CN206042509U - Double -deck flexible line way board of anti -electromagnetic interference HDI - Google Patents
Double -deck flexible line way board of anti -electromagnetic interference HDI Download PDFInfo
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- CN206042509U CN206042509U CN201620918199.0U CN201620918199U CN206042509U CN 206042509 U CN206042509 U CN 206042509U CN 201620918199 U CN201620918199 U CN 201620918199U CN 206042509 U CN206042509 U CN 206042509U
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- electromagnetic interference
- conductive layer
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Abstract
The utility model discloses a double -deck flexible line way board of anti -electromagnetic interference HDI, including the circuit board body, the circuit board body includes first cover membrane, an electromagnetic interference resistance layer, first conducting layer, substrate, second conducting layer, the 2nd electromagnetic interference resistance layer and second cover membrane, the substrate covers respectively from top to bottom has first conducting layer and second conducting layer, all is equipped with the copper plate above first conducting layer and the second conducting layer, is equipped with an electromagnetic interference resistance layer between copper plate and the first cover membrane, is equipped with the 2nd electromagnetic interference resistance layer between copper plate and the second cover membrane, and first conducting layer, substrate to second conducting layer are passed to the blind hole, plate on the blind hole inner wall and be equipped with one deck hole copper, is the thickness of hole copper 10 12um. The utility model has the advantages of reasonable design, thickness is thin, can reduce the weight of electronic packaging, and first conducting layer and second conducting layer set up the electromagnetic interference resistance layer outward, shield external electromagnetic interference, electromagnetic compatibility problem when solving multiple electronic product simultaneous working.
Description
Technical field
This utility model is related to flexible circuitry technical field, and in particular to a kind of HDI Double-layer flexible lines of electromagnetism interference
Road plate.
Background technology
Referred to as " soft board ", industry claims " FPC ", is flexible circuit board (Flexible Printed Circuit Board)
With printed circuit made by flexible insulation base material, have the advantages that many rigid printed circuit boards do not possess, it is possible to achieve freely
Bending, winding, folding.The volume of electronic product can be substantially reduced using FPC, electronic product is suitable for high density, miniaturization, height
The needs of reliable direction development.With the raising and the increase of transinformation content of electrical information transfer rate, electronic equipment is to frivolous
Short and small, high-performance, multi-functional direction develop and Electronic Assembly Foundation progress, for electronic devices and components interconnection high density
Interconnection（HDI）Product, has gone on the surface mounting technique stage comprehensively from the Through-Hole Technology stage, has moved towards wafer-level package rank
Section, and just progressively moving towards the system in package stage.The nineties initial stage in 20th century, high density interconnection technique, the technology is in routine
Wiring board in introduce blind buried via hole, fine linewidth line-spacing can produce thin layer that conventional multilayer plate technique cannot realize, many
Layer, stable high density interconnection printed substrate are that high-density multi-layered wiring board techniques cannot realize thin layer, multilamellar, stable height
Density interconnected printed circuit board is high-density multi-layered wiring board, has adapted to electronic product to lighter, less, thinner, reliability more
The requirement that high direction is developed, meets the continuous requirement of Electronic Encapsulating Technology of new generation.
Utility model content
Utility model purpose：For the problem and shortage of above-mentioned presence of the prior art, the purpose of this utility model is
A kind of HDI Double-layer flexible circuit boards of electromagnetism interference are provided.The external electromagnetic interference of shielding, solves various electronic products simultaneously
Emc issue during work.
Technical scheme：For reaching above-mentioned purpose, a kind of HDI Double-layer flexible lines of electromagnetism interference described in the utility model
Road plate, including wiring board body, the wiring board body include the first coverlay, the first anti-electromagnetic interference layer, the first conductive layer,
Base material, the second conductive layer, the second anti-electromagnetic interference layer and the second coverlay, the base material be covered with respectively up and down the first conductive layer and
Second conductive layer, the first conductive layer and the second conductive layer are equipped with copper plate, are provided between copper plate and the first coverlay
First anti-electromagnetic interference layer, is provided with the second anti-electromagnetic interference layer between copper plate and the second coverlay, blind hole is conductive through first
Layer, base material to the second conductive layer, plating on the blind hole inwall are provided with one layer of hole copper, and the thickness of the hole copper is 10-12um.
Further, the described first anti-electromagnetic interference layer and the second anti-electromagnetic interference layer are by ferrum
Oxysome or the die casting of nano-crystal soft-magnetic body are constituted.The design of double-deck anti-electromagnetic interference layer can shield external electromagnetism and do
Disturb, prevent the key property of electromagnetic interference influence wiring board.
Further, first coverlay, the first anti-electromagnetic interference layer, the first conductive layer, base material, the second conductive layer,
Two ends alignment is stacked successively for second anti-electromagnetic interference layer and the second coverlay.The design that two ends alignment is stacked can be protected
Card ground floor coverlay and second layer coverlay by the first anti-electromagnetic interference layer inside wiring board, the first conductive layer, base material, the
In two conductive layers, the second anti-electromagnetic interference layer are coated on, effective insulation protection effect is played.
Further, the base material is made up of polyimide copper-clad plate.Dimension stability is good, high temperature resistant, tension
Resistance to spalling is high, it is ensured that the ruggedness of wiring board, long service life.
Further, first conductive layer and the second conductive layer are Copper Foil, aluminium foil or native silver.Copper Foil, aluminium foil or native silver
Metal ductility it is good, thickness of thin, reduce wiring board thickness.
Further, first coverlay and the second coverlay are liquid photosensitive PI type films.Thickness is easy to molding, resistance to
It is hot good, insulate and good flame retardation effect.
Above-mentioned technical proposal can be seen that the beneficial effects of the utility model：
A kind of HDI Double-layer flexible circuit boards of electromagnetism interference described in the utility model, reasonable in design, thickness
It is thin, the weight of Electronic Packaging is reduced, by arranging anti-electric magnetic disturbance layer outside the first conductive layer and the second conductive layer, is shielded external
Electromagnetic interference, solve emc issue when various electronic products are worked simultaneously.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure：1- wiring board bodies, the first coverlays of 2-, the first anti-electromagnetic interference layers of 3-, the first conductive layers of 4-, 5- bases
Material, the second conductive layers of 6-, 7- copper plates, the second anti-electromagnetic interference layers of 8-, the second coverlays of 9-, 10- blind holes, 11- holes copper.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, further elucidate this utility model.
Embodiment
A kind of HDI Double-layer flexible circuit boards of electromagnetism interference as shown in Figure 1, including wiring board body 1, the circuit
Plate body 1 includes that the first coverlay 2, the first anti-electromagnetic interference layer 3, the first conductive layer 4, base material 5, the second conductive layer 6, second are prevented
Electromagnetic interference layer 8 and the second coverlay 9, the base material are covered with the first conductive layer 4 and the second conductive layer 6 up and down respectively, and first leads
Electric layer 4 and the second conductive layer 6 are equipped with copper plate 7 above, be provided with the first anti-electromagnetism and do between copper plate 7 and the first coverlay 2
Layer 3 is disturbed, the second anti-electromagnetic interference layer 8 between copper plate 7 and the second coverlay 9, is provided with, blind hole 10 passes through the first conductive layer 4, base
5 to the second conductive layer 6 of material, plating on 10 inwall of the blind hole are provided with one layer of hole copper 11, and the thickness of the hole copper 11 is 10-12um.
Described in the present embodiment, the first anti-electromagnetic interference layer 3 and the second anti-electromagnetic interference layer 8 are by ferrite or nanocrystalline
Soft magnetic bodies die casting is constituted.The design of the anti-electromagnetic interference layer in both sides can shield external electromagnetic interference, prevent electromagnetic interference influence
The key property of wiring board
First coverlay 2, the first anti-electromagnetic interference layer 3 described in the present embodiment, the first conductive layer 4, base material 5, second are led
Two ends alignment is stacked successively for electric layer 6, the second anti-electromagnetic interference layer 8 and the second coverlay 9.What two ends alignment was stacked sets
Meter can ensure that the first anti-electromagnetic interference layer 3 inside wiring board, first are led by ground floor coverlay 2 and second layer coverlay 8
Electric layer 4, base material 5, the second conductive layer 6, the second anti-electromagnetic interference layer 8 play anti-welding effect, are flexible circuitry conductor in being coated on
Mechanics protective effect is played, long-term bending operation can be undergone.
Base material 5 described in the present embodiment is made up of polyimide copper-clad plate.The scantling of polyimide copper-clad plate is steady
Qualitative good, high temperature resistant, tension resistance to spalling are high, and the ruggedness of wiring board is effectively ensured.
First conductive layer 4 described in the present embodiment and the second conductive layer 6 are Copper Foil, aluminium foil or native silver.Metal ductility is good,
Thickness of thin, reduces the thickness of wiring board.
First coverlay 2 described in the present embodiment and the second coverlay 9 are liquid photosensitive PI type films.
This utility model is chosen base material 5 first, is then led to the first conductive layer 4 and the second conductive layer 6 respectively in processing
The both sides up and down that binding agent is fixed on base material 5 are crossed, is then exposed on the first conductive layer 4 and the second conductive layer 6 respectively again
And etching, laser drilling blind hole 10 is then carried out again, finally on the first conductive layer 4 of the circuit for having etched, superposition first is prevented
Electromagnetic interference layer 3 is pressed, and is superimposed the second anti-electromagnetic interference layer 8, is pressed, finally first on the second conductive layer 6
Anti- electromagnetic interference layer 3 and 8 outer side covers the first coverlay 2 of the second anti-electromagnetic interference layer and the second coverlay 9, press closely knit.
Embodiment is merely to illustrate this utility model rather than limits scope of the present utility model, is reading this practicality
After new, those skilled in the art fall within what the application claims were limited to various equivalences of the present utility model
Scope.
Claims (6)
1. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference, it is characterised in that：Including wiring board body（1）, the circuit
Plate body（1）Including the first coverlay（2）, the first anti-electromagnetic interference layer（3）, the first conductive layer（4）, base material（5）, it is second conductive
Layer（6）, the second anti-electromagnetic interference layer（8）With the second coverlay（9）, the base material is covered with the first conductive layer up and down respectively（4）With
Second conductive layer（6）, the first conductive layer（4）With the second conductive layer（6）Copper plate (7), copper plate (7) and first is equipped with above
First anti-electromagnetic interference layer (3) are provided between coverlay (2), are provided with second anti-electric between copper plate (7) and the second coverlay (9)
Magnetic disturbance layer (8), blind hole (10) pass through the first conductive layer (4), base material (5) to the second conductive layer (6), blind hole (10) inwall
Upper plating is provided with one layer of hole copper (11), and the thickness of hole copper (11) is 10-12um.
2. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference according to claim 1, it is characterised in that：Described
One anti-electromagnetic interference layer（3）With the second anti-electromagnetic interference layer（8）Constituted by ferrite or the die casting of nano-crystal soft-magnetic body.
3. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference according to claim 1, it is characterised in that：Described
One coverlay（2）, first anti-electromagnetic interference layer (3), it is the first conductive layer (4), base material (5), the second conductive layer (6), second anti-electric
Two ends alignment is stacked successively for magnetic disturbance layer (8) and the second coverlay (9).
4. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference according to claim 1, it is characterised in that：The base
Material (5) is made up of polyimide copper-clad plate.
5. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference according to claim 1, it is characterised in that：Described
One conductive layer（4）It is Copper Foil, aluminium foil or native silver with the second conductive layer (6).
6. HDI Double-layer flexible circuit boards of a kind of electromagnetism interference according to claim 1, it is characterised in that：Described
One coverlay (2) and the second coverlay (9) are liquid photosensitive PI type films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918199.0U CN206042509U (en) | 2016-08-23 | 2016-08-23 | Double -deck flexible line way board of anti -electromagnetic interference HDI |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918199.0U CN206042509U (en) | 2016-08-23 | 2016-08-23 | Double -deck flexible line way board of anti -electromagnetic interference HDI |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042509U true CN206042509U (en) | 2017-03-22 |
Family
ID=58305675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620918199.0U Expired - Fee Related CN206042509U (en) | 2016-08-23 | 2016-08-23 | Double -deck flexible line way board of anti -electromagnetic interference HDI |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206042509U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890132A (en) * | 2019-04-09 | 2019-06-14 | 盐城维信电子有限公司 | A kind of multi-layer flexible circuit board and preparation method thereof of shielded signal line |
| TWI738545B (en) * | 2020-10-21 | 2021-09-01 | 大陸商華通精密線路板（惠州）有限公司 | Processing technology to improve the convenience of emi removal film |
-
2016
- 2016-08-23 CN CN201620918199.0U patent/CN206042509U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890132A (en) * | 2019-04-09 | 2019-06-14 | 盐城维信电子有限公司 | A kind of multi-layer flexible circuit board and preparation method thereof of shielded signal line |
| CN109890132B (en) * | 2019-04-09 | 2021-10-22 | 盐城维信电子有限公司 | Multilayer flexible circuit board for shielding signal line and manufacturing method thereof |
| TWI738545B (en) * | 2020-10-21 | 2021-09-01 | 大陸商華通精密線路板（惠州）有限公司 | Processing technology to improve the convenience of emi removal film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170322 Termination date: 20190823 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |