CN206490788U - A kind of MEMS microphone shell structure - Google Patents
A kind of MEMS microphone shell structure Download PDFInfo
- Publication number
- CN206490788U CN206490788U CN201621385144.4U CN201621385144U CN206490788U CN 206490788 U CN206490788 U CN 206490788U CN 201621385144 U CN201621385144 U CN 201621385144U CN 206490788 U CN206490788 U CN 206490788U
- Authority
- CN
- China
- Prior art keywords
- plate
- inwall
- top plate
- step surface
- right plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The utility model discloses a kind of MEMS microphone shell structure, including the outer cover body being made of ceramic material, the inwall of outer cover body, which has, is connected with gold thread pad on step surface, step surface.The utility model has following technique effect using above-mentioned technical proposal：Shell structure uses ceramic material, solves the Insulation Problems of MEMS pieces substrate and shell bonding plane；Small terminal plate need not additionally be increased again to realize that electrical connection is acted on, material is saved, reduce cost and improve production efficiency；Shell structure uses ceramic material, and hardness is larger, and pressure not easily leads to casing deformation, and the Sensitivity Stability of product is significantly improved.
Description
Technical field
The utility model is related to MEMS microphone technical field, more particularly to a kind of MEMS microphone shell structure.
Background technology
Signal to noise ratio is an important indicator of MEMS microphone, and client is also constantly proposing that higher and higher signal to noise ratio need to
Ask, existing advance sound structure is as shown in figure 1, the shell, the terminal plate that are made including metal material, MEMS pieces are connected to terminal plate
On, sound hole is offered on metal shell, the MEMS microphone advance sound type signal to noise ratio of this structure has reached bottleneck.
To realize more high s/n ratio, as shown in Fig. 2 MEMS pieces can be attached on the metal shell with sound hole, pass through
The mode at bottom turn top realizes the high s/n ratio of advance sound structure MEMS microphone.But the MEMS microphone of this structure has
Have the disadvantage that：
1）, need to solve the insulation for the shell that MEMS pieces substrate and metal material are made, case surface needs to do insulation position
Reason or increase unclassified stores insulation；
2）, in shell increase a small terminal plate, to realize the electrical connection of chip and PCB；
3）, because shell is made of metal material, the compression capability of shell 1 is limited, is easily deformed, and causes internal components film
Piece is deformed upon or stress variation, causes sensitivity unstable；
4）, by component processing method limit value, miniaturization difficult.
To realize more high s/n ratio, as shown in figure 3, multi-layer PCB formula can also be used, multi-layer PCB formula has the disadvantages that：
1）, multi-layer PCB composition, cost is high；
2）, tin cream selection issue, PCB absorbs that heat is larger, is difficult to realize the application of high temperature tin cream, causes product reflux mistake
Cheng Rongyi snaps, and performance is bad；
3）, signal wire leakage, product shielding properties is poor, causes antijamming capability and ESD abilities；
4）, miniaturization difficult.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of MEMS Mikes in view of the shortcomings of the prior art
Wind shell structure, the shell structure solves the Insulation Problems of MEMS pieces substrate and shell, it is not required that extra again
Increase small terminal plate to realize electrical connection, save material, improve production efficiency；Meanwhile, the shell structure shell hardness
Larger, pressure not easily leads to casing deformation, and the Sensitivity Stability of product is significantly improved, and it has good heat resistance,
The application of high temperature tin cream is not influenceed, it is ensured that the high reliability of product.
The utility model uses following technical scheme, a kind of MEMS microphone shell structure, including uses ceramic material system
Into outer cover body.
The following is further improvement of the utility model：
The inwall of outer cover body, which has, is connected with gold thread pad on step surface, step surface.
Further improve：
The outer cover body includes being connected with left plate and right plate on top plate, top plate；
Left plate（2）With right plate（3）End to end formation toroidal shell；
The right plate has inwall and outer wall, and the inwall of right plate is step, and the inwall of right plate has a platform
Terrace, step surface is be arranged in parallel with top plate, and gold thread pad is connected with step surface；
The left plate has inwall and outer wall, and the inwall of left plate is step, and left plate has a step surface, platform
PCB connection pads are connected with terrace.
Further improve：
The outer cover body includes being connected with left plate and right plate on top plate, top plate；
The right plate has inwall and outer wall, and the inwall of right plate is step, and the inwall of right plate has three platforms
Terrace, three step surfaces be arranged in parallel with top plate respectively, are located in three step surfaces on middle step surface and are connected with gold thread weldering
In disk, three step surfaces PCB connection pads are connected with the step surface away from top plate.
Further improve：
The outer cover body includes being connected with left plate and right plate on top plate, top plate；
The right plate has inwall and outer wall, and the inwall of right plate is step, and the inwall of right plate has two platforms
Terrace, two step surfaces are be arranged in parallel with top plate respectively, and gold thread pad is connected with the step surface away from top plate；
The left plate has inwall and outer wall, and the inwall of left plate is step, and left plate has a step surface, platform
PCB connection pads are connected with terrace.
Further improve：
The outer cover body includes being connected with left plate and right plate on top plate, top plate；
The right plate has inwall and outer wall, and the inwall of right plate is step, and the inwall of right plate has three platforms
Terrace, three step surfaces be arranged in parallel with top plate respectively, are located in three step surfaces on middle step surface and are connected with gold thread weldering
In disk, three step surfaces PCB connection pads are connected with the step surface away from top plate；
Left plate has inwall and outer wall, and the inwall of left plate is step, and the inwall of left plate has a step surface.
Further improve：
The outer cover body includes being connected with left plate and right plate on top plate, top plate；
The right plate has inwall and outer wall, and the inwall of right plate is step, and the inwall of right plate has two platforms
Terrace, two step surfaces are be arranged in parallel with top plate respectively, and gold thread pad is connected with the step surface away from top plate；
Left plate has inwall and outer wall, and the inwall of left plate is step, and the inwall of left plate has two step surfaces,
Two step surfaces are be arranged in parallel with top plate respectively, and PCB connection pads are connected with the step surface away from top plate in two step surfaces.
The utility model has following technique effect using above-mentioned technical proposal：
1st, shell structure uses ceramic material, solves the Insulation Problems of MEMS pieces substrate and shell bonding plane；
2nd, it need not additionally increase small terminal plate again to realize that electrical connection is acted on, save material, reduce cost and carry
High production efficiency；
3rd, shell structure uses ceramic material, and hardness is larger, and pressure not easily leads to casing deformation, and the sensitivity of product is steady
It is qualitative to significantly improve；
4th, ceramic material temperature tolerance used is good, it is ensured that the application of product high temperature tin cream, it is ensured that product can with higher
By property；
5th, indoor design used in this scheme flexibly, easily realizes that product is minimized.
Above-mentioned technical proposal is described further with reference to the accompanying drawings and examples：
Brief description of the drawings：
Accompanying drawing 1 is MEMS microphone structure schematic diagram in background technology；
Accompanying drawing 2 is metallic housing type MEMS microphone structure schematic diagram in background technology；
Accompanying drawing 3 is multi-layer PCB formula MEMS microphone structure schematic diagram in background technology；
Accompanying drawing 4 is MEMS microphone structure schematic diagram in the utility model embodiment 1；
Accompanying drawing 5 is MEMS microphone structure schematic diagram in the utility model embodiment 2；
Accompanying drawing 6 is MEMS microphone structure schematic diagram in the utility model embodiment 3；
Accompanying drawing 7 is MEMS microphone structure schematic diagram in the utility model embodiment 4；
Accompanying drawing 8 is MEMS microphone structure schematic diagram in the utility model embodiment 5；
Accompanying drawing 9 is MEMS microphone and the spirit of metallic housing type MEMS microphone in the prior art in the utility model embodiment 1
Sensitivity is with pressure change relation comparison diagram.
In figure：1- top plates；2- left plates；3- right plates；4- outer cover bodies；5- gold thread pads；6-PCB connection pads；7-
Sound hole.
Embodiment
Embodiment 1, as shown in figure 4, a kind of MEMS microphone shell structure, including outer cover body 4, the outer cover body 4
It is made of ceramic material.
The outer cover body 4 includes being connected with left plate 2 and right plate 3 on top plate 1, top plate 1.
Left plate（2）With right plate（3）End to end formation toroidal shell.
The right plate 3 has inwall and outer wall, and the inwall of right plate 3 is step, and the inwall of right plate 3 has one
Step surface, step surface is be arranged in parallel with top plate 1, and gold thread pad 5 is connected with step surface.
The left plate 2 has inwall and outer wall, and the inwall of left plate 2 is step, and left plate 2 has a step
PCB connections pad 6 is connected with face, step surface.
Position on top plate 1 close to left plate 2 offers sound hole 7.
As shown in figure 9, entering line sensitivity with pressure change relation to the MEMS microphone assembled using above-mentioned shell structure
Test, show that its clever dynamics is small with pressure change, pressure sensitivity in the range of 10N-50N can be maintained at -38.0dB with -
Between 38.5dB.
Embodiment 2, as shown in figure 5, a kind of MEMS microphone shell structure, including outer cover body 4, the outer cover body 4
It is made of ceramic material.
The outer cover body 4 includes being connected with left plate 2 and right plate 3, left plate on top plate 1, top plate 1（2）With
Right plate（3）End to end formation toroidal shell.
The right plate 3 has inwall and outer wall, and the inwall of right plate 3 is step, and the inwall of right plate 3 has three
Step surface, three step surfaces be arranged in parallel with top plate 1 respectively, are located in three step surfaces on middle step surface and are connected with gold thread
In pad 5, three step surfaces PCB connections pad 6 is connected with the step surface away from top plate 1.
Position on top plate 1 close to left plate 2 offers sound hole 7.
Embodiment 3, as shown in fig. 6, a kind of MEMS microphone shell structure, including outer cover body 4, the outer cover body 4
It is made of ceramic material.
The outer cover body 4 includes being connected with left plate 2 and right plate 3, left plate on top plate 1, top plate 1（2）With
Right plate（3）End to end formation toroidal shell.
The right plate 3 has inwall and outer wall, and the inwall of right plate 3 is step, and the inwall of right plate 3 has two
Step surface, two step surfaces are be arranged in parallel with top plate 1 respectively, and gold thread pad 5 is connected with the step surface away from top plate 1.
The left plate 2 has inwall and outer wall, and the inwall of left plate 2 is step, and left plate 2 has a step
PCB connections pad 6 is connected with face, step surface.
Position on top plate 1 close to left plate 2 offers sound hole 7.
Embodiment 4, as shown in fig. 7, a kind of MEMS microphone shell structure, including outer cover body 4, the outer cover body 4
It is made of ceramic material.
The outer cover body 4 includes being connected with left plate 2 and right plate 3, left plate on top plate 1, top plate 1（2）With
Right plate（3）End to end formation toroidal shell.
The right plate 3 has inwall and outer wall, and the inwall of right plate 3 is step, and the inwall of right plate 3 has three
Step surface, three step surfaces be arranged in parallel with top plate 1 respectively, are located in three step surfaces on middle step surface and are connected with gold thread
In pad 5, three step surfaces PCB connections pad 6 is connected with the step surface away from top plate 1.
Left plate 2 has inwall and outer wall, and the inwall of left plate 2 is step, and the inwall of left plate 2 has a step
Face.
Embodiment 5, as shown in figure 8, a kind of MEMS microphone shell structure, including outer cover body 4, the outer cover body 4
It is made of ceramic material.
The outer cover body 4 includes being connected with left plate 2 and right plate 3, left plate on top plate 1, top plate 1（2）With
Right plate（3）End to end formation toroidal shell.
The right plate 3 has inwall and outer wall, and the inwall of right plate 3 is step, and the inwall of right plate 3 has two
Step surface, two step surfaces are be arranged in parallel with top plate 1 respectively, and gold thread pad 5 is connected with the step surface away from top plate 1.
Left plate 2 has inwall and outer wall, and the inwall of left plate 2 is step, and the inwall of left plate 2 has two steps
Face, two step surfaces are be arranged in parallel with top plate 1 respectively, and PCB connections are connected with the step surface away from top plate 1 in two step surfaces
Pad 6.
Claims (6)
1. a kind of MEMS microphone shell structure, it is characterised in that：Including the outer cover body being made of ceramic material（4）；
Outer cover body（4）Inwall have gold thread pad be connected with step surface, step surface（5）.
2. MEMS microphone shell structure according to claim 1, it is characterised in that：The outer cover body（4）Including top
Plate（1）, top plate（1）On be connected with left plate（2）And right plate（3）；
Left plate（2）With right plate（3）End to end formation toroidal shell；
The right plate（3）With inwall and outer wall, right plate（3）Inwall be step, right plate（3）Inwall have one
Individual step surface, step surface and top plate（1）It is arranged in parallel, gold thread pad is connected with step surface（5）；
The left plate（2）With inwall and outer wall, left plate（2）Inwall be step, left plate（2）With a step
PCB connection pads are connected with face, step surface（6）.
3. MEMS microphone shell structure according to claim 1, it is characterised in that：The outer cover body（4）Including top
Plate（1）, top plate（1）On be connected with left plate（2）And right plate（3）；
The right plate（3）With inwall and outer wall, right plate（3）Inwall be step, right plate（3）Inwall have three
Individual step surface, three step surfaces respectively with top plate（1）It is arranged in parallel, is located in three step surfaces on middle step surface and is connected with
Gold thread pad（5）, away from top plate in three step surfaces（1）Step surface on be connected with PCB connection pads（6）.
4. MEMS microphone shell structure according to claim 1, it is characterised in that：The outer cover body（4）Including top
Plate（1）, top plate（1）On be connected with left plate（2）And right plate（3）；
The right plate（3）With inwall and outer wall, right plate（3）Inwall be step, right plate（3）Inwall have two
Individual step surface, two step surfaces respectively with top plate（1）It is arranged in parallel, away from top plate（1）Step surface on be connected with gold thread pad
（5）；
The left plate（2）With inwall and outer wall, left plate（2）Inwall be step, left plate（2）With a step
PCB connection pads are connected with face, step surface（6）.
5. MEMS microphone shell structure according to claim 1, it is characterised in that：The outer cover body（4）Including top
Plate（1）, top plate（1）On be connected with left plate（2）And right plate（3）；
The right plate（3）With inwall and outer wall, right plate（3）Inwall be step, right plate（3）Inwall have three
Individual step surface, three step surfaces respectively with top plate（1）It is arranged in parallel, is located in three step surfaces on middle step surface and is connected with
Gold thread pad（5）, away from top plate in three step surfaces（1）Step surface on be connected with PCB connection pads（6）；
Left plate（2）With inwall and outer wall, left plate（2）Inwall be step, left plate（2）Inwall there is platform
Terrace.
6. MEMS microphone shell structure according to claim 1, it is characterised in that：The outer cover body（4）Including top
Plate（1）, top plate（1）On be connected with left plate（2）And right plate（3）；
The right plate（3）With inwall and outer wall, right plate（3）Inwall be step, right plate（3）Inwall have two
Individual step surface, two step surfaces respectively with top plate（1）It is arranged in parallel, away from top plate（1）Step surface on be connected with gold thread pad
（5）；
Left plate（2）With inwall and outer wall, left plate（2）Inwall be step, left plate（2）Inwall there are two platforms
Terrace, two step surfaces respectively with top plate（1）It is arranged in parallel, away from top plate in two step surfaces（1）Step surface on be connected with
PCB connection pads（6）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385144.4U CN206490788U (en) | 2016-12-16 | 2016-12-16 | A kind of MEMS microphone shell structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385144.4U CN206490788U (en) | 2016-12-16 | 2016-12-16 | A kind of MEMS microphone shell structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490788U true CN206490788U (en) | 2017-09-12 |
Family
ID=59769652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621385144.4U Active CN206490788U (en) | 2016-12-16 | 2016-12-16 | A kind of MEMS microphone shell structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490788U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111866695A (en) * | 2019-04-30 | 2020-10-30 | 讯芯电子科技（中山）有限公司 | Microphone device manufacturing method and microphone device |
-
2016
- 2016-12-16 CN CN201621385144.4U patent/CN206490788U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111866695A (en) * | 2019-04-30 | 2020-10-30 | 讯芯电子科技（中山）有限公司 | Microphone device manufacturing method and microphone device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101482720B1 (en) | Package structure for silicon pressure sensor | |
| CN208399071U (en) | Silicon piezoresistance type pressure sensor packaging structure | |
| TW200713551A (en) | Packages, methods for fabricating the same, anisotropic conductive films, and conductive particles utilized therein | |
| US8350373B2 (en) | Chip stacked structure and method of fabricating the same | |
| WO2017012251A1 (en) | Environment sensor | |
| CN107195589A (en) | Semiconductor device | |
| WO2015125620A1 (en) | Module | |
| CN205050835U (en) | Semiconductor device | |
| CN105784260A (en) | Novel pressure sensor | |
| CN206490788U (en) | A kind of MEMS microphone shell structure | |
| WO2017012250A1 (en) | Environment sensor | |
| TWI611703B (en) | Microphone package structure | |
| CN202443963U (en) | Semiconductor substrate package structure | |
| CN205622875U (en) | MEMS microphone | |
| CN110176435A (en) | Physical quantity transducer and semiconductor devices | |
| CN202710237U (en) | Absolute pressure sensor packaging structure | |
| TWI229394B (en) | Ball grid array semiconductor package with resin coated metal core | |
| CN205378345U (en) | FPC suitable for pressure sensor | |
| CN207053769U (en) | A kind of combination sensor | |
| CN204286668U (en) | Pressure transducer | |
| CN101106120A (en) | Spherical grid array encapsulation structure of base plate bottom glue encapsulation | |
| CN114497356A (en) | Semiconductor chip, semiconductor packaging structure and manufacturing method thereof | |
| CN203848956U (en) | Pressure sensor | |
| CN209417076U (en) | A kind of acceleration transducer | |
| CN206313996U (en) | A kind of MEMS microphone package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |