CN205430766U - HDI high density lamination circuit board - Google Patents
HDI high density lamination circuit board Download PDFInfo
- Publication number
- CN205430766U CN205430766U CN201620212082.0U CN201620212082U CN205430766U CN 205430766 U CN205430766 U CN 205430766U CN 201620212082 U CN201620212082 U CN 201620212082U CN 205430766 U CN205430766 U CN 205430766U
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- circuit board
- board
- wiring board
- sides
- insulating barrier
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Abstract
The utility model relates to a HDI circuit board field, concretely relates to HDI high density lamination circuit board. HDI high density lamination circuit board, including two -sided base plate, the etching has a circuit on the two -sided base plate, passes through the insulating layer in two -sided base plate both sides and connects the the first line board, passes through the insulating layer in the first line board both sides and connects the the second line board, passes through the insulating layer in the second line board both sides and connects third circuit board, passes through the insulating layer in third circuit board both sides and connects fourth circuit board, set up the mark recess one on the side of the first line board, set up twice mark recess on the side of the second line board, set up three mark recesses on the side of third circuit board, set up four mark recesses on the side of fourth circuit board, the blind hole that is provided with the metallization between each layer circuit board and between each layer circuit board and the two -sided base plate realizes the inter -plate interconnection. Same position at each layer circuit board sets up the locating hole, realizes the accurate location between the circuit board, the circuit sheet -metal elements heat dissipation of also being convenient for.
Description
Technical field
This utility model relates to HDI wiring board art, is specifically related to a kind of HDI high-density lamination circuit board.
Background technology
Along with electronic equipment develops and the progress of Electronic Assembly Foundation to compact, high-performance, multi-functional direction, HDI product for electronic devices and components interconnection has gone on the surface mounting technique stage from the Through-Hole Technology stage comprehensively, move towards the wafer-level package stage, and the most progressively move towards the system in package stage.The nineties initial stage in 20th century, Japan, the U.S. have started application high-density interconnection technology, this technology introduces blind buried via hole in conventional wiring board, fine linewidth line-spacing, slim, multilamellar, the most high-density multi-layered wiring board of stable high-density interconnected printed circuit board that conventional multilayer plate technique cannot realize can be produced, adapted to electronic product to gentlier, the requirement that develops of less, thinner, the higher direction of reliability, meet the needs of the packaging density that a new generation's Electronic Encapsulating Technology improves constantly.Therefore, high-density multi-layered wiring board techniques one climbs up the arena of history, the most flourish.
Utility model content
Problem to be solved in the utility model is to overcome the deficiencies in the prior art, it is provided that a kind of HDI high-density lamination circuit board, this kind of wiring board can effectively promote the heat dispersion of wiring board and can realize precise positioning.
For solving the problems referred to above, the technical solution adopted in the utility model is: HDI high-density lamination circuit board, including double-sided substrate, it is etched with circuit on described double-sided substrate, first line plate is connected by insulating barrier in double-sided substrate both sides, connect the second wiring board in first line plate both sides by insulating barrier, connect tertiary circuit plate in the second wiring board both sides by insulating barrier, connect the 4th wiring board in tertiary circuit plate both sides by insulating barrier；The side of first line plate arranges one marker groove, the side of the second wiring board arranges twice marker groove, the side of tertiary circuit plate arranges three road marker groove, the side of the 4th wiring board arranges four road marker groove；It is provided with metallized blind hole between described each sandwich circuit board and between each sandwich circuit board and double-sided substrate to realize interconnecting between plate, positions hole in the corner of wiring board and arranging without electronic component and position, conducting wire of center.
Preferably, described insulating barrier uses modified o-cresol formaldehyde epoxy resin.
Preferably, in described marker groove, there is black ink.
Preferably, described blind hole realizes metallization by copper facing.
Preferably, hole, described location is at the same position of each sandwich circuit board.
The beneficial effects of the utility model are: arrange hole, location at the same position of each sandwich circuit board, it is simple to realize the precise positioning between wiring board, also allow for the heat radiation of wiring board element simultaneously；Arranging the marker groove consistent with wiring board title in the side of each sandwich circuit board, it is simple to distinguish each sandwich circuit board, insulating barrier uses modified o-cresol formaldehyde epoxy resin, and insulation effect is good, and non-stimulated more environmentally-friendly.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model.
Wherein reference is as follows:
1, double-sided substrate；2, insulating barrier；3, first line plate；4, the second wiring board；5, tertiary circuit plate；6, the 4th wiring board；7, marker groove；8, blind hole；9, hole, location.
Detailed description of the invention
Below in conjunction with Fig. 1, this utility model is described further:
HDI high-density lamination circuit board, including double-sided substrate 1, it is etched with circuit on described double-sided substrate 1, first line plate 3 is connected by insulating barrier 2 in double-sided substrate 1 both sides, the second wiring board 4 is connected by insulating barrier 2 in first line plate 3 both sides, connect tertiary circuit plate 5 in the second wiring board 4 both sides by insulating barrier 2, connect the 4th wiring board 6 in tertiary circuit plate 5 both sides by insulating barrier 2；The side of first line plate 3 arranges one marker groove 7, the side of the second wiring board 4 arranges twice marker groove 7, the side of tertiary circuit plate 5 arranges three road marker groove 7, the side of the 4th wiring board 6 arranges four road marker groove 7；It is provided with metallized blind hole 8 between described each sandwich circuit board and between each sandwich circuit board and double-sided substrate 1 to realize interconnecting between plate, positions hole 9 in the corner of wiring board and arranging without electronic component and position, conducting wire of center.
Insulating barrier 2 uses modified o-cresol formaldehyde epoxy resin, has black ink in described marker groove 7, and described blind hole 8 realizes metallization by copper facing, and hole, described location 9 is at the same position of each sandwich circuit board.
The beneficial effects of the utility model are: arrange hole 9, location at the same position of each sandwich circuit board, it is simple to realize the precise positioning between wiring board, also allow for the heat radiation of wiring board element simultaneously；Arranging the marker groove 7 consistent with wiring board title in the side of each sandwich circuit board, it is simple to distinguish each sandwich circuit board, insulating barrier 2 uses modified o-cresol formaldehyde epoxy resin, and insulation effect is good, and non-stimulated more environmentally-friendly.
The above, be only preferred embodiment of the present utility model, is not the restriction that this utility model is made other form.Any those skilled in the art are changed possibly also with the technology contents of the disclosure above or are modified as the Equivalent embodiments of equivalent variations.But every without departing from technical solutions of the utility model content, any simple modification, equivalent variations and remodeling above example made according to structure of the present utility model and operation principle, still fall within the protection domain of technical solutions of the utility model.
Claims (5)
1.HDI high-density lamination circuit board, including double-sided substrate, it is etched with circuit on described double-sided substrate, it is characterized in that: connect first line plate in double-sided substrate both sides by insulating barrier, the second wiring board is connected by insulating barrier in first line plate both sides, connect tertiary circuit plate in the second wiring board both sides by insulating barrier, connect the 4th wiring board in tertiary circuit plate both sides by insulating barrier；The side of first line plate arranges one marker groove, the side of the second wiring board arranges twice marker groove, the side of tertiary circuit plate arranges three road marker groove, the side of the 4th wiring board arranges four road marker groove；It is provided with metallized blind hole between described each sandwich circuit board and between each sandwich circuit board and double-sided substrate to realize interconnecting between plate, positions hole in the corner of wiring board and arranging without electronic component and position, conducting wire of center.
HDI high-density lamination circuit board the most according to claim 1, it is characterised in that: described insulating barrier uses modified o-cresol formaldehyde epoxy resin.
HDI high-density lamination circuit board the most according to claim 1, it is characterised in that: in described marker groove, there is black ink.
HDI high-density lamination circuit board the most according to claim 1, it is characterised in that: described blind hole realizes metallization by copper facing.
HDI high-density lamination circuit board the most according to claim 1, it is characterised in that: hole, described location is at the same position of each sandwich circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620212082.0U CN205430766U (en) | 2016-03-21 | 2016-03-21 | HDI high density lamination circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620212082.0U CN205430766U (en) | 2016-03-21 | 2016-03-21 | HDI high density lamination circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205430766U true CN205430766U (en) | 2016-08-03 |
Family
ID=56519354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620212082.0U Active CN205430766U (en) | 2016-03-21 | 2016-03-21 | HDI high density lamination circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205430766U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905514A (en) * | 2021-10-15 | 2022-01-07 | 大连亚太电子有限公司 | High-density interconnection printed HDI (high Density interconnection) manufactured board and processing method thereof |
-
2016
- 2016-03-21 CN CN201620212082.0U patent/CN205430766U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905514A (en) * | 2021-10-15 | 2022-01-07 | 大连亚太电子有限公司 | High-density interconnection printed HDI (high Density interconnection) manufactured board and processing method thereof |
| CN113905514B (en) * | 2021-10-15 | 2024-05-31 | 大连亚太电子有限公司 | High-density interconnection printed HDI board and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |