with the bridge arched upward upwards close to support plate end in the support plate.
2. the cooling stand of fixed heat conducting pipe according to claim 1, it is characterised in that the bottom of the base has number Bar double wedge, the double wedge is pressed on the mainboard of notebook.
3. the cooling stand of fixed heat conducting pipe according to claim 2, it is characterised in that four of the cover plate and base Screw hole is provided with angle, the screw through the screw hole is just locked on the mainboard of notebook.
CN201720308267.6U 2017-03-27 2017-03-27 The cooling stand of fixed heat conducting pipe Active CN206594617U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720308267.6U CN206594617U (en) 2017-03-27 2017-03-27 The cooling stand of fixed heat conducting pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720308267.6U CN206594617U (en) 2017-03-27 2017-03-27 The cooling stand of fixed heat conducting pipe

Publications (1)

Publication Number Publication Date
CN206594617U true CN206594617U (en) 2017-10-27

Family

ID=60123037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720308267.6U Active CN206594617U (en) 2017-03-27 2017-03-27 The cooling stand of fixed heat conducting pipe

Country Status (1)

Country Link
CN (1) CN206594617U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111857288A (en) * 2020-07-13 2020-10-30 西安高达智能仪器仪表有限公司 Computer waste heat utilization and dual-purpose water cooling system of heat dissipation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111857288A (en) * 2020-07-13 2020-10-30 西安高达智能仪器仪表有限公司 Computer waste heat utilization and dual-purpose water cooling system of heat dissipation
CN111857288B (en) * 2020-07-13 2022-11-11 北京环渤高科能源技术有限公司 Computer waste heat utilization and dual-purpose water cooling system of heat dissipation

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