CN206105601U - Cmp设备抛光头掉片检测系统 - Google Patents
Cmp设备抛光头掉片检测系统 Download PDFInfo
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- CN206105601U CN206105601U CN201621085173.9U CN201621085173U CN206105601U CN 206105601 U CN206105601 U CN 206105601U CN 201621085173 U CN201621085173 U CN 201621085173U CN 206105601 U CN206105601 U CN 206105601U
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- rubbing head
- pressure
- piece
- control module
- detecting system
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- 238000005498 polishing Methods 0.000 title abstract description 13
- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 238000012544 monitoring process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 5
- 230000000274 adsorptive effect Effects 0.000 claims description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000011897 real-time detection Methods 0.000 abstract description 2
- 238000010835 comparative analysis Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000254 damaging effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201621085173.9U CN206105601U (zh) | 2016-09-27 | 2016-09-27 | Cmp设备抛光头掉片检测系统 |
PCT/CN2017/097356 WO2018059144A1 (zh) | 2016-09-27 | 2017-08-14 | Cmp设备抛光头掉片检测方法和系统 |
Applications Claiming Priority (1)
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CN201621085173.9U CN206105601U (zh) | 2016-09-27 | 2016-09-27 | Cmp设备抛光头掉片检测系统 |
Publications (1)
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CN206105601U true CN206105601U (zh) | 2017-04-19 |
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CN201621085173.9U Active CN206105601U (zh) | 2016-09-27 | 2016-09-27 | Cmp设备抛光头掉片检测系统 |
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CN (1) | CN206105601U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106425828A (zh) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Cmp设备抛光头掉片检测方法和系统 |
WO2018059144A1 (zh) * | 2016-09-27 | 2018-04-05 | 清华大学 | Cmp设备抛光头掉片检测方法和系统 |
CN110103133A (zh) * | 2019-06-25 | 2019-08-09 | 吉姆西半导体科技(无锡)有限公司 | 研磨头微漏检测系统 |
CN113579989A (zh) * | 2021-08-13 | 2021-11-02 | 西安奕斯伟材料科技有限公司 | 滑片检测装置和抛光系统 |
-
2016
- 2016-09-27 CN CN201621085173.9U patent/CN206105601U/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106425828A (zh) * | 2016-09-27 | 2017-02-22 | 天津华海清科机电科技有限公司 | Cmp设备抛光头掉片检测方法和系统 |
WO2018059144A1 (zh) * | 2016-09-27 | 2018-04-05 | 清华大学 | Cmp设备抛光头掉片检测方法和系统 |
CN110103133A (zh) * | 2019-06-25 | 2019-08-09 | 吉姆西半导体科技(无锡)有限公司 | 研磨头微漏检测系统 |
CN113579989A (zh) * | 2021-08-13 | 2021-11-02 | 西安奕斯伟材料科技有限公司 | 滑片检测装置和抛光系统 |
CN113579989B (zh) * | 2021-08-13 | 2024-01-26 | 西安奕斯伟材料科技股份有限公司 | 滑片检测装置和抛光系统 |
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: CMP equipment polishing head falls piece detecting system Effective date of registration: 20180206 Granted publication date: 20170419 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191022 Granted publication date: 20170419 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |