CN206040687U - COB light source base plate - Google Patents
COB light source base plate Download PDFInfo
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- CN206040687U CN206040687U CN201620781174.0U CN201620781174U CN206040687U CN 206040687 U CN206040687 U CN 206040687U CN 201620781174 U CN201620781174 U CN 201620781174U CN 206040687 U CN206040687 U CN 206040687U
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- substrate
- substrate unit
- light source
- base plate
- cob light
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Abstract
The application discloses COB light source base plate includes that a plurality of shapes are the first base plate unit and the second base plate unit of square, on the horizontal direction, first base plate unit with second base plate unit interval sets up and is homopolar adjacent, in vertical direction, first base plate unit with setting of second base plate unit interval and heterocharge are adjacent, or, on the horizontal direction, first base plate unit with setting of second base plate unit interval and heterocharge are adjacent, in vertical direction, first base plate unit with second base plate unit interval sets up and is homopolar adjacent. Compare twice encapsulation of prior art, the utility model provides an arrange the COB light source base plate who forms with above -mentioned mode, only need carry out once encapsulation and just can obtain a plurality of the same base plate units, not only improved COB light source base plate's packaging efficiency, still guaranteed product quality simultaneously.
Description
Technical field
The utility model is related to light sources technical field, more particularly, it relates to a kind of COB light source substrate.
Background technology
With the development of LED/light source encapsulation technology, a kind of Novel LED light source device is COB (chip on board encapsulation) light source
Device is increasingly taken seriously, and COB light source device is that multiple chips are rest directly upon heat-radiating substrate surface by crystal-bonding adhesive
Light source device, with low cost, specular removal, photochromic uniform and the features such as facilitate easy-to-use, while COB light source is again with application portability
It is good by market with the advantages such as variation are designed.
During production COB light source device, first the mirror-surface aluminum base board of COB light source device is punched out or is cut, then
It is packaged, ultimately forms multiple COB light source devices, multiple base board units are formed by punching, the mode of punching is having four
Individual base board unit forms a foursquare center and is drilled so that two right angles on the diagonal of each base board unit become
Into quadrant.However, due to two adjacent base board unit die bond bonding wire directions it is perpendicular, therefore, encapsulation when, need
Encapsulation step twice is carried out, for example, the encapsulation all base board units parallel to die bond bonding wire direction are packaged for the first time, second
The secondary encapsulation all base board units vertical to die bond bonding wire direction are packaged, therefore, the mirror-surface aluminum base board that prior art is provided
In encapsulation, packaging efficiency is low.
Therefore, the packaging efficiency of COB (chip on board encapsulation) light source device how is improved, is that those skilled in the art are badly in need of
Technical problem to be solved.
Utility model content
For solving above-mentioned technical problem, the utility model provides a kind of COB light source substrate, it is possible to increase COB (chip on boards
Encapsulation) light source device packaging efficiency.
For achieving the above object, the utility model provides following technical scheme：
A kind of COB light source substrate, is foursquare first substrate unit and second substrate unit including multiple shapes,
The first substrate unit is spaced according to identical die bond bonding wire direction with the second substrate unit, is welded in the die bond
The spaced first substrate unit in line direction is adjacent with the second substrate unit homopolarity, is welding perpendicular to the die bond
The spaced first substrate unit in line direction is adjacent with the second substrate unit heteropole.
Preferably, in above-mentioned COB light source substrate, the first substrate unit and the second substrate unit are according to water
Square to die bond bonding wire direction arrangement.
Preferably, in above-mentioned COB light source substrate, the first substrate unit and the second substrate unit are according to perpendicular
Nogata to die bond bonding wire direction arrangement.
Preferably, in above-mentioned COB light source substrate, on the first substrate unit and the second substrate unit
Two diagonal positions are respectively provided with the positioning port of a quarter circle of punching.
Preferably, in above-mentioned COB light source substrate, the first substrate unit and the second substrate unit cover copper
Layer surface is provided with encapsulated layer.
From above-mentioned technical proposal as can be seen that a kind of COB light source substrate provided by the utility model, including multiple shapes
Be foursquare first substrate unit and second substrate unit, in the horizontal direction, the first substrate unit with it is described
Second substrate unit interval is arranged and homopolarity is adjacent, in the vertical direction, the first substrate unit and the second substrate list
First interval setting and heteropole is adjacent；Or, in the horizontal direction, the first substrate unit is set with the second substrate unit interval
Put and heteropole is adjacent, in the vertical direction, the first substrate unit are arranged with the second substrate unit interval and homopolarity phase
It is adjacent.
According to the COB light source substrate that above-mentioned arrangement mode is formed, directly cutting is carried out after encapsulation to which and obtains multiple lists
Only first substrate unit and multiple single second substrate units, after second substrate unit dextrorotation is turn 90 degrees,
First substrate unit is identical with second substrate unit outward appearance.Therefore, encapsulation twice compared to existing technology, the utility model are provided
The COB light source substrate for arranging in the above described manner, it is only necessary to once encapsulated
Unit, not only increases the packaging efficiency of COB light source substrate, while also assures that product quality.
Description of the drawings
In order to be illustrated more clearly that the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or accompanying drawing to be used is briefly described needed for description of the prior art, it should be apparent that, drawings in the following description are only
It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawings can be obtained according to the accompanying drawing for providing.
The structural representation of the first substrate unit that Fig. 1 is provided for the utility model embodiment；
The structural representation of the second substrate unit that Fig. 2 is provided for the utility model embodiment；
A kind of COB light source substrate schematic diagram that Fig. 3 is provided for the utility model embodiment；
Another kind of COB light source substrate schematic diagram that Fig. 4 is provided for the utility model embodiment.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only the utility model a part of embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
The structural representation of the first substrate unit for referring to Fig. 1 and Fig. 2, Fig. 1 and providing for the utility model embodiment, figure
The structural representation of the 2 second substrate units provided for the utility model embodiment.Fig. 1 and Fig. 2 is expressed as not being packaged
First substrate unit before and the structural representation of second substrate unit.
In a kind of specific embodiment, there is provided a kind of COB light source substrate, it is including multiple shapes foursquare
First substrate unit 11 and second substrate unit 22.No matter first substrate unit 11 or second substrate unit 22, its concrete knot
Structure is 98% high reflection aluminium, BT layers, copper clad layers 03, is arranged at 03 face center region of copper clad layers and area and is less than copper clad layers 03
Crystal bonding area and the annular die bond wire welding area around crystal bonding area are Bonging areas (heavy NI/PD/AU).Wherein, covering
The second of the surface of layers of copper 03 is diagonally respectively arranged with positive pole and negative pole.It is pointed out that second can diagonally be pros
The diagonal one pair of which of two couple of shape, to which and is not specifically limited.Second it is diagonal and first it is diagonal in " first " and " the
Two " attribute is respectively, does not represent diagonal quantity, it is diagonal for two right angles on the diagonal.
In the horizontal direction, the first substrate unit 11 is with 22 interval setting of second substrate unit and homopolarity phase
Neighbour, in the vertical direction, the first substrate unit 11 is with 22 interval setting of second substrate unit and heteropole is adjacent；Or,
In the horizontal direction, the first substrate unit 11 is with 22 interval setting of second substrate unit and heteropole is adjacent, vertical
On direction, the first substrate unit 11 is with 22 interval setting of second substrate unit and homopolarity is adjacent.
Specifically, in same row or same row, between two first substrate units 11, it is provided with second substrate unit
First substrate unit 11 is provided between 22, or two second substrate units 22.In the horizontal direction be same row, the first base
The positive pole of Slab element 11 is adjacent with the positive pole of second substrate unit 22, negative pole and the second substrate unit 22 of first substrate unit 11
Negative pole it is adjacent, be same row in the vertical direction perpendicular to horizontal direction, the negative pole and second substrate of first substrate unit 11
The positive pole of unit 22 is adjacent, and the positive pole of first substrate unit 11 is adjacent with the positive pole of second substrate unit 22.In the same manner, another
Arrangement mode will not be described here.
According to the COB light source substrate that above-mentioned arrangement mode is formed, directly cutting is carried out after encapsulation to which and obtains multiple lists
Only first substrate unit 11 and multiple single second substrate units 22,22 dextrorotation of second substrate unit is turn 90 degrees
Afterwards, first substrate unit 11 is identical with 22 outward appearance of second substrate unit.Therefore, encapsulation twice compared to existing technology, this reality
With the COB light source substrate for arranging in the above described manner of new offer, it is only necessary to once encapsulated can just obtain it is multiple
Identical base board unit, not only increases the packaging efficiency of COB light source substrate, while also assures that product quality.
Annular crystal bonding area is provided with the die bond hole 0101 for identifying die bond direction, the line direction in die bond hole 0101
It is exactly die bond direction.On the basis of above-mentioned embodiment, there are following two specific embodiments to illustrate.
Refer to Fig. 1, a kind of COB light source substrate schematic diagram that Fig. 1 is provided for the utility model embodiment.
In the first embodiment, the first substrate unit 11 and the second substrate unit 22 are according to horizontal die bond
Direction arranges.
Specifically, as first substrate unit 11 and the second substrate unit 22 are level according to the die bond direction
Direction arranges, therefore, according to the first substrate unit 11 and 22 homopolarity arranged adjacent of the second substrate unit, if the first base
With positive pole in the upper right corner, mode of the negative pole in the lower left corner is arranged Slab element 11, then, second substrate unit 22 is existed with positive pole
The upper left corner, mode of the negative pole in the lower right corner are arranged, i.e., the positive pole of first substrate unit 11 is on the upper right corner, the right side being adjacent
, in the upper left corner, the positive pole of the two is adjacent for the positive pole of the second substrate unit 22 on side, in the same manner, if the negative pole of first substrate unit 11 exists
The lower left corner, in the lower right corner, the negative pole of the two is adjacent for the negative pole of the second substrate unit 22 on the left side being adjacent.Perpendicular to institute
State on die bond direction i.e. vertical direction, according to the first substrate unit 11 and 22 heteropole adjacent row of the second substrate unit
Row, even, in the lower left corner, the positive pole of the second substrate unit 22 of the lower section being adjacent is on a left side for the negative pole of first substrate unit 11
Upper angle, the negative pole of first substrate unit 11 are adjacent with the positive pole of lower section second substrate unit 22, in the same manner, if first substrate unit 11
Positive pole in the upper right corner, the negative pole of the second substrate unit 22 of the top being adjacent in the lower right corner, first substrate unit 11
Negative pole is adjacent with the positive pole of the second substrate unit 22 of top.
Further, the die bond hole 01 of the first substrate and the second substrate is arranged at substrate level center line and consolidates
The point of intersection of brilliant wire welding area.
Die bond hole 01 generally has two, the die bond wire welding area being respectively arranged between negative pole and positive pole.In the present embodiment,
The line in die bond hole 0101 is the horizontal central line of foursquare first substrate unit 11 and second substrate unit 22, i.e. die bond hole
0101 point of intersection for being arranged at square horizontal center line and die bond wire welding area.One die bond hole 01 is located on the right of negative pole and near negative
Pole, another die bond hole 01 are located at the positive pole left side and near positive pole.
Refer to Fig. 2, another kind of COB light source substrate schematic diagram that Fig. 2 is provided for the utility model embodiment.
In second embodiment, specifically, the first substrate unit 11 and the second substrate unit 22 according to
Vertically die bond direction arrangement.
Specifically, as first substrate unit 11 and the second substrate unit 22 are vertical according to the die bond direction
Direction arranges, therefore, according to the first substrate unit 11 and 22 homopolarity arranged adjacent of the second substrate unit, if the first base
With positive pole in the upper right corner, mode of the negative pole in the lower left corner is arranged Slab element 11, then, second substrate unit 22 is existed with positive pole
The lower right corner, mode of the negative pole in the upper left corner are arranged, i.e., the negative pole of first substrate unit 11 is adjacent down in the lower left corner
, in the upper left corner, the negative pole of the two is adjacent, in the same manner, if the positive pole of first substrate unit 11 exists for the negative pole of the second substrate unit 22 of side
The upper right corner, in the lower right corner, the positive pole of the two is adjacent for the positive pole of the second substrate unit 22 of the top being adjacent.Perpendicular to institute
State in die bond direction i.e. horizontal direction, according to the first substrate unit 11 and 22 heteropole adjacent row of the second substrate unit
Row, even, in the lower left corner, the negative pole of the second substrate unit 22 on the left side being adjacent is on the right side for the negative pole of first substrate unit 11
Inferior horn, the negative pole of first substrate unit 11 are adjacent with the positive pole of left side second substrate unit 22, in the same manner, if first substrate unit 11
Positive pole in the upper right corner, the negative pole of the second substrate unit 22 on the right being adjacent in the upper left corner, first substrate unit 11
Positive pole is adjacent with the negative pole of the second substrate unit 22 on the right.
Further, the die bond hole 01 of the first substrate and the second substrate is arranged at substrate vertical center line and consolidates
The point of intersection of brilliant wire welding area.
Die bond hole 01 generally has two, the die bond wire welding area being respectively arranged between negative pole and positive pole.In the present embodiment
In, the line in die bond hole 0101 is the vertical center line of foursquare first substrate unit 11 and second substrate unit 22, i.e., solid
Geode 0101 is arranged at the point of intersection of square vertical center line and die bond wire welding area.One die bond hole 01 is located at the negative pole left side and leans on
Nearly negative pole, another die bond hole 01 is located on the right of positive pole and near positive pole.
Although first substrate unit 11 and second substrate unit 22 because the set location in die bond hole 0101 is different
Difference, but after encapsulation, no matter the die bond hole 0101 on first substrate unit 11 or second substrate unit 22 can be sealed
Dress layer is blocked, therefore, after 22 dextrorotation of second substrate unit is turn 90 degrees, first substrate unit 11 and second substrate unit
22 outward appearances are identical, can regard as identical base board unit.Therefore, encapsulation twice compared to existing technology, the utility model are carried
For the COB light source substrate for arranging in the above described manner, it is only necessary to once encapsulated
Slab element, not only increases the packaging efficiency of COB light source substrate, while also assures that product quality.
Further, the first diagonal position on the first substrate unit and the second substrate unit is respectively provided with punching
The positioning port 02 of a quarter circle cut.
According to above-mentioned arrangement mode, with first substrate unit 11 and second substrate unit 22 is stated according to die bond direction as water
Square illustrate to as a example by arrangement, on COB light source substrate, choose two-by-two the adjacent length of side that constitutes for the two of the base board unit length of side
Foursquare four base board units again, i.e., two first substrate units 11 and two second substrate units 22, two the first bases
Slab element 11 and second substrate unit 22 are symmetrical for two times of the base board unit length of side of foursquare diagonal with regard to the length of side,
And the length of side at two times of the base board unit length of side of square central be by four base board units first it is diagonal in one it is straight
What angle surrounded, it is punched out herein, it is only necessary to be directly punched circular hole, the directly formation the in follow-up cutting after punching
Pair of horns has the base board unit of the circular positioning port 02 of a quarter.In compared to existing technology, individually to each base board unit
First be diagonally punched out, as the size of positioning port 02 is less, it is irregular to be easily caused 02 edge of positioning port, is punched efficiency
Low shortcoming.The arrangement mode that the present embodiment is provided so that 02 neat in edge of positioning port that punching is formed, improves punching effect
Rate, it is ensured that the quality of base board unit.
Further, 03 surface of copper clad layers of the first substrate unit 11 and the second substrate unit 22 is respectively provided with
There is encapsulated layer.
Due to the die bond direction of base board unit it is consistent, it is only necessary to once encapsulate, therefore, reduce to COB light source base
The encapsulation step of plate, increased encapsulated layer on the surface of each base board unit, and COB light source substrate is protected.
In this specification, each embodiment is described by the way of progressive, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use that this practicality is new
Type.Various modifications to these embodiments will be apparent for those skilled in the art, determined herein
The General Principle of justice can be realized in the case of without departing from spirit or scope of the present utility model in other embodiments.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide scope consistent with features of novelty.
Claims (7)
1. a kind of COB light source substrate, is foursquare first substrate unit and second substrate unit including multiple shapes, its
It is characterised by, in the horizontal direction, the first substrate unit is arranged with the second substrate unit interval and homopolarity is adjacent,
On vertical direction, the first substrate unit is arranged with the second substrate unit interval and heteropole is adjacent；
Or, in the horizontal direction, the first substrate unit is arranged with the second substrate unit interval and heteropole is adjacent, perpendicular
Upwards, the first substrate unit is arranged with the second substrate unit interval and homopolarity is adjacent for Nogata.
2. COB light source substrate as claimed in claim 1, it is characterised in that the first substrate unit and second base
Slab element is arranged according to horizontal die bond direction.
3. COB light source substrate as claimed in claim 2, it is characterised in that the first substrate and the second substrate
Die bond hole is arranged at the point of intersection of substrate level center line and die bond wire welding area.
4. COB light source substrate as claimed in claim 1, it is characterised in that the first substrate unit and second base
Slab element is arranged according to vertical die bond direction.
5. COB light source substrate as claimed in claim 4, it is characterised in that the first substrate and the second substrate
Die bond hole is arranged at the point of intersection of substrate vertical center line and die bond wire welding area.
6. the COB light source substrate as described in any one of claim 1 to 5, it is characterised in that the first substrate unit and institute
State the positioning port of the on second substrate unit first a quarter circle for being diagonally respectively provided with punching.
7. COB light source substrate as claimed in claim 6, it is characterised in that the first substrate unit and second base
The copper clad layers surface of Slab element is provided with encapsulated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620781174.0U CN206040687U (en) | 2016-07-20 | 2016-07-20 | COB light source base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620781174.0U CN206040687U (en) | 2016-07-20 | 2016-07-20 | COB light source base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040687U true CN206040687U (en) | 2017-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620781174.0U Active CN206040687U (en) | 2016-07-20 | 2016-07-20 | COB light source base plate |
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| Country | Link |
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| CN (1) | CN206040687U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565325A (en) * | 2018-02-01 | 2018-09-21 | 广州硅能照明有限公司 | COB substrate |
-
2016
- 2016-07-20 CN CN201620781174.0U patent/CN206040687U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565325A (en) * | 2018-02-01 | 2018-09-21 | 广州硅能照明有限公司 | COB substrate |
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