CN206148399U - Automatic equipment is got rid of to wafer protective layer - Google Patents
Automatic equipment is got rid of to wafer protective layer Download PDFInfo
- Publication number
- CN206148399U CN206148399U CN201620961309.1U CN201620961309U CN206148399U CN 206148399 U CN206148399 U CN 206148399U CN 201620961309 U CN201620961309 U CN 201620961309U CN 206148399 U CN206148399 U CN 206148399U
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- CN
- China
- Prior art keywords
- wafer
- protective layer
- group
- eliminating equipment
- platform
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides an automatic equipment is got rid of to wafer protective layer, includes: a wafer is taken advantage of and is carried a device, cutting knife group, one fen off -line group, a base to the group sets firmly on this base with aforementioned device, the wafer is taken advantage of a year device to have and is taken advantage of year a platform and a rotation axis to make the wafer set up on it, should cut the knife tackle and radially stretch into between this wafer and this protective layer, and make to take advantage of and carry the platform to should the rotation of cutting knife group leaving this protective layer part, branch off -line group is corresponding to be stretched into between this wafer and this protective layer to with both complete separation, and remove the protective layer, will cut the knife tackle once more most likely and radially stretch into between the gluey material of this wafer and surface, branch off -line group is corresponding to be stretched into between this wafer and this glue material to with both complete separation, through the utility model discloses a during the contractible casual labourer of automatic equipment is got rid of to wafer protective layer and reduce manufacturing cost.
Description
Technical field
This utility model is related to a kind of eliminating equipment, espespecially a kind of by full-automatic lifting process efficiency and shortening man-hour
Automatic wafer protective layer eliminating equipment.
Background technology
Wafer can cover on the surface one layer of protective glass after shaped cut sheets, and then protection is not processed etching wiring
Crystal column surface, prior art mainly cuts out a gap by artificial first stretching into a cutter between the wafer and the protective glass
Space, finally stretches into clearance space and both separation is removed again into protective glass with wire rod again, and because crystal column surface still has part
The glue material of bonding wafer and protective glass, therefore remain a need for again stretching on cutter and cut out between glue material and wafer a clearance space simultaneously
Glue material is removed into crystal column surface again by wire rod, because prior art is all mainly to carry out by artificial mode, its shortcoming is
Man-hour is longer, and lifts the fraction defective of technique because artificial lower knife is easier to produce error easily produces destruction to wafer.
Therefore, although the problems such as lifting the still uncontrollable fraction defective of manpower or reduce man-hour, these shortcomings are still ability
Field technique personnel most need at this stage one of shortcoming for improving.
Utility model content
Therefore, be the shortcoming that solves above-mentioned prior art, main purpose of the present utility model be provide it is a kind of by from
The mode of dynamicization lifts the efficiency that wafer removes sealer and the equipment for shortening man-hour.
In order to achieve the above object, this utility model provides a kind of automatic wafer protective layer eliminating equipment, including：One wafer is taken advantage of
Carry put, a cutter group, one point of off line group, base；
The wafer is taken advantage of to carry to put and takes advantage of carrying platform and a rotary shaft with one, it is described take advantage of carrying platform rotatably with the rotation
Axle pivot joint；The cutter group has a fixed mount, a cutter and a knife rest, the fixed mount can to should wafer take advantage of and carry
Put close to or away from setting, the cutting knife is on the knife rest, and the knife rest sets with the fixed mount Slide Group；Described point takes off
Unit has a support, and is provided with multiple guide wheels, and an at least wire rod is arranged with these guide wheels；The base have a platform and
An at least slide rail group, aforementioned cutter group, this point of off line group are correspondingly arranged on the platform of base, and the wafer is taken advantage of and carries taking advantage of of putting
Carrying platform is correspondingly arranged in the slide rail group.
Wherein, this takes advantage of carrying platform also to have an at least sucker.
Wherein, also with a Suction cup assembly, the Suction cup assembly has a bracing frame and multiple suckers, the Suction cup assembly correspondence
The wafer is taken advantage of to carry and is put close to or away from setting, and these suckers are correspondingly arranged in one end of the bracing frame.
Wherein, the wafer take advantage of carry put take advantage of carrying platform by the slide rail group to should base move horizontally.
Wherein, also with a ultraviolet illumination group, the ultraviolet illumination group has multiple quartz burners, and this is ultraviolet
Line light group be correspondingly arranged in the wafer take advantage of carry put top.
Wherein, the bracing frame is also connected with a pneumatic cylinder, and the pneumatic cylinder makes these Suction cup assemblies take advantage of close to or away from the wafer
Carry and put.
Wherein, there is a slide rail, the knife rest mutually corresponding can slide with the fixed mount between the knife rest and the fixed mount.
Wherein, also with a roll wheel assembly and an adhesive tape group, the roll wheel assembly has a rolling wheel support and multiple rollers, this
A little rollers are set in parallel each other on the rolling wheel support, have an at least active rotation in these rollers in the roll wheel assembly
Roller, the adhesive tape group has a master rotor, twines outside the master rotor and is provided with multiple adhesive tapes.
Wherein, also platform is contacted with a viscose, the viscose contact platform has multiple trundles, the viscose contact platform
Combined with the rolling wheel support by a slide rail group, the slide rail group enables viscose contact platform to hang down by a servo motor driven
Directly move up and down, the tape portion is set around these trundle outer rims.
Can lifting process yield and reduction man-hour and then drop by automatic wafer protective layer eliminating equipment of the present utility model
Low manufacturing cost.
Description of the drawings
Fig. 1：The three-dimensional combination figure of the first embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 2：The wafer of the first embodiment of automatic wafer protective layer eliminating equipment of the present utility model is taken advantage of to carry and puts solid
Figure；
Fig. 3：The cutter group axonometric chart of the first embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 4：Point off line group axonometric chart of the first embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 5：The three-dimensional combination figure of the second embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 6：For the Suction cup assembly axonometric chart of the second embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 7：The roll wheel assembly axonometric chart of the second embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 8：The three-dimensional combination figure of the 3rd embodiment of automatic wafer protective layer eliminating equipment of the present utility model；
Fig. 9：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 10：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 11：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 12：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 13：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 14：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model；
Figure 15：Automatic wafer protective layer eliminating equipment action schematic diagram of the present utility model.
Description of reference numerals
1 automatic wafer protective layer eliminating equipment
11 wafers are taken advantage of to carry and are put
111 take advantage of carrying platform
1111 suckers
112 rotary shafts
12 cutter groups
121 fixed mounts
122 cutter
123 knife rests
124 slide rails
13 points of off line groups
131 supports
132 guide wheels
133 wire rods
14 Suction cup assemblies
141 bracing frames
142 suckers
143 pneumatic cylinders
15 roll wheel assemblies
151 rolling wheel supports
152 rollers
152a active rotation rollers
16 adhesive tape groups
161 master rotors
162 adhesive tapes
17 viscoses contact platform
171 trundles
172 slide rail groups
173 servo motors
18 bases
181 platforms
182 slide rail groups
2 ultraviolet illumination groups
21 quartz burners
3 wafers
31 protective layers
32 glue materials
B clearance spaces
C clearance spaces.
Specific embodiment
Above-mentioned purpose of the present utility model and its structure and characteristic functionally, by according to the preferred embodiment of appended accompanying drawing
It is explained.
Refer to Fig. 1,2,3,4, be automatic wafer protective layer eliminating equipment of the present utility model first embodiment it is vertical
Body constitutional diagram, wafer are taken advantage of to carry and put axonometric chart, cutter group axonometric chart and point off line group axonometric chart, as illustrated, described automatic
Wafer with protection layer eliminating equipment 1 includes：One wafer is taken advantage of to carry and puts 11, one cutter group, 12, one point of off line group 13, a base 18；
The wafer is taken advantage of to carry to put 11 and have and one takes advantage of the rotary shaft 112 of carrying platform 111 and, described to take advantage of carrying platform 111 to revolve
Turn ground and the pivot joint of rotary shaft 112, it is described to take advantage of carrying platform 111 that also there is an at least sucker 1111, it is such as brilliant to adsorb working substance
Circle.
The cutter group 12 has a fixed mount 121, a cutter 122 and a knife rest 123, and the fixed mount 121 can
To should wafer take advantage of to carry and put 11 close to or away from setting, the cutter 122 are set up on the knife rest 123, and the knife rest 123
Set with the Slide Group of fixed mount 121, there is a slide rail 124 between the knife rest 123 and the fixed mount 121, the knife rest 123 is consolidated with this
Determining frame 121 can mutually correspond to slip.
Described point of off line group 13 has a support 131, and is provided with multiple guide wheels 132, is arranged with least on these guide wheels 132
One wire rod 133.
The base 18 has a platform 181 and an at least slide rail group 182, aforementioned cutter group 12, this point of off line group 13
It is correspondingly arranged on the platform 181 of base 18, the wafer is taken advantage of and carries the carrying platform 111 of taking advantage of for putting 11 and be correspondingly arranged in the slide rail group
On 182, the wafer is taken advantage of to carry and puts 11 and be movable to aforementioned cutter group 12, this point of phase of off line group 13 by the slide rail group 182
Corresponding position.
Fig. 5,6,7 are referred to, is the solid of the second embodiment of automatic wafer protective layer eliminating equipment of the present utility model
Constitutional diagram, Suction cup assembly axonometric chart and roll wheel assembly axonometric chart, and referring again to Fig. 1～4, as illustrated, the present embodiment is described
Automatic wafer protective layer eliminating equipment 1, part-structure is identical with aforementioned first embodiment, therefore here will be repeated no longer, this
Embodiment is with aforementioned first embodiment maximum difference：The present embodiment also has a Suction cup assembly 14, a roll wheel assembly 15,
Adhesive tape group 16, viscose contact platform 17；
The Suction cup assembly 14 has a bracing frame 141 and a multiple suckers 142, the Suction cup assembly 14 can to should wafer take advantage of
Carry and put 11 close to or away from setting, these suckers 142 are correspondingly arranged in one end of the bracing frame 141, the bracing frame 141 also connects
A pneumatic cylinder 143 is connect, the pneumatic cylinder 143 can make these Suction cup assemblies 14 take advantage of to carry close to or away from the wafer and put 11.
The roll wheel assembly 15 has a rolling wheel support 151 and multiple rollers 152, and these rollers 152 set each other in parallel
It is placed on the rolling wheel support 151, there is an at least active rotation roller 152a, the adhesive tape group 16 winding in these rollers 152
In these outer rims of roller 152, the adhesive tape group 16 has a master rotor 161, and outside is wound with multiple adhesive tapes 162, the main rolling
Cylinder 161 is sheathed on any of which of these rollers 152, and the glue that will be wound in outside the master rotor 161 of the adhesive tape group 16
Band 162 is pulled out, and is sequentially set around these outer rims of roller 152, and least significant end is fixed on active rotation roller 152a, should
Active rotation roller 152a can active rotation furl the adhesive tape 162.
The viscose contacts platform 17 and has multiple trundles 171, and viscose contact platform 17 is by a slide rail group 172 and is somebody's turn to do
Rolling wheel support 151 is combined, the slide rail group 172 driven by a servo motor 173 enable the viscose contact platform 17 it is vertical on
Lower movement, the part of aforementioned tape 162 is set around these outer rims of trundle 171.
The base 18 has a platform 181 and an at least slide rail group 182, aforementioned cutter group 12, this point of off line group 13,
The Suction cup assembly 14 is correspondingly arranged on the platform of base 18, and the wafer is taken advantage of and carries the carrying platform 111 of taking advantage of for putting 11 and be correspondingly arranged in
In the slide rail group 182, the wafer take advantage of carry put 11 by the slide rail group 182 be movable to aforementioned cutter group 12, this point take off
Unit 13, the Suction cup assembly 14, the corresponding section of roll wheel assembly 15.
Fig. 8 is referred to, is the three-dimensional combination of the 3rd embodiment of automatic wafer protective layer eliminating equipment of the present utility model
Figure, the present embodiment part-structure technical characteristic is identical with aforementioned first embodiment, therefore here will not be described in great detail, but the present embodiment
Places different from aforementioned first embodiment are：The wafer is taken advantage of and carries the vertical direction for putting 11 home positions before not yet action
With a ultraviolet illumination group 2, the ultraviolet illumination group 2 has multiple quartz burners 21.
Fig. 9,10,11,12,13,14,15 are referred to, is automatic wafer protective layer eliminating equipment action of the present utility model
Schematic diagram, in the lump refering to Fig. 1～7, as illustrated, automatic wafer protective layer eliminating equipment of the present utility model is first first when working
By working substance（Wafer 3）It is positioned over the wafer and takes advantage of to carry and put 11 and take advantage of on carrying platform 111, the surface of wafer 3 has protective layer 31
（Glass）, and there is glue material 32 between the protective layer 31 and the wafer 3, thereafter by the slide rail group 182 of base 18 by wafer
Take advantage of to carry and put 11 and be moved horizontally near cutter group 12, the cutter group 12 is by the cunning between knife rest 123 and the fixed mount 121
Thickness between the automatic detection wafer 3 of rail 124 and protective layer 31 simultaneously voluntarily adjusts appropriate height and position, and cutter 122 are stretched into
Between the wafer 3 and protective layer 31, then taken advantage of to carry by the wafer and put 11 and take advantage of carrying platform 111 to be rotated by 360 ° to make the cutter 122
A clearance space b will be cut out between the wafer 3 and the protective layer 31, then is inserted between this by the wire rod 133 of this point of off line group 13
In the b of gap space, the radial direction translation of the tailing edge wafer 3 makes the protective layer 31 separate with the wafer 3, and the wafer is taken advantage of to carry and puts 11
Carrying platform 111 of taking advantage of be moved to immediately below the Suction cup assembly 14, the bracing frame 141 of the Suction cup assembly 14 passes through again the pneumatic cylinder
143 make the close wafer of these Suction cup assemblies 14 take advantage of to carry and put 11, then adsorb the protective layer 31 by the sucker 142, then by the gas
Cylinder pressure 143 makes these Suction cup assemblies 14 take advantage of to carry away from the wafer and put 11, completes the work for removing the protective layer 31.
The wafer is taken advantage of to carry and puts 11 and be moved again near the cutter group 12, the cutter group 12 by knife rest 123 with
The 121 adjustment height and position of slide rail 124 between the fixed mount, and cutter 122 are stretched between the wafer 3 and glue material 32, then by
The wafer is taken advantage of to carry and puts 11 and take advantage of carrying platform 111 to be rotated by 360 ° to make the cutter 122 to cut between the wafer 3 and the glue material 32
Go out a clearance space c, then inserted in clearance space c by the wire rod 133 of this point of off line group 13, the radial direction of the tailing edge wafer 3
Direction translation makes the glue material 32 separate with the wafer 3, then takes advantage of to carry by the wafer and put 11 and be moved to below the roll wheel assembly 15,
The adhesive tape 162 is guided to press close to the glue material 32 on the surface of wafer 3 by the viscose contact platform 17, and by active rotation roller 152a
Rotate and drive adhesive tape 162 that the glue material 32 is removed into the surface of wafer 3, finally the wafer is taken advantage of to carry to put 11 and return origin and completes work
Make.
By automatic wafer protective layer eliminating equipment of the present utility model protective layer is removed simultaneously in fully automated way
And directly can directly link with other semiconductor manufacturing equipments, and then improve prior art and carry out removing guarantor by artificial mode
The shortcoming of sheath, significantly reduces man-hour and reduces the generation of fraction defective.
Claims (9)
1. a kind of automatic wafer protective layer eliminating equipment, it is characterised in that include：
One wafer is taken advantage of to carry and is put, and with one carrying platform and a rotary shaft are taken advantage of, it is described take advantage of carrying platform rotatably with the rotary shaft pivot
Connect；
One cutter group, with a fixed mount, a cutter and a knife rest, the fixed mount to should wafer take advantage of to carry and put close
Or be arranged distant from, the cutting knife is on the knife rest, and the knife rest sets with the fixed mount Slide Group；
One point of off line group, with a support, and is provided with multiple guide wheels, and an at least wire rod is arranged with these guide wheels；
One base, with a platform and an at least slide rail group, aforementioned cutter group, this point of off line group are correspondingly arranged in the base
On platform, the wafer is taken advantage of and carries the carrying platform of taking advantage of put and be correspondingly arranged in the slide rail group.
2. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that described to take advantage of carrying platform also to have
An at least sucker.
3. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that also with a Suction cup assembly,
The Suction cup assembly has a bracing frame and a multiple suckers, the Suction cup assembly to should wafer take advantage of to carry and put close to or away from setting,
These suckers are correspondingly arranged in one end of the bracing frame.
4. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that the wafer is taken advantage of and carries taking advantage of of putting
Carrying platform by the slide rail group to should base move horizontally.
5. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that also with a ultraviolet illumination
Group, the ultraviolet illumination group has multiple quartz burners, and the ultraviolet illumination group is correspondingly arranged in into the wafer takes advantage of and carry
Put top.
6. automatic wafer protective layer eliminating equipment according to claim 3, it is characterised in that the bracing frame is also connected with a gas
Cylinder pressure, the pneumatic cylinder makes these Suction cup assemblies take advantage of to carry close to or away from the wafer and put.
7. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that between the knife rest and the fixed mount
With a slide rail, the knife rest is mutually corresponding with the fixed mount to slide.
8. automatic wafer protective layer eliminating equipment according to claim 1, it is characterised in that also with a roll wheel assembly and
One adhesive tape group, the roll wheel assembly has a rolling wheel support and multiple rollers, and these rollers are set in parallel each other in the roller
On frame, there is an at least active rotation roller in these rollers in the roll wheel assembly, the adhesive tape group has a master rotor, the master
Cylindrical outer is twined and is provided with multiple adhesive tapes.
9. automatic wafer protective layer eliminating equipment according to claim 8, it is characterised in that also flat with viscose contact
Platform, the viscose contact platform has multiple trundles, and the viscose contact platform is combined by a slide rail group with the rolling wheel support,
The slide rail group enables viscose contact platform vertically to move by a servo motor driven, and aforementioned tape part is set around
These trundle outer rims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620961309.1U CN206148399U (en) | 2016-08-26 | 2016-08-26 | Automatic equipment is got rid of to wafer protective layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620961309.1U CN206148399U (en) | 2016-08-26 | 2016-08-26 | Automatic equipment is got rid of to wafer protective layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206148399U true CN206148399U (en) | 2017-05-03 |
Family
ID=58627072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620961309.1U Expired - Fee Related CN206148399U (en) | 2016-08-26 | 2016-08-26 | Automatic equipment is got rid of to wafer protective layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206148399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106169421A (en) * | 2016-08-26 | 2016-11-30 | 振图科技股份有限公司 | Automatically wafer protective layer eliminating equipment |
-
2016
- 2016-08-26 CN CN201620961309.1U patent/CN206148399U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106169421A (en) * | 2016-08-26 | 2016-11-30 | 振图科技股份有限公司 | Automatically wafer protective layer eliminating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 Termination date: 20200826 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |