CN206136472U - PCB board carrier for wave -soldering - Google Patents
PCB board carrier for wave -soldering Download PDFInfo
- Publication number
- CN206136472U CN206136472U CN201621160927.2U CN201621160927U CN206136472U CN 206136472 U CN206136472 U CN 206136472U CN 201621160927 U CN201621160927 U CN 201621160927U CN 206136472 U CN206136472 U CN 206136472U
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- CN
- China
- Prior art keywords
- pcb board
- soldering
- wave
- plate
- elastic plate
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Abstract
The utility model relates to a PCB board carrier for wave -soldering, including the base plate, set up transparent elastic plate on the base plate, set up hollow area on the transparent elastic plate, hollow area's shape with to wait to carry PCB plate -type form identical, lie in on the base plate hollow area set up supply wave -soldering soldering tin pass through the dead zone territory, the bight that lies in hollow area sets up the axis of rotation, rotates the articulated rotating turret that has in the axis of rotation, the rotating turret rotate the epaxial seat and the dwang of overhang downwards of rotating including lieing in, the top of dwang sets up the location briquetting, sets up flexible flexure strip on the lower terminal surface of location briquetting, the top of rotation seat and axis of rotation between set up the pressure spring. Guarantee PCB board stable position fixing, effectively solve the problem that the PCB board welded the dress skew.
Description
Technical field
This utility model is related to pcb board and is welded field, and in particular to a kind of wave-soldering pcb board carrier.
Background technology
Wave-soldering is to allow the solder side of PCB plates directly to contact with high-temperature liquid state stannum and reach welding purpose, its high-temperature liquid state stannum
Keep an inclined-plane, and by wave-soldering device make liquid tin is formed a lot of be similar to it is wavy reach weld PCB plates mesh
, its main material is soldering tin bar.With electronic product development in pluralism, pursue PCB plate high precisions becomes inevitable with high efficiency
Trend.At present when wave-soldering is welded pcb board, PCB plates are fixed on carrier first, carrier Jing successively is driven by guide rail
Cross each station to be welded.If the problems such as PCB plates positioning will definitely not bring solder printing to offset, so as to affect PCB plates
Production quality.Therefore, setting accuracy of the PCB plates on carrier requires stricter.Existing wave-soldering pcb board carrier
Put for pcb board using slotting on substrate mostly, then pcb board is positioned by pin, because pcb board is glass fibre material,
Deformation itself is also easy to produce, and this there is pcb board and the problem for positioning shakiness is placed on substrate, cause the skew that is welded.
The content of the invention
This utility model purpose is to provide a kind of wave-soldering pcb board carrier, it is ensured that pcb board stable position, effectively solving
Pcb board is welded the problem of skew.
In order to realize object above, the technical solution adopted in the utility model is：A kind of wave-soldering pcb board carrier, bag
Include substrate, transparent elastic plate be set on substrate, open up void region on transparent elastic plate, the shape of described void region with treat
Carry pcb board shape to match, the transmission region arranged for wave-soldering tin-soldering is located in void region on substrate, positioned at void region
Corner rotary shaft is set, be rotatablely hinged with rotating turret in rotary shaft, described rotating turret includes the rotation being located in rotary shaft
Seat and the rotating bar for overhanging downwards, the top of rotating bar arranges positioning briquetting, on the lower surface of positioning briquetting flexible resilient is arranged
Stage clip is set between piece, described rotation seat and the top of rotary shaft.
It is of the present utility model to have technical effect that：By the way that fluting on existing substrate is modified to arrange transparent on substrate
Elastic plate, then the void region carried for pcb board is opened up on transparent elastic plate, acted on by the elastic shrinkage of transparent elastic plate
Stable blocks pcb board, and the deformation of pcb board is absorbed by the elastic shrinkage of transparent elastic plate, then turning by void region corner
Moving frame is rotated around rotary shaft, turns to void region top, and rotating turret is pressed by the presence of stage clip, the top of rotating bar in rotary shaft
The positioning briquetting at end compresses the pcb board on void region, and in order to ensure that positioning briquetting thrust is excessive, too quickly cause pcb board
On there is impression, on positioning briquetting lower surface arrange flexible resilient piece.Pcb board stable position is so ensured that, effectively solution
Certainly pcb board is welded the problem of skew.
Description of the drawings
Fig. 1 is front view of the present utility model；
Fig. 2 is fragmentary, perspective view of the present utility model.
Specific embodiment
Referring to the drawings, a kind of wave-soldering pcb board carrier, including substrate 10, arranges transparent elastic plate 20, thoroughly on substrate 10
Void region 21 is opened up on bright elastic plate 20, the shape of described void region 21 matches with pcb board shape to be carried, substrate 10
The upper transmission region 11 arranged in void region 21 for wave-soldering tin-soldering, the corner positioned at void region 21 arranges rotary shaft
31, be rotatablely hinged with rotating turret 32 in rotary shaft 31, described rotating turret 32 include the rotation seat 32a being located in rotary shaft 31 and
The rotating bar for overhanging downwards, the top of rotating bar arranges positioning briquetting 32b, and on the lower surface of positioning briquetting 32b flexible pellet is arranged
Property piece 32c, stage clip 40 is set between described rotation seat 32a and the top of rotary shaft 31.
By the way that fluting on existing substrate 10 is modified to arrange transparent elastic plate 20 on the substrate 10, then in transparent elastic
The void region 21 carried for pcb board is opened up on plate 20, is acted on by the elastic shrinkage of transparent elastic plate 20 and stable is blocked PCB
Plate, the deformation of pcb board is absorbed by the elastic shrinkage of transparent elastic plate 20, then by the rotating turret 32 in the corner of void region 21 around
Rotary shaft 31 is rotated, and turns to the top of void region 21, and rotating turret 32 is pressed by the presence of stage clip 40, rotating bar in rotary shaft 31
Positioning briquetting 32b on top compress pcb board on void region 21, and in order to ensure that positioning briquetting 32b thrust is excessive, mistake
Suddenly cause occur impression on pcb board, flexible resilient piece 32c is set on positioning briquetting 32b lower surface.So ensure that PCB
Plate stable position, effectively solving pcb board is welded the problem of skew.
Further, at least two void regions 21 are opened up on described transparent elastic plate 20.
At least two void regions 21 for arranging carry for polylith pcb board, are so disposably welded into beneficial to crest welder
Type polylith pcb board is carried, improve production efficiency.
Further, fixing bolt 50 is set between described substrate 10 and transparent elastic plate 20.
Described substrate 10 overlaps arrangement with the plate edge of transparent elastic plate 20, and described fixing bolt 50 is along transparent elastic plate
20 plate edge arrangement.
With reference to Fig. 1,2, the bottom of rotary shaft 31 is placed on substrate 10, the top of rotary shaft 31 arrange hold-doun nut rotation-limited
Frame 32.The benefit that lower fixing bolt 50, hold-doun nut is arranged is illustrated below：Long its elasticity of the use time of transparent elastic plate 20 is received
Contracting ability there may be deficiency, easily removes transparent elastic plate 20 and more renews by backing out fixing bolt 50, hold-doun nut
Transparent elastic plate 20, be so further ensured that pcb board stable position.
The plate edge top of transparent elastic plate 20 arranges protection mask 60, and fixing bolt 50 is placed on protection mask 60.Protection
Mask 60 is placed on the plate edge of transparent elastic plate 20, substrate 10, plays the protective effect to transparent elastic plate 20, substrate 10, it is to avoid
Crest welder guide rail is to transparent elastic plate 20, the destruction that causes transparent elastic plate 20 or substrate 10 of colliding with of substrate 10.
Claims (5)
1. a kind of wave-soldering pcb board carrier, including substrate（10）, it is characterised in that：Substrate（10）Upper setting transparent elastic plate
（20）, transparent elastic plate（20）On open up void region（21）, described void region（21）Shape and pcb board shape to be carried
Match, substrate（10）It is upper to be located at void region（21）The interior transmission region arranged for wave-soldering tin-soldering（11）, positioned at vacancy section
Domain（21）Corner arrange rotary shaft（31）, rotary shaft（31）On be rotatablely hinged with rotating turret（32）, described rotating turret（32）
Including positioned at rotary shaft（31）On rotation seat（32a）With the downward rotating bar for overhanging, the top of rotating bar arranges positioning briquetting
（32b）, positioning briquetting（32b）Lower surface on arrange flexible resilient piece（32c）, described rotation seat（32a）With rotary shaft
（31）Top between stage clip is set（40）.
2. wave-soldering according to claim 1 pcb board carrier, it is characterised in that：Described transparent elastic plate（20）On
Open up at least two void regions（21）.
3. wave-soldering according to claim 1 pcb board carrier, it is characterised in that：Described substrate（10）With transparent bullet
Property plate（20）Between fixing bolt is set（50）.
4. wave-soldering according to claim 3 pcb board carrier, it is characterised in that：Described substrate（10）With transparent bullet
Property plate（20）Plate edge overlap arrangement, described fixing bolt（50）Along transparent elastic plate（20）Plate edge arrangement.
5. wave-soldering according to claim 4 pcb board carrier, it is characterised in that：Transparent elastic plate（20）Plate edge on
Side arranges protective frame（60）, protective frame（60）Cover transparent elastic plate（20）With substrate（10）Plate edge, fixing bolt（50）Put
In protective frame（60）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621160927.2U CN206136472U (en) | 2016-11-01 | 2016-11-01 | PCB board carrier for wave -soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621160927.2U CN206136472U (en) | 2016-11-01 | 2016-11-01 | PCB board carrier for wave -soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206136472U true CN206136472U (en) | 2017-04-26 |
Family
ID=58575686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621160927.2U Active CN206136472U (en) | 2016-11-01 | 2016-11-01 | PCB board carrier for wave -soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206136472U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108776422A (en) * | 2018-04-25 | 2018-11-09 | 华灿光电(苏州）有限公司 | Clean the auxiliary carrier and reticle cleaning machine of reticle |
| CN113873818A (en) * | 2021-09-30 | 2021-12-31 | 信太科技（集团）股份有限公司 | Combined multi-chip integrated circuit board |
-
2016
- 2016-11-01 CN CN201621160927.2U patent/CN206136472U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108776422A (en) * | 2018-04-25 | 2018-11-09 | 华灿光电(苏州）有限公司 | Clean the auxiliary carrier and reticle cleaning machine of reticle |
| CN108776422B (en) * | 2018-04-25 | 2022-02-11 | 华灿光电(苏州）有限公司 | Auxiliary carrier for cleaning photoetching plate and photoetching plate cleaning machine |
| CN113873818A (en) * | 2021-09-30 | 2021-12-31 | 信太科技（集团）股份有限公司 | Combined multi-chip integrated circuit board |
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| GR01 | Patent grant |