CN206400571U - Fingerprint recognition module and electronic equipment - Google Patents

Fingerprint recognition module and electronic equipment Download PDF

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Publication number
CN206400571U
CN206400571U CN201621137605.6U CN201621137605U CN206400571U CN 206400571 U CN206400571 U CN 206400571U CN 201621137605 U CN201621137605 U CN 201621137605U CN 206400571 U CN206400571 U CN 206400571U
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China
Prior art keywords
connecting portion
fingerprint recognition
printed circuit
circuit board
recognition module
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CN201621137605.6U
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Chinese (zh)
Inventor
周宝华
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Ofilm Microelectronics Technology Co ltd
Jiangxi OMS Microelectronics Co Ltd
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Nanchang OFilm Biometric Identification Technology Co Ltd
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Priority to CN201621137605.6U priority Critical patent/CN206400571U/en
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Abstract

The utility model is related to fingerprint recognition module and includes the electronic equipment of the fingerprint recognition module.The fingerprint recognition module includes the fingerprint recognition chip with first connecting portion and the printed circuit board (PCB) with second connecting portion, wherein, the fingerprint recognition chip is in the 3rd close-shaped connecting portion with what is set in the periphery of first connecting portion, and printed circuit board (PCB) has the 4th connecting portion corresponding with the 3rd connecting portion that the periphery in second connecting portion is set, wherein, in the case where fingerprint recognition chip is installed on a printed circuit, seamless unoccupied place is closely connected between the 3rd connecting portion and the 4th connecting portion.By according to fingerprint recognition module of the present utility model and the electronic equipment with the fingerprint recognition module, it is possible to achieve do not pass through the waterproof effect of sealing.

Description

Fingerprint recognition module and electronic equipment
Technical field
The utility model relates in general to electronic device field, and relates in particular to fingerprint recognition module and with this The electronic equipment of fingerprint recognition module.
Background technology
With the popularization of electronic equipment, for the consideration in terms of security and practicality, increasing electronic equipment tool There is fingerprint identification function.By using fingerprint recognition, electronic equipment can be easily unlocked, without inputting cumbersome unblock Password.Also, user can apply shop, and other pay and fingerprint identification function are used under scenes, or user can be with Authentication is completed by fingerprint recognition, such as logging in mailbox.
Generally, the fingerprint recognition module of electronic equipment includes fingerprint recognition chip, is covered in fingerprint recognition chip IQ Protection cap and the circuit board electrically connected with fingerprint recognition chip.Also, it is more and more with the popularization of portable electric appts Ground uses flexible printed circuit board (FPC).Flexible printed circuit board is because its Distribution density is high, lightweight, thickness of thin the characteristics of, In many products such as mobile phone, notebook computer, PDA, digital camera, LCM.
Sensor circuit etc. is packaged by fingerprint recognition chip by a variety of packing forms, and will be used for conduction The portion of connection is drawn out to outside the molding outer casing of chip, for example, be referred to as drawing pin, thus with the electricity such as flexible printed circuit board Connection.For example, in common Background Grid array packages form, needle-like pin is replaced with the encapsulation of hard contact formula, so as to be used as envelope The extraction pin of the circuit of dress, is connected with flexible printed circuit board.
On the other hand, on the fingerprint recognition chip such as flexible printed circuit board to be connected to, it is provided with and knows with fingerprint The corresponding connecting portion of extraction pin of other chip, for example, pad.So, when fingerprint recognition chip is for example with surface installation technique After on flexible printed circuit board, draw pin can be connected with pad so that realize fingerprint recognition chip with it is soft Electrical connection between property printed circuit board (PCB), to transmit various electric signals therebetween.
Surface installation technique is a kind of technology and technique popular in current electronic assembly industry, and it is by hydrid integrated circuit Technology is developed, with the characteristics of using component surface mounting technology and reflow solder technique, as in Electronic products manufacturing The package technique of a new generation.
Surface installation technique has high packing density, reliability height, shock resistance is strong, welding point defect rate is low, high frequency characteristics Good the advantages of, also, surface combination technique contribute to using small volume, lightweight electronic component and it is easy to automate and Improve production efficiency.But, even by surface installation technique, by fingerprint recognition chip attachment to flexible printed circuit board After upper, gap is also inevitably present therebetween, and the gap causes moisture to be easily accessible fingerprint recognition chip and flexibility Between printed circuit board (PCB), so as to be impacted to the electrical connection section between fingerprint recognition chip and flexible printed circuit board, such as Cause to connect the short circuit etc. between pin.
In the prior art, fingerprint recognition chip circumference is typically employed in carry out mode for dispensing glue to carry out waterproof, it is still, real Existing dispensing needs single equipment and manufacturing process, so as to reduce the production efficiency of fingerprint recognition module and improve cost.
Fig. 4 is the schematic diagram for the assembling process for showing traditional fingerprint recognition module.As shown in figure 4, when using tradition Technique, when being encapsulated chip 30 and FPC 40 using SMT, fingerprint recognition chip 300 is installed on flexible printed circuit board 400 Afterwards, in addition it is also necessary to which in the peripheral dot encapsulation marine glue 500 of chip, and sealing needs dispensing board, this undoubtedly adds fingerprint knowledge The manufacture burden of other module.
Further, since dispensing inevitably takes effective space on flexible printed circuit board, also to fingerprint recognition The design and manufacture of module bring inconvenience.
Utility model content
The purpose of this utility model is to solve above-mentioned technical problem, and provides to have and do not need dispensing to carry out waterproof Novel and improved fingerprint recognition module and the electronic equipment with the fingerprint recognition module.
To achieve the above object, according to one side of the present utility model, there is provided a kind of fingerprint recognition module, the fingerprint Recognize that module includes fingerprint recognition chip and printed circuit board (PCB), the fingerprint recognition chip, which has, to be used for and the printed circuit board (PCB) The first connecting portion of electrical connection and the printed circuit board (PCB) have the second connecting portion for being used for electrically connecting with the first connecting portion, Wherein:The fingerprint recognition chip is in the 3rd close-shaped connecting portion with what is set in the periphery of the first connecting portion, And the printed circuit board (PCB) has the 4th company corresponding with the 3rd connecting portion that the periphery in the second connecting portion is set Socket part, and in the case where fingerprint recognition chip is installed on a printed circuit, nothing between the 3rd connecting portion and the 4th connecting portion Closely connect to gap.
In above-mentioned fingerprint recognition module, the first connecting portion is hard contact, the second connecting portion be with it is described The corresponding metal pad of hard contact, and after the first connecting portion and the second connecting portion are melted by the first tin cream portion Tin cream alloy is connected.
In above-mentioned fingerprint recognition module, the 3rd connecting portion is rectangle or the ring dress sheet metal of circle, described the Four connecting portions are rectangle or the ring dress sheet metal of circle, and the 3rd connecting portion and the 4th connecting portion pass through the second tin Tin cream alloy after cream portion melts is connected.
In above-mentioned fingerprint recognition module, the first connecting portion and the 3rd connecting portion are in same level, with same One material and the formation in same manufacturing process step.
In above-mentioned fingerprint recognition module, the second connecting portion and the 4th connecting portion are in same level, with same One material and the formation in same manufacturing process step.
In above-mentioned fingerprint recognition module, the first tin cream portion and the second tin cream portion are located at same level, and Formed in same manufacturing process step.
In above-mentioned fingerprint recognition module, the fingerprint recognition chip is encapsulated in Background Grid array packages form.
In above-mentioned fingerprint recognition module, the printed circuit board (PCB) is flexible printed circuit board.
In above-mentioned fingerprint recognition module, the fingerprint recognition chip is arranged on the printed circuit with surface installation technique Plate.
To achieve the above object, according to another aspect of the present utility model there is provided a kind of electronic equipment, the electronics is set Standby to include fingerprint recognition module, the fingerprint recognition module includes fingerprint recognition chip and printed circuit board (PCB), the fingerprint recognition Chip have be used for the first connecting portion that electrically connect with the printed circuit board (PCB) and the printed circuit board (PCB) have for it is described The second connecting portion of first connecting portion electrical connection, wherein:The fingerprint recognition chip has in the periphery of the first connecting portion What is set is in the 3rd close-shaped connecting portion, and the printed circuit board (PCB) has what the periphery in the second connecting portion was set The 4th connecting portion corresponding with the 3rd connecting portion, and in the case where fingerprint recognition chip is installed on a printed circuit, Seamless unoccupied place is closely connected between 3rd connecting portion and the 4th connecting portion.
