CN205960172U - Low -intermodulation power load - Google Patents
Low -intermodulation power load Download PDFInfo
- Publication number
- CN205960172U CN205960172U CN201620838362.2U CN201620838362U CN205960172U CN 205960172 U CN205960172 U CN 205960172U CN 201620838362 U CN201620838362 U CN 201620838362U CN 205960172 U CN205960172 U CN 205960172U
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- casing
- radiator
- power
- power load
- low intermodulation
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Abstract
The utility model discloses a low -intermodulation power load, including RFin interface, box, bottom plate, power resistive film piece and radiator, what the RFin interface was detachable installs in the one end of box, the bottom of box is located to the bottom plate, be equipped with the louvre on the bottom plate, the radiator is installed in the box, power resistive film piece is installed on the radiator, the RFin interface passes through the microstrip line and is connected with power resistive film piece, the upper end of box be equipped with with the corresponding opening of power resistive film piece. The utility model discloses an absorptive mode of power resistive film piece, radio frequency transmission adoption microstrip line allotment structure lets the impedance of microstrip line and resistance keep unanimous, and then guarantees that both impedances are reliable with the connection in succession, satisfy at DC simultaneously the intermodulation value of 3GHz frequency channel within range can reach <= 90dBm.
Description
Technical field
This utility model is related to power loading techniques field, more specifically, particularly to a kind of for test instrunment
The low intermodulation power load of test port.
Background technology
With the development of wireless communication technology, low intermodulation power load is widely used in the communications industry.Due to general low
Intermodulation load all to realize power absorption by the way of the low intermodulation cable of one section of tens to hundreds of rice is wound around, its product
Cost of implementation is high, and volume is big, the low many unfavorable factors of radiating efficiency, in order to improve above-mentioned situation it is necessary to design one kind changes
The low intermodulation power load entered.
Utility model content
The purpose of this utility model is to provide that a kind of structure is simple, reduce volume and the low intermodulation power load of cost.
In order to achieve the above object, the technical solution adopted in the utility model is as follows：
A kind of low intermodulation power load, including RFin interface, casing, base plate, power resistor diaphragm and radiator, described
What RFin interface was detachable is installed on one end of casing, and described base plate is provided with radiating located at the bottom of casing, described base plate
Hole, described radiator is installed in casing, and described power resistor diaphragm is installed on radiator, and described RFin interface passes through micro-strip
Line is connected with power resistor diaphragm, and the upper end of described casing is provided with the opening corresponding with power resistor diaphragm.
Further, described RFin interface passes through the detachable one end being installed on casing of installing plate.
Further, described radiator includes heat-radiating substrate, and is installed on multiple radiating fins of heat-radiating substrate one end,
It is provided with fastening screw between two radiating fins of end, described power resistor diaphragm is fixedly installed in by trip bolt
In fastening screw.
Further, the surface of described radiating fin is wavy shaped configuration.
Further, it is additionally provided with heat-conducting silicone grease between described radiator and casing.
Compared with prior art, the utility model has the advantage of：This utility model adopts power resistor diaphragm to absorb
Mode, radio frequency transmission adopts microstrip line Adjustable structure, allows the impedance of microstrip line and resistance to be consistent, and then ensures both impedances
Continuous and connection is reliable, and the mutual tone pitch simultaneously meeting in DC-3GHz band limits can reach≤- 90dBm.
Brief description
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or in description of the prior art the accompanying drawing of required use be briefly described it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, in the premise not paying creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the front view of low intermodulation power load described in the utility model.
Fig. 2 is the left view of low intermodulation power load described in the utility model.
Fig. 3 is the top view of low intermodulation power load described in the utility model.
Fig. 4 is the heat spreader structures figure of low intermodulation power load described in the utility model.
Description of reference numerals：1st, RFin interface, 2, installing plate, 3, casing, 4, base plate, 5, power resistor diaphragm, 6, opening,
7th, heat-radiating substrate, 8, radiating fin, 9, fastening screw.
Specific embodiment
Below in conjunction with the accompanying drawings preferred embodiment of the present utility model is described in detail, so that advantage of the present utility model
Can be easier to be readily appreciated by one skilled in the art with feature, thus make apparent clear and definite to protection domain of the present utility model
Define.
Refering to shown in Fig. 1-Fig. 3, this utility model provides a kind of low intermodulation power load, including RFin interface 1, casing 3,
Base plate 4, power resistor diaphragm 5 and radiator, the detachable one end being installed on casing 3 of described RFin interface 1, described base plate
4 are provided with louvre located at the bottom of casing 3, described base plate 4, and described radiator is installed in casing 3, described power resistor film
Piece 5 is installed on radiator, and described RFin interface 1 is connected with power resistor diaphragm 5 by microstrip line, the upper end of described casing 3
It is provided with the opening 6 corresponding with power resistor diaphragm 5.
Preferably, described RFin interface 1 passes through the detachable one end being installed on casing 3 of installing plate 2.
Preferably, being additionally provided with heat-conducting silicone grease between described radiator and casing 3, it is effectively reduced thermal resistance.
Design principle of the present utility model is：The mode being absorbed from high-power resistance diaphragm, radio frequency transmission adopts micro-
Band wire Adjustable structure, allows the impedance of microstrip line and resistance to be consistent, and then ensures that both impedances are continuous and it is reliable, simultaneously to connect
The mutual tone pitch meeting in DC-3GHz band limits can reach≤- 90dBm.Power resistor diaphragm 5 is directly anchored to cavity
Fan on hot device, its heat producing can be made effectively and rapidly to distribute, and load and between cavity and radiator, coat one
Layer heat-conducting silicone grease, is effectively reduced thermal resistance.
When using, powerful radiofrequency signal is 50 ohm by resistance to this utility model, and resistance to power is the big of 250W
Power resistor diaphragm is to absorb terminal, and the micro-strip cable plate joined by impedance adjustable is in system link through row impedance matching.
Refering to shown in Fig. 4, described radiator includes heat-radiating substrate 7, and the multiple radiatings being installed on heat-radiating substrate 7 one end
Fin 8, is provided with fastening screw 9 between two radiating fins 8 of end, and described power resistor diaphragm 5 passes through trip bolt
It is fixedly installed in fastening screw 9.
Preferably, for improving radiating efficiency further, the surface of described radiating fin 8 is wavy shaped configuration.
By enforcement of the present utility model, have an advantage in that：
1st, small volume, lightweight, it is easily installed, save the installing space of system.
2nd, select the high-power plate resistor of 50 ohm/200W, meet the resistance to power requirement of passive cross modulation test system.
3rd, load cavity adopts pure copper material, so that its heat producing is effectively dissipated away.
4th, the mutual tone pitch of low intermodulation power load can reach≤- 90dBm, fully meets the needs of front end intermodulation testing.
Although being described in conjunction with the accompanying embodiment of the present utility model, patent owner can want in appended right
Various modifications or modification is made, as long as less than the protection model described by claim of the present utility model within the scope of asking
Enclose, all should be within protection domain of the present utility model.
Claims (5)
1. a kind of low intermodulation power load it is characterised in that：Including RFin interface, casing, base plate, power resistor diaphragm and radiating
Device, the detachable one end being installed on casing of described RFin interface, described base plate sets on the bottom of casing, described base plate
There is louvre, described radiator is installed in casing, described power resistor diaphragm is installed on radiator, described RFin interface leads to
Cross microstrip line to be connected with power resistor diaphragm, the upper end of described casing is provided with the opening corresponding with power resistor diaphragm.
2. low intermodulation power load according to claim 1 it is characterised in that：It is removable that described RFin interface passes through installing plate
Unload one end being installed on casing of formula.
3. low intermodulation power load according to claim 1 it is characterised in that：Described radiator includes heat-radiating substrate, with
And it is installed on multiple radiating fins of heat-radiating substrate one end, it is provided with fastening screw, institute between two radiating fins of end
State power resistor diaphragm to be fixedly installed in fastening screw by trip bolt.
4. low intermodulation power load according to claim 3 it is characterised in that：The surface of described radiating fin is waveform
Structure.
5. low intermodulation power load according to claim 1 it is characterised in that：It is additionally provided between described radiator and casing
Heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620838362.2U CN205960172U (en) | 2016-08-04 | 2016-08-04 | Low -intermodulation power load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620838362.2U CN205960172U (en) | 2016-08-04 | 2016-08-04 | Low -intermodulation power load |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205960172U true CN205960172U (en) | 2017-02-15 |
Family
ID=57972897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620838362.2U Active CN205960172U (en) | 2016-08-04 | 2016-08-04 | Low -intermodulation power load |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205960172U (en) |
-
2016
- 2016-08-04 CN CN201620838362.2U patent/CN205960172U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |