CN206553626U - A kind of detachable chemical vapor deposition spray equipment - Google Patents

A kind of detachable chemical vapor deposition spray equipment Download PDF

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Publication number
CN206553626U
CN206553626U CN201720210923.9U CN201720210923U CN206553626U CN 206553626 U CN206553626 U CN 206553626U CN 201720210923 U CN201720210923 U CN 201720210923U CN 206553626 U CN206553626 U CN 206553626U
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CN
China
Prior art keywords
spray
top plate
detachable
chemical vapor
vapor deposition
Prior art date
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Active
Application number
CN201720210923.9U
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Chinese (zh)
Inventor
甘志银
沈桥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Zhongyuan Semiconductor Technology Co., Ltd.
Original Assignee
GUANGDONG REALFAITH SEMICONDUCTOR EQUIPMENT CO Ltd
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Priority to CN201720210923.9U priority Critical patent/CN206553626U/en
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Abstract

The utility model discloses a kind of detachable chemical vapor deposition spray equipment, mainly it is made up of gas mixing chamber, shower plate, shower and detachable top plate, it is characterized in that adding one layer of detachable roof on the basis of existing spray equipment, the top plate keeps the spray face after detachable top plate temperature and cooling to tend to consistent by thermally contacting point and spray good thermal conductivity.The utility model has the advantages that detachable top plate can simplify existing spray manufacturing process, the processing request to former spray face is reduced, it is possible to individually unload cleaning, there is actively impact to improving processing quality.

