CN206322669U - 一种高可靠性高压功率半导体模块芯片 - Google Patents
一种高可靠性高压功率半导体模块芯片 Download PDFInfo
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- CN206322669U CN206322669U CN201621087230.7U CN201621087230U CN206322669U CN 206322669 U CN206322669 U CN 206322669U CN 201621087230 U CN201621087230 U CN 201621087230U CN 206322669 U CN206322669 U CN 206322669U
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CN108365015A (zh) * | 2017-12-29 | 2018-08-03 | 济南兰星电子有限公司 | 半导体二极管芯片及其制作方法 |
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CN108365015A (zh) * | 2017-12-29 | 2018-08-03 | 济南兰星电子有限公司 | 半导体二极管芯片及其制作方法 |
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Denomination of utility model: A high reliability high voltage power semiconductor module chip Effective date of registration: 20201019 Granted publication date: 20170711 Pledgee: Qimen Anhui rural commercial bank Limited by Share Ltd. Pledgor: HUANGSHAN 777 ELECTRONICS Co.,Ltd. Registration number: Y2020980006927 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211116 Granted publication date: 20170711 Pledgee: Qimen Anhui rural commercial bank Limited by Share Ltd. Pledgor: HUANGSHAN 777 ELECTRONICS CO.,LTD. Registration number: Y2020980006927 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170711 |