CN206349390U - Low operating temperature bloom efficiency LED package device - Google Patents

Abstract

Low operating temperature bloom efficiency LED package device, N × M small LED grains (4) of integration packaging at least two array packaging in the matrix form are used on the upside of substrate (3), wherein, N ＞ 1, M >=2, small LED grain (4) the encapsulating structure operating current of N × M array packaging is not more than the rated operational current of the suitable large stretch of LED grain (1) of total rated power, and the total light flux of small LED grain (4) encapsulating structure of N × M array packaging is more than the luminous flux of the suitable large stretch of LED grain (1) of total rated power.By in less tight space, the small LED grain of the higher small array packaging of multiple total light efficiencies is installed in closely spaced array mode and is used as lamp light source, quick heat radiating function admirable, encapsulation volume is small, using convenient, realize low heating high effect, obtain energy-conservation and the effect of high life are gone back simultaneously, and dust-proof, water resistance preferably, meets IP specification grades, meanwhile, significantly reduce raw material production cost.

Description

Low operating temperature bloom efficiency LED package device

Technical field

The utility model is related to LED encapsulation structure energy efficiency improved technology, especially low operating temperature bloom efficiency LED Packaging system.

Background technology

LED chip and encapsulating develops to high-power direction, although, 10- bigger than Φ 5mmLED can be produced under high current 20 times of luminous flux, but light decay must be solved the problems, such as using the effective encapsulating material radiated with not deteriorating, it is impossible to the heat of processing Quick light decay and the short main cause of lamp life often can be caused.Therefore, shell and encapsulation be also its key technology, can hold Occurred by the LED encapsulation of several W power.White, green, bluish-green, the blue power-type LED of 5W series at the beginning of 2003 supply, in vain The output of light LED light reaches 1871Lm, light efficiency 44.31lm/W, and the LED of 10W power can be born by developing, large area pipe；Size is 2.5 × 2.5mm, can work under 5A electric currents, and light output reaches 2001Lm, be grown a lot space as solid light source.

LED solid-state illuminations are developed so far or some technologies need to break through and progressive, in general current electric energy conversion Luminous energy into needs is still too low or even is less than the half of conversion ratio, mostly still changes into unwanted heat energy, encapsulates skill The LED application of this defective effect in art.LED solid-state illuminations are also generated excessively while being and be converted into luminous energy by electric energy The deficiency of pending heat energy.

The integrative packaging technique that LED product is used during fabrication, the structure of more outstanding LED bulb product needs To further optimization.Based on the principle of luminosity of LED one-way, designer updates on fitting structure so that LED bulb Spot light of the distribution curve flux substantially with incandescent lamp it is convergent.On the one hand improved technology needs to be concerned with how lifting luminescent quality, On the other hand it is then to lay siege to how constantly to reduce cost.

As shown in Figure 1, general traditional method the lateral surface of substrate 3 of bottom can increase in large stretch of LED 1 encapsulating structure of grain Plus radiating fin 2, as external heat sink, this is most-often used radiating mode, but it can so increase radiating cost and light fixture again Weight and volume, for example, in 80 watts~150 watts high wattage light fixture projects are manufactured and designed, this kind of small-sized luminaire body is accumulated in sternly Lattice are limited, it is impossible to increase heat dissipation metal fin to radiate, and this is also that prior art is not enough present in design principle.

The principle Shortcomings of existing LED encapsulation, general packaged type mostly for the increase for obtaining overall luminous flux, Do not increase under chip area use, with high current, the encapsulation of low-voltage packaged type, but must with higher volume of radiator come Radiating, to being that outside a big obstacle, light decay and life-span to packaging system are also test in the design of light fixture, can say be do not repay Lose.Likewise, LED encapsulation is in order to increase the service efficiency of the high chip of conventional price, can all increase electric current to chip can hold The highest scope received, although its unit lumen number can be increased by so doing, must more be solved with electric energy conversion luminous energy institute The heat dissipation problem of the high heat energy produced, so, existing design principle seriously restricts the development of associated lamp technology.

Utility model content

The purpose of this utility model is to provide low operating temperature bloom efficiency LED package device, improve LED encapsulation principles and Structure, low heating and high lumen luminous efficiency are realized while taking into account.

The purpose of this utility model will be realized by following technical measures：Collected in the matrix form using N × M on the upside of substrate Into the small LED grain of encapsulation at least two array packaging, wherein, N ＞ 1, the small LED grain encapsulating structure of M >=2, N × M array packaging Operating current is not more than the rated operational current of the suitable large stretch of LED grain of total rated power, the N × M small LED of array packaging The total light flux of grain encapsulating structure is more than the luminous flux of the suitable large stretch of LED grain of total rated power.

Especially, there are thermal dispersant coatings in substrate downside surface.

Especially, the small LED grain of array packaging is arranged on support frame, or, the small LED grain of array packaging, which is arranged on, to be dissipated In thermosetting reservation；Support frame is arranged on middle part upside in radiating permanent seat, and radiating permanent seat is arranged on lamp holder upper end, in support frame Outer and radiating permanent seat upper end is installed by bubble-cap；Support frame surface has reflecting layer.High Power Factor control electricity is installed in lamp holder Source.Radiating permanent seat has good heat conductive insulating performance.Support frame is connected to form conductive structure with radiating permanent seat.

Advantage and effect of the present utility model：By in less tight space, installing multiple in closely spaced array mode The small LED grain of the higher small array packaging of total light efficiency is as lamp light source, also due to the small LED grain of substantial amounts of array packaging Small chip substitutes high current, large stretch of LED of specular removal grain large chip, and quick heat radiating function admirable, encapsulation volume is small, using just Victory, realizes low heating high effect, while also obtain energy-conservation and the effect of high life, dust-proof, water resistance preferably, meets IP specifications Grade, meanwhile, significantly reduce raw material production cost.

Brief description of the drawings

Fig. 1 is LED heat-dissipation packaging structures schematic diagram in the prior art.

Fig. 2 is electric current-light efficiency influence relation curve schematic diagram of the different encapsulating structure modes of LED.

Fig. 3 is LED heat-dissipation packaging structure schematic diagrames in the utility model embodiment 1.

Fig. 4 is applied to specular removal bulb structure schematic diagram for improved LED cooling encapsulations in the utility model embodiment 2.

Reference includes：

The small LED grain 4 of large stretch of LED grain 1, radiating fin 2, substrate 3, array packaging, thermal dispersant coatings 5, lamp holder 6, radiating Fixed seat 7, support frame 8, bubble-cap 9.

Embodiment

The utility model principle is, since electric energy generation luminous energy and heat energy, electric energy=luminous energy+heat energy, so, it is only hot It can reduce, luminous energy can just increase.As shown in Figure 2, large stretch of LED 1 single package chip product of grain of original large-size, By selecting array packaging 4 chips of small LED grain of many reduced sizes to carry out integration packaging replacement, wherein, multiple chips come Generation heat energy is shared out equally, especially, by using several different chips, the supply of electric current is reduced gradually, through overtesting pair Than finding, after the work rated current for reducing supply, operating temperature is decreased obviously, and the lumen number of certain unit luminous energy also declines, But Lm/W light efficiency is increased by a lot, all obtaining same by the test result experiment of several chips to this design principle Curve.

In the utility model, the packaging system of the one single chip of original large-size, change many reduced sizes of selection Chip carrys out encapsulating structure, allows multiple chips to share out equally original heat energy, such heat energy compared with dispersed phase to being easily processed many, On the other hand, while reducing supply work rated current, at this moment total supply power supply wattage is reduced, and operating temperature will substantially simultaneously Decline, certainly, the lumen number of unit luminous energy also declines, however, being collected the small LED grain 4 of multiple array packagings using array way Into encapsulation, the general power wattage needed is obtained.At this moment, not only overall package structure heat energy is greatly reduced, and Lm/W light Efficiency also increases a lot simultaneously.After improvement, the electric current of reduction supply LED grain or chip can reduce the generation of heat energy simultaneously.Take The effect obtained also includes, and total luminous flux is increased substantially, and multiple small LED 4 total heats of grain of array packaging are far below original Encapsulating structure, and be evenly distributed, it is easy to radiate.

Found in present invention research, 85~120lm/ is only encapsulated out with the rated current of 1 chip of existing large stretch of LED grain W product, but after improving, it is only necessary to when supplying electric current and being reduced to original less than 30%, so that it may reach 160~185lm/W's Light efficiency, the low operating temperature bloom efficiency energy-saving effect obtained after undoubtedly improving is significant.Except radiating fin can be reduced The cost of piece 2, allows LED lamp product to have more design spaces, also obtains lm/W increase simultaneously, carries and stretches electric energy and change into The efficiency of luminous energy, can be applicable on the light fixture for needing bloom efficiency packaging system.

Prior art is tested with the rated current of large chip and only encapsulates out light efficiency above and below 85~120lm/W, and this implementation In example, when electric current is supplied only to original less than 20%, so that it may reach 160~185lm/W or so light efficiency.

The utility model is described in further detail with reference to the accompanying drawings and examples.

Embodiment 1：As shown in Figure 3, the upside of substrate 3 uses N × M integration packaging at least two array collection in the matrix form Small LED grain 4 is filled, wherein, N ＞ 1, M >=2, N × M array packaging 4 encapsulating structure operating currents of small LED grain are not more than always The rated operational current of the suitable large stretch of LED grain 1 of rated power, N × M array packaging 4 encapsulating structures of small LED it is total Luminous flux is more than the luminous flux of the suitable large stretch of LED grain 1 of total rated power.

In foregoing, there are thermal dispersant coatings 5 in the downside surface of substrate 3.

In the present embodiment, due to the improvement of encapsulating structure, compared with the suitable large stretch of LED grain 1 of total rated power, even if Under conditions of identical luminous flux is kept, the LED encapsulation structure radiating after improvement is also significantly relatively low, and the downside surface of substrate 3 is not Need radiating fin 2 and fan using tradition as radiator again, at most only need by thermal dispersant coatings 5, you can efficiently Solution radiating.

On packaged lamp grain, large-size chip package fitting structure will be used in the past first for the utility model, by closing The supporting construction of the reason design integrated fixation of multi-chip, is improved to using more smaller size of chip, concentrating on one originally Chip on it is luminous disperse to averraged to several small chip with heating, meanwhile, only supply the work of original large chip Make less than the 30% of electric current less electric current, can thus substantially reduce heat energy generation, be conducive to being evenly distributed in small chip Under radiator structure it is more efficient carry out heat heat loss through conduction, further, can because the generation of heat energy has been greatly reduced The setup cost that decorrelation sets heat dissipation metal fin is even saved to reduce, this also allows the profile of light fixture more exquisite.

In the present embodiment, to carry out general power 0.2W COB encapsulation using the small LED grain 4 of array packaging, every lamp grain makes Electric current is reduced；Inadequate wattage, 0.1W × 2=are supplied using lamp grain number using the small LED grain 4 of 2 0.1W array packagings 0.2W.Continue to be improved to and disperse heat energy, i.e. 0.05W × 4 using 4 0.05WCOB array of packages packagings, 4 small chips of small LED grain =0.2W, still, reduces supply electric current more than 70%, in the obvious and economization radiating fin 2 that cools, total light flux is but carried It is high.

Embodiment 2：As shown in Figure 4, the small LED grain 4 of array packaging is arranged on support frame 8, or, array packaging is small LED grain 4 is arranged in radiating permanent seat 7；Support frame 8 is arranged on middle part upside in radiating permanent seat 7, and radiating permanent seat 7 is pacified It is outer and bubble-cap 9 is installed in the upper end of radiating permanent seat 7 in support frame 8 mounted in the upper end of lamp holder 6；The surface of support frame 8 has reflecting layer. High Power Factor control power supply is installed in lamp holder 6.Radiating permanent seat 7 has good heat conductive insulating performance.Support frame 8 and radiating The connection of fixed seat 7 forms conductive structure.

In the present embodiment, it is possible to achieve under the conditions of the bubble-cap 9 of reduced size volume, obtain that operating temperature is relatively low and light The higher integrated LED bulb of efficiency.The equivalent light source of compact setting more than 10000LM light efficiencies in the less volume of light fixture, together When integrated high power factor control power supply, obtain energy-conservation and the light fixture product of high life, quick heat radiating function admirable, with compared with Good dust-proof, water resistance, meets IP specification grades.The congenial area illumination of multiple directions high angle can be also realized, can improve and carry The efficiency that electric energy changes into luminous energy is stretched, be can be applicable on the light fixture for needing bloom efficiency packaging system, is especially limited in small size It is more prominent using the encapsulation technology effect after improving on the high wattage light fixture of system.It can replace with existing conventional conventional high-tension sodium Lamp or all-round smooth bulb etc..

Claims (6)

1. low operating temperature bloom efficiency LED package device, it is characterised in that on the upside of substrate (3) using N × M in the matrix form The small LED grain (4) of integration packaging at least two array packaging, wherein, N ＞ 1, the small LED grain (4) of M >=2, N × M array packaging Encapsulating structure operating current is not more than the rated operational current of the suitable large stretch of LED grain (1) of total rated power, N × M array The total light flux of small LED grain (4) encapsulating structure of packaging is more than the luminous flux of the suitable large stretch of LED grain (1) of total rated power.

2. low operating temperature bloom efficiency LED package device as claimed in claim 1, it is characterised in that on the downside of substrate (3) There are thermal dispersant coatings (5) on surface.

3. low operating temperature bloom efficiency LED package device as claimed in claim 1, it is characterised in that the small LED of array packaging Lamp grain (4) is arranged on support frame (8), or, the small LED grain (4) of array packaging is arranged in radiating permanent seat (7)；Support Frame (8) is arranged on middle part upside in radiating permanent seat (7), and radiating permanent seat (7) is arranged on lamp holder (6) upper end, in support frame (8) Outer and radiating permanent seat (7) upper end is installed by bubble-cap (9).

4. low operating temperature bloom efficiency LED package device as claimed in claim 3, it is characterised in that support frame (8) surface With reflecting layer.

5. low operating temperature bloom efficiency LED package device as claimed in claim 3, it is characterised in that installed in lamp holder (6) High Power Factor controls power supply.

6. low operating temperature bloom efficiency LED package device as claimed in claim 3, it is characterised in that support frame (8) is with dissipating Thermosetting reservation (7) connection forms conductive structure.