CN206400115U - A kind of scintillation screen encapsulating structure - Google Patents
A kind of scintillation screen encapsulating structure Download PDFInfo
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- CN206400115U CN206400115U CN201720006307.1U CN201720006307U CN206400115U CN 206400115 U CN206400115 U CN 206400115U CN 201720006307 U CN201720006307 U CN 201720006307U CN 206400115 U CN206400115 U CN 206400115U
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Abstract
The utility model provides a kind of scintillation screen encapsulating structure, and the scintillation screen encapsulating structure includes：Substrate；The substrate includes relative first surface and second surface；It is formed at the flash layer for being used to being converted into X-ray into visible ray of the substrate first surface；Cover the reflection glue-line for being used to reflect the visible ray that the flash layer conversion is obtained of the flash layer.Scintillation screen encapsulating structure of the present utility model can reach higher reflectivity using visible light reflecting layer of the reflection glue-line as scintillation screen, and reflection bondline thickness is relatively thin, can greatly improve the picture quality of product, improves product competitiveness.
Description
Technical field
The utility model belongs to X-ray flat panel detector field, is related to a kind of scintillation screen encapsulating structure.
Background technology
In X-ray flat panel detector industry, cesium iodide scintillation screen has low dosage, high-resolution, high picture quality, into
For the main product developed in industry.
For cesium iodide scintillation screen, light photon can be converted into when receiving x-ray photon and exciting, it is seen that light light
The sub and then panel that is photoelectrically converted receives to switch to electronics vacancy pair, so as to read generation image by peripheral circuit.Here X-ray swashs
The direction of the light photon sent is random, that is, any direction is minded and is all possible in three dimensions, then just
There is the light photon close to half away from opto-electronic conversion panel, this part light needs to use reflecting layer to change its propagation side
To progress is traveled to be utilized on opto-electronic conversion panel；The reflectivity in this reflecting layer is just most important.
In the prior art, typically all selection uses metal composite film gluing to cesium iodide scintillation screen to the material in reflecting layer,
Reflection, waterproof, the function of anti-scratch can be played.Fig. 1 is shown as a kind of cesium iodide scintillation screen encapsulating structure, from top to bottom successively
Including metal composite film reflecting layer 101, cesium iodide film layer 102 and opto-electronic conversion panel 103 (or transparency carrier).In the prior art
Metal foil is as the reflecting layer of light photon, and the reflectivity to visible ray is about 90%, and reflectivity is not high enough, wastes a lot
Visible light signal is, it is necessary to further improve reflectivity.
Therefore, a kind of new scintillation screen encapsulating structure how is provided, further to improve the performance of scintillation screen, so as to improve
The picture quality of detector, makes product more competitive, is asked as those skilled in the art's important technology urgently to be resolved hurrily
Topic.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of scintillation screen encapsulation knot
Structure, for solving in scintillation screen in the prior art because reflecting layer reflectivity is not high enough, causes the problem of picture quality is relatively low.
In order to achieve the above objects and other related objects, the utility model provides a kind of scintillation screen encapsulating structure, the sudden strain of a muscle
Bright screen encapsulating structure includes：
Substrate；The substrate includes relative first surface and second surface；
It is formed at the flash layer for being used to being converted into X-ray into visible ray of the substrate first surface；
Cover the reflection glue-line for being used to reflect the visible ray that the flash layer conversion is obtained of the flash layer.
Alternatively, the thickness range of the reflection glue-line is 30-100 μm.
Alternatively, the reflection glue-line is 94.5%-99.5% to the reflectivity range of visible ray.
Alternatively, the substrate is for will be seen that light is converted to the opto-electronic conversion panel of electric signal.
Alternatively, the substrate is the transparency carrier that can pass through visible ray.
Alternatively, the scintillation screen encapsulating structure also includes the waterproof membrane for covering the reflection glue-line.
Alternatively, the waterproof membrane is alternately formed by stacking by metal film and oxidation film.
Alternatively, the scintillation screen encapsulating structure also includes covering the reflection glue-line and for the support of waterproof anti-scratch
Layer.
Alternatively, the scintillation screen encapsulating structure also includes the fluid sealant for surrounding the supporting layer surrounding, the fluid sealant
Lower surface is connected with the first surface of the substrate.
Alternatively, the flash layer is caesium iodide scintillator layer.
As described above, scintillation screen encapsulating structure of the present utility model, has the advantages that：Flicker of the present utility model
Shield encapsulating structure and metal composite film is replaced as the visible light reflecting layer of scintillation screen using reflection glue-line, can reach higher anti-
Rate (can reach 99%) is penetrated, and reflection bondline thickness is relatively thin (30-70 μm can meet requirement).Glue-line is reflected without any organic molten
Agent is separated out, it is to avoid cesium iodide scintillation screen declines because of moisture or organic solvent dissolving resolution ratio.Reflect glue-line coating convenient, only
One layer of conventional silk-screen printing technique even spread is needed to use, and curing process is simple, it is only necessary to heating cure, Gu
Talk about temperature relatively low, curable, solidification in 3 hours at 100 DEG C in 1 hour at 150 DEG C, the solidification in 24 hours of normal temperature needs.This practicality is new
The scintillation screen encapsulating structure of type can greatly improve the picture quality of product, improve product competitiveness.
Brief description of the drawings
Fig. 1 is shown as the schematic diagram of cesium iodide scintillation screen encapsulating structure in the prior art.
Fig. 2 is shown as structural representation of the scintillation screen encapsulating structure of the present utility model in embodiment one.
Fig. 3 is shown as structural representation of the scintillation screen encapsulating structure of the present utility model in embodiment two.
Component label instructions
101 metal composite film reflecting layer
102 cesium iodide film layers
103 opto-electronic conversion panels
201 substrates
202 flash layers
203 reflection glue-lines
204 waterproof membranes
205 supporting layers
206 fluid sealants
Embodiment
Embodiment of the present utility model is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages of the present utility model and effect easily.
Fig. 2 is referred to Fig. 3.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., is only used to
Coordinate the content disclosed in specification, so that those skilled in the art is understood with reading, be not limited to the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influenceing the utility model effect that can be generated and the purpose that can reach, all should still fall in the utility model
Disclosed technology contents are obtained in the range of covering.Meanwhile, in this specification it is cited as " on ", " under ", " left side ",
The term on " right side ", " centre " and " one " etc., is merely convenient to understanding for narration, and it is enforceable to be not used to restriction the utility model
Scope, being altered or modified for its relativeness is enforceable when being also considered as the utility model under without essence change technology contents
Category.
Embodiment one
The utility model provides a kind of scintillation screen encapsulating structure, referring to Fig. 2, being shown as the scintillation screen encapsulating structure
Schematic diagram, including：
Substrate 201；The substrate 201 includes relative first surface and second surface；
It is formed at the flash layer 202 for being used to being converted into X-ray into visible ray of the first surface of substrate 201；
Cover the reflection glue-line 203 for being used to reflect the visible ray that the flash layer conversion is obtained of the flash layer 202.
Specifically, the substrate 1 can use opto-electronic conversion panel, the opto-electronic conversion panel can will be seen that light is converted to
Electric signal.As an example, the opto-electronic conversion panel include charge coupled cell (Charge-coupled Device, CCD),
Amorphous silicon film transistor (Thin Film Transistor, α-Si TFT), complementary metal oxide semiconductor
The sensor devices such as (Complementary Metal Oxide Semiconductor, CMOS) transistor.
In another embodiment, the substrate 1 also can be using the transparency carrier that can pass through visible ray, such as glass substrate.
In addition, the substrate 1 should not can also too limit the utility model using carbon plate, aluminium sheet, fibre optic plate etc. herein
Protection domain.
Specifically, the flash layer 202 is using caesium iodide scintillator layer.Caesium iodide scintillator crystal is using cesium iodide as base
The inorganic scintillation crystal of material, in addition to pure caesium iodide scintillator (CsI), according to the difference for adding activator, can be divided into thallium and swash
Living and sodium activates two kinds, and its chemical formula is respectively CsI (Tl), CsI (Na).In the present embodiment, in the caesium iodide scintillator layer
Cesium iodide crystal be preferred to use cesium iodide polycrystalline.
Specifically, the thickness range of the reflection glue-line 203 is 30-100 μm, the reflection glue-line 203 is to visible ray
Reflectivity range is 94.5%-99.5%, can greatly improve the picture quality of product, improves product competitiveness.
As an example, the reflection glue-line 203 (is such as aoxidized by heat curing-type base material and the reflection grain being scattered in base material
Titanium particle) composition.In the present embodiment, the reflection glue-line 203 is preferred to use the model KXE13- of MOMENTIVE companies production
1007 high reflection glue.
Specifically, the scintillation screen encapsulating structure also includes the waterproof membrane 204 for covering the reflection glue-line 203.It is described anti-
Moisture film 204 can use homogenous material film layer, such as silicon dioxide film, titanium dioxide film, aluminium film, germanium film, also can be using difference
The composite film of material composition.As an example, the waterproof membrane 204 is composite water-proof film, replaced by metal film and oxidation film
It is formed by stacking.The metal film includes but is not limited to germanium film, aluminium film etc., and the oxidation film includes but is not limited to silica
Film, titanium dioxide film etc..
As an example, the making step of the scintillation screen encapsulating structure of the present embodiment is as follows：
1. caesium iodide scintillator layer is deposited on substrate；
2. screen process press is directly utilized in the high reflection glue-line of caesium iodide scintillator one layer 30-70 μm of printed thereon of layer；
3. a coated scintillation screen is put into baking oven and is heated to 100 DEG C, insulation 3h solidifications (or toast ginseng using other temperature
Number)；
4. baked product load is put into evaporation MULTILAYER COMPOSITE waterproof membrane on vacuum coating equipment, waterproof membrane uses metal
The multilayers such as film, oxide membranous layer are alternately deposited.
Embodiment two
Referring to Fig. 3, the schematic diagram of scintillation screen encapsulating structure described in the present embodiment is shown as, including：
Substrate 201；The substrate 201 includes relative first surface and second surface；
It is formed at the flash layer 202 for being used to being converted into X-ray into visible ray of the first surface of substrate 201；
Cover the reflection glue-line 203 for being used to reflect the visible ray that the flash layer conversion is obtained of the flash layer 202.
Wherein, the scintillation screen encapsulating structure also includes covering the reflection glue-line 203 and for the support of waterproof anti-scratch
Layer 205 and the fluid sealant 206 for surrounding the supporting layer surrounding, the lower surface of fluid sealant 206 and the first of the substrate 201
Surface is connected.The supporting layer 205 can reduce the breakage rate of the reflection glue-line 203, it is possible to reflect glue in silk-screen printing
As the supporting layer of reflection glue-line during layer, metal composite film can be used.The fluid sealant 206 can prevent steam from being connect from edge
Enter scintillator layers at seam, can be using materials such as epoxy resin, polyurethane silica gel.
As an example, the making step of the scintillation screen encapsulating structure of this implementation is as follows：
1. one layer 30-100 μm of high reflection glue-line is printed on supporting layer using screen process press；Supporting layer has waterproof
Vapour and anti-scratch function, such as metal composite film；
2. the supporting layer with reflection glue is sticked on using laminating machine the substrate that caesium iodide scintillator layer had been deposited
On；In the present embodiment, the substrate is by taking glass substrate as an example；
3. the product sticked is put into baking oven is heated to 100 DEG C, insulation 3h solidifications；
4. utilize surrounding point gluing of the point gum machine at supporting layer and bonding glass.
In summary, scintillation screen encapsulating structure of the present utility model is used as flicker using reflection glue-line instead of metal composite film
The visible light reflecting layer of screen, can reach higher reflectivity (can reach 99%), and relatively thin (30-70 μm of bondline thickness of reflection
Requirement can be met).Reflection glue-line is separated out without any organic solvent, it is to avoid cesium iodide scintillation screen is because of moisture or organic solvent
Resolution ratio is dissolved to decline.Reflect glue-line coating convenient, it is only necessary to using one layer conventional of silk-screen printing technique even spread,
And curing process is simple, it is only necessary to heating cure, fixed line temperature is relatively low, at 150 DEG C 1 hour it is curable, 3 is small at 100 DEG C
When solidify, normal temperature need 24 hours solidify.Scintillation screen encapsulating structure of the present utility model can greatly improve the image matter of product
Amount, improves product competitiveness.So, the utility model effectively overcomes various shortcoming of the prior art and has high industrial profit
With value.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art can all be carried out without prejudice under spirit and scope of the present utility model to above-described embodiment
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by claim of the present utility model.
Claims (10)
1. a kind of scintillation screen encapsulating structure, it is characterised in that the scintillation screen encapsulating structure includes：
Substrate；The substrate includes relative first surface and second surface；
It is formed at the flash layer for being used to being converted into X-ray into visible ray of the substrate first surface；
Cover the reflection glue-line for being used to reflect the visible ray that the flash layer conversion is obtained of the flash layer.
2. scintillation screen encapsulating structure according to claim 1, it is characterised in that：It is described reflection glue-line thickness range be
30-100μm。
3. scintillation screen encapsulating structure according to claim 1, it is characterised in that：Reflection of the reflection glue-line to visible ray
Rate scope is 94.5%-99.5%.
4. scintillation screen encapsulating structure according to claim 1, it is characterised in that：The substrate is for will be seen that light is changed
For the opto-electronic conversion panel of electric signal.
5. scintillation screen encapsulating structure according to claim 1, it is characterised in that：The substrate is the saturating of permeable visible ray
Bright substrate.
6. scintillation screen encapsulating structure according to claim 1, it is characterised in that：The scintillation screen encapsulating structure also includes covering
The waterproof membrane of the lid reflection glue-line.
7. scintillation screen encapsulating structure according to claim 6, it is characterised in that：The waterproof membrane is by metal film and oxide
Film is alternately formed by stacking.
8. scintillation screen encapsulating structure according to claim 1, it is characterised in that：The scintillation screen encapsulating structure also includes covering
The lid reflection glue-line is simultaneously used for the supporting layer of waterproof anti-scratch.
9. scintillation screen encapsulating structure according to claim 8, it is characterised in that：The scintillation screen encapsulating structure also includes bag
The fluid sealant of the supporting layer surrounding is enclosed, the fluid sealant lower surface is connected with the first surface of the substrate.
10. scintillation screen encapsulating structure according to claim 1, it is characterised in that：The flash layer is caesium iodide scintillator
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720006307.1U CN206400115U (en) | 2017-01-04 | 2017-01-04 | A kind of scintillation screen encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720006307.1U CN206400115U (en) | 2017-01-04 | 2017-01-04 | A kind of scintillation screen encapsulating structure |
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| Publication Number | Publication Date |
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| CN206400115U true CN206400115U (en) | 2017-08-11 |
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| CN201720006307.1U Active CN206400115U (en) | 2017-01-04 | 2017-01-04 | A kind of scintillation screen encapsulating structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098276A (en) * | 2018-01-29 | 2019-08-06 | 上海奕瑞光电子科技股份有限公司 | Flat panel detector and preparation method thereof based on narrow frame transparent enclosure |
| CN113636158A (en) * | 2021-08-10 | 2021-11-12 | 上海烁泰科技有限公司 | Packaging process of scintillator panel |
-
2017
- 2017-01-04 CN CN201720006307.1U patent/CN206400115U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098276A (en) * | 2018-01-29 | 2019-08-06 | 上海奕瑞光电子科技股份有限公司 | Flat panel detector and preparation method thereof based on narrow frame transparent enclosure |
| CN113636158A (en) * | 2021-08-10 | 2021-11-12 | 上海烁泰科技有限公司 | Packaging process of scintillator panel |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201201 Shanghai City, Pudong New Area Zhangjiang hi tech Industrial District Ruiqinglu No. 590 9 2 storey 202 room Patentee after: Shanghai Yi Ruiguang electronic Polytron Technologies Inc Address before: 201201 Shanghai City, Pudong New Area Pudong New Area Zhangjiang High tech Industrial District Ruiqinglu No. 590 9 2 storey 202 room Patentee before: Shanghai Yirui Optoelectronics Technology Co., Ltd. |
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| CP03 | Change of name, title or address |