CN206306269U - Cutter sweep - Google Patents
Cutter sweep Download PDFInfo
- Publication number
- CN206306269U CN206306269U CN201621079139.0U CN201621079139U CN206306269U CN 206306269 U CN206306269 U CN 206306269U CN 201621079139 U CN201621079139 U CN 201621079139U CN 206306269 U CN206306269 U CN 206306269U
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- China
- Prior art keywords
- line
- cut
- collecting tank
- shaking device
- washer jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A kind of cutter sweep, it includes：Multiple rollers；One line of cut, activity winding is fixed on and closing is formed on these rollers；One collecting tank, is arranged between these rollers and line of cut lower section；One lowering or hoisting gear, which is provided with a work plate, and the work plate is provided with all bars, and the work plate and section seat are arranged at the collecting tank and line of cut top；One first washer jet, is arranged at the collecting tank side and line of cut top；One second washer jet, is arranged at the collecting tank opposite side and line of cut top；One first shaking device, is incorporated on first washer jet；One second shaking device, is incorporated on second washer jet.
Description
Technical field
The utility model is related to technical field of motors, espespecially a kind of crystal ingot (or crystal bar, crystal block that can make machined object
Deng) surface atomizing, the roughening of section, (silicon) substrate spotlight effect is lifted, and the cutting force of line of cut, cutting speed can be lifted
And the semiconductor or the cutter sweep of solar base plate of service life.
Background technology
Common substrate is widely used in semiconductor industry and solar energy industry, and by taking the silicon substrate as an example, and its
In the program of manufacture, it is one of important technique to process (Multi-wire Sawing) using multiple line formula saw blade cutting.Therefore,
TaiWan, China patent discloses No. 201235174 and discloses one kind《The cutting cooling device of diamond line》, the utility model such as Fig. 1
With shown in Fig. 2, the diamond line of the cutting is continuously wrapped on multiple rollers, and crystal ingot (or crystal bar, crystal block etc.) is done
Successional cutting, while the diamond line that cutting is used can just reverse winding recovery to get up to reuse again in process, such as
This with time-consuming, also, once can simultaneously make the sawing of multi-disc, and the crystal ingot can be monocrystalline or polycrystalline silicon bar (solar energy
Battery material), GaAs crystal bar or hyaline-quartz crystal bar etc..In cut place, two opposite sides be respectively provided with can spray coolant (or
Claim cutting fluid) nozzle, coolant is sprayed online towards the position cut or diamond.
In this technical side utility model, refer to shown in Fig. 1, when the purpose of the coolant is except being cooling cutting processing
Outside produced heat energy, it is also possible to rinse out the cutting chip that card is invested on diamond line and machined object (crystal ingot).But merely with this
The simple flushing of coolant, after the cutting technique is through a period of time, still can be in multiple parallel and horizontally arranged diamond lines 1
On block attached excessive cutting chip 3 and be difficult to clean on multiple diamond crystal grain 2 for having, its cleaning performance is limited.Therefore cut
The cutting acute angle of these diamond crystal grain 2 is blocked when the card of chip 3 invests excessive on these diamond crystal grain 2, and reduces acute angle
Contact area between machined object so that cutting force and cutting speed reduction, and easily cause that diamond line service life subtracts
It is few.
Also, please arrange in pairs or groups refering to shown in Fig. 2, being such as applied in solar cell silicon substrate technique, though can be by these brills
Make the cutting of multiple line formula between stone line 1 and machined object and form multiple crystal ingots sections 4 and (figure only shows a piece of) arranged in parallel, should
Although the two sides 41,42 of crystal ingot section 4 can all form the line of wave by the cutting of these diamond crystal grain 2 of the diamond line 1
Road (visually observes unobvious), though the lines can reach the absorption of light and reduce in the use of solar cell silicon substrate
Light reflectivity, but only cutting will cause that the two sides 41,42 excessively smooth and light reflectivity is higher in this way, and comparing to gather
The energy of light harvesting, the photoelectric transformation efficiency for solar cell silicon substrate is still quite not enough.Also, crystal ingot section 4
The two sides 41,42 machined by multiple line formula saw blade cutting after formed, on the two sides 41,42 cannot it is pre-formed not
The lattice shape of the hole, vestige or details of rule, the subsequent machining technology for solar cell (silicon) substrate is for example carried out
During etch process, the more slow problem of speed for having etching corrosion processing is present.Therefore, how to lack for discussed above
Point is improved, where the technical difficulties that as inventor to be solved.
Utility model content
In view of the shortcoming of prior art, therefore the purpose of this utility model is to provide a kind of to make the crystalline substance of machined object
The surface atomizing of ingot (or crystal bar, crystal block etc.) section, roughening, lift (silicon) substrate spotlight effect, and can lift line of cut
Cutting force, the semiconductor of cutting speed and service life or solar base plate cutter sweep.
In order to reach the above object, the utility model provides a kind of cutter sweep, and it includes：Multiple rollers；One cutting
Line, activity winding is fixed on and closing is formed on these rollers；One collecting tank, is arranged between these rollers and under the line of cut
Side；One lowering or hoisting gear, which is provided with a work plate, and the work plate is provided with all bars, and the work plate and section seat are set
In the collecting tank and line of cut top；One first washer jet, is arranged at the collecting tank side and line of cut top；One
Two washer jets, are arranged at the collecting tank opposite side and line of cut top；One first shaking device, is incorporated into first cleaning
On nozzle；One second shaking device, is incorporated on second washer jet.
Wherein, the utility model also provides a kind of cutter sweep, and it includes：Multiple rollers；One line of cut, activity winding is consolidated
Closing is formed on these rollers；One collecting tank, is arranged between these rollers and line of cut lower section；One lifting dress
Put, which is provided with a work plate, the work plate is provided with all bars, the work plate and the section seat be arranged at the collecting tank and
Line of cut top；One first washer jet, is arranged at the collecting tank side and line of cut top；One second washer jet,
It is arranged at the collecting tank opposite side and line of cut top；One the 3rd shaking device, is incorporated on the collecting tank.
Wherein, the utility model also provides a kind of cutter sweep, and it includes：Multiple rollers；One line of cut, activity winding is consolidated
Closing is formed on these rollers；One collecting tank, is arranged between these rollers and line of cut lower section；One lifting dress
Put, which is provided with a work plate, the work plate is provided with all bars, the work plate and the section seat be arranged at the collecting tank and
Line of cut top；One first washer jet, is arranged at the collecting tank side and line of cut top；One second washer jet,
It is arranged at the collecting tank opposite side and line of cut top；One first shaking device, is incorporated on first washer jet；One
Two shaking devices, are incorporated on second washer jet；One the 3rd shaking device, is incorporated on the collecting tank.
By one first shaking device be incorporated on first washer jet and one second shaking device be incorporated into this second
On washer jet or one the 3rd shaking device is incorporated on the collecting tank or first shaking device, the second shaking device and the 3rd
Shaking device is set simultaneously.
Wherein, the line of cut is diamond line, and first shaking device, the second shaking device and the 3rd shaking device are super
Sound wave oscillator.
The utility model its when making multiple line formula saw blade cutting and processing, crystal ingot (or crystal bar, the crystal block of machined object can be made
Deng) surface atomizing, the roughening of section, (silicon) substrate spotlight effect is lifted, and the cutting force of line of cut, cutting speed can be lifted
And service life, realize its effect.
Brief description of the drawings
Fig. 1：The cutting of the diamond line of the multiple line formula saw blade cutting processing of prior art uses enlarged diagram；
Fig. 2：The structure enlarged diagram of the crystal ingot section two sides of prior art；
Fig. 3：The structural representation of the cutter sweep of the utility model preferred embodiment；
Fig. 4：The section seat of the utility model preferred embodiment combines the schematic diagram of crystal ingot (or crystal bar, crystal block etc.)；
Fig. 5：The pre- multiple line formula saw blade cutting for carrying out crystal ingot (or crystal bar, crystal block etc.) of the utility model preferred embodiment
The action schematic diagram of processing；
Fig. 6：The multiple line formula saw blade cutting for carrying out crystal ingot (or crystal bar, crystal block etc.) of the utility model preferred embodiment adds
Action schematic diagram in work；
Fig. 7：The utility model preferred embodiment carry out multiple line formula saw blade cutting processing in by using first vibrations dress
Put with the second shaking device as the use state amplification that sonicator is cleaned line of cut and offer line of cut concussion is shown
It is intended to；
Fig. 8：The utility model preferred embodiment carry out multiple line formula saw blade cutting processing in by using first vibrations dress
Put, the second shaking device and the 3rd shaking device be for sonicator is cleaned line of cut and provides making for line of cut concussion
Use state enlarged diagram；
Fig. 9：After the crystal ingot (or crystal bar, crystal block etc.) of the utility model preferred embodiment makees the processing of multiple line formula saw blade cutting
Be formed as the schematic diagram of multiple crystal ingot sections；
Figure 10：The A-A section enlarged diagrams of Fig. 9 of the utility model preferred embodiment.
Description of reference numerals
(prior art)
The diamond crystal grain of 1 diamond line 2
3 cutting chip 4 crystal ingot sections
The side of 41 side 42
(the utility model)
The line of cut of 5 roller 6
The residue chip of 60 diamond crystal grain 61
The lowering or hoisting gear of 7 collecting tank 8
The section seat of 81 work plate 82
The shaking device of 100 first washer jet 101 first
The shaking device of 200 second washer jet 201 second
The crystal ingot of 300 the 3rd shaking device 400
400A crystal ingots section 400B sides
The water droplet of 400C sides 500
600 water Sassers
Specific embodiment
In order that your auditor can have a clear understanding of content of the present utility model, added with the following example collocation accompanying drawing and symbol
To illustrate, it please be referred to.
Refer to shown in Fig. 3, the utility model provides a kind of cutter sweep, and it includes：Multiple rollers 5, a line of cut 6,
One collecting tank 7, a lowering or hoisting gear 8, one first washer jet 100, one second washer jet 200, one first shaking device 101,
One second shaking device 201 and one the 3rd shaking device 300.
The line of cut 6 can be diamond line and be fixed on these rollers with the winding method activity winding of multiple line formula cutting processing
Closing is formed on 5 so that the line of cut 6 between two rollers 5 forms the arrangement of multiple and horizontal intervals, these rollers 5 with
Motor positive-reverse drives the line of cut 6 to be moved on the roller 5, is produced such as the effect of cutter cutting when the line of cut 6 is driven.
The collecting tank 7 is arranged between these rollers 5 and the lower section of line of cut 6, and the lowering or hoisting gear 8 is provided with a work plate 81, the work
Part plate 81 is provided with all bars 82, and the work plate 81 and section seat 82 are arranged at the collecting tank 7 and the top of line of cut 6,
Operation can be automatically controlled by the lowering or hoisting gear 8, work plate 81 be caused in the range of the line of cut 6 and collecting tank 7 and is cut
Bar 82 makees lifting action, and section seat 82 is made up of the material such as carbon, glass, plastics, ceramics of approximate rectangular shape, and it is
The bending spill that top is flat and lower section is such as cylindrical, therefore section seat 82 is the material that can be cut by the line of cut 6.This
One washer jet 100 is arranged at the side of collecting tank 7 and the top of line of cut 6, also, second washer jet 200 is arranged at
The opposite side of collecting tank 7 and the top of line of cut 6.In the present embodiment, first shaking device 101 is incorporated into first cleaning
On nozzle 100, second shaking device 201 is incorporated on second washer jet 200, and the 3rd shaking device 300 is combined
In on the collecting tank 7, first shaking device 101, the second shaking device 201 and the 3rd shaking device 300 are ultrasonic vibrating
Device, contact is installed on first washer jet 100, the second washer jet 200 and the collection to its sonicator respectively in principle
On liquid bath 7, you can play ultrasonic vibrations effect.
Please continue to refer to shown in Fig. 4, wherein, the crystal ingot 400 of semiconductor (or crystal bar, crystal block etc.) can be cylinder type,
But system is not limited, and is fitted together to the bow face of the lower section of the outer peripheral edge of crystal ingot 400 and section seat 82, while can profit
Fixed with solid.And 82 top of section seat is fixed with the lower section gluing of the work plate 81 using solid.Entering
Before row makees the processing of multiple line formula saw blade cutting to crystal ingot 400, can first by the washer jet 200 of the first washer jet 100 and second
Cutting liquid (or coolant) is filled in advance in the inside of collecting tank 7 and is allowed to overfill, or directly in collecting tank 7 with artificial side
Formula is packed full with cutting liquid, and can pre-actuate first shaking device 101, the second shaking device 201 and the 3rd shaking device
300.These rollers 5 and line of cut 6 make the line of cut 6 make the horizontal cutting of positive reverse by the drive of motor (figure does not show)
Cut.
Therefore, please continue to refer to shown in Fig. 5, wherein, when the multiple line formula saw blade cutting that crystal ingot 400 is carried out in advance is processed, utilize
Lowering or hoisting gear 8 perpendicular to the direction of line of cut 6 decline, crystal ingot 400 is slowly contacted into the line of cut 6, start during contact into
The multiple line formula saw blade cutting processing of row crystal ingot 400.And as shown in Figure 6, during its crystal ingot 400 is carried out with the processing of multiple line formula saw blade cutting
When (undressed completion and crystal ingot 400 are temporarily placed in enter in water-filling in collecting tank 7 and cut), inherently produce residue chip and rub
Wipe and heat up, therefore except transferring out cutting liquid in the line of cut 6 by the washer jet 200 of the first washer jet 100 and second
It is upper (by line of cut 6 drive also can splash on the crystal ingot 400 in processing everywhere) make to lower the temperature, clean and lubricate beyond, take
Setting with first shaking device 101 and second shaking device 201, may be such that first washer jet 100 and second is clear
Wash the cutting liquid that nozzle 200 transfers out to produce sound wave resonance and lift cleaning power, and refer to Fig. 7, can more lift the cutting
Cleaning force when line 6 is diamond line, and the water droplet 500 of cutting liquid blocks when can easily take away the line of cut 6 by diamond line thereon
Invest the residue chip 61 on diamond crystal grain 60, and cutting liquid is when hitting splash down on the line of cut 6, while may be such that the cutting
Line 6 produces the irregular fluctuation of larger slightly amplitude, vibrations in cutting process, also can not advised by line of cut 6 is produced
Swing then, vibrations so that the residue chip 61 that card is invested on diamond crystal grain 60 gives vibration and shrugs off (fall), make multiple diamonds
Crystal grain 60 regenerates acute angle cut surface, is increased cutting force, the crystal ingot cutting speed of the line of cut 6, and residue chip 61 goes
Except rear and the service life of line of cut 6 can be lifted.
Please continue to refer to shown in Fig. 6, wherein, the crystal ingot 400 carries out (undressed complete in multiple line formula saw blade cutting process
Into).Should closely be set between the collecting tank 7 and line of cut 6, and its collecting tank 7 can constantly overflow cutting liquid, also, at this
Its cutting liquid can slightly flood arround the line of cut 6 or contour during spilling in the range of collecting tank 7.Therefore by
3rd shaking device 300 is set to sonicator so that the cutting liquid that the collecting tank 7 is loaded makees sound wave concussion, and
Collocation as shown in figure 8, and produce water Sasser 600 to be transferred on the line of cut 6 inside collecting tank 7 so that line of cut 6 is produced
Irregular swing, vibrations, therefore by the irregular swing of line of cut 6, vibrations are made, carrying out, multiple line formula saw blade cutting is processed
Cheng Zhong, equally may be such that card invests the residue chip 61 on diamond crystal grain 60 and gives vibration and shrugs off (fall), make the diamonds of multiple
Crystal grain 60 regenerates acute angle cut surface, is increased cutting force, the crystal ingot cutting speed of the line of cut 6, and residue chip 61 goes
Except rear and the service life of line of cut 6 can be lifted.In the present embodiment, and can simultaneously by collocation the He of the first shaking device 101
The sound wave vibrating effect (through the splash of water droplet 500 of sound wave resonance on line of cut 6) of the second shaking device 201 is dual to reach
And the purpose of the service life of the cutting force, the cutting speed of crystal ingot 400 and line of cut 6 of service hoisting line of cut 6.
Also, as a example by being applied to the cutting of solar cell silicon substrate, please continue to refer to shown in Fig. 6 and Fig. 8, wherein,
In order that obtaining crystal ingot 400 can meet preferably solar energy in multiple line formula saw blade cutting process and after the completion of cutting processing
The optically focused characteristic of (silicon) substrate so that the photoelectric transformation efficiency lifting of (silicon) substrate, enables light to be gathered in (silicon) substrate as far as possible
On.Therefore the utility model is same causes that the line of cut 6 is being cut by the shaking device 201 of the first shaking device 101 and second
Irregular fluctuation, vibrations or the 3rd shaking device 300 of larger slightly amplitude are produced during cutting again such that line of cut 6 is produced
The irregular swing of life, vibrations or first shaking device 101, the second shaking device 201 and the 3rd shaking device 300 set simultaneously
Irregular swing, the vibrations of the produced line of cut 6 when putting, as shown in Fig. 6 and Fig. 9, if its crystal ingot 400 is in multiple line formula line
(lowering or hoisting gear 8 can reversely draw high drive work plate 81, section seat 82 and crystal ingot 400 in the cutting after saw cut is machined
The top of line 6) multiple crystal ingots section 400A and arranged in parallel can be formed, and pulled down from the work plate 81 after machining, can
By the crystal ingot 400 of next new section seat 82 and semiconductor, gluing is on work plate 81, and shown in Fig. 8 and Figure 10 together, and this is every
Two sides 400B, 400C of one crystal ingot section 400A makes line of cut 6 produce irregular swing, shake by the concussion of foregoing sound wave
It is dynamic, it will so that the two sides 400B, 400C form more atomization, (400B, 400C are work for the two sides on the surface of roughening
The line of cut 6 of multiple line formula saw blade cutting processing passes through the face for being formed in the cutting made).
Therefore, additional ultrasonic vibrating makes line of cut 6 produce irregular swing and vibrations, rather than it is pure cut,
Make the two sides 400B, 400C of each crystal ingot section 400A formed more be atomized, (more trickle cuts on the surface of roughening
Irregular holes, vestige, details caused by secant 6 etc. and formed multiple spot destruction, using naked eyes viewing seem atomization), to carry
When being applied to solar cell (silicon) substrate for crystal ingot section 400A, (silicon) substrate can be enable to increase the absorption of sunlight
Power, to reduce the light reflectivity of the two sides 400B, 400C so as to lifting the surface area of light absorbs, actually spy of the present utility model
Point.Also, another derivative feature is so that the two sides 400B, 400C of crystal ingot section 400A is pre-machined out lattice shape
(preforming), for the etch process subsequently made on crystal ingot section 400A, can also accelerate its process velocity (with the two sides
The lattice shapes such as irregular holes, vestige, the details of 400B, 400C are along corrosion processing).
In sum, refer to shown in Fig. 6, Fig. 8 and Figure 10, the utility model is combined by first shaking device 101
In on first washer jet 100 and second shaking device 201 be incorporated on second washer jet 200 or the 3rd vibrations
Device 300 is incorporated on the collecting tank 7 or first shaking device 101, the second shaking device 201 and the 3rd shaking device 300
The structure for setting simultaneously, is provided ultrasonic vibrating, is exported with the washer jet 200 of the first washer jet 100 and second
Cutting liquid and/or the sound wave that produces of the cutting liquid that is loaded of the inside of collecting tank 7 concussion is all conducted to line of cut 6 indirectly, borrow
By the energy transmission of water, make the place for thering is cutting liquid (there is moisture) to be contacted with line of cut 6 that just there is the effect of sound wave concussion, with
Can make the utility model make multiple line formula saw blade cutting process when, when its line of cut 6 cuts to crystal ingot 400, at the same generation
Remove residue chip 61, cut and irregular fluctuation, the function of vibrations, being somebody's turn to do for the crystal ingot section 400A of machined object can be made
Two sides 400B, 400C are atomized, roughening (will not produce excessively smooth surface), lift (silicon) substrate spotlight effect and its light
Photoelectric transformation efficiency, and cutting force, cutting speed and the service life of line of cut 6 can be lifted, realize its effect.
Person discussed above, only the utility model preferred embodiment is not limited to of the present utility model special
Sharp protection domain；Therefore do not depart from made in spirit and scope of the present utility model equivalent shapes, construction or combination conversion,
Should all be covered by within protection domain of the present utility model.
Claims (9)
1. a kind of cutter sweep, it is characterised in that it includes：
Multiple rollers；
One line of cut, activity winding is fixed on and closing is formed on these rollers；
One collecting tank, is arranged between these rollers and line of cut lower section；
One lowering or hoisting gear, which is provided with a work plate, and the work plate is provided with all bars, and the work plate and section seat are set
In the collecting tank and line of cut top；
One first washer jet, is arranged at the collecting tank side and line of cut top；
One second washer jet, is arranged at the collecting tank opposite side and line of cut top；
One first shaking device, is incorporated on first washer jet；
One second shaking device, is incorporated on second washer jet.
2. cutter sweep as claimed in claim 1, it is characterised in that the line of cut is diamond line.
3. cutter sweep as claimed in claim 1 or 2, it is characterised in that first shaking device and second shaking device
It is sonicator.
4. a kind of cutter sweep, it is characterised in that it includes：
Multiple rollers；
One line of cut, activity winding is fixed on and closing is formed on these rollers；
One collecting tank, is arranged between these rollers and line of cut lower section；
One lowering or hoisting gear, which is provided with a work plate, and the work plate is provided with all bars, and the work plate and section seat are set
In the collecting tank and line of cut top；
One first washer jet, is arranged at the collecting tank side and line of cut top；
One second washer jet, is arranged at the collecting tank opposite side and line of cut top；
One the 3rd shaking device, is incorporated on the collecting tank.
5. cutter sweep as claimed in claim 4, it is characterised in that the line of cut is diamond line.
6. the cutter sweep as described in claim 4 or 5, it is characterised in that the 3rd shaking device is sonicator.
7. a kind of cutter sweep, it is characterised in that it includes：
Multiple rollers；
One line of cut, activity winding is fixed on and closing is formed on these rollers；
One collecting tank, is arranged between these rollers and line of cut lower section；
One lowering or hoisting gear, which is provided with a work plate, and the work plate is provided with all bars, and the work plate and section seat are set
In the collecting tank and line of cut top；
One first washer jet, is arranged at the collecting tank side and line of cut top；
One second washer jet, is arranged at the collecting tank opposite side and line of cut top；
One first shaking device, is incorporated on first washer jet；
One second shaking device, is incorporated on second washer jet；
One the 3rd shaking device, is incorporated on the collecting tank.
8. cutter sweep as claimed in claim 7, it is characterised in that the line of cut is diamond line.
9. cutter sweep as claimed in claim 7 or 8, it is characterised in that first shaking device, the second shaking device and
Three shaking devices are sonicator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621079139.0U CN206306269U (en) | 2016-09-26 | 2016-09-26 | Cutter sweep |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621079139.0U CN206306269U (en) | 2016-09-26 | 2016-09-26 | Cutter sweep |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206306269U true CN206306269U (en) | 2017-07-07 |
Family
ID=59242195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621079139.0U Expired - Fee Related CN206306269U (en) | 2016-09-26 | 2016-09-26 | Cutter sweep |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206306269U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107263750A (en) * | 2017-08-07 | 2017-10-20 | 苏州赛万玉山智能科技有限公司 | The cutting method and three-dimensional structure solar silicon wafers of solar silicon wafers |
| CN114851413A (en) * | 2022-03-25 | 2022-08-05 | 河南科技大学 | Connecting piece groove, diamond wire slicing machine and cutting method of large-size silicon rod |
-
2016
- 2016-09-26 CN CN201621079139.0U patent/CN206306269U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107263750A (en) * | 2017-08-07 | 2017-10-20 | 苏州赛万玉山智能科技有限公司 | The cutting method and three-dimensional structure solar silicon wafers of solar silicon wafers |
| CN107263750B (en) * | 2017-08-07 | 2020-01-10 | 苏州赛万玉山智能科技有限公司 | Cutting method of solar silicon wafer and three-dimensional solar silicon wafer |
| CN114851413A (en) * | 2022-03-25 | 2022-08-05 | 河南科技大学 | Connecting piece groove, diamond wire slicing machine and cutting method of large-size silicon rod |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170707 Termination date: 20190926 |