CN206365151U - Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via - Google Patents

Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via Download PDF

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Publication number
CN206365151U
CN206365151U CN201621404445.7U CN201621404445U CN206365151U CN 206365151 U CN206365151 U CN 206365151U CN 201621404445 U CN201621404445 U CN 201621404445U CN 206365151 U CN206365151 U CN 206365151U
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CN
China
Prior art keywords
optical fiber
pcb board
fiber interface
back drill
ground via
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201621404445.7U
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Chinese (zh)
Inventor
郝彦霞
李庆海
王灿钟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Bo Circuit Co Ltd
Original Assignee
Shenzhen Bo Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Bo Circuit Co Ltd filed Critical Shenzhen Bo Circuit Co Ltd
Priority to CN201621404445.7U priority Critical patent/CN206365151U/en
Application granted granted Critical
Publication of CN206365151U publication Critical patent/CN206365151U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of pcb board structure by back drill with realizing cracking down illegal activities under optical fiber interface via in pcb board technical field, including pcb board and through the non-ground via of the pcb board, non- ground via is connected with the internal layer signal wire of pcb board internal layer, the side of non-ground via is provided with optical fiber interface, and the non-ground via close to optical fiber interface side is provided with back drill region.The utility model efficiently solve the problems, such as optical fiber interface part again on PCB placement-and-routing utilization rate.

Description

Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via
Technical field
The utility model is related to circuit board technology field, specifically, is to be related to one kind to realize optical fiber interface by back drill Lower cracking down illegal activities via pcb board structure.
Background technology
Printed circuit board(Printed Circuit Board, pcb board)Also known as printed circuit board (PCB), printed substrate, are electricity The important component of physical support and the signal transmission of sub- product.Conventional fiber interface is typically all crimped in pcb board, light Fine interface is all metal shell, so being with not allowing cracking down illegal activities via below optical fiber interface, is otherwise easily caused optical fiber interface With the situation of non-ground via short circuit.
But with constantly developing rapidly for information age, pcb board tends to highly dense high integration development, and such structure is held The waste of pcb board layout is easily caused, veneer utilization rate how is improved just into a current major issue.
The content of the invention
In order to overcome the shortcomings of existing technology, the utility model provides one kind and realizes cracking down illegal activities under optical fiber interface by back drill The pcb board structure of ground via, efficiently solve the problems, such as optical fiber interface part again on PCB placement-and-routing utilization rate.
Technical solutions of the utility model are as described below:
Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via, it is characterised in that including pcb board and pass through The non-ground via of the pcb board is worn, the non-ground via is connected with the internal layer signal wire of the pcb board internal layer, the non-ground mistake The side in hole is provided with optical fiber interface, and the non-ground via close to the optical fiber interface side is provided with back drill region.
According to the utility model of such scheme, it is characterised in that back drill region face where the optical fiber interface Layer is extended at the internal layer signal wire.
According to the utility model of such scheme, its advantage is, the utility model cracking down illegal activities under optical fiber interface Via, solve the problems, such as optical fiber interface part again on PCB placement-and-routing utilization rate, effectively increase PCB single board utilization rate, So as to reduce the pressure of placement-and-routing spatially.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure, 10, pcb board;11st, top surface;12nd, bottom surface;20th, optical fiber interface;30th, non-ground via;40th, interior layer signal Line;50th, back drill region.
Embodiment
Below in conjunction with the accompanying drawings and the utility model is further described embodiment:
As shown in figure 1, a kind of pcb board structure by back drill with realizing cracking down illegal activities under optical fiber interface via, including pcb board 10 With the non-ground via 30 through pcb board 10, non-ground via 30 is connected with the internal layer signal wire 40 of the internal layer of pcb board 10, non-ground via 30 side is provided with optical fiber interface 20, and the non-ground via 30 close to the side of optical fiber interface 20 is provided with back drill region 50.
It is preferred that, back drill region 50 is extended at internal layer signal wire 40 from the place surface layer of optical fiber interface 20.
In the present embodiment, optical fiber interface 20 is directed to crimp the interface of metal shell, and optical fiber interface 20 is arranged at PCB On the top surface 11 of plate 10, the circuit of bottom surface 20 is connected to internal layer signal wire 40 by the non-ground via after back drill, from top surface 11 to The non-ground via area of internal layer signal wire 40 is stub, and this part is connect by back drilling method formation back drill region 50, now optical fiber Non- ground via under mouth 20 would not be with the short circuit of optical fiber interface 20 on top surface 11.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted, And all these modifications and variations should all belong to the protection domain of the utility model appended claims.
Exemplary description is carried out to the utility model patent above in conjunction with accompanying drawing, it is clear that the reality of the utility model patent Now it is not subject to the restrictions described above, as long as the method for employing the utility model patent conceives various with technical scheme progress Improve, or it is not improved the design of the utility model patent and technical scheme are directly applied into other occasions, in this reality With in new protection domain.

Claims (2)

1. pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via, it is characterised in that including pcb board and run through The non-ground via of the pcb board, the non-ground via is connected with the internal layer signal wire of the pcb board internal layer, the non-ground via Side be provided with optical fiber interface, the non-ground via close to the optical fiber interface side is provided with back drill region.
2. the pcb board structure according to claim 1 by back drill with realizing cracking down illegal activities under optical fiber interface via, its feature exists In the back drill region is extended at the internal layer signal wire from surface layer where the optical fiber interface.
CN201621404445.7U 2016-12-21 2016-12-21 Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via Active CN206365151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621404445.7U CN206365151U (en) 2016-12-21 2016-12-21 Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621404445.7U CN206365151U (en) 2016-12-21 2016-12-21 Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via

Publications (1)

Publication Number Publication Date
CN206365151U true CN206365151U (en) 2017-07-28

Family

ID=59375506

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621404445.7U Active CN206365151U (en) 2016-12-21 2016-12-21 Pass through the pcb board structure of back drill with realizing cracking down illegal activities under optical fiber interface via

Country Status (1)

Country Link
CN (1) CN206365151U (en)

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