CN206311212U - A kind of thermal infrared imager - Google Patents
A kind of thermal infrared imager Download PDFInfo
- Publication number
- CN206311212U CN206311212U CN201621431215.XU CN201621431215U CN206311212U CN 206311212 U CN206311212 U CN 206311212U CN 201621431215 U CN201621431215 U CN 201621431215U CN 206311212 U CN206311212 U CN 206311212U
- Authority
- CN
- China
- Prior art keywords
- heat
- housing
- thermal infrared
- infrared imager
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011324 bead Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The utility model provides a kind of thermal infrared imager, and it includes：It is successively set on shutter in housing, detector and circuit board, the position that the outer face of the housing is corresponding with circuit board is provided with heat abstractor, and air vent is correspondingly arranged on the housing end face and the end face relative with the end face between the heat abstractor and circuit board.Thermal infrared imager of the present utility model, simple structure, radiating efficiency are high.
Description
Technical field
The utility model is related to infrared technique field, more particularly, to a kind of thermal infrared imager.
Background technology
Thermal infrared imager is the infrared energy point for receiving measured target using Infrared Detectors and optical imagery object lens
The reflection of cloth figure is on the light-sensitive element of Infrared Detectors, so as to obtain Infrared Thermogram, this thermography and body surface
Heat distribution is corresponding, that is, the invisible infrared energy that object sends is changed into visible thermal image by thermal infrared imager.
Different colours on thermal image represent the different temperatures of testee.
With the development of integrated technology and microelectronic packaging technology, the overall power density of electronic component constantly increases, and
The physical size of electronic component and electronic equipment is but gradually intended to small-sized, miniaturization, and produced heat is accumulated rapidly, led
The heat flow density around electronic component is caused to increase sharply.But, hot environment will influence the property of electronic component and equipment
Energy.
At present, traditional thermal infrared imager is directly transferred to outward by by the heat of detector and other heater elements
On shell, be directly emitted to heat in air by radiation tooth again by shell.This radiating mode is when power consumption is smaller or enclosure volume
It is general to meet imaging and thermometric requirement when larger.But when thermal infrared imager function increases, power consumption is increased and volume is increasingly small-sized
During change, radiating is difficult to satisfaction and require that, causes that thermal infrared imager image quality is not high, and thermometric is uneven, inaccurate.
Utility model content
To overcome above mentioned problem or solving the above problems at least in part, the utility model provides a kind of radiating efficiency
The high, thermal infrared imager of simple structure.
According to one side of the present utility model, there is provided a kind of thermal infrared imager, it includes：It is successively set in housing
Shutter, detector and circuit board, the position that the outer face of the housing is corresponding with circuit board are provided with heat abstractor, positioned at institute
State and be correspondingly arranged air vent on housing end face and the end face relative with the end face between heat abstractor and circuit board.
On the basis of such scheme, surrounding and housing are set between the detector being arranged in housing and the circuit board
The deep bead being brought into close contact, the air vent is located at deep bead near the side of circuit board.
On the basis of such scheme, the deep bead uses rigid plastics.
On the basis of such scheme, it is disposed between the side end face of the detector window and the inner face of housing
Heat-conducting piece and heat conductive pad, and the heat-conducting piece extends to the outer face of the shutter.
On the basis of such scheme, the heat conductive pad is silica gel.
On the basis of such scheme, the heat-conducting piece is metal.
On the basis of such scheme, the metal is aluminium alloy, magnesium alloy or copper alloy.
A kind of thermal infrared imager that the application is proposed, its advantage is mainly reflected in following aspect：
(1) it is effective to improve radiating efficiency and radiating rate by setting the corresponding passage of heat abstractor；
(2) by setting deep bead, it is to avoid harmful effect of the heat abstractor to detector；
(3) by setting heat conductive pad, the radiating efficiency of detector and shutter is improved, makes the radiating of shutter uniform, it is to avoid dissipated
The signal quality of hot uneven influence shutter.
Brief description of the drawings
Fig. 1 is according to a kind of structural representation of thermal infrared imager in the utility model embodiment.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is used to illustrate the utility model, but is not limited to scope of the present utility model.
It is shown in Figure 1, a kind of thermal infrared imager, including housing 1, camera lens 10, shutter 2 are disposed with housing 1, are visited
Survey device 3 and circuit board 4.The outer face of housing 1 corresponding with circuit board 4 is provided with heat abstractor 5, the shell where heat abstractor 5
Air vent 6 is correspondingly arranged on the end face 1a of body 1 and the end face 1b relative with end face 1a.
Heating is easiest in thermal infrared imager, and the maximum part of caloric value is exactly circuit board 4.In time by circuit board 4
The heat derives for distributing to the stability and reliability that outside housing 1, can effectively improve thermal infrared imager operation, meanwhile,
The accuracy of thermal infrared imager detection operation can be improved.
Heat abstractor 5 is set on the corresponding end face of housing 1 of circuit board 4, the heat that circuit board 4 is distributed is exported in time
Outside housing 1.Meanwhile, air vent 6 is correspondingly arranged on the end face 1a and relative end face 1b of the place housing 1 of heat abstractor 5, divulge information
Hole 6 itself can play a part of to heat is derived outside housing 1, and at the same time, air vent 6 coordinates heat abstractor 5, plays more
Good, faster thermolysis.
In a specific embodiment, heat abstractor 5 uses fan.When fan is operated, hot gas, housing 1 are outwards derived
The air vent 6 being correspondingly arranged on relative end face 1a and 1b, accelerates the circulation of air, and the heat for distributing circuit board 4 is quickly led
Go out to outside housing 1.
Deep bead 7 is set between circuit board 4 and detector 3, and deep bead 7 is brought into close contact with the inner face of housing 1.Ventilation
Hole 6 is located at the side of deep bead 7, also, positioned at the side where circuit board 4.
Deep bead 7 makes the region at the place of 1 interior circuit board of housing 4 and the zone isolation where detector 3, it is to avoid circuit board 4
The heat for distributing has undesirable effect to the detection accuracy of detector 3.Simultaneously as being set on the corresponding housing 1 of circuit board 4
There is a heat abstractor 5, and a corresponding air vent 6, to avoid heat abstractor 5 and/or air-flow produced by air vent 6 to detector
3 detection operation has undesirable effect, by setting deep bead 7 so that the region where detector 3 is in sealing state, and it is electric
There is airflow to radiate in the region where road plate 4.
The material of deep bead 7 uses rigid plastics.Rigid plastics can either play gear wind action, but with it is good every
Thermal effect, it is to avoid the heat that circuit board 4 is distributed is conducted from deep bead 7 to the region where detector 3, influences the inspection of detector 3
Survey effect.
Received in detector 3 and be provided with heat conduction between the side end face of window of the conveying signal of shutter 2 and the inner face of housing 1
Pad 8 and heat-conducting piece 9.Heat conductive pad 8 closely connects together detector 3 with heat-conducting piece 9, and heat-conducting piece 9 is brought into close contact with housing 1.And
And, heat-conducting piece 9 covers the outer face beyond the window of whole shutter 2, and further the heat of cut-off detector 3 conducts to shutter 2.
Heat conductive pad 8 and heat-conducting piece 9 are set by the side end face of the window in detector, makes to be dissipated in the course of work of detector 3
The heat of hair exports to housing 1 by heat conductive pad 8 and heat-conducting piece 9, and then distributes, to reduce the environment temperature of the work of detector 3,
Improve the operational reliability of detector 3.
In a specific embodiment, heat conductive pad 8 uses heat conductive silica gel.Heat conductive silica gel has preferable pliability and heat
Conductibility, the region being covered between the window of detector 3 and heat-conducting piece 9 that can be fitted, to derive heat, quick heat radiating.
In another specific embodiment, heat-conducting piece 9 uses metal material.Metal used be aluminium alloy, magnesium alloy or
Copper alloy.Metal has good thermal conductivity, quickly can transmit heat to radiate to housing 1.Meanwhile, metal covering shutter 2
Region in addition to window, because the heat-transfer rate of metal is fast, is easy to derive the even heat of detector 3, makes the work of shutter 2
Make environment temperature rise not high and uniform, it is to avoid the signal that the environment temperature difference of the working region of shutter 2 is caused receives difference, from
And influence detection accuracy.
Thermal infrared imager of the present utility model, sets heat abstractor 5, also, visiting on the corresponding housing 1 of circuit board 4
Survey between device 3 and circuit board 4 and deep bead is set, heat conductive pad 8 is set between the window side end face of detector 3 and the inner face of housing 1
With heat-conducting piece 9, fully ensure that the heater element heat of thermal infrared imager is distributed, by outside heat derives to housing 1, so that will be red
The heat produced during outer thermal imager operation is derived outside housing 1 in time, it is ensured that the stability and reliability of thermal infrared imager work
Property.
Finally, the present processes are only preferably embodiment, are not intended to limit protection domain of the present utility model.
It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc. should be included in this reality
Within new protection domain.
Claims (7)
1. a kind of thermal infrared imager, it is characterised in that it includes：It is successively set on shutter (2), detector (3) in housing (1)
With circuit board (4), the position that the outer face of the housing (1) is corresponding with circuit board (4) is provided with heat abstractor (5), is located at
On housing (1) end face (1a) and the end face (1b) relative with the end face (1a) between the heat abstractor (5) and circuit board (4)
It is correspondingly arranged air vent (6).
2. a kind of thermal infrared imager as claimed in claim 1, it is characterised in that：Be arranged at detector (3) in housing (1) with it is described
The deep bead (7) that surrounding is brought into close contact with housing (1) is set between circuit board (4), and the air vent is close to positioned at deep bead (7)
The side of circuit board (4).
3. a kind of thermal infrared imager as claimed in claim 2, it is characterised in that：The deep bead (7) uses rigid plastics.
4. a kind of thermal infrared imager as claimed in claim 1, it is characterised in that：The side end face of detector (3) window and housing
(1) heat conductive pad (8) and heat-conducting piece (9) are disposed between inner face, and the heat-conducting piece (9) extends to the shutter
(2) outer face.
5. a kind of thermal infrared imager as claimed in claim 4, it is characterised in that：The heat conductive pad (8) is silica gel.
6. a kind of thermal infrared imager as claimed in claim 4, it is characterised in that：The heat-conducting piece (9) is metal.
7. a kind of thermal infrared imager as claimed in claim 6, it is characterised in that：The metal is aluminium alloy, magnesium alloy or copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621431215.XU CN206311212U (en) | 2016-12-23 | 2016-12-23 | A kind of thermal infrared imager |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621431215.XU CN206311212U (en) | 2016-12-23 | 2016-12-23 | A kind of thermal infrared imager |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206311212U true CN206311212U (en) | 2017-07-07 |
Family
ID=59247371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621431215.XU Expired - Fee Related CN206311212U (en) | 2016-12-23 | 2016-12-23 | A kind of thermal infrared imager |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206311212U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040621A (en) * | 2018-09-20 | 2018-12-18 | 武汉高德智感科技有限公司 | A kind of infrared mould group with reinforcement heat sinking function |
| CN109945978A (en) * | 2017-12-21 | 2019-06-28 | 杭州美盛红外光电技术有限公司 | A kind of automatic focusing structure |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
| WO2021047351A1 (en) * | 2019-09-10 | 2021-03-18 | 深圳市大疆创新科技有限公司 | Infrared imaging unit, imaging device, and unmanned aerial vehicle |
-
2016
- 2016-12-23 CN CN201621431215.XU patent/CN206311212U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945978A (en) * | 2017-12-21 | 2019-06-28 | 杭州美盛红外光电技术有限公司 | A kind of automatic focusing structure |
| CN109040621A (en) * | 2018-09-20 | 2018-12-18 | 武汉高德智感科技有限公司 | A kind of infrared mould group with reinforcement heat sinking function |
| WO2021047351A1 (en) * | 2019-09-10 | 2021-03-18 | 深圳市大疆创新科技有限公司 | Infrared imaging unit, imaging device, and unmanned aerial vehicle |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170707 |
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| CF01 | Termination of patent right due to non-payment of annual fee |