In above-mentioned electronic equipment, the first connecting portion is hard contact, and the second connecting portion is and the metal The corresponding metal pad in contact, and the first connecting portion and the second connecting portion pass through the tin cream after the thawing of the first tin cream portion Alloy is connected.
In above-mentioned electronic equipment, the 3rd connecting portion is rectangle or the ring dress sheet metal of circle, and the described 4th connects Socket part is rectangle or the ring dress sheet metal of circle, and the 3rd connecting portion and the 4th connecting portion pass through the second tin cream portion Tin cream alloy connection after thawing.
In above-mentioned electronic equipment, the first connecting portion and the 3rd connecting portion are in same level, with same material Material and the formation in same manufacturing process step.
In above-mentioned electronic equipment, the second connecting portion and the 4th connecting portion are in same level, with same material Material and the formation in same manufacturing process step.
In above-mentioned electronic equipment, the first tin cream portion and the second tin cream portion are located at same level, and same Formed in manufacturing process step.
In above-mentioned electronic equipment, the fingerprint recognition chip is encapsulated in Background Grid array packages form.
In above-mentioned electronic equipment, the printed circuit board (PCB) is flexible printed circuit board.
In above-mentioned electronic equipment, the fingerprint recognition chip is arranged on the printed circuit board (PCB) with surface installation technique.
By according to fingerprint recognition module of the present utility model and the electronic equipment with the fingerprint recognition module, Ke Yitong The connecting portion periphery crossed between fingerprint recognition chip and printed circuit board (PCB) is provided for sealing the structure of waterproof, so as to be not required to Want to realize waterproof effect in the case of dispensing, improve the space utilization rate of printed circuit board (PCB), promote fingerprint recognition module Design and manufacture.
By according to fingerprint recognition module of the present utility model and the electronic equipment with the fingerprint recognition module, Ke Yi The structure for sealing waterproof is formed in the step of forming the electrical connection between fingerprint recognition chip and printed circuit board (PCB), without The manufacturing process to be added, so as to improve the production efficiency of fingerprint recognition module and reduce cost.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of the fingerprint recognition module according to the utility model embodiment;
Fig. 2 is the schematic diagram of the fingerprint recognition module with waterproof construction according to the utility model embodiment;
Fig. 3 is the schematic diagram for the assembling process for showing traditional fingerprint recognition module;
Fig. 4 is the schematic diagram for the assembling process for showing the fingerprint recognition module according to the utility model embodiment.
Embodiment
Describe to be used for open the utility model below so that those skilled in the art can realize the utility model.Retouch below Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in disclosure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the orientation of the instruction such as " outer " or position close System is to be based on orientation shown in the drawings or position relationship, and it is for only for ease of description the utility model and simplified and describes, without It is that instruction or the signified device of hint or element must have specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.
It is understood that term " one " be interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no It is understood that as the limitation to quantity.
The term and word used in description below and claim is not limited to literal implication, but only new by this practicality Type people, which is used so that, can understand and as one man understand the utility model.Therefore, it is only clearly to those skilled in the art The purpose of explanation rather than in order to limit mesh of the present utility model as defined in appended claims and their equivalent And following description that various embodiments of the present utility model are provided.
Although the ordinal number of such as " first ", " second " etc. will be used to describe various assemblies, those are not limited herein Component.The term is only used for distinguishing a component and another component.For example, first assembly can be referred to as the second component, and together Sample, the second component can also be referred to as first assembly, the teaching conceived without departing from the utility model.Term as used herein "and/or" includes any of the project listed of one or more associations and all combination.
The term being used herein is only used for describing the purpose of various embodiments and is not intended to limitation.As used herein, Singulative is intended to also include plural form, makes an exception unless the context clearly dictates.Will further be understood that term " comprising " and/or " having " specifies depositing for described feature, number, step, operation, component, element or its combination when using in this specification , and it is not excluded for the presence or additional of one or more of the other feature, number, step, operation, component, element or its group.
The term being used herein including technology and scientific terminology has the art being generally understood that with those skilled in the art Language identical implication, so long as not being defined differently than the term.It should be understood that the term tool limited in usually used dictionary There is the implication consistent with the implication of term of the prior art.
To achieve the above object, should according to the one side of the utility model embodiment there is provided a kind of fingerprint recognition module Fingerprint recognition module includes fingerprint recognition chip and printed circuit board (PCB), and the fingerprint recognition chip, which has, to be used for and the printed circuit board (PCB) The first connecting portion of electrical connection and the printed circuit board (PCB) have the second connecting portion for being used for electrically connecting with the first connecting portion, its In:What the fingerprint recognition chip had that the periphery in the first connecting portion sets is in the 3rd close-shaped connecting portion, and the print Printed circuit board has the 4th connecting portion corresponding with the 3rd connecting portion that the periphery in the second connecting portion is set, and in fingerprint In the case that identification chip is installed on a printed circuit, seamless unoccupied place closely connects between the 3rd connecting portion and the 4th connecting portion Connect.
Fig. 1 is the decomposing schematic representation of the fingerprint recognition module according to the utility model embodiment.Wherein, Fig. 1 (a) is shown Fingerprint recognition chip, and Fig. 1 (b) shows printed circuit board (PCB).As shown in Fig. 1 (a), fingerprint recognition chip 10 has the One connecting portion 11 and the 3rd peripheral connecting portion 12 in first connecting portion 11, for example, the 3rd connecting portion 12 is rectangular ring, from And be isolated from the outside first connecting portion 11.Here, the connecting portion 12 of first connecting portion 11 and the 3rd can be by conductive metal material Material is made, for example metallic copper.In addition, as shown in Fig. 1 (b), printed circuit board (PCB) 20 has second connecting portion 21 and connected second The 4th peripheral connecting portion of socket part 21.Wherein, the of the second connecting portion 21 of printed circuit board (PCB) 20 and fingerprint recognition chip 10 One connecting portion 11 is in position and corresponding in shape so that fingerprint recognition chip 10 be installed to printed circuit board (PCB) 20 it Afterwards, electrical connection can be set up between first connecting portion 11 and second connecting portion 21.Also, the 4th connection of printed circuit board (PCB) 20 Portion 22 and the 3rd connecting portion 12 of fingerprint recognition chip 10 are in position and corresponding in shape, for example, the 4th connecting portion 22 is also Rectangular ring, so that second connecting portion 21 be isolated from the outside.So, when fingerprint recognition chip 10 is installed to printed circuit board (PCB) 20 When, by forming closely seamless connection between the 3rd connecting portion 12 and the 4th connecting portion 22, it can be electrically connected relative to each other First connecting portion 11 and second connecting portion 21 the isolation steam connect, so that according to the fingerprint recognition of the utility model embodiment Module has waterproof effect.
Also, due to as shown in figure 1, the 3rd connecting portion 12 and the 4th connecting portion 22 are respectively formed at fingerprint recognition chip 10 With the first connecting portion 11 on printed circuit board (PCB) 20 and the periphery of second connecting portion 21, and not departing from fingerprint recognition chip 10 Border.So, when fingerprint recognition chip is installed on printed circuit board (PCB), printing will not be taken as traditional dispensing Exceptional space on circuit board, so, the valuable space that can be saved on printed circuit board (PCB), so as to improve printed circuit board (PCB) Space utilization rate, promotes the design and manufacture of fingerprint recognition module.
In addition, it will be understood by those skilled in the art that the connection between the 3rd connecting portion and the 4th connecting portion only needs to protect The seamless close connection of card, and whether do not limit is electrical connection, because needing not move through the 3rd connecting portion and the Four connecting portions between fingerprint recognition chip and printed circuit board (PCB) transmit signal.
In above-mentioned fingerprint recognition module, first connecting portion is hard contact, and second connecting portion is corresponding with hard contact Metal pad, and first connecting portion and second connecting portion pass through the tin cream alloy after the first tin cream portion melts and connect.
As described above, in the manufacture field of current electronic device, surface installation technique (is also known as surface mounting technology, i.e., SMT) it is most popular a kind of technology and technique in current electronic assembly industry.In SMT, electronic component is fabricated to nothing and drawn Pin or short leg surface-assembled component (also known as sheet component, i.e. SMC/SMD be arranged on printed circuit board (PCB) surface or On the surface of other substrates, welding assembly is subject to by methods such as reflow welding or immersed solder.
Thus, in the fingerprint recognition module according to the utility model embodiment, preferably by SMT by fingerprint recognition core Piece is installed on a printed circuit, and certainly, the utility model embodiment does not limit specific mounting means, it would however also be possible to employ example The inserting mode of such as pin and socket.In addition, fingerprint recognition chip can use various packing forms, such as grid array is sealed Dress, such as Land Grid Array (LGA) or ball-type grid array (BGA), certainly, fingerprint recognition chip can also be with other The chip of form encapsulation, such as Socket T, the fingerprint recognition module of the utility model embodiment is not intended to carry out this Any limitation.
Printed circuit board (PCB), or other are arranged on when the fingerprint recognition chip using Background Grid array packages, and in SMT modes When on substrate, the first connecting portion of fingerprint recognition chip is preferably hard contact, and the second connecting portion of printed circuit board (PCB) is excellent Choosing is metal pad, and shown in such as Fig. 1 (a) and (b), also, the first connecting portion and second connecting portion pass through the first tin cream The tin cream alloy that portion is formed after melting, the method such as above-mentioned reflow welding or immersed solder links together, so as to realize the first connection Electrical connection between portion and second connecting portion, and by the first connecting portion and second connecting portion, by fingerprint recognition chip and Printed circuit board (PCB) is strongly adhered to together.
Specifically, according to SMT basic technology, first for example, by screen printing technique, by the soldering paste of welding, example On paste solder printing to the second connecting portion of printed circuit board (PCB).Then, fingerprint recognition chip is installed to printed circuit exactly On the fixed position of plate, to ensure that first connecting portion and second connecting portion are alignd.Afterwards, the tin cream of welding is melted, makes finger Line identification chip and printed circuit board (PCB) are strongly adhered to together, while realizing the electricity between first connecting portion and second connecting portion Connection, to transmit signal between fingerprint recognition chip and printed circuit board (PCB).Certainly, it will be understood by those skilled in the art that root According in the fingerprint recognition module of the utility model embodiment, fingerprint recognition chip, which is installed on printed circuit board (PCB), to be used Other modes beyond the tin cream and welding assembly of welding, for example, directly fingerprint recognition chip attachment is existed using conducting resinl On printed circuit board (PCB).
Afterwards, the printed circuit board (PCB) assembled can also be cleaned, to remove harmful weldering as needed Connect residue, such as scaling powder.Also, welding quality and assembling quality etc. can also be carried out to the printed circuit board (PCB) assembled Detection, and to detecting that out of order printed circuit board (PCB) is done over again etc..
In above-mentioned fingerprint recognition module, the 3rd connecting portion is rectangle or the ring dress sheet metal of circle, the 4th connecting portion It is rectangle or the ring dress sheet metal of circle, and the 3rd connecting portion and the 4th connecting portion pass through the tin cream after the thawing of the second tin cream portion Alloy is connected.
Here, it will be understood by those skilled in the art that the connection between the 3rd connecting portion and the 4th connecting portion can pass through Mode same as described above is formed, certainly, and the connected mode between the 3rd connecting portion and the 4th connecting portion can be connected with first Connected mode between portion and second connecting portion is identical, can also be different from each other.But, it is excellent from the perspective of technique simplification Selection of land, the connection side between connected mode and first connecting portion and second connecting portion between the 3rd connecting portion and the 4th connecting portion Formula is identical, for example, all pass through SMT modes.And, it is preferable that in fingerprint recognition chip it is the situation of Background Grid array packages form Under, its 3rd connecting portion is also similar to the pattern formed of hard contact.Also, according to the shape of fingerprint recognition chip Shape, such as rectangle, circle, the 3rd connecting portion can also be the pattern of the shape consistent with the shape of the fingerprint recognition chip. For example, in the case where fingerprint recognition chip is circle, the pattern of the 3rd connecting portion can also be circular, so as to obtain In the case of good isolation effect, efficiently utilization space.
In above-mentioned fingerprint recognition module, first connecting portion and the 3rd connecting portion in same level, with same material and Formed in same manufacturing process step.
In above-mentioned fingerprint recognition module, second connecting portion and the 4th connecting portion in same level, with same material and Formed in same manufacturing process step.
In above-mentioned fingerprint recognition module, the first tin cream portion and the second tin cream portion are located at same level, and in same technique Formed in fabrication steps.
As described above, the connected mode between the 3rd connecting portion and the 4th connecting portion is connected with first connecting portion and second In the case of connected mode identical between portion, the manufacture process of whole fingerprint recognition module can be simplified.Specifically, referring to In the encapsulation process of line identification module, the 3rd connecting portion can be formed while first connecting portion is formed, i.e., in same level, With identical material in same manufacturing step, the ring-type for surrounding each hard contact is formed while each hard contact is formed Pattern.In addition, among the manufacturing process of printed circuit board (PCB), the 4th connecting portion also is formed while second connecting portion is formed, I.e. in same level, with identical material in same manufacturing step, metal pad corresponding with each hard contact is being formed Ring-type pad corresponding with annular patterns is formed simultaneously.Also, in installation steps, the tin cream of welding can be passed through silk screen The modes such as printing are printed in second connecting portion and the 4th connecting portion, and by modes such as reflow weldings, in same manufacturing step Realize the connection of first connecting portion and second connecting portion simultaneously, and the 3rd connecting portion and second connecting portion connection.
So, extra step is not needed according to the fingerprint recognition module of the utility model embodiment, can with tradition Fingerprint recognition module the identical step of manufacturing process in, be additionally formed between fingerprint recognition chip and printed circuit board (PCB) Be used for seal the structure of waterproof.So, due to the manufacturing process that need not be added, thus also without to it is existing production set It is standby to carry out big improvement, the production efficiency of fingerprint recognition module can be improved and production cost is reduced.
Fig. 2 is the schematic diagram of the fingerprint recognition module with waterproof construction according to the utility model embodiment.Such as Fig. 2 institutes Show, after fingerprint recognition chip 100 is installed on flexible printed circuit board 200, fingerprint recognition chip 100 and flexible printing electricity Road plate 200 is closely joined together by functional tin cream portion 101 and non-functional tin cream portion 102.If water is from water inlet Locate the bottom that A enters chip, then can be blocked by the non-functional tin cream portion 102 of periphery, without to functional tin cream portion 101 Impact.So, it is achieved that the waterproof effect of fingerprint recognition module not sealing.
To achieve the above object, embodiment of the present utility model discloses a kind of manufacturer of fingerprint recognition module in addition Method, the fingerprint recognition module includes fingerprint recognition chip and printed circuit board (PCB), and the manufacture method includes:On fingerprint recognition chip The first connecting portion for being electrically connected with printed circuit board (PCB) is made;It is made on a printed circuit for being electrically connected with first connecting portion The second connecting portion connect;It is in the 3rd close-shaped company to be made on fingerprint recognition chip and be arranged on the peripheral of first connecting portion Socket part, and, the 4th connection corresponding with the 3rd connecting portion that the periphery of second connecting portion is set is formed on a printed circuit Portion, wherein, the 3rd connecting portion and the 4th connecting portion is manufactured to cause feelings on a printed circuit are installed in fingerprint recognition chip Under condition, seamless unoccupied place is closely connected between the 3rd connecting portion and the 4th connecting portion.
In the manufacture method of above-mentioned fingerprint recognition module, first connecting portion is hard contact, and second connecting portion is and gold Belong to the corresponding metal pad in contact, and the manufacture method further comprises:By between first connecting portion and second connecting portion Melt as tin cream alloy to connect first connecting portion and second connecting portion in the first tin cream portion.
In the manufacture method of above-mentioned fingerprint recognition module, the 3rd connecting portion is that rectangle or circular ring fill sheet metal, 4th connecting portion is that rectangle or circular ring fill sheet metal, and the manufacture method further comprises:Will in the 3rd connecting portion and Melt as tin cream alloy to connect the 3rd connecting portion and the 4th connecting portion in the second tin cream portion between 4th connecting portion.
Wherein, the first connecting portion and the 3rd connecting portion are in same level, with same material and in same technique system Formed in journey step.
In the manufacture method of above-mentioned fingerprint recognition module, the second connecting portion and the 4th connecting portion are in same Level, is formed with same material and in same manufacturing process step.
In the manufacture method of above-mentioned fingerprint recognition module, the first tin cream portion and the second tin cream portion are positioned at same Level, and formed in same manufacturing process step.
Here, according to the other details of the manufacture method of the fingerprint recognition module of the utility model embodiment with above for It is identical according to the accordingly description of the fingerprint recognition module of the utility model embodiment, therefore in order to avoid redundancy is just repeated no more.
Fig. 3 is the schematic diagram for the assembling process for showing the fingerprint recognition module according to the utility model embodiment.Such as Fig. 4 It is shown, when the manufacture method using the fingerprint recognition module according to the utility model embodiment, chip 10 and FPC 20 is encapsulated When, after fingerprint recognition chip 100 is installed on flexible printed circuit board 200, because 102 pairs of non-functional tin cream portion has The waterproof effect in the tin cream portion 101 of function, it is no longer necessary to dispensing step, so as to also be no longer needed for dispensing board, but can be with A point plate directly is carried out to the flexible printed circuit board for being provided with fingerprint recognition chip, so as to significantly simplify fingerprint recognition module Manufacturing process.
To achieve the above object, according to the another aspect of the utility model embodiment, there is provided a kind of electronic equipment, the electricity Sub- equipment includes fingerprint recognition module, and fingerprint recognition module includes fingerprint recognition chip and printed circuit board (PCB), the fingerprint recognition core There is piece first connecting portion and the printed circuit board (PCB) for being electrically connected with printed circuit board (PCB), which to have, is used for and first connecting portion electricity The second connecting portion of connection, wherein, the fingerprint recognition chip is in close-shaped with what is set in the periphery of first connecting portion 3rd connecting portion, and the printed circuit board (PCB) has the 4th company corresponding with the 3rd connecting portion that the periphery in second connecting portion is set Socket part, and in the case where fingerprint recognition chip is installed on a printed circuit, nothing between the 3rd connecting portion and the 4th connecting portion Closely connect to gap.
In above-mentioned electronic equipment, the first connecting portion is hard contact, and the second connecting portion is corresponding with hard contact Metal pad, and first connecting portion and second connecting portion pass through the tin cream alloy after the first tin cream portion melts and connect.
In above-mentioned electronic equipment, the 3rd connecting portion is rectangle or the ring dress sheet metal of circle, the 4th connecting portion It is rectangle or the ring dress sheet metal of circle, and the 3rd connecting portion and the 4th connecting portion pass through the tin cream after the thawing of the second tin cream portion Alloy is connected.
In above-mentioned electronic equipment, the first connecting portion and the 3rd connecting portion in same level, with same material and Formed in same manufacturing process step.
In above-mentioned electronic equipment, the second connecting portion and the 4th connecting portion in same level, with same material and Formed in same manufacturing process step.
In above-mentioned electronic equipment, the first tin cream portion and the second tin cream portion are located at same level, and in same technique Formed in fabrication steps.
In above-mentioned electronic equipment, the fingerprint recognition chip is encapsulated in Background Grid array packages form.
In above-mentioned electronic equipment, the printed circuit board (PCB) is flexible printed circuit board.
In above-mentioned electronic equipment, the fingerprint recognition chip is arranged on the printed circuit board (PCB) with surface installation technique.
Here, it will be understood by those skilled in the art that can be various according to the electronic equipment of the utility model embodiment Mobile electronic device with fingerprint identification function, such as smart phone, cell phone, tablet PC, notebook Or other multifunction displays or entertainment device.Also, electronic equipment can also be various wearable devices, such as intelligently Wrist-watch, health monitor, body-building belt, electronic bracelet, head-wearing device, electronic components etc..In addition, electronic equipment can also be non-shifting Dynamic device, such as computing device, utensil, Internet of Things (IoT) device etc., it can be that various centralizations or distributing calculate dress Put, for example, desktop computer, grid computing resource, server, server farm, virtual computing resource, cloud computing resources, route Device, interchanger, point-to-point distributed computing resource etc..
In addition, electronic equipment can also be include living room utensil, kitchen appliance, bathroom utensils, bedroom utensil or its The utensil of combination.For example, electronic equipment can be TV, video-unit, audio devices, clock, lighting unit, home entertaining system System, washing machine, refrigerator, baking box, micro-wave oven, game host etc..Moreover, electronic equipment can be thermostat, warning system, heating Unit, cooling unit, electronic lock, garage door opener, electricity generation system etc..
By according to fingerprint recognition module of the present utility model and the electronic equipment with the fingerprint recognition module, Ke Yitong The connecting portion periphery crossed between fingerprint recognition chip and printed circuit board (PCB) is provided for sealing the structure of waterproof, so as to be not required to Want to realize waterproof effect in the case of dispensing, improve the space utilization rate of printed circuit board (PCB), promote fingerprint recognition module Design and manufacture.
By according to fingerprint recognition module of the present utility model and the electronic equipment with the fingerprint recognition module, Ke Yi The structure for sealing waterproof is formed in the step of forming the electrical connection between fingerprint recognition chip and printed circuit board (PCB), without The manufacturing process to be added, so as to improve the production efficiency of fingerprint recognition module and reduce cost.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art For art personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these improve and Retouching also should be regarded as protection domain of the present utility model.

Claims (10)

1. a kind of fingerprint recognition module, the fingerprint recognition module includes fingerprint recognition chip and printed circuit board (PCB), the fingerprint Identification chip have be used for the first connecting portion that electrically connect with the printed circuit board (PCB) and the printed circuit board (PCB) have for The second connecting portion of the first connecting portion electrical connection, it is characterised in that:
The fingerprint recognition chip is in the 3rd close-shaped connecting portion with what is set in the periphery of the first connecting portion,
The printed circuit board (PCB) is with the periphery setting in the second connecting portion and the 3rd connecting portion the corresponding 4th Connecting portion, and
In the case where the fingerprint recognition chip is installed on the printed circuit board, the 3rd connecting portion and the described 4th Seamless unoccupied place is closely connected between connecting portion.
2. fingerprint recognition module as claimed in claim 1, wherein, the first connecting portion is hard contact, and described second connects Socket part is metal pad corresponding with the hard contact, and the first connecting portion and the second connecting portion pass through the first tin Tin cream alloy after cream portion melts is connected.
3. fingerprint recognition module as claimed in claim 2, wherein the 3rd connecting portion is rectangle or the ring dress gold of circle Belong to piece, the 4th connecting portion is rectangle or circular ring fills sheet metal, and the 3rd connecting portion and the 4th connection Tin cream alloy after portion is melted by the second tin cream portion is connected.
4. fingerprint recognition module as claimed in claim 3, wherein, the first connecting portion and the 3rd connecting portion are in same One level, is formed with same material and in same manufacturing process step.
5. fingerprint recognition module as claimed in claim 3, wherein, the second connecting portion and the 4th connecting portion are in same One level, is formed with same material and in same manufacturing process step.
6. fingerprint recognition module as claimed in claim 3, wherein, the first tin cream portion and the second tin cream portion are located at together One level, and formed in same manufacturing process step.
7. fingerprint recognition module as claimed in claim 1, wherein, the fingerprint recognition chip is sealed in Background Grid array packages form Dress.
8. fingerprint recognition module as claimed in claim 1, wherein, the printed circuit board (PCB) is flexible printed circuit board.
9. fingerprint recognition module as claimed in claim 1, wherein, the fingerprint recognition chip is arranged on surface installation technique The printed circuit board (PCB).
10. a kind of electronic equipment, the electronic equipment includes fingerprint recognition module, the fingerprint recognition module includes fingerprint recognition Chip and printed circuit board (PCB), the fingerprint recognition chip have be used for the first connecting portion that is electrically connected with the printed circuit board (PCB) and The printed circuit board (PCB) has the second connecting portion for being used for electrically connecting with the first connecting portion, it is characterised in that:
The fingerprint recognition chip is in the 3rd close-shaped connecting portion with what is set in the periphery of the first connecting portion,
The printed circuit board (PCB) is with the periphery setting in the second connecting portion and the 3rd connecting portion the corresponding 4th Connecting portion, and
It is seamless between the 3rd connecting portion and the 4th connecting portion in the case where fingerprint recognition chip is installed on a printed circuit Ground is closely connected.
CN201621137605.6U 2016-10-19 2016-10-19 Fingerprint recognition module and electronic equipment Active CN206400571U (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106339700A (en) * 2016-10-19 2017-01-18 南昌欧菲生物识别技术有限公司 Fingerprint identification module group and manufacturing method thereof and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106339700A (en) * 2016-10-19 2017-01-18 南昌欧菲生物识别技术有限公司 Fingerprint identification module group and manufacturing method thereof and electronic equipment

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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

Patentee after: Jiangxi OMS Microelectronics Co.,Ltd.

Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province

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