Description

A kind of detachable chemical vapor deposition spray equipment
Technical field
The utility model is related to chemical vapor depsotition equipment, more particularly, to the spray equipment of chemical vapor depsotition equipment.
Background technology
Chemical vapor deposition(CVD)Technology collection precision optical machinery, semi-conducting material, vacuum electronic, hydrodynamics, optics, change Learn, computer is multidisciplinary is integrated, be the advanced semiconductor material that a kind of automaticity is high, expensive, integration ofTechnology degree is high Material, opto-electronic device manufacture special equipment.Chemical vapor depsotition equipment as compound semiconductor materials epitaxial growth ideal Method, with quality is high, stability is good, reproducible, technique flexibly, can scale volume production the features such as, have become industry life The key core equipment of semiconductor photoelectric device and microwave device is produced, is had broad application prospects and industrialization value.
The reaction environment of chemical vapor deposition spray equipment is very harsh, often is faced with high temperature, corrosive gas, pre-deposition Reaction etc., it is global design to cause existing vapor deposition apparatus spray equipment, and spray requires frequent maintenance and replacement, including spray Drenching surface deposition pollution needs often cleaning, or because spray hole plug, or even spray are scrapped, causes production cost to be held high very much It is expensive.Regular maintenance, the also significant wastage production time is cleaned, reduce production efficiency.
The content of the invention
The purpose of this utility model is to provide a kind of spray equipment of chemical vapor depsotition equipment, reduces spray maintaining Interval time, reduce production cost.
The technical scheme that this patent is used is that a kind of detachable chemical vapor deposition spray equipment is main to include spray (2), spray air inlet(1), gas mixing chamber(5), shower(6), cooling water inlet(3), coolant outlet(4), shower water Cold chamber(7)Deng, it is characterised in that spray(2)Bottom surface is provided with detachable top plate(8), detachable top plate(8)By removably connecting Mode and spray(2)Bottom surface is connected, the detachable top plate(8)Top cloth is provided with thermo-contact point(9), thermo-contact point(9)By Prepared by heat conduction good material, respectively with detachable top plate(8)Top surface and spray(2)Bottom surface is contacted, and plays detachable top plate(8)And spray (2)Between conductive force, detachable top plate(8)Upper distribution is provided through hole(10), make the shower of protrusion(6)It can extend into Corresponding through hole(10)In.
Preferably, the detachable top plate of above-mentioned detachable chemical vapor deposition spray equipment(8)With spray(2)Bottom surface is connected Mode is fixed for bolt connection, and bolt connection is simple and reliable, easy to disassemble and replacing.
Preferably, the detachable top plate of above-mentioned detachable chemical vapor deposition spray equipment(8)Thermo-contact point(9)Material is By the metal material that thermal conductivity is good and vapour pressure is relatively low, such as aluminium, copper material are constituted, kept away to realize while good heat conductive Exempt from chemical vapor deposition to be disturbed by impurity.
Preferably, the detachable top plate of above-mentioned detachable chemical vapor deposition spray equipment(8)Thickness is arranged on 2-10mm It is advisable, detachable top plate(8)Thickness is blocked up to have considerable influence to reacting gas air-flow, and cost is also too high, excessively thin then easily deformable.
In general, by the contemplated above technical scheme of the utility model compared with prior art, have with following Beneficial effect:
1st, the design of detachable top plate, is simplified former spray surface treatment, the working process of shower protrusion, reduces To the processing request of former spray face, spray production cost is reduced.
2nd, detachable top plate can individually unload cleaning, can so avoid the replacing and maintenance of spray, reduce and be produced into This, improves production efficiency.
3rd, the thermo-contact point set at the top of detachable top plate can ensure that detachable top plate tends to the spray face temperature after cooling Unanimously, with stable and suppression detachable top plate the deformation in keeping temperature border, the setting for thermally contacting point is simple, reliable, makes removable top Plate is simple and reliable.
4th, detachable top plate can design different surface appearances as needed, such as pass through different roughness, material modification Thermo parameters method in spray reaction chamber can be optimized by changing slin emissivity, add process window, to improving processing quality tool There is actively impact.
Brief description of the drawings
Fig. 1 is the schematic diagram of the detachable chemical vapor depsotition equipment spray equipment of the utility model.
In all of the figs, identical reference is used for representing identical element or structure, wherein:1- sprays air inlet Mouthful, 2- sprays, 3- cooling water inlets, 4- coolant outlets, 5- gas mixing chambers, 6- showers, 7- spray waterways, 8- is removable Top plate, 9- thermo-contact points, 10- through holes, 11- substrates, 12- slide holders.
Embodiment
Embodiment of the present utility model is further illustrated below in conjunction with the accompanying drawings, and Fig. 1 is according to embodiment party of the present utility model The structural representation diagram of formula device.It should be understood that Fig. 1 emphasis illustrates to be implemented according to the utility model disclosed in the utility model The component of mode device, that is to say, that these accompanying drawings be not intended to illustrate in the utility model device each is independent Component.
The technical scheme that this patent is used is that a kind of detachable chemical vapor deposition spray equipment is main to include spray 2nd, spray air inlet 1, gas mixing chamber 5, shower 6, cooling water inlet 3, coolant outlet 4, spray waterway 7 etc., it is special Levy and be that spraying 2 bottom surfaces is provided with detachable top plate 8, detachable top plate 8 is fitted company by dismountable connected mode with spraying 2 bottom surfaces Connect, the top cloth of detachable top plate 8 is provided with thermo-contact point 9, thermo-contact point 9 is prepared by heat conduction good material, respectively with can Tear the top surface of top plate 8 and the contact of 2 bottom surfaces of spray open, play to be distributed setting on the conductive force between detachable top plate 8 and spray 2, detachable top plate 8 Through hole 10 is equipped with, the shower 6 of protrusion is extend into corresponding through hole 10.Reacting gas passes sequentially through spray 2 Spray air inlet 1, gas mixing chamber 5, the through hole 10 of shower 6 and detachable top plate be input in reaction cavity, carrying Material needed for physical-chemical reaction deposition occurs for the surface of substrate 11 on piece platform 12.
Preferably, the detachable top plate 8 of above-mentioned detachable chemical vapor deposition spray equipment is fitted and connected with 2 bottom surfaces of spray Mode is fixed for bolt connection, and bolt connection is simple and reliable, easy to disassemble and replacing.
Preferably, the thermo-contact of detachable top plate 89 materials of point of above-mentioned detachable chemical vapor deposition spray equipment are by leading The metal material that heating rate is good and vapour pressure is relatively low, such as aluminium, copper material composition, avoiding while to realize good heat conductive Vapour deposition is learned to be disturbed by impurity.
Preferably, the thickness of detachable top plate 8 of above-mentioned detachable chemical vapor deposition spray equipment is arranged on 2-10mm and is Preferably, the thickness of detachable top plate 8 is blocked up has considerable influence to reacting gas air-flow, and cost is also too high, excessively thin then easily deformable.
It is described above to be merely exemplary for the utility model, and nonrestrictive, those of ordinary skill in the art Understanding, in the case where not departing from the spirit and scope that claim is limited, can be made according to the disclosure above content change, Modification is equivalent, but falls within protection domain of the present utility model.
Above-described embodiment is the one of which of the utility model more preferably embodiment, and the utility model is not It is defined in this.Any those skilled in the art, do not depart from the usual change that is carried out in spirit and scope of the present utility model and Replacing should all be included in protection domain of the present utility model.

Claims (4)

1. a kind of detachable chemical vapor deposition spray equipment, main to include spray(2), spray air inlet(1), gas mixing Chamber(5), shower(6), cooling water inlet(3), coolant outlet(4), spray waterway(7)Deng, it is characterised in that spray(2) Bottom surface is provided with detachable top plate(8), detachable top plate(8)Pass through dismountable connected mode and spray(2)Bottom surface connect, it is described can Tear top plate open(8)Top cloth is provided with thermo-contact point(9), thermo-contact point(9)Prepared by heat conduction good material, respectively with removable top Plate(8)Top surface and spray(2)Bottom surface is contacted, and plays detachable top plate(8)And spray(2)Between conductive force, detachable top plate(8)On Distribution is provided through hole(10), make the shower of protrusion(6)Corresponding through hole can be extend into(10)In.
2. detachable chemical vapor deposition spray equipment as claimed in claim 1, it is characterised in that the detachable top plate(8) With spray(2)Bottom surface releasable connection mode is fixed for bolt connection.
3. detachable chemical vapor deposition spray equipment as claimed in claim 1, it is characterised in that the detachable top plate(8) Thickness is 2-10mm.
4. detachable chemical vapor deposition spray equipment as claimed in claim 1, it is characterised in that the thermo-contact point(9) Material is that, by the metal material that thermal conductivity is good and vapour pressure is relatively low, such as aluminium, copper material are constituted.
CN201720210923.9U 2017-03-06 2017-03-06 A kind of detachable chemical vapor deposition spray equipment Active CN206553626U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720210923.9U CN206553626U (en) 2017-03-06 2017-03-06 A kind of detachable chemical vapor deposition spray equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720210923.9U CN206553626U (en) 2017-03-06 2017-03-06 A kind of detachable chemical vapor deposition spray equipment

Publications (1)

Publication Number Publication Date
CN206553626U true CN206553626U (en) 2017-10-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720210923.9U Active CN206553626U (en) 2017-03-06 2017-03-06 A kind of detachable chemical vapor deposition spray equipment

Country Status (1)

Country Link
CN (1) CN206553626U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110835751A (en) * 2018-08-17 2020-02-25 东京毅力科创株式会社 Valve device, processing device, and control method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110835751A (en) * 2018-08-17 2020-02-25 东京毅力科创株式会社 Valve device, processing device, and control method
CN110835751B (en) * 2018-08-17 2022-05-06 东京毅力科创株式会社 Valve device, processing device, and control method

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CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 528251 1, No. 5, Nanzhou street, Ping Zhou, Nanhai District, Foshan, Guangdong

Patentee after: Guangdong Zhongyuan Semiconductor Technology Co., Ltd.

Address before: 528251 Zhaoxin Semiconductor Co., Ltd., Jingu Photoelectric Industry Community, Nangang Road, Pingzhou, Nanhai District, Foshan City, Guangdong Province

Patentee before: Guangdong RealFaith Semiconductor Equipment Co., Ltd.