CN206460958U - A kind of encapsulating structure - Google Patents
A kind of encapsulating structure Download PDFInfo
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- CN206460958U CN206460958U CN201621472283.0U CN201621472283U CN206460958U CN 206460958 U CN206460958 U CN 206460958U CN 201621472283 U CN201621472283 U CN 201621472283U CN 206460958 U CN206460958 U CN 206460958U
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- pcb board
- chip
- encapsulating structure
- connecting plate
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- 230000007613 environmental effect Effects 0.000 claims description 23
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model is related to a kind of encapsulating structure.The encapsulating structure includes：First pcb board, second pcb board and connecting plate, first pcb board and second pcb board are oppositely arranged, the connecting plate, which is arranged between first pcb board and second pcb board and respectively with first pcb board and second pcb board, to be connected, first pcb board, second pcb board and the connecting plate surround accommodating chamber, the conductive through hole for connecting first pcb board and second pcb board is provided with the connecting plate, the conductive through hole is configured as first pcb board and second pcb board electric connection, electronic component is provided with first pcb board and the 2nd PCB.Encapsulating structure in the utility model includes the first pcb board, the second pcb board and connecting plate, first pcb board and the second pcb board are electrically connected with by the conductive through hole on connecting plate, electronic component is respectively provided with the first pcb board and the second pcb board, effectively to reduce the size of encapsulating structure.
Description
Technical field
The utility model is related to encapsulation field, more particularly, to a kind of encapsulating structure with double-layer PCB board.
Background technology
With the development of science and technology, the volume in mobile phone, notebook and other portable type electronic products constantly reduces.People
To the performance requirement of portable type electronic product also more and more higher, this requires the volume of matching electronic component as far as possible
It is small.Sensor has been commonly utilized on the electronic products such as mobile phone, notebook as detection device.
Existing encapsulating structure is usually that it, which is generally comprised, surrounds via the product formed after complicated encapsulation procedure step
The pcb board and shell of accommodating chamber, and the multiple electronic components being arranged in accommodating chamber.Electronic component can be sensor, patrol
Collect control element or driving element etc..In existing encapsulating structure, electronic component is arranged on pcb board, electrically to connect with pcb board
Connect.But, due to being placed with multiple electronic components in accommodating chamber, cause the overall dimensions of packaging mechanism bigger than normal, it is impossible to meet
Portable, miniaturization requirement.
Accordingly, it would be desirable to be improved to existing encapsulating structure.
Utility model content
A purpose of the present utility model is to provide a kind of encapsulating structure.
According to one side of the present utility model, there is provided a kind of encapsulating structure.The encapsulating structure includes：First pcb board,
Second pcb board and connecting plate, first pcb board and second pcb board are oppositely arranged, and the connecting plate is arranged on described
It is connected between one pcb board and second pcb board and respectively with first pcb board and second pcb board, described first
Pcb board, second pcb board and the connecting plate surround accommodating chamber, and connection the first PCB is provided with the connecting plate
The conductive through hole of plate and second pcb board, the conductive through hole is configured as first pcb board and the 2nd PCB
Plate is electrically connected with, and electronic component is provided with first pcb board and the 2nd PCB.
Optionally, the two ends of the conductive through hole are electrically connected at first pcb board and described in the way of soldering
On the pad of two pcb boards.
Optionally, the connecting plate is the 3rd pcb board, and the conductive through hole is worn for the metallization through the connecting plate
Hole.
Optionally, the microphone chip and the first asic chip of electric connection are provided with first pcb board, in institute
State the environmental sensor chip and the second asic chip that electric connection is provided with the second pcb board.
Optionally, microphone chip is fixed with first pcb board, environment is fixed with second pcb board
Sensor chip, is further fixed on sharing asic chip, the microphone core on first pcb board or second pcb board
Piece and environmental sensor chip are electrically connected with the shared asic chip.
Optionally, microphone chip is fixed with first pcb board, is fixed with second pcb board shared
Asic chip, is fixed with environmental sensor chip on the shared asic chip, the shared asic chip respectively with it is described
Microphone chip and the environmental sensor chip are electrically connected with.
Optionally, the microphone chip is inverted on first pcb board, sets sound on first pcb board
Hole, position of the acoustic aperture on first pcb board is corresponding with the position of the microphone chip diaphragm.
Optionally, the first asic chip and first environment sensor of electric connection are provided with first pcb board
Chip, is provided with the second asic chip and second environment sensor chip of electric connection on second pcb board.
Optionally, first environment sensor chip is fixed with first pcb board, it is solid on second pcb board
Surely there is shared asic chip, second environment sensor core is fixed with second pcb board or the shared asic chip
Piece, the first environment sensor chip and the second environment sensor chip electrically connect with the shared asic chip
Connect.
Optionally, it is provided with through hole on first pcb board or second pcb board.
The encapsulating structure that the utility model is provided includes the first pcb board, the second pcb board and connecting plate.First pcb board and
Two pcb boards are electrically connected with by the conductive through hole on connecting plate, and electronics can be set on the first pcb board and the second pcb board
Element, so as to the size for the encapsulating structure that multiple electronic components are set in effectively reduction.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for constituting a part for specification describes embodiment of the present utility model, and uses together with the description
In explanation principle of the present utility model.
Fig. 1 is the schematic diagram of encapsulating structure in the utility model embodiment；
Fig. 2 is the schematic diagram of encapsulating structure in the utility model embodiment；
Fig. 3 is the schematic diagram of encapsulating structure in the utility model embodiment；
Fig. 4 is the schematic diagram of encapsulating structure in the utility model embodiment；
Fig. 5 is the schematic diagram of encapsulating structure in the utility model embodiment；
Fig. 6 is the schematic diagram of encapsulating structure in the utility model embodiment.
Wherein, 1：First pcb board；2：Second pcb board；3：Connecting plate；4：Conductive through hole；5：Microphone chip；6：First
Asic chip；7：Acoustic aperture；8：Second asic chip；9：Environmental sensor chip；10：Share asic chip；11：Through hole；12：The
One environmental sensor chip；13：First asic chip；14：Second environment sensor chip；15：Second asic chip；16：Altogether
Use asic chip.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：Unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is not limited
Make scope of the present utility model.
The description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
New and its application or any limitation used.
It may be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in appropriate situation
Under, the technology and equipment should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The microphone and the integrating device of environmental sensor that the utility model is provided include the first pcb board 1, the second pcb board 2
With connecting plate 3.Wherein, first pcb board 1 and second pcb board 2 are oppositely arranged.The connecting plate 3 is arranged on described
Between one pcb board 1 and second pcb board 2, and it is connected with first pcb board 1 and second pcb board 2.Described
One pcb board 1, second pcb board 2 and the connecting plate 3 surround accommodating chamber.For example, the quantity of connecting plate 3 can have many
It is individual, multiple connecting plates 3 successively head and the tail connect, multiple connecting plates 3 can surround and be fixedly connected on first pcb board 1 or
The marginal position of second pcb board 2；The connecting plate 3, which may also set up, to be structure as a whole.
As shown in figure 1, being provided with conductive through hole 4 on the connecting plate 3, the conductive through hole 4 connects the first PCB
Plate 1 and second pcb board 2.The two ends of the conductive through hole 4 are electric with first pcb board 1 and second pcb board 2 respectively
Property connection.Electronic component is provided with first pcb board 1 and second pcb board 2.In this way, by multiple electronic components
In the accommodating chamber for being integrated in the encapsulating structure, and it can effectively reduce the chi of the interior encapsulating structure for setting multiple electronic components
It is very little, to meet the requirement of portable miniaturization.
Preferably, the connecting plate 3 is the 3rd pcb board, and the conductive through hole 4 is the perforation through the 3rd pcb board,
And it is coated with metal that can be conductive in the inner surface of the perforation.For example, the conductive through hole 4 can be copper plated through holes.In this way,
First pcb board 1 and second pcb board 2 are electrically connected with by the conductive through hole 4 on the connecting plate 3.Need explanation
It is that the connecting plate 3 can also be other materials, such as described connecting plate 3 can be the toroidal shell for being with upper and lower opening.
Preferably, the position of the correspondence conductive through hole 4 is set on first pcb board 1 and second pcb board 2
There is pad.The two ends of the conductive through hole 4 are connected to first pcb board 1 and second pcb board 2 in the way of soldering
On pad.It should be noted that the two ends of the conductive through hole 4 can also other electrical connector modes be electrically connected
On first pcb board 1 and second pcb board 2.
In the utility model, the electronic component can be microphone, environmental sensor, logic control element or drive
One kind or and a variety of of dynamic element etc..Moreover, the electronic component can have different positions in the accommodating chamber.
Optionally, the asic chip 6 of microphone chip 5 and first of electric connection is provided with first pcb board 1,
The asic chip 8 of environmental sensor chip 9 and second of electric connection is provided with second pcb board 2.For example, such as Fig. 1 institutes
Show, the microphone chip 5 and first asic chip 6 can be separately fixed on first pcb board 1, described first
Asic chip 6 and the microphone chip 5 can also be sequentially stacked on first pcb board 1；Similarly, the 2nd ASIC
Chip 8 and the environmental sensor chip 9 can respectively be fixed or overlapping be fixed on first pcb board 1.
Optionally, as shown in Fig. 2 being fixed with microphone chip 5 on first pcb board 1.In second pcb board 2
On be fixed with environmental sensor chip 9.It is further fixed on sharing ASIC cores on first pcb board 1 or second pcb board 2
Piece 10.The microphone chip 5 and environmental sensor chip 9 are electrically connected with the shared asic chip 10.For example, working as institute
When stating shared asic chip 10 and being fixed on second pcb board 2, the environmental sensor chip 9 is electrically connected at described
On one pcb board 1, and respectively through first pcb board 1, conductive through hole 4, the second pcb board 2 and the shared asic chip 10
It is electrically connected with.In this way, acoustical signal that the shared asic chip 10 can be received to the microphone chip 5 and the environment
The ambient signal that sensor chip 9 is received carries out being converted into the processing such as electric signal and amplification.
Optionally, as shown in figure 3, being fixed with microphone chip 5 on first pcb board 1, in second pcb board 2
On be fixed with shared asic chip 10, be fixed with environmental sensor chip 9 on the shared asic chip 10.It is described to share
Asic chip 10 is electrically connected with the microphone chip 5 and the environmental sensor chip 9 respectively.For example, the environment is passed
Sensor chip 9 can be pasted onto on the shared asic chip 10；The microphone chip 5 can be electrically connected at institute by lead
State on the pad on the second pcb board 2, then be electrically connected with the shared asic chip 10.
In the utility model, microphone chip 5 and environmental sensor chip 9 are provided with the accommodating chamber, it is needed
Sound, environment being in communication with the outside to sense outside etc..It is provided with first pcb board 1 or first pcb board 1
Acoustic aperture 7.In this way, by acoustic aperture 7, extraneous sound is applied to the diaphragm of the microphone chip 5；The environmental sensor 9 can
To be gyroscope or pressure, temperature, humidity, optical sensor chip etc., the change of external environment is applied to environmental sensor
On chip 9.
The microphone chip 5 is arranged on first pcb board 1, in order to ensure the performance of the encapsulating structure, is reduced
The size of the encapsulating structure.It is further preferred that as shown in Figure 1 to Figure 3, the microphone chip 5 is inverted in described first
On pcb board 1.For example, the microphone chip 5 can be welded on by way of planting tin ball on first pcb board 1.It is described
Acoustic aperture 7 is arranged on first pcb board 1, position of the acoustic aperture 7 on first pcb board 1 and the microphone chip
The position of 5 diaphragms is corresponding.In this way, external sound is applied to the diaphragm of the microphone chip 5 by the acoustic aperture 7；It is extraneous
The change of environment is applied on environmental sensor chip 9 by the aperture on diaphragm.
Optionally, the first asic chip 13 and first environment sensing of electric connection are provided with first pcb board 1
Device chip 12, is provided with the second asic chip 15 and second environment sensor chip of electric connection on second pcb board 2
14.For example, as shown in figure 4, first asic chip 13 and the first environment sensor chip 12 can be separately fixed at
On first pcb board 1, first asic chip 13 and the first environment sensor chip 12 can also be sequentially stacked in
On first pcb board 1；Similarly, second asic chip 15 and the second environment sensor chip 14 can be consolidated respectively
It is fixed or overlapping be fixed on second pcb board 2.
Optionally, as shown in figure 5, being fixed with first environment sensor chip 12 on first pcb board 1.Described
Shared asic chip 16 is fixed with second pcb board 2, second environment sensor chip is further fixed on second pcb board 2
14.The first environment sensor chip 12 and the second environment sensor chip 14 are electric with the shared asic chip 16
Property connection.For example, the first environment sensor chip 12 can be electrically connected at by lead on first pcb board 1, and according to
It is secondary to pass through the first pcb board 1, energization guide hole 4, the second pcb board 2 ambient signal fax is transported into the shared asic chip 16.
Optionally, as shown in fig. 6, being fixed with first environment sensor chip 12 on first pcb board 1.Described
Shared asic chip 16 is fixed with second pcb board 2, second environment sensor core is fixed with the shared asic chip 16
Piece 14.The first environment sensor chip 12 and the second environment sensor chip 14 with the shared asic chip 16
It is electrically connected with.
In the utility model, the first environment sensor chip 12 and the second environment sensor chip 14 are set
In the accommodating chamber.In order to which external environment is imported in accommodating chamber, the first environment sensor chip 12 and institute are acted on
In the sensitive membrane for stating second environment sensor chip 14, it is further preferred that as shown in Figures 4 to 6, in first pcb board 1
Or it is provided with through hole 11 on second pcb board 2.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that above example is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case where not departing from scope and spirit of the present utility model, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (10)
1. a kind of encapsulating structure, it is characterised in that including：First pcb board (1), the second pcb board (2) and connecting plate (3), it is described
First pcb board (1) and second pcb board (2) are oppositely arranged, the connecting plate (3) be arranged on first pcb board (1) and
It is connected between second pcb board (2) and respectively with first pcb board (1) and second pcb board (2), described first
Pcb board (1), second pcb board (2) and the connecting plate (3) surround accommodating chamber, the company of being provided with the connecting plate (3)
Lead to the conductive through hole (4) of first pcb board (1) and second pcb board (2), the conductive through hole (4) is configured as institute
State the first pcb board (1) and second pcb board (2) is electrically connected with, it is equal on first pcb board (1) and the 2nd PCB
It is provided with electronic component.
2. encapsulating structure according to claim 1, it is characterised in that the two ends of the conductive through hole (4) are with the side of soldering
Formula is electrically connected on the pad of first pcb board (1) and second pcb board (2).
3. encapsulating structure according to claim 1, it is characterised in that the connecting plate (3) is the 3rd pcb board, described to lead
Electric through-hole (4) is the through metallized hole through the connecting plate (3).
4. encapsulating structure according to claim 1, it is characterised in that be provided with and electrically connect on first pcb board (1)
The microphone chip (5) and the first asic chip (6) connect, the environment that electric connection is provided with second pcb board (2) is passed
Sensor chip (9) and the second asic chip (8).
5. encapsulating structure according to claim 1, it is characterised in that be fixed with microphone on first pcb board (1)
Chip (5), environmental sensor chip (9) is fixed with second pcb board (2), in first pcb board (1) or described
It is further fixed on sharing asic chip (10) on second pcb board (2), the microphone chip (5) and environmental sensor chip (9) are
It is electrically connected with the shared asic chip (10).
6. encapsulating structure according to claim 1, it is characterised in that be fixed with microphone on first pcb board (1)
Chip (5), is fixed with shared asic chip (10) on second pcb board (2), is fixed with the shared asic chip
Environmental sensor chip (9), the shared asic chip (10) respectively with the microphone chip (5) and the environmental sensor
Chip (9) is electrically connected with.
7. the encapsulating structure according to claim 4-6 is one of any, it is characterised in that microphone chip (5) upside-down mounting
On first pcb board (1), acoustic aperture (7) is provided with first pcb board (1), the acoustic aperture (7) is described first
Position on pcb board (1) is corresponding with the position of the microphone chip (5) diaphragm.
8. encapsulating structure according to claim 1, it is characterised in that be provided with and electrically connect on first pcb board (1)
The first asic chip (13) and first environment sensor chip (12) connect, is provided with second pcb board (2) and electrically connects
The second asic chip (15) and second environment sensor chip (14) connect.
9. encapsulating structure according to claim 1, it is characterised in that be fixed with the first ring on first pcb board (1)
Border sensor chip (12), is fixed with shared asic chip (16), in second pcb board on second pcb board (2)
(2) second environment sensor chip (14), the first environment sensor or on the shared asic chip (16) are fixed with
Chip (12) and the second environment sensor chip (14) are electrically connected with the shared asic chip (16).
10. encapsulating structure according to claim 8 or claim 9, it is characterised in that in first pcb board (1) or described second
Through hole (11) is provided with pcb board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472283.0U CN206460958U (en) | 2016-12-29 | 2016-12-29 | A kind of encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472283.0U CN206460958U (en) | 2016-12-29 | 2016-12-29 | A kind of encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206460958U true CN206460958U (en) | 2017-09-01 |
Family
ID=59697066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621472283.0U Active CN206460958U (en) | 2016-12-29 | 2016-12-29 | A kind of encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206460958U (en) |
-
2016
- 2016-12-29 CN CN201621472283.0U patent/CN206460958U/en active Active
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |