CN206301786U - A kind of high brightness LED - Google Patents
A kind of high brightness LED Download PDFInfo
- Publication number
- CN206301786U CN206301786U CN201621468409.7U CN201621468409U CN206301786U CN 206301786 U CN206301786 U CN 206301786U CN 201621468409 U CN201621468409 U CN 201621468409U CN 206301786 U CN206301786 U CN 206301786U
- Authority
- CN
- China
- Prior art keywords
- film layer
- luminescence chip
- circuit board
- radiating
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model is related to diode field, specifically related to a kind of high brightness LED, including circuit board, the luminescence chip that is connected to circuit board, be arranged on luminescence chip electrode, connection electrode and circuit board gold thread, packaging body outside luminescence chip is covered at, also including being arranged at radiating subassembly of the circuit board away from luminescence chip side；The luminescence chip includes the first light tiles being connected in parallel and the second light tiles, the thermal insulative board being arranged between the first light tiles and the second light tiles；The circuit board center offers a through hole, and conducting strip is provided with the through hole, and described luminescence chip one end is installed in through hole and positioned at conducting strip top；The radiating subassembly includes the cooling base for being connected to circuit board and conducting strip, several radiating fins being installed on cooling base.The utility model good heat dissipation effect, light transmission efficiency are high, light extraction efficiency is high, luminosity is high.
Description
Technical field
The utility model is related to diode field, more particularly to a kind of high brightness LED.
Background technology
With developing rapidly for science and technology, light emitting diode (LED) conduct lighting source of new generation, because it has volume
Small, long lifespan, colour rendering are good, many advantages of efficient energy-saving and environmental protection, progressively replace conventional light source.It is luminous at present
Diode is in automobile interior exterior light, display backlight, outdoor landscape illumination, portable system flash lamp, projector light source, advertisement
The fields such as lamp box, torch, traffic lights are all widely used.
Light emitting diode is one kind of semiconductor diode, electric energy can be changed into luminous energy.Light emitting diode with it is common
Diode is equally made up of a PN junction, it may have unilateral conduction.After forward voltage is added to light emitting diode, from P
Area is injected into the hole in N areas and the electronics in P areas is injected into by N areas, in a few micrometers near PN junction respectively with the electronics and P in N areas
The hole-recombination in area, produces the fluorescence of spontaneous radiation.
With the progressively popularization of light emitting diode, its defect also has attracted increasing attention, and maximum of which defect is
Luminosity is low, it is impossible to adapt to the demand of power-type LED.
Producing this phenomenon mainly has following several respects reason, produces first, during LED operation substantial amounts of
Heat, causes diode internal temperature to raise, and influences the luminous intensity of diode chip for backlight unit, also results in epoxy resin encapsulating material
Flavescence, embrittlement, influence light transmission efficiency, cause luminosity relatively low.Secondly as prepare the semi-conducting material of light emitting diode with
The refractive index difference of air is big, causes the shooting angle of light small and interface reflectivity is high, and so, the light that active area sends only has one
Part is extracted, and remaining light can be then reflected back toward inside semi-conducting material, absorbed by after multiple reflections, so as to make
Into light extraction efficiency problem not high, cause the external quantum efficiency of light emitting diode low, further result in luminosity low.The
Three,
Utility model content
To solve the above problems, the utility model provide a kind of good heat dissipation effect, light transmission efficiency is high, light extraction efficiency is high,
Luminosity high brightness LED high.
The technical scheme that the utility model is used is：A kind of high brightness LED, including circuit board, it is connected to electricity
The gold thread of the luminescence chip of road plate, the electrode being arranged on luminescence chip, connection electrode and circuit board, cover at outside luminescence chip
The packaging body in portion, also including being arranged at radiating subassembly of the circuit board away from luminescence chip side；The luminescence chip includes parallel connection
First light tiles and the second light tiles of connection, the thermal insulative board being arranged between the first light tiles and the second light tiles；The electricity
Road plate center offers a through hole, and conducting strip is provided with the through hole, and described luminescence chip one end is installed in through hole and is located at
Conducting strip top；The radiating subassembly is including being connected to the cooling base of circuit board and conducting strip, being installed on cooling base
Several radiating fins.
To being further improved to for above-mentioned technical proposal, the packaging body includes substrate layer, first high successively from inside to outside
Refractive index monomer film layer, the first low-refraction monomer film layer, the second high refractive index monomers film layer, the second low-refraction monomer film
Layer.
To being further improved to for above-mentioned technical proposal, the first high refractive index monomers film layer and the second high index of refraction list
Body film layer is silicon monoxide film layer, and the first low-refraction monomer film layer and the second low-refraction monomer film layer are fluorination
Magnesium monomer film layer.
To being further improved to for above-mentioned technical proposal, the radiating subassembly also includes being arranged at radiating fin length direction
Several radiating fins.
To being further improved to for above-mentioned technical proposal, the both sides of the radiating fin in the middle of cooling base are equipped with scattered
Hot fin, and the radiating fin of both sides alternating inclinations are outwards arranged in radiating fin both sides successively；Positioned at cooling base both sides
The equal side of radiating fin is provided with radiating fin.
To being further improved to for above-mentioned technical proposal, the radiating fin and radiating fin setting at an acute angle
The beneficial effects of the utility model are：
1st, on the one hand, luminescence chip of the present utility model includes that two the first light tiles being connected in parallel and second light
Piece, luminous power is big, and luminous intensity is big, can significantly improve luminosity of the present utility model.Second aspect, in the first light tiles
And second be provided with thermal insulative board between light tiles, the heat transfer between the first light tiles and the second light tiles is prevented by thermal insulative board
And cross influence is caused, the temperature of the first light tiles and the second light tiles is advantageously reduced, so as to keep the first light tiles and
The luminous intensity of two light tiles, is further conducive to improving luminosity of the present utility model.The third aspect, luminescence chip passes through
It is connected with radiating subassembly between conducting strip, the heat produced in the luminescence chip course of work is directly conducted to radiating by conducting strip
Component, then outside is radiated to by radiating subassembly, radiating efficiency is high, is easy to reduce the temperature of luminescence chip, prevents luminescence chip
Cause luminous efficiency low because temperature is too high, be further conducive to improving luminosity of the present utility model.Fourth aspect, dissipates
Hot component includes the cooling base for being connected to circuit board and conducting strip, several radiating fins being installed on cooling base, leads to
Crossing radiating fin increases area of dissipation, accelerates heat radiation, and radiating efficiency is high, is further conducive to improving hair of the present utility model
Brightness.
2nd, packaging body includes substrate layer, the first high refractive index monomers film layer, the first low-refraction monomer successively from inside to outside
Film layer, the second high refractive index monomers film layer, the second low-refraction monomer film layer.Multiple antireflective coatings are provided with, compound anti-reflection is formed
Film, due to using high index of refraction-low-refraction-alternate form of high index of refraction-low-refraction, can be to wavestrip wide and narrow wavestrip
Light source all has the apparent reflex that disappears, and reduces the transmitting of light, improves the transmissivity of light, prevents the light that luminescence chip sends
Partly reflected after encapsulated body, be further conducive to improving luminosity of the present utility model.
3rd, the first high refractive index monomers film layer and the second high refractive index monomers film layer are silicon monoxide film layer, described first
Low-refraction monomer film layer and the second low-refraction monomer film layer are magnesium fluoride monomer film layer.Silicon monoxide film layer is compared to ring
Oxygen tree fat, its heat resistance is good, can prevent packaging body due to internal temperature raise and turn yellow, embrittlement, it is ensured that good light transmittance,
Further be conducive to improving luminosity of the present utility model.Meanwhile, the refractive index of silicon monoxide is high, the refractive index of magnesium fluoride
It is low, combined by both, the reflex that disappears preferably is played, reflectivity is reduced, the transmitance of light is improved, be further conducive to
Improve luminosity of the present utility model.
4th, radiating subassembly also includes being arranged at several radiating fins of radiating fin length direction, and radiating fin sets
Put, increased the surface area of radiating subassembly, improve radiating efficiency, prevent LED internal temperature too high, further have
Beneficial to raising luminosity of the present utility model.
5th, the both sides of the radiating fin in the middle of cooling base are equipped with radiating fin, and both sides radiating fin successively
Alternating inclinations are outwards arranged in radiating fin both sides, there is certain gap between adjacent heat radiation fin；Positioned at cooling base both sides
The equal side of radiating fin be provided with radiating fin.Radiating fin alternating inclinations are outwards arranged in radiating fin both sides, are easy to air
Lateral flow, air and the longitudinal direction and meeting for vertical direction air of lateral flow increase mobility and the disorder of Laminar Flow
Property, so as to disturb and destroy Laminar Flow, the coefficient of heat transfer is improved, so as to improve radiating efficiency, be further conducive to improving this reality
With new luminosity.
6th, radiating fin and radiating fin setting at an acute angle, are more convenient for increasing the lateral flow of air, so as to improve heat exchange
Coefficient, improves radiating efficiency, is further conducive to improving luminosity of the present utility model.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation of luminescence chip of the present utility model；
Fig. 3 is the structural representation of packaging body of the present utility model；
Fig. 4 is the structural representation of radiating subassembly of the present utility model.
Specific embodiment
The utility model is further described below in conjunction with accompanying drawing.
As shown in figure 1, being structural representation of the present utility model.
A kind of high brightness LED 100, including circuit board 110, be connected to the luminescence chip 120 of circuit board 110, set
The gold thread 140 of the electrode 130, connection electrode 130 and circuit board 110 that are placed on luminescence chip 120, cover at luminescence chip 120
Outside packaging body 150, also including being arranged at radiating subassembly 160 of the circuit board 110 away from the side of luminescence chip 120.
As shown in Fig. 2 being the structural representation of luminescence chip of the present utility model.
Luminescence chip 120 includes the first light tiles 121 for being connected in parallel and the second light tiles 122, be arranged at first lights
Thermal insulative board 123 between the light tiles 122 of piece 121 and second.
The center of circuit board 110 offers in a through hole 111, the through hole 111 and is provided with conducting strip 112, the luminescence chip
120 one end are installed in through hole 111 and positioned at the top of conducting strip 112.
As shown in figure 3, being the structural representation of packaging body of the present utility model.
Packaging body 150 includes substrate layer 151, the first high refractive index monomers film layer 152, the first low refraction successively from inside to outside
Rate monomer film layer 153, the second high refractive index monomers film layer 154, the second low-refraction monomer film layer 155.It is provided with multiple anti-reflection films
Layer, forms compound anti-reflection film, due to using high index of refraction-low-refraction-alternate form of high index of refraction-low-refraction, can be right
The light source of wavestrip wide and narrow wavestrip all has the apparent reflex that disappears, and reduces the transmitting of light, improves the transmissivity of light, prevents
Partly reflected after the encapsulated body 150 of light that luminescence chip 120 sends, be further conducive to improving of the present utility model luminous
Brightness.
First high refractive index monomers film layer 152 and the second high refractive index monomers film layer 154 are silicon monoxide film layer, described
First low-refraction monomer film layer 153 and the second low-refraction monomer film layer 155 are magnesium fluoride monomer film layer.Silicon monoxide film
Layer compared to epoxy resin, its heat resistance is good, can prevent packaging body 150 due to internal temperature raise and turn yellow, embrittlement, it is ensured that
Good light transmittance, is further conducive to improving luminosity of the present utility model.Meanwhile, the refractive index of silicon monoxide is high, fluorine
The refractive index for changing magnesium is low, is combined by both, preferably plays the reflex that disappears, and reduces reflectivity, improves the transmitance of light,
Further be conducive to improving luminosity of the present utility model.
As shown in figure 4, being the structural representation of radiating subassembly of the present utility model.
Radiating subassembly 160 is including being connected to the cooling base 161 of circuit board 110 and conducting strip 112, being installed on cooling base
Several radiating fins 162 on 161.
Radiating subassembly 160 also includes being arranged at several radiating fins 163, radiating fin of the length direction of radiating fin 162
The setting of piece 163, increased the surface area of radiating subassembly 160, improve radiating efficiency, prevent the inside of light emitting diode 100 temperature
Height is spent, is further conducive to improving luminosity of the present utility model.
The both sides of the radiating fin 162 in the middle of cooling base 161 are equipped with radiating fin 163, and both sides radiating
Alternating inclinations are outwards arranged in the both sides of radiating fin 162 to fin 163 successively, there is certain gap between adjacent heat radiation fin 163；
The equal side of radiating fin 162 positioned at the both sides of cooling base 161 is provided with radiating fin 163.The alternating inclinations of radiating fin 163 are outside
The both sides of radiating fin 162 are arranged in, are easy to air lateral flow, air and longitudinal direction and the phase of vertical direction air of lateral flow
The mobility and irregularity for increasing Laminar Flow are met, so as to disturb and destruction Laminar Flow, the raising coefficient of heat transfer, so as to improve scattered
The thermal efficiency, is further conducive to improving luminosity of the present utility model.
Radiating fin 163 and the setting at an acute angle of radiating fin 162, are more convenient for increasing the lateral flow of air, so as to improve
The coefficient of heat transfer, improves radiating efficiency, is further conducive to improving luminosity of the present utility model.
On the one hand, luminescence chip of the present utility model 120 includes two the first light tiles 121 being connected in parallel and the second hair
Mating plate 122, luminous power is big, and luminous intensity is big, can significantly improve luminosity of the present utility model.Second aspect, first
Thermal insulative board 123 is provided between the light tiles 122 of light tiles 121 and second, the first light tiles 121 and are prevented by thermal insulative board 123
Heat transfer between two light tiles 122 and cause cross influence, advantageously reduce the first light tiles 121 and the second light tiles
122 temperature, so as to keep the luminous intensity of the first light tiles 121 and the second light tiles 122, is further conducive to improving this reality
With new luminosity.The third aspect, luminescence chip 120 is lighted by being connected with radiating subassembly 160 between conducting strip 112
The heat produced in the course of work of chip 120 is directly conducted to radiating subassembly 160, then by radiating subassembly by conducting strip 112
160 are radiated to outside, and radiating efficiency is high, are easy to reduce the temperature of luminescence chip 120, prevent luminescence chip 120 due to temperature mistake
It is high and cause luminous efficiency low, be further conducive to improving luminosity of the present utility model.Fourth aspect, radiating subassembly 160
Including the cooling base 161 for being connected to circuit board 110 and conducting strip 112, several heat radiating fins for being installed on cooling base 161
Piece 162, area of dissipation is increased by radiating fin 162, accelerates heat radiation, and radiating efficiency is high, is further conducive to improving this
The luminosity of utility model.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that common for this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (6)
1. a kind of high brightness LED, it is characterised in that：Including circuit board, it is connected to the luminescence chip of circuit board, sets
Gold thread in the electrode on luminescence chip, connection electrode and circuit board, packaging body outside luminescence chip is covered at, also including setting
It is placed in radiating subassembly of the circuit board away from luminescence chip side；The luminescence chip includes the first light tiles for being connected in parallel and the
Two light tiles, the thermal insulative board being arranged between the first light tiles and the second light tiles；The circuit board center offers a through hole,
Conducting strip is provided with the through hole, described luminescence chip one end is installed in through hole and positioned at conducting strip top；The radiating group
Part includes the cooling base for being connected to circuit board and conducting strip, several radiating fins being installed on cooling base.
2. a kind of high brightness LED according to claim 1, it is characterised in that：The packaging body from inside to outside according to
It is secondary including substrate layer, the first high refractive index monomers film layer, the first low-refraction monomer film layer, the second high refractive index monomers film layer,
Second low-refraction monomer film layer.
3. a kind of high brightness LED according to claim 2, it is characterised in that：First high refractive index monomers
Film layer and the second high refractive index monomers film layer are silicon monoxide film layer, the first low-refraction monomer film layer and the second low folding
Penetrate rate monomer film layer and be magnesium fluoride monomer film layer.
4. a kind of high brightness LED according to claim 3, it is characterised in that：The radiating subassembly also includes setting
It is placed in several radiating fins of radiating fin length direction.
5. a kind of high brightness LED according to claim 4, it is characterised in that：Dissipating in the middle of cooling base
The both sides of hot fin are equipped with radiating fin, and the radiating fin of both sides alternating inclinations are outwards arranged in radiating fin two successively
Side；The equal side of radiating fin positioned at cooling base both sides is provided with radiating fin.
6. a kind of high brightness LED according to claim 5, it is characterised in that：The radiating fin and heat radiating fin
Piece setting at an acute angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621468409.7U CN206301786U (en) | 2016-12-29 | 2016-12-29 | A kind of high brightness LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621468409.7U CN206301786U (en) | 2016-12-29 | 2016-12-29 | A kind of high brightness LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206301786U true CN206301786U (en) | 2017-07-04 |
Family
ID=59205816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621468409.7U Expired - Fee Related CN206301786U (en) | 2016-12-29 | 2016-12-29 | A kind of high brightness LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206301786U (en) |
-
2016
- 2016-12-29 CN CN201621468409.7U patent/CN206301786U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM353308U (en) | LED illumination device | |
| CN102364710A (en) | Light emitting diode (LED) white light source device | |
| CN205859663U (en) | A kind of LEDbulb lamp with high heat dispersion | |
| Nian et al. | Review of optical designs for light-emitting diode packaging | |
| CN103047553A (en) | High-luminous-efficacy high-power light-emitting diode (LED) panel light | |
| CN102157503A (en) | Light-emitting diode structure capable of emitting light and enhancing heat radiation efficiency and LED (light-emitting diode) lamp | |
| CN206301786U (en) | A kind of high brightness LED | |
| CN208256718U (en) | A kind of encapsulating structure of LED | |
| CN206349387U (en) | LED lamp bead structure based on ceramet substrate | |
| CN205692863U (en) | A kind of LED encapsulation structure | |
| CN201829498U (en) | Light emitting diode (LED) integrated light source panel | |
| CN103928601B (en) | A kind of LED module | |
| CN206301842U (en) | A kind of long-term durability luminous diode | |
| CN203398159U (en) | High-cup three-in-one straight-insert LED lamp | |
| CN200968538Y (en) | Thick film packaging heat sinking integrated LED lamp tube | |
| CN111106099A (en) | High-power COB heat dissipation packaging structure | |
| CN103606622A (en) | LED integrated-type light source | |
| CN103822112A (en) | LED (light emitting diode) light source with jet radiating function | |
| CN208817125U (en) | A kind of polychrome one LED light source | |
| CN203784662U (en) | Improved LED (Light-Emitting Diode) fluorescent lamp | |
| CN203273499U (en) | LED (light emitting diode) street lamp luminescence module | |
| CN202915195U (en) | Light-emitting diode (LED) street lamp of jet flow heat dissipation | |
| CN202361110U (en) | High-power LED panel light with high luminous efficiency | |
| CN208336262U (en) | A kind of RGB Full-color LED encapsulation structure | |
| CN209675326U (en) | A kind of LED lamp bead that stability is good |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1 Patentee after: Guangdong Hui Xin Electronic Technology Co., Ltd. Address before: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1 Patentee before: Dongguan Hui Hui Electronic Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20201229